全球晶圆加工和组装设备市场—增长、趋势、COVID-19 的影响和预测 (2023-2028)

在 2022 年至 2027 年的预测期内，全球晶圆加工和组装设备市场预计将以 8.4% 的复合年增长率增长。

晶圆加工和组装设备市场预计会随着消费电子产品需求的增长而增长。 随着对电子产品的需求不断增加，客户对改进新电子产品质量的期望也越来越高。 一些消费电子产品和 ID 解决方案，例如识别标籤和智能卡，将 RFID 与用于集成电路製造的晶圆相结合。 对无缝集成到电子产品中的超光滑表面和小型晶圆的需求越来越大。

主要亮点

• 根据印度品牌资产基金会的数据，到 2022 年，印度家电和消费电子 (ACE) 行业的产值预计将增长到 3.15 万亿印度卢比(483.7 亿美元)，复合年增长率为 9%。 印度的电子製造业预计也将在 2024-25 年达到 3000 亿美元(225 万亿)。 此外，消费电子产品的使用和消费增加将刺激对半导体的需求，预计这将在预测期内提振晶圆加工和组装设备市场收入。
• 晶圆加工和组装设备行业的一个突出趋势是对具有更高设备性能的小型化晶圆的需求不断增加。 例如，晶圆最终被压平到几十微米的厚度。 大多数用于存储器、CIS 和电源系统的半导体晶圆被减薄到 100 um 至 200 um 的厚度。 对于存储设备，需要最大限度地提高单个封装中的存储容量、提高数据传输速度和功耗，尤其是在移动应用中，这推动了对更薄设备的需求。 2D NAND/DRAM 等典型的存储设备使用厚度大于 200 um 的硅晶圆。
• 地区政府机构正计划投资半导体生产，这可能会为研究目标市场创造增长机会。 例如，2021年9月，德国经济部宣布为欧盟欧洲共同利益重点项目倡议拨款30亿欧元，这是欧盟刺激投资、降低进口依赖的主要补贴措施之一，您已表示愿意投资。 这笔钱将被德国政府用来建造一个新的半导体製造厂。 这项投资的主要目的是为了减少我们未来半导体需求对进口半导体的依赖。 像这样的政府政策将对研究目标市场产生重大影响。
• 在晶圆製造週期中，晶圆会承受机械负载，□□包括锯木厂、体力劳动、液体喷射、运输系统和取放设备。 当今市场上的功率半导体通常是在厚度为 50-100um 的 200mm 晶圆上製造的，儘管路线图允许更薄的晶圆降至 1um。 该晶圆的背面经过机械抛光。 抛光过程中会出现各种缺陷，如抛光痕迹、抛光不良造成的边缘缺口、星形裂纹、边缘颗粒卡在砂轮中的彗星、嵌入颗粒、钻孔线等。
• 此外，由于 COVID-19 大流行导致全球晶圆半导体短缺，公司正致力于提高产能。 例如，中芯国际(国际半导体製造公司)宣布将于 2021 年 9 月在上海自贸区开设一家新工厂。我们有积极的计划将其翻一番。

晶圆加工及组装设备市场趋势

薄膜沉积是推动市场的因素之一

• CVD(化学气相沉积)技术通常用于製造半导体和薄膜。 CVD设备市场的增长主要是由于半导体、LED和存储设备行业的快速增长，原因是基于微电子的消费品需求增加以及电镀中Cr6的严格使用限制。
• 2022 年 1 月，韩国特种真空炉製造商 Thermvac 开发了可在 900度C 至 2400度C 温度范围内使用的 CVD 设备的工艺技术、设计和製造技术。继续满足 这是为了应对半导体、光伏、手机、航空航天、国防等高科技行业对高温耐热CVD材料日益增长的需求。
• 线性溅射设备用于太阳能、显示器、数据存储和半导体等应用。 例如，2021年12月，博世开始量产SiC功率半导体，供应全球汽车製造商。 为了满足对半导体不断增长的需求，2021 年博世位于罗伊特林根的晶圆厂已经增加了 10,764 平方英尺的洁净室空间。 到 2023 年底将增加 32,292 平方英尺。 半导体产量的增加推动了所调查的市场。
• 该地区汽车行业的发展有望为市场增长创造重大机遇。 例如，迪拜最近发起了一项运动，到 2030 年在阿联酋的街道上拥有 42,000 辆电动汽车。 溅射设备用于涂覆传动系统轴承和部件，随着电动汽车开发的增加，将显着推动研究市场。
• 溅射薄膜越来越多地用于生物医学应用。 例如，圆柱形磁控管溅射已用于在批量医疗支架上沉积保护涂层。 纳米薄膜广泛应用于电子、纺织、製药、陶瓷和许多其他应用领域。 纳米薄膜涂层织物通常通过化学气相沉积、溶胶-凝胶和磁控溅射方法製成。 例如，磁控溅射法具有膜厚可控、纯度高、高速低温、附着力好、可操作性好、环境友好等优点。

