标准逻辑 IC 市场 - COVID-19 的增长、趋势、影响和预测 (2023-2028)

在预测期内，全球标准 IC 市场预计将以 3.2% 的复合年增长率增长。

据说市场是进化的而不是革命的。 因为最近没有观察到明显的变化。 随着半导体行业的小型化趋势，现有架构和技术不断发展。

主要亮点

• 标准逻辑 IC 是集成电路形式的逻辑门。 该 IC 封装有用于电路中的引脚。 由于BiPolar技术和CMOS技术在製造工艺和架构上的差异，在工作电压、响应时间、输出形式等方面存在差异。 逻辑门的贡献在电子设计和功率优化中是必不可少的。
• 通过改进陶瓷和塑料实现封装解决方案的小型化在为特定用途选择合适的逻辑 IC 方面发挥了重要作用。 7400 系列和 4000 系列是使用最广泛的标准逻辑 IC。 设备的小型化，尤其是消费电子产品，一直是人们关注的焦点，并塑造了整个行业。
• 製造商强调使用新的和改进的逻辑 IC，它们具有更好的温度监控和适应性，有望在汽车行业等行业提供全面服务。 例如，2021 年 11 月，三星电子宣布了三款用于下一代汽车的全新逻辑解决方案：Exynos Auto T5123、Exynos V7 和 S2VPS01。 S2VPS01 是一款电源管理 IC (PMIC)，可调节和整流车载信息娱乐性能的电源输入。 该 IC 包括各种功能以防止恶劣的热环境，例如过压保护 (OVP) 和热关断 (TSD)。
• 在 COVID-19 疫情期间，对半导体设备的需求转向消费电子产品和用于医疗保健设备的计算设备。 这影响了逻辑 IC 製造行业定制构建的正常需求週期。 排除这种影响，对标准 IC 解决方案的需求温和而强劲，消费电子产品线弥补了受影响的工业应用。 后疫情时代，多个行业将復苏，半导体需求将飙升，逻辑IC市场也将加速。

标准逻辑IC市场趋势

汽车行业是最大的需求来源

• 汽车行业经常期待大规模的电气化和发展。 智能连接技术和自主能力的引入正在推动对半导体封装的需求。 这导致电路、MPU、传感器的使用增加，以及标准逻辑 IC 的部署用于电源调节和整流。
• 提高安全性和舒适性的新时代技术正在积极增加半导体在乘用车中的使用。 为了满足安全标准，例如安全气囊、自动驾驶功能和电子稳定控制 (ESC) 程序，公司使用最好的逻辑 IC 之一，同时遵守严格的电路级法规。 例如，德州仪器 (TI) 等公司提供符合 AEC-Q100 标准的汽车逻辑设备。 该 IC 支持 5V 至 1.2V 的宽电源电压范围，以满足任何汽车系统的要求，包括信息娱乐系统、车身控制模块、汽车照明和高级驾驶员辅助系统 (ADAS)。
• IoT 服务和远程访问功能（例如地理围栏、远程信息处理、车队管理系统、自动驾驶和半自动驾驶辅助、车载信息娱乐系统以及其他基于 SIM 卡的实用程序）将使汽车行业转变为高密度通信应用.我领先 这导致越来越多地引入通信模块和传感器，以提供详细的原理图输入参数以供进一步处理。 特别是在电动汽车中，模块和传感器广泛使用逻辑 IC 来维持电气安全标准和电源效率。
• 随着世界向电动汽车 (EV) 过渡，对电气参数的广泛监管要求需要逻辑门 IC 来安全实施充电和放电技术。 汽车公司正在整个车辆、报废部署阶段和充电基础设施中利用逻辑 IC 的潜在和宽电压处理能力。 这些因素正在推动标准逻辑 IC 行业的创新和进步，以优化功耗、工作电压和缩放特性。

