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市场调查报告书
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1137874

功率半导体市场 - COVID-19 的增长、趋势、影响、预测（2022-2027 年）

Power Semiconductor Market - Growth, Trends, and Forecasts (2022 - 2027)
出版日期: | 出版商: Mordor Intelligence | 英文 130 Pages | 商品交期: 2-3个工作天内

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简介目录

预计全球功率半导体市场在此期间的复合年增长率为 3.3%。

功率半导体的作用与普通半导体相同，但规模要大得多。功率半导体是具有与普通半导体相同功能的高性能元件，可以处理数千兆瓦的大电流、高电压和高频率。与其他半导体器件一样，它们用于整流和放大电信号以及打开和关闭电流。常用于工业应用和远距离输配电。

主要亮点

  • 该材料主要由碳化硅（SiC）和氮化镓（GaN）组成。与硅相比，GaN和SiC具有更宽的禁带宽度（Si：1.1，SiC：3.3，GaN：3.4），因此也被称为宽禁带半导体。SiC MOSFET 和二极管具有高开关频率和高功率密度，使其成为电动汽车车载充电器的理想器件。由于世界各国政府的努力，电动汽车行业继续快速增长。
  • 2022 年 5 月，Infineon Technologies与全球现代驱动技术和电气化解决方案提供商 Vitesco Technologies 签署了开发碳化硅功率半导体的合作协议。碳化硅显着提高了电动汽车驱动系统中高压电力电子设备的效率。例如，Vitesco Technology 在管理电驱动电机的超紧凑型高压逆变器中使用 SiC 组件。SiC 组件已经在当前一代的电子设备中使用，因为它们允许更小的尺寸和更高的效率。
  • 新成立的联合研究实验室配备了车载充电器（OBC）和DC/DC转换器等车载设备评估和应用评估所需的主要设备。通过这种方式，两家公司有望加强合作伙伴关係并加速使用 SiC 开发电源解决方案。
  • Power Delivery 为充电器带来更多智能，从而能够检测连接的设备。这允许充电器在尽可能短的时间内提供充电所需的准确功率。基于 GaN（氮化镓）的充电器可提高效率、减少热量并减小每个产品的尺寸。
  • 此外，2021 年 5 月，日本政府在其一年增长战略中宣布，该岛国将增加支出以加强国内先进半导体设备的生产。政府已承诺提供 2000 亿日元支持国内芯片製造业，目标是到 2030 年在下一代功率半导体中占全球 40% 的份额。
  • 此外，预计到 2050 年，全球电力需求将从目前的 25,000 TWh 增长到 38,000 TWh，从而增加所有市场的电力需求。在行业层面，全球 800 万个数据中心使用的能源占全球能源使用量的 2-3%，预计这一比例将上升到 5% 以上。工业电机消耗 30% 并且还在增加。预计电动汽车将成为最大的消费者，到 2040 年将占全球能源消耗的 5%（来源：GaN Systems）。GaN 降低了所有这些系统的损耗。
  • 由于 COVID-19 大流行和消费电子行业的销售暴跌，消费电子行业对 SiC 功率半导体的市场需求一直低迷。根据 IPC International, Inc. 2020 年 3 月的调查数据，接受调查的全球电子製造商和供应商中有 40% 表示消费电子是受 COVID-19 疫情影响最严重的行业，他预计会有。