亚太地区占据主要市场份额

• 亚太地区是全球增长最快的半导体市场。 许多供应商已在该地区设立生产设施，以满足中国、韩国和新加坡等国家对智能手机和消费电子产品的强劲需求。
• 为了满足广泛的客户需求，每家公司都启动了新项目并扩大了在该地区的业务。 例如，2021 年 9 月，UTAC Holding, Ltd. 在其先进的半导体製造解决方案套件中增加了最先进的等离子切割和多项目晶圆 (MPW) 功能。 等离子切割缩小了芯片之间的划线宽度并增加了每个晶圆的芯片数量。 它还提供了近乎完美的切割质量，没有碎屑或裂纹，与长期存在侧壁质量问题的传统机械锯切工艺相比具有明显优势。
• 此外，公共机构和私营公司还对新产品和研发设施进行投资。 例如，2021 年 9 月，中国最大的合同芯片製造商中芯国际 (SMIC) 宣布已与上海自由贸易区的临港特区达成协议。 根据协议，中芯国际将建立一个新的晶圆代工厂，每月生产10万片12英寸晶圆。 此外，2021 年 3 月，我们将与深圳市政府合作，投资 23.5 亿美元建设月产 40,000 片 12 英寸晶圆的製造工厂，该工厂将生产 28 纳米(纳米)或以上的集成电路。
• 同样，2021 年 10 月，新南威尔士州政府认识到全球半导体行业缺少澳大利亚主要参与者，并宣布了该中心的一项新计划 该枢纽，即半导体行业服务管理局 (S3B)，将设在悉尼的 Tech Central，并将由州政府资助。 此外，首席科学家和工程师办公室指出，在对国内半导体场景进行调研后，目前澳洲还没有一家主要以半导体设计或半导体开发为核心业务的公司。 新基地利用国内的晶圆加工和划片设备市场。
• 随着 TSV(硅通孔)技术在手机和无线/网络设备等低功耗、高性能设备中的普及，对隐形切割设备的需求不断增加。 由于 TSV 能够进行上述应用中的 2.5D/3D 封装，因此它是 TSV 组装/封装(使用隐形切割的芯片到芯片/芯片到晶圆组装等)的有效系统。 对于存储器和逻辑，激光切割和刀片切割结合使用。

晶圆加工及组装设备市场竞争分析

全球晶圆加工组装设备市场适度集中。 玩家倾向于投资于提供创新的产品，以满足不同行业不断变化的需求。 此外，参与者正在采取战略活动，如合作伙伴关係、合併和收购，以扩大他们的影响力。 市场的最新发展包括:

• 2022 年 3 月 - SK siltron 宣布其位于美国密歇根州贝城的碳化硅 (SiC) 半导体晶圆製造工厂开始运营。 我们计划每年生产约 60,000 件。 此外，6英寸SiC晶圆是主要产品。
• 2021 年 9 月 - Infineon Technologies AG 在其位于奥地利菲拉赫的工厂启动了一家高科技芯片工厂，用于在 300 毫米薄晶圆上製造功率半导体器件。 16亿欧元的投资将成为欧洲微电子领域最大的项目之一。 据该公司称，该工厂的工业半导体年产能据说足以支持产生约 1,500 TWh 电力的光伏系统，大约是德国年用电量的三倍。

其他好处

• Excel 格式的市场预测 (ME) 表
• 三个月的分析师支持

内容

第1章介绍

• 研究假设和市场定义
• 调查范围

第2章研究方法论

第 3 章执行摘要

第 4 章市场洞察

• 市场概览
• 产业吸引力 - 波特五力分析
  • 供应商的议价能力
  • 买家的议价能力
  • 新进入者的威胁
  • 替代品的威胁
  • 竞争公司之间的敌对关係
• 评估 COVID-19 对市场的影响