亚太地区推动市场增长

• 我们在亚洲最大的製造基地包括中国大陆、台湾、韩国和日本。 廉价的熟练劳动力、有利的天气条件、政府的激励措施、强大的电力和水利基础设施、交通和物流以及有吸引力的投资条件支持半导体製造业的发展。 这些行业是标准製造逻辑 IC 和存储设备的主要贡献者。
• 根据半导体行业协会 (SIA) 提供的 2021 年美国半导体行业状况，全球半导体总製造能力的大约 75% 位于东亚。 当前运行的製造设备具有7nm及以下的尖端能力。 鑑于当前的市场环境，预计该地区的主导地位在预测期内将继续上升。 如此高的发展速度背后是政府的激励措施，与其他地区相比，可以显着降低总体拥有成本 (TCO)。
• 据 SIA 称，台湾公司在 80 年代末和 90 年代初建立了代工模式。 这些部门专门製造由其他地区的公司设计的芯片。 台湾现在拥有世界前五名代工厂中的两个，占世界总产能的20%。 与英特尔（美国）和三星（韩国）一起，台积电是能够生产先进节点（10 纳米及以下）逻辑芯片的三大公司之一。 这些先进的逻辑芯片将安装在计算密集型设备中，例如个人电脑、数据中心/人工智能服务器和智能手机。 全球大部分顶级节点（5nm和7nm）产能都在台湾。
• 半导体製造所需材料的高度集成，例如光致抗蚀剂、硅晶片、包括封装基板在内的化学品和特种气体，也在决定逻辑 IC 製造的位置。 例如，蚀刻工艺需要 C4F6，并且可以比最接近的替代品快 30% 的速度完成工艺。 亚洲国家，尤其是台湾，已经看穿了这样的事情。 为其他地区聚集这些资源以削弱亚洲的主导地位需要大量的投资和时间。

标准逻辑IC市场竞争者分析

标准逻辑 IC 市场的竞争是温和的。 在这个市场上，製造商和客户定期合作开发系统。 观察到共享专业知识并利用新的逻辑门 IC 来提高操作和功率效率。 改进热管理、系统响应时间和优化功耗是关键目标。

其他好处

• Excel 格式的市场预测 (ME) 表
• 三个月的分析师支持

内容

第1章介绍

• 调查假设和市场定义
• 调查范围

第2章研究方法论

第 3 章执行摘要

第4章市场动态

• 市场概览
• 产业吸引力 - 波特五力分析
  • 新进入者的威胁
  • 买家的议价能力
  • 供应商的议价能力
  • 替代品的威胁
  • 竞争公司之间的敌对关係
• 市场驱动力
  • 工业4.0推动逻辑IC普及
  • 半导体和电路的以应用为中心的要求
• 市场製约因素
  • 製造业高度依赖铸造厂

第 5 章市场细分

• 按类型
  • 数字双极
  • 电脑芯片
  • MOS门阵列
  • MOS 通用逻辑
  • MOS 标准单元
  • MOS显示驱动
  • MOS触摸屏控制器
• 通过申请
  • 沟通
  • 车载
  • 消费类电子产品
  • 工业
  • 医疗保健
  • 其他用途
• 区域信息
  • 北美
  • 欧洲
  • 亚太地区
  • 世界其他地区

第6章竞争格局

• 公司简介
  • Diodes Incorporated
  • Texas Instruments Incorporated
  • Xilinx, Inc.
  • STMicroelectronics N.V
  • Toshiba Electronic Devices and Storage Corporation
  • ROHM Co., Ltd.
  • Microchip Technology Incorporated
  • NXP Semiconductors N.V.
  • ON Semiconductor Corporation
  • Samsung Electronics Company Ltd.
  • Intel Corporation

第7章 市场机会与今后动向

The global standard IC market is expected to witness a CAGR of 3.2% over the forecast period. The market is described as evolutionary instead of revolutionary because no drastic change has been observed lately. The pre-existing architectures and technologies continue to evolve with scaling-down trends in the semiconductor industry.