主要市场趋势

汽车行业有望显着增长

  • 由于价格更低、续航里程更长，电动汽车现在变得越来越流行。此外，如今电动汽车变得越来越普遍，降低了价格并增加了行驶里程。根据国际能源署（IEA）的数据，2021年全球插电式电动轻型汽车销量将达到约660万辆。
  • 在过去几年中，许多原始设备製造商已宣布对电动汽车进行价值数十亿美元的投资，部分原因在于二氧化碳排放法规的影响。预计未来几年将采取重要步骤，以提高电动汽车上路的比例。半导体在电动汽车和内燃机中都发挥着重要作用。
  • 正在研究在汽车动力系统中使用 SiC（碳化硅）器件。最近的进展逐渐使 SiC 器件成为一种可行的解决方案。
  • 随着政府鼓励清洁能源和製造商继续寻找使汽车更容易使用的方法，预计道路上的电动汽车数量将继续增长。使这成为可能的是对更快、更持久、更小、更轻和更安全电池的需求推动的电池技术不断创新。例如，采用快速充电系统的特斯拉今天已经将 SiC 整合到其车辆架构中。
  • SiC 半导体非常适合安装在插电式混合动力汽车 (PHEV) 和电动汽车 (EV) 中的车载充电器和逆变器等应用。这是因为它比传统的硅更节能。
  • 此外，电动汽车的长距离行驶和充电需要能够承受高温的电力电子设备。SiC 半导体的特点是能效超过 95%，这意味着在功率转换过程中，例如在大功率快速充电器中充电，只有 5% 的能量以热量的形式损失掉。
  • 此外，2021 年 5 月，Infineon Technologies宣布推出采用 CoolSiCMOSFET 技术的全新汽车电源模块系列。使用碳化硅代替硅确保了安装在电动汽车中的转换器的高效率。Hyundai Motor Group报告称，与基于硅的解决方案相比，基于Infineon CoolSiCpower 模块的牵引逆变器能够使车辆行驶里程增加 5% 以上，因为这种 SiC 解决方案的损耗更低，从而提高了效率。

亚太地区预计将显着增长

  • 亚太地区主导全球半导体市场，并在政府政策的进一步支持下，有望主导全球功率半导体市场。此外，该地区的半导体产业以中国大陆、日本、台湾和韩国为首，它们合计约占全球分立半导体市场的 65%。越南、泰国、马来西亚和新加坡等地区也对该市场的主导地位做出了重大贡献。
  • 根据印度电子和半导体协会的数据，到 2025 年，该国的半导体元件市场预计将达到 323.5 亿美元，复合年增长率为 10.1%（2018-2025 年）。该国已成为全球研发中心利润丰厚的目的地。因此，由于政府正在推行“印度製造”计划，预计对半导体市场的投资。
  • 此外，该地区是一个电子中心，每年在该地区消费数百万台电子设备并出口到其他地方。如此高产量的电子设备和组件极大地促进了所研究的市场份额。例如，印度对消费电子产品的需求增加也推动了该地区市场的增长。据 IBEF 称，预计 2024 年印度对电子硬件的需求将达到 4000 亿美元，进一步推动市场增长。
  • 此外，Vivo 通过其印度官方推特宣布，该公司的旗舰智能手机 X80 Pro 将很快获得 Android 13 Preview 版本。不只是这款机型，iQOO9 Pro 也已确认在本月底收到预览版。两款中国 OEM 智能手机都将在 2022 年 8 月 23 日之前接受 Android 13 Preview 版本。2022年8月，vivo在印度市场发布了智能手机“V25 Pro”。这是我们 V 系列中延迟时间最长的型号。该小工具配备了一个三重摄像头设置，一个 64MP 主传感器、一个 8MP 超广角镜头和一个 2MP 微距拍摄器。
  • 此外，根据消费者技术协会的数据，中国和美国等国家是世界上最大的消费电子市场，总收入超过 3500 亿美元。然而，印度和巴西等新兴国家正在推动研究领域的需求和进步。例如，根据印度政府的数据，到 2024-2025 年，印度的消费电子和消费电子行业预计将翻一番，达到 14.8 亿卢比。预计这将进一步增加对化合物半导体的需求。
  • 为了满足市场需求，功率半导体製造商正在迅速采用碳化硅 (SiC) 等材料，这种材料可以在更高的电压、温度和频率下工作，并提供更高的效率和可靠性。
  • 此外，2021 年 2 月，Silicon Power Corporation 将在印度 Halol（古吉拉特邦）开设子公司 SiC Fabrication Unit，为印度电子行业带来许多机遇。这个新的 SiC 製造工厂的开业不仅将加速印度创建和发展“印度製造”电子产业的目标，而且还将减少其对进口的依赖，尤其是对来自中国的进口依赖。