第 5 章市场动态

• 市场驱动力
  • 不断增加的消费者需求

对电子设备的需求不断增长

促进製造业发展

• 人工智能的扩散

人工智能、物联网、互联设备

各行业设备的激增

• 市场挑战
  • 技术的动态特性

需要对生产设备进行几处改动

生产设备

第 6 章市场细分

• 按设备类型
  • 化学机械抛光

(中医)

• 蚀刻
• 薄膜形成
  • 化学气相沉积
  • 溅射
  • 其他
• 光刻胶处理
• 装配设备
  • 贴片
  • 引线键合
  • 包装
  • 检查和切割

电镀等

• 区域信息
  • 亚太地区
  • 北美
  • 世界其他地区
• 按产品 - 晶圆加工设备
  • 动态随机存取存储器
  • 与非
  • 铸造/逻辑
  • 其他产品

第7章厂商排名分析

第8章竞争格局

• 公司简介
  • Applied Materials Inc
  • ASML Holding Semiconductor Company
  • Tokyo Electron Limited
  • Lam Research Corporation
  • KLA Corporation
  • Hitachi High-Technologies Corporation
  • Disco Corporation
  • ASM Pacific Technology
  • Kulicke and Soffa Industries, Inc
  • BE Semiconductor Industries N.V
  • Towa Corporation

第9章 投资分析

第10章 投资分析市场将来性

The Global Wafer Processing and Assembly Equipment Market is expected to grow at a CAGR of 8.4% during the forecast period of 2022 to 2027. The wafer processing and assembly equipment market is expected to grow in response to rising consumer electronics demand. Customer expectations for improved qualities of new electronic gadgets have risen as demand for electronic products has increased. Several consumer electronics and identity solutions, such as identification tags, smart cards, and others, combine RFIDs with wafers for integrated circuit fabrication. Customers increasingly demand ultra-smooth surfaces and smaller wafers for seamless integration into electronic products.

Key Highlights

• According to the Indian Brand Equity Foundation, In 2022, the Indian appliance and consumer electronics (ACE) sector is predicted to grow at a 9% compound annual growth rate (CAGR) to INR 3.15 trillion (USD 48.37 billion). The Indian electronics manufacturing sector is expected to reach USD 300 billion (INR 22.5 lakh crore) by 2024-25. Furthermore, increased consumer electronics device usage and consumption are predicted to fuel semiconductor demand, boosting wafer processing and assembly equipment market revenues throughout the projection period.
• A prominent trend in the wafer processing and assembly equipment industry is the growing demand for miniaturized wafers with higher device performance. Wafers, for example, are flattened down to final thicknesses of tens of micrometers. Most semiconductor wafers used in memory, CIS, and power applications are reduced to 100 µm-200 µm in thickness. In the case of memory devices, further thickness reduction is required due to the need to maximize the memory capacity of single packages, increased data transmission rates, and power consumption fueled mostly by mobile applications. Silicon wafers thicker than 200 µm are used in standard memory devices like 2D NAND/DRAM.
• The government bodies in the different regions are planning to invest in the production of semiconductors, which may create an opportunity for the studied market to grow. For instance, in September 2021, Germany's economy ministry stated that the country is willing to invest EUR 3 billion in the EU's "Important Projects of Common European Interest" initiative, which is one of the EU's primary subsidy tools for stimulating investment and reducing import dependency. The money will be used by the German government to build new semiconductor manufacturing factories. This investment is primarily aimed at reducing dependency on imported semiconductors for future semiconductor needs. Government policies like this will significantly drive the studied market.
• Wafers are subjected to mechanical loads induced by sawing, manual handling, liquid jets, transport systems, and pick and place equipment during the wafer manufacturing cycle. Power semiconductors on the market now are generally made on 200-mm wafers with thicknesses ranging from 50 to 100 µm, although their roadmaps allow for wafers as thin as 1 µm. Mechanical polishing thins the backside of these wafers. Grinding marks, grinding failures resulting in edge chips, star cracks, and comets generated by edge particles caught in the grinding wheel, embedded particles, cleavage lines, and a variety of other faults are all defects caused by the polishing process.
• Furthermore, the global shortage of wafer semiconductors led by the COVID-19 pandemic has encouraged players to focus on increasing production capacity. For instance, Semiconductor Manufacturing International Corp (SMIC) has indulged in aggressive plans to double its production capacity by 2025 by constructing new chip fabrication plants in different cities, including its announcement in September 2021 to establish a new factory in Shanghai's free trade zone.