Key Highlights

• Standard logic ICs are logic gates in the form of integrated circuits. The ICs are packaged with pins meant for further use in circuitry. The different manufacturing processes and architectures of BiPolar and CMOS technologies provide the difference in operational voltages, response time, and output form. The contributions of logic gates in electronic design and power optimization are essential.
• The scaling down of packaging solutions driven by improvements in ceramics and plastics has played an integral role in choosing the appropriate logic IC for specific purposes. 7400 and 4000 series are among the most broadly used standard logic ICs. The constant focus on scaling down devices, especially consumer electronics, has shaped the industry.
• Manufacturers highlight the use of new and improved logic ICs with better temperature monitoring and adaptability, promising full service in industries like the automotive industry. For instance, in November 2021, Samsung Electronics introduced three new Logic solutions for the next generation of automobiles, including Exynos Auto T5123, Exynos V7, and S2VPS01. The S2VPS01 is a power management IC (PMIC) that regulates and rectifies electrical power input to in-vehicle infotainment performance. The IC is bundled with various features for protection from harsh thermal conditions, including over-voltage protection (OVP) and thermal shut down (TSD).
• The demand for semiconductor devices during the COVID-19 pandemic shifted towards consumer electronics and computing devices for healthcare equipment. This affected the regular demand cycle in the logic IC manufacturing industry for custom builds. Apart from the shift, the demand for standard IC solutions was moderate to steady, with the affected industrial applications compensated by the consumer electronics product lines. In the post-pandemic world, as several industries revive, the demand for semiconductors spikes, accelerating the logic IC market.

Standard Logic IC Market Trends

Automotive Industry to Generate the Maximum Demand

• The automotive industry is looking forward to wide-scale electrification and advancements regularly. The introduction of smart connected tech and autonomous features is driving the demand for the implementation of semiconductors. Hence, the increased use of circuitry, MPUs, and sensors directs the increased deployment of standard logic ICs for power regulation and rectification.
• The new-age technology catering to safety and modification of ride dynamics is aggressively increasing the use of semiconductors in passenger vehicles. To meet safety norms like airbags, autonomous features, electronic stability control (ESC) programs, and others, companies follow strict regulations on circuit level and use one of the best logic ICs available. For instance, companies like Texas Instruments (TI) offers automotive logic devices compliant with the AEC-Q100 standard. The ICs support a wide range of supply voltages, ranging between 5V and 1.2V, to meet the requirements of any automotive system, including infotainment systems, body control modules, automotive lighting, and advanced driver assistance systems (ADAS).
• IoT Services and remote access features like geofencing, telematics, fleet management systems, autonomous and semiautonomous driving assists, in-vehicle infotainment, and other SIM-based utilities are taking the automotive sector towards dense application of communication. This encourages the deployment of communication modules and more sensors to provide detailed schematic input parameters for further processing. The modules and sensors are extensively using logic ICs to maintain electrical safety standards and power efficiency, especially in electric vehicles.
• As the world is shifting toward Electric Vehicles (EVs), the requirement of extensive regulation of electrical parameters invites logic gate ICs for safer implementation of the charging and discharging technologies. Automotive companies utilize the potential and wide range of voltage handling capabilities of logic ICs through the vehicles' and final deployment stages and charging infrastructure. These factors drive the innovation and advancement in the standard logic IC industry to optimize power consumption, operating voltages, and scaling properties.

Asia Pacific Region to Drive the Market Growth

• Some of Asia's biggest manufacturing hubs include China, Taiwan, South Korea, and Japan. The availability of a cheaper skilled workforce, favorable weather conditions, government incentives, robust power, and water infrastructure, transportation and logistics, and attractive investment conditions help the semiconductor fabrication industries flourish. These industries contribute significantly to standard manufacturing logic ICs and storage devices.
• According to the 2021 State of the U.S. Semiconductor industry provided by the Semiconductor Industry Association (SIA), about 75% of the world's total semiconductor manufacturing capacity lies in East Asia. The currently operating manufacturing units have 7 nm and below leading-edge capabilities. The current market conditions promise the region's overall domination to continue rising over the forecast period. Major credit for this high rate of development goes to the significant government incentives that significantly bring down the Total Cost of Operation (TCO) compared to the alternate locations.
• According to SIA, Taiwanese firms founded the foundry model in the late 1980s and 1990s. These units specialized in manufacturing the chips designed by firms from other regions. Today Taiwan comprises two of the five largest foundries globally, hosting 20% of the total global capacity. TSMC is one of the three firms, along with Intel (US) and Samsung (South Korea), that can produce logic chips in advanced nodes (10 nanometers or below). These advanced logic chips are deployed in compute-intensive devices like PCs, data center/AI servers, and smartphones. Most of the world's capacity in the top nodes (5 and 7 nanometers) is located in Taiwan.
• The high concentration of the materials required for semiconductor manufacturing like photoresists, silicon wafers, chemicals including packaging substrates, or specialty gases also defines the location of manufacturing logic ICs. For instance, C4F6 is required for the etching process, enabling the process completion 30% faster than the closest alternative. Asian countries, especially Taiwan, have figured out such factors. It would take a notable amount of investment and time for the other regions to align such resources to disrupt the Asian dominance.