竞争格局

功率半导体市场是一个由少数大玩家主导的整合市场。就市场份额而言，少数大公司主导市场。预计很快就会对专注于创新的大公司进行各种收购和合作。市场上的主要参与者包括Infineon Technologies和Texas Instruments。

  • 2021 年 3 月 - MagnaChip 宣布推出新的低压差 (LDO) 线性稳压器，该稳压器具有超快瞬态响应，适用于基于通用闪存 (UFS) 的多芯片封装 (MCP)。它是 eMMC（嵌入式多媒体控制器）的高级版本，旨在实现高速同时读取和写入。
  • 2021 年 3 月 - Alpha Omega Semiconductor 推出符合 AEC-Q101 标准的新型 1200V 碳化硅 (SiC) αSiC MOSFET。它非常适合满足高效率和高可靠性要求，例如电动汽车 (EV) 车载充电器、电机驱动逆变器和非车载充电站。
  • 2021 年 2 月 - Nexperia 扩展其 LFPAK56D MOSFET 产品线，采用符合 AEC-Q101 标准的半桥封装。动力总成、电机控制和 DC/DC 应用的寄生电感降低 60%，热性能得到改善。

其他福利

  • Excel 格式的市场预测 (ME) 表
  • 3 个月的分析师支持

目录

第 1 章 简介

  • 研究假设和市场定义
  • 调查范围

第二章研究方法论

第三章执行摘要

第四章市场洞察

  • 市场概况
  • 行业价值链分析
  • 行业吸引力——波特五力分析
    • 供应商的议价能力
    • 消费者议价能力
    • 新进入者的威胁
    • 竞争对手之间的竞争
    • 替代品的威胁
  • 评估 COVID-19 对市场的影响
  • 技术快照

第五章市场动态

  • 市场驱动力
    • 对消费电子产品和无线通信的需求不断增长
    • 对节能、电池供电的便携式设备的需求不断增长
  • 市场製约因素
    • 硅片短缺，驱动需求波动

第六章市场细分

  • 按组件
    • 离散的
    • 模块
    • 电源集成电路
  • 按材质
    • 硅/锗
    • 碳化硅 (SiC)
    • 氮化镓（江恩）
  • 按终端用户行业
    • 汽车
    • 消费类电子产品
    • IT/通讯领域
    • 军事/航空航天
    • 电力
    • 工业设备
    • 其他最终用户
  • 区域信息
    • 北美
    • 欧洲
    • 亚太地区
    • 拉丁美洲
    • 中东/非洲

第 7 章 竞争格局

  • 公司简介
    • Infineon technologies AG
    • Texas instruments Inc.
    • United Silicon Carbide Inc.
    • ST Microelectronics NV
    • NXP semiconductor Inc.
    • ON Semiconductor Corporation
    • Renesas Electronic Corporation
    • Broadcom Inc.
    • Toshiba Corporation
    • Mitsubishi Electric Corporation
    • Fuji Electric Co. Ltd
    • Semikron International
    • Cree Inc.
    • ROHM□Co Ltd
    • Vishay Intertechnology Inc.□
    • Nexperia BV□
    • Alpha & Omega Semiconductor
    • Magnachip□Semiconductor Corp
    • Microchip□Technology Inc
    • Littlefuse Inc

第八章投资分析

第九章 市场潜力

简介目录
Product Code: 63819

The global power semiconductor market is anticipated to register a CAGR of 3.3% during the period. Power semiconductors perform the same tasks as regular semiconductors, only on a much larger scale. These high-performance components are capable of handling extremely high electrical currents, voltages, and frequencies up to several gigawatts. Like all semiconductor devices, power semiconductors are used to rectify and amplify electrical signals or turn the flow of electricity on and off. These are typically used for industrial applications and the long-distance transmission and distribution of electricity.