Wafer Processing & Assembly Equipment Market Trends

Thin Film Deposition is One of the Factor Driving the Market

• The Chemical Vapor Deposition (CVD) technology is commonly employed in the fabrication of semiconductors and thin films. The expansion of the CVD equipment market is primarily driven by increasing demand for microelectronics-based consumer items, which is resulting in quicker growth of the semiconductor, LED, and storage device industries, as well as severe limits on the use of Cr6 for electroplating.
• In January 2022, ThermVac Inc., a Korean manufacturer of special vacuum furnaces, continues to respond to the needs of domestic and international clients by developing process technology and design and manufacturing technology for CVD equipment that can be used at temperatures ranging from 900°C to 2,400°C. This corresponds to the growing demand for high-temperature heat-resistant CVD components in high-tech industries like semiconductors, solar power, mobile phones, aerospace, and defense.
• The linear sputtering equipment is used in applications like solar energy, display, Data storage, semiconductor, and many more. For instance, in December 2021, Bosch started the volume production of Sic-based power semiconductors supplying automotive manufacturers worldwide. To meet the increasing demand for such semiconductors, an extra 10,764 square feet were already added to the clean-room space at the Bosch wafer fab in Reutlingen in 2021. Another 32,292 square feet will be added by the end of 2023. Such an increase in the production of semiconductors will drive the studied market.
• The advancements in the regional automotive industry are expected to create significant opportunities for market growth. For instance, Dubai recently launched a campaign to have 42,000 EVs on the streets of Emirates by 2030. The sputtering equipment is used in the coating of Drive train bearings and components as the increase in the developments of EV vehicles will significantly drive the studied market.
• Sputtered thin films are increasingly being used in biomedical applications. An example is a cylindrical magnetron sputtering to deposit protective coatings on batches of medical stents. Nano-films are widely employed in electronics, textiles, pharmaceuticals, ceramics, and various other applications. Fabrics coated with Nanofilm are often created by chemical vapor deposition, sol-gel technique, and magnetron sputtering. The magnetron sputtering method, for example, offers the benefits of controlled film thickness, high purity, high speed and low temperature, excellent adhesion, ease of operation, and environmental friendliness, among others.

Asia Pacific Holds the Major Share of the Market

• Asia-Pacific has the world's fastest-growing semiconductor market. Many vendors are setting up production facilities in the region in response to strong demand for smartphones and other consumer electronics gadgets from nations including China, the Republic of Korea, and Singapore.
• The companies are expanding their presence in the region by starting new projects to cater to the wide need of the customer. For instance, in September 2021, UTAC Holding, Ltd. added state-of-the-art plasma dicing and multi-project wafer (MPW) capabilities to a range of advanced semiconductor manufacturing solutions. Plasma dicing narrows the scribe line width between chips and increases the number of chips per wafer. Also, it provides "nearly perfect" cutting quality with no chips or cracks, which is a clear advantage over traditional mechanical sawing processes that lead to chronic sidewall quality issues.
• Further public agencies and private companies are investing in new products and research & development facilities. For instance, In September 2021, China's largest contract chipmaker Semiconductor Manufacturing International Corp (SMIC) announced the company's agreement with the Lin-Gang Special area-part of Shanghai's free trade zone. This agreement enables SMIC to establish a new foundry with a monthly planned capacity of 100,000 12-inch wafers. Also, in March 2021, the company announced an investment of USD 2.35 billion in coordination with the Shenzhen government for a manufacturing facility to produce 28nanometre (nm) and above integrated circuits with a monthly capacity of 40,000 12-inch wafers.
• Similarly, in October 2021, the Government of New South Wales is aware that the global semiconductor industry lacks Australia's major players and plans a new center to improve the feasibility of critical jobs in this sector. The hub, the Semiconductor Sector Service Bureau (S3B), will be based in Sydney's Tech Central and be funded by the state government. Further, Chief Scientist and Engineer Office, after researching the national semiconductor scene, mentioned there are currently no major Australian companies with semiconductor design or semiconductor development as their core business. The new hub leverages the country's wafer processing and dicing equipment market.
• The demand for stealth dicing equipment is growing as TSV (Through Silicon Via) technology becomes more prevalent for low-power, high-performance devices such as mobile phones and other wireless and networking devices. As TSV can package 2.5/3D for the applications listed above, the equipment is useful for TSV Assembly/Packaging (chip-to-chip and chip-to-wafer assembly with stealth dicing and other processes). In Memory and Logic, a combination of laser dicing and blade dicing is used.