Standard Logic IC Market Competitor Analysis

The standard logic IC market is moderately competitive. The market witnesses regular collaboration among manufacturers and client companies to venture into developing systems. The industry observes sharing expertise, leveraging new advanced logic gate ICs, and boosting operational and power efficiency. Improved heat management, system response time, and power consumption optimization are some of the critical goals.'

• March 2022 - NXP Semiconductors and Hitachi Energy collaborated to fasten the adoption of silicon carbide (SiC) power semiconductor modules in e-mobility. The partnership aims to provide SiC MOSFET-based, more efficient, reliable, and functionally safe solutions. These solutions will be deployed for powertrain inverters, leveraging NXP's advanced, high-performance GD3160 isolated HV Gate Drivers and Hitachi Energy's RoadPak automotive SiC MOSFET power modules.
• May 2021 - Samsung electronics announced the allocation of KRW 171 Trillion in Logic Chip Buniesses by 2030. The plan displays an increase of KRW 38 Trillion compared to the one conveyed in April 2019. The company has also declared constructing a new production line in Pyeongtaek, Korea, expected to be completed by the 2022 second half. The plant will contribute to carrying out 5-nanometer logic semiconductors and 14-nanometer DRAM manufacturing processes, featuring Extreme Ultraviolet (EUV) lithography technology.

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumption & Market Definition
• 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET DYNAMICS

• 4.1 Market Overview
• 4.2 Industry Attractiveness - Porter's Five Forces Analysis
  • 4.2.1 Threat of New Entrants
  • 4.2.2 Bargaining Power of Buyers
  • 4.2.3 Bargaining Power of Suppliers
  • 4.2.4 Threat of Substitute Products
  • 4.2.5 Intensity of Competitive Rivalry
• 4.3 Market Drivers
  • 4.3.1 Industry 4.0 Driving the Deployment of Logic ICs
  • 4.3.2 Application-Centric Demands for Semiconductor and Circuitry
• 4.4 Market Restraints
  • 4.4.1 High Dependence on Foundries for Manufacturing

5 MARKET SEGMENTATION

• 5.1 By Type
  • 5.1.1 Digital Bipolar
  • 5.1.2 CMOS
  • 5.1.3 MOS Gate Arrays
  • 5.1.4 MOS General Purpose Logic
  • 5.1.5 MOS Standard Cells
  • 5.1.6 MOS Display Drives
  • 5.1.7 MOS Touch Screen Controllers
• 5.2 By Application
  • 5.2.1 Communication
  • 5.2.2 Automotive
  • 5.2.3 Consumer Electronics
  • 5.2.4 Industrial
  • 5.2.5 Healthcare
  • 5.2.6 Other Applications
• 5.3 By Geography
  • 5.3.1 North America
  • 5.3.2 Europe
  • 5.3.3 Asia-Pacific
  • 5.3.4 Rest of the World

6 COMPETITIVE LANDSCAPE

• 6.1 Company Profiles
  • 6.1.1 Diodes Incorporated
  • 6.1.2 Texas Instruments Incorporated
  • 6.1.3 Xilinx, Inc.
  • 6.1.4 STMicroelectronics N.V
  • 6.1.5 Toshiba Electronic Devices and Storage Corporation
  • 6.1.6 ROHM Co., Ltd.
  • 6.1.7 Microchip Technology Incorporated
  • 6.1.8 NXP Semiconductors N.V.
  • 6.1.9 ON Semiconductor Corporation
  • 6.1.10 Samsung Electronics Company Ltd.
  • 6.1.11 Intel Corporation

7 MARKET OPPORTUNITIES AND FUTURE TRENDS