Key Highlights

  • The material is majorly comprised of Silicon Carbide (SiC) and Gallium Nitride (GaN). Compared to silicon, GaN and SiC have a wider bandgap (Si:1.1, SiC:3.3, and GaN:3.4), and, therefore, it is also called Wide Band Gap Semiconductors. SiC MOSFETs and diodes offer high switching frequency and high power density and are ideally suited for electric vehicle onboard chargers. The electric vehicles industry is catering to rapid growth owing to initiatives from several governments across the world.
  • In May 2022, Infineon Technology AG and Vitesco Technologies, a global provider of the latest drive technologies and electrification solutions, signed a partnership agreement to develop silicon carbide power semiconductors. The efficiency of high-voltage power electronics in the drive systems of electrified cars is significantly improved by silicon carbide. For instance, SiC components are used by Vitesco Technologies in extremely small high-voltage inverters that manage electric drive motors. SiC components are already being used in the present generation of electronics since they allow for compact sizes and high efficiency.
  • The new joint laboratory contains major equipment required for device and application evaluation in automotive applications, such as onboard chargers (OBCs) and DC/DC converters. The firms expect that this will allow them to strengthen their partnership and accelerate the development of SiC-based power solutions.
  • Power delivery brings more intelligence to the charger and enables the detection of the device connected to it. This allows the charger to deliver the precise amount of power needed to charge it in the shortest possible time. A charger with GaN (Gallium Nitride) increases efficiency, lowers the heat, and decreases each product's size.
  • Moreover, In May 2021, the Japanese government announced under their yearly growth agenda that the island country planned to increase spending to ramp up the local production of advanced semiconductor devices. The government pledged JPY 200 billion to support the domestic chipmaking industry and aims to hold a 40% global share in next-generation power semiconductors by 2030.
  • Furthermore, power requirements are increasing in every market, as global requirements for electricity are anticipated to increase from 25,000 TWh currently to 38,000 TWh in the year 2050. At the sector level, 8 million data centers in the world use 2-3% of the world's energy use, and that share is expected to rise to more than 5%. Industrial motors consume 30% and growing; electric vehicles will become large consumers of 5% of global energy consumption by 2040 (source: GaN Systems). GaN reduces losses in all these systems.
  • With the onset of the COVID-19 pandemic and the steep nosedive sales in the consumer electronics segment, the market demand for SiC power semiconductors from the consumer electronics industry witnessed impeded growth rates. As per data from the March 2020 survey by IPC International, Inc., 40% of the global electronics manufacturers and suppliers surveyed stated that consumer electronics were expected to be the most impacted industry due to the COVID-19 outbreak.

Key Market Trends

Automotive Industry Expected to Have Significant Growth

  • Electric cars are becoming common on the road nowadays with prices coming down and range going up. In addition, electric vehicles are becoming common on the road nowadays, with prices coming down and range going up. According to the International Energy Agency, plug-in electric light vehicle sales globally reached around 6.6 million in 2021.
  • In the past few years, many OEMs have announced billions of dollars worth of investment in EVs, which is also strong due to the restrictions on CO2 emissions. Key steps will be taken in the coming years, and a higher percentage of EVs on the road will be seen. Semiconductors play a key role in both electric vehicles and those with internal combustion engines.
  • Research has been undergoing when it comes to the use of silicon carbide (SiC) devices within the automotive powertrain. Due to recent advancements, it is gradually becoming a feasible solution.
  • The number of electric vehicles out on the streets is expected to keep multiplying as governments continue to incentivize clean energy and manufacturers find ways to make their cars more accessible. A big part of making that possible is the ongoing innovation in battery technology, driven by the demand for smaller, lighter, and safer batteries that charge faster and last longer. For instance, Tesla, which uses a rapid charging solution, is already using SiC within its vehicle architectures today.
  • SiC semiconductors are ideal for applications, such as onboard chargers and inverters used within plug-in hybrid (PHEV) and fully electric vehicles (EVs). This is because their energy efficiency is significantly higher compared to traditional silicon.
  • To ensure that EVs can operate over long distances and charge within a reasonable timeframe, the vehicle's power electronics must be capable of handling high temperatures. SiC semiconductors benefit from more than 95% energy efficiency, i.e., only 5% of the energy is lost as heat during power conversion instances, such as recharging the vehicle at a high-power rapid-charger.
  • Further, in May 2021, Infineon Technologies launched a new power module with CoolSiCMOSFET technology for automotive applications. The use of silicon carbide instead of silicon ensured higher efficiency in converters in electric vehicles. Hyundai Motor Group reported that it was able to increase the range of its vehicles by more than 5% because of efficiency gains resulting from the lower losses of this SiC solution compared to the Si-based solution with the help of the traction inverters based on Infineon's CoolSiCpower module.