Wafer Processing & Assembly Equipment Market Competitor Analysis

The Global Wafer Processing and Assembly Equipment market is moderately consolidated. Players tend to invest in innovating their product offerings to cater to the different industry's changing demands. Moreover, players adopt strategic activities like partnerships, mergers, and acquisitions to expand their presence. Some of the recent developments in the market are:

• March 2022 - SK siltron announced the beginning of the operation of the Silicon carbide (SiC) semiconductor wafer manufacturing plant in Bay City, Michigan, US. The company has a plan to produce around 60,000 annually. Also, a 6-inch SiC wafer is the main product of the company.
• September 2021 - Infineon Technologies AG launched its high-tech chip factory for power semiconductor devices on 300-millimeter thin wafers at its Villach site in Austria. At EUR 1.6 billion, the investment made by the company represents one of the largest such projects in the microelectronics sector in Europe. According to the company, the annual capacity planned for industrial semiconductors from the facility is sufficient to equip solar systems producing a total of around 1,500 TWh of electricity, which is around three times the annual power consumption of Germany.

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumption And Market Defination
• 1.2 Scope of the study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET INSIGHTS

• 4.1 Market Overview
• 4.2 Industry Attractiveness - Porter's Five Forces Analysis
  • 4.2.1 Bargaining Power Of Suppliers
  • 4.2.2 Bargaining Power Of Buyers
  • 4.2.3 Threat Of New Entrants
  • 4.2.4 Threat Of Substitutes
  • 4.2.5 Intensity Of Competitive Rivalry
• 4.3 Assessment of the Impact of Covid-19 on the Market

5 MARKET DYNAMICS

• 5.1 Market Drivers
  • 5.1.1 Increasing Needs of Consumer

Electronic Devices Boosting the

Manufacturing Prospects

• 5.1.2 Proliferation of Artificial

Intelligence, IoT and Connected

Devices across Industry Verticals

• 5.2 Market Challenges
  • 5.2.1 Dynamic Nature of Technologies

Requires Several Changes in

Manufacturing Equipment

6 MARKET SEGMENTATION

• 6.1 By Equipment Type
  • 6.1.1 Chemical Mechanical Polishing

(CMP)

• 6.1.2 Etching
• 6.1.3 Thin Film Deposition
  • 6.1.3.1 CVD
  • 6.1.3.2 Sputter
  • 6.1.3.3 Other Type
• 6.1.4 Photoresist Processing
• 6.1.5 Assembly Equipment
  • 6.1.5.1 Die Attach
  • 6.1.5.2 Wire Bonding
  • 6.1.5.3 Packaging
  • 6.1.5.4 Inspection, Dicing,

Plating and Others

• 6.2 By Geography
  • 6.2.1 Asia-Pacific
  • 6.2.2 North America
  • 6.2.3 Rest of the World
• 6.3 By Product - Wafer Processing Equipment
  • 6.3.1 DRAM
  • 6.3.2 NAND
  • 6.3.3 Foundry/Logic
  • 6.3.4 Other Products

7 VENDOR RANKING ANALYSIS

8 COMPETITIVE LANDSCAPE

• 8.1 Company Profiles
  • 8.1.1 Applied Materials Inc
  • 8.1.2 ASML Holding Semiconductor Company
  • 8.1.3 Tokyo Electron Limited
  • 8.1.4 Lam Research Corporation
  • 8.1.5 KLA Corporation
  • 8.1.6 Hitachi High-Technologies Corporation
  • 8.1.7 Disco Corporation
  • 8.1.8 ASM Pacific Technology
  • 8.1.9 Kulicke and Soffa Industries, Inc
  • 8.1.10 BE Semiconductor Industries N.V
  • 8.1.11 Towa Corporation

9 INVESTMENT ANALYSIS

10 FUTURE OF THE MARKET