Asia Pacific Expected to Have Significant Growth

  • The Asia Pacific region is expected to dominate the global power semiconductor market, as the region dominates the global semiconductor market, which is further supported by government policies. Moreover, the region's semiconductor industry is driven by China, Japan, Taiwan, and South Korea, which together constitute around 65% of the global discrete semiconductor market, while others like Vietnam, Thailand, Malaysia, and Singapore also contribute significantly to the region's dominance in the market.
  • According to the Indian Electronics and Semiconductor Association, the country's semiconductor component market is expected to be worth USD 32.35 billion by 2025, registering a CAGR of 10.1% (2018-2025). The country is a lucrative destination for global R&D centers. Thus, the government's ongoing 'Make In India' initiative is expected to result in investments in the semiconductor market.​
  • Moreover, the region is an electronics hub with millions of electronic devices made annually for consumption in the region and exported to other places. This high production of electronic devices and components significantly contributes to the market share of the market studied.​ For instance, the increasing demand for consumer electronics in India has also facilitated the regional market's growth. According to IBEF, Demand for electronics hardware in India is expected to reach USD 400 billion by FY2024. which will further drive the market growth.
  • Moreover, Vivo announced from its official Indian Twitter handle that its flagship X80 Pro smartphone will soon receive the Android 13 Preview build. Although it's not the only model, the iQOO9 Pro is confirmed to receive the Preview later this month. Both smartphones from the Chinese OEMs are set to accept the Android 13 Preview build by August 23, 2022. In addition, in August 2022, Vivo announced the V25 Pro smartphone in the Indian market. It is the most delinquent V series model from the Company. The gadget packs a triple camera setup with a 64-megapixel primary sensor, an 8-megapixel ultra-wide-angle lens, and a 2-megapixel macro shooter.
  • Furthermore, countries like China and the United States are the world's largest consumer electronic markets, with combined revenues of over USD 350 billion, according to the Consumer Technology Association. However, emerging countries like India and Brazil fuel the demand and advancements in the studied segment. For instance, according to the government's data, the Indian appliances and consumer electronics industry is projected to double to INR 1.48 lakh crore by 2024 - 2025. This is further anticipated to boost the need for compound semiconductors.
  • To address market needs, power semiconductor manufacturers are quickly adopting materials such as silicon carbide (SiC), which can operate at higher voltages, temperatures, and frequencies, while delivering improved efficiency and reliability.
  • Furthermore, in February 2021, Silicon Power Corporation opened its subsidiary, the SiCfabrication unit, in Halol(Gujarat), India, bringing many opportunities for the Indian Electronics sector. The opening of this new SiCfabrication will not only accelerate India's objective to create and develop a "Make in India" Electronic devices Industry but also reduce dependence on imports, especially from China.

Competitive Landscape

The power semiconductor market is a consolidated market dominated by a few major players. In terms of market share, few of the major players dominate the market. Various acquisitions and collaborations of large companies are expected to take place shortly, which focus on innovation. Some of the key players in the market are Infineon Technologies and Texas Instruments.

  • March 2021 - Magnachip launched a new Low-dropout (LDO) linear regulator featuring an ultra-fast transient response for a Universal Flash Storage (UFS)-based Multi-Chip Package (MCP). It is an advanced version of an Embedded Multi-Media Controller (eMMC), which was developed for concurrent read and write performance at higher speeds.
  • March 2021 - Alpha and Omega Semiconductor announced the new AEC-Q101 qualified 1200V silicon carbide (SiC) αSiC MOSFETs. This is ideal for the high efficiency and reliability requirements of electric vehicles (EV) onboard chargers, motor drive inverters, and off-board charging stations.
  • February 2021 - Nexperia extended the LFPAK56D MOSFET line-up with the AEC-Q101-qualified half-bridge package. It offers 60% lower parasitic inductance and improved thermal performance for power trains, motor control, and DC/DC application.

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumptions​ and Market Definition​
  • 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET INSIGHTS

  • 4.1 Market Overview​
  • 4.2 Industry Value Chain Analysis
  • 4.3 Industry Attractiveness - Porter's Five Forces Analysis​
    • 4.3.1 Bargaining Power of Suppliers​
    • 4.3.2 Bargaining Power of Consumers​
    • 4.3.3 Threat of New Entrants​
    • 4.3.4 Intensity of Competitive Rivalry​
    • 4.3.5 Threat of Substitutes​
  • 4.4 Assessment of the Impact of COVID-19 on the Market
  • 4.5 Technology Snapshot

5 MARKET DYNAMICS

  • 5.1 Market Drivers
    • 5.1.1 Increasing Demand for Consumer Electronics and Wireless Communications
    • 5.1.2 Growing Demand for Energy-efficient Battery-powered Portable Devices
  • 5.2 Market Restraints
    • 5.2.1 Shortage of Silicon Wafers and Variable Driving Requirements

6 MARKET SEGMENTATION

  • 6.1 By Component
    • 6.1.1 Discrete
    • 6.1.2 Module
    • 6.1.3 Power Integrated Circuits
  • 6.2 By Material
    • 6.2.1 Silicon/Germanium
    • 6.2.2 Silicon Carbide (Sic)
    • 6.2.3 Gallium Nitride (Gann)
  • 6.3 By End-user Industry
    • 6.3.1 Automotive
    • 6.3.2 Consumer Electronics
    • 6.3.3 IT and Telecommunication
    • 6.3.4 Military and Aerospace
    • 6.3.5 Power
    • 6.3.6 Industrial
    • 6.3.7 Other End-user Industries
  • 6.4 By Geography
    • 6.4.1 North America
    • 6.4.2 Europe
    • 6.4.3 Asia Pacific
    • 6.4.4 Latin America
    • 6.4.5 Middle East and Africa

7 COMPETITIVE LANDSCAPE

  • 7.1 Company Profiles
    • 7.1.1 Infineon technologies AG
    • 7.1.2 Texas instruments Inc.
    • 7.1.3 United Silicon Carbide Inc.
    • 7.1.4 ST Microelectronics NV
    • 7.1.5 NXP semiconductor Inc.
    • 7.1.6 ON Semiconductor Corporation
    • 7.1.7 Renesas Electronic Corporation
    • 7.1.8 Broadcom Inc.
    • 7.1.9 Toshiba Corporation
    • 7.1.10 Mitsubishi Electric Corporation
    • 7.1.11 Fuji Electric Co. Ltd
    • 7.1.12 Semikron International
    • 7.1.13 Cree Inc.
    • 7.1.14 ROHM​ Co Ltd
    • 7.1.15 Vishay Intertechnology Inc.​
    • 7.1.16 Nexperia BV​
    • 7.1.17 Alpha & Omega Semiconductor
    • 7.1.18 Magnachip​ Semiconductor Corp
    • 7.1.19 Microchip​ Technology Inc
    • 7.1.20 Littlefuse Inc

8 INVESTMENT ANALYSIS​​​

9 FUTURE OF THE MARKET​