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市场调查报告书
商品编码
1438380

磷化铟晶圆：市场占有率分析、产业趋势与统计、成长预测（2024-2029）

Indium Phosphide Wafer - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2024 - 2029)
出版日期: | 出版商: Mordor Intelligence | 英文 115 Pages | 商品交期: 2-3个工作天内

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简介目录

磷化铟晶圆市场规模预计到2024年为1.7703亿美元，预计到2029年将达到3.1115亿美元，在预测期内（2024-2029年）市场规模将增至1194万美元，复合年增长率为%。

磷化铟晶圆 - 市场

磷化铟 (InP) 具有可产生高效雷射、调变和高灵敏度检测器的特性。它还可以产生雷射讯号并将这些讯号转换为电子形式以进行识别。这些产品用于企业网路、资料中心、远距光纤连接、3G、5G 和 LTE基地台无线连接以及卫星通讯。这些不断增长的需求正在推动市场的发展。

主要亮点

  • 磷化铟晶圆越来越多地被用于製造应用，例如汽车雷射雷达、3D 感测、消费性穿戴设备以及通讯领域资料通讯的成长。预计这将在预测期内推动市场。此外，InPin的主要应用包括5G通讯、使用光和雷射的资料中心连接、光纤雷射和检测器、硅光电、射频放大器、军事和5G通讯中使用的开关以及医疗领域中的红外线。这包括热成像等。
  • 称为光电装置的电子元件可侦测和调节光。将电讯息转换为红外线或可见能量，反之亦然。应用于太阳能发电、光纤通讯系统、监控控制电路、电眼等。光电元件用于量子级联雷射和用于受激发射的注入雷射二极体。 LED 和影像感测器用于数位成像系统、包装和安全应用。
  • 根据2020年11月发布的爱立信移动报告，预计到年终，全球行动资料流量将达到每月约51 EB（Exabyte）。预计这一数字将增加近 4.5 倍，达到每月 226 EB。这一数字代表了超过 60 亿同时使用智慧型手机、笔记型电脑和大量新设备的人消耗的行动资料。
  • 半导体硅片是电子工业的基础，也是许多微电子装置的关键零件。由于当前的技术形势、电子移动性和数数位化的进步，这些产品现已广泛用于各种设备中。对更小型设备的需求也大大增加了对单一设备附加功能的需求，从而推高了硅晶圆的价格。
  • 由于全球大多数地区仍处于封锁状态，冠状病毒感染疾病(COVID-19) 大流行已导致半导体製造设备行业的多种产品停止​​生产。封锁措施减少了消费性电子产品的需求，影响了全球半导体产业。全球汽车需求和出货货量的持续下降对半导体市场产生了负面影响，目前对半导体製造设备的需求低迷。

磷化铟晶圆市场趋势

消费性电器产品产业可望带动市场

  • 穿戴式科技是一种发展趋势，它将电子产品整合到日常活动中，并透过能够佩戴在身体的任何部位来适应不断变化的生活方式。连接互联网的能力以及在网路和设备之间提供资料交换选项等因素正在引领可穿戴技术的趋势。
  • 据思科系统公司称，全球连网穿戴装置数量三年内翻了一番，从 2016 年的 3.25 亿增加到 2019 年的 7.22 亿。预计到 2022 年，设备数量将超过 10 亿台。
  • 此外，根据日本内务部，截至 2021 年，超过 7% 的日本家庭拥有穿戴式装置。在整个研究期间（2014-2021年），穿戴式装置的家庭普及稳定成长，从2014年的0.5%上升到2020年的5%。
  • 全球都市化不断上升，推动了对先进且具有视觉吸引力的产品的需求，这些产品的功能可以更好地满足消费者的需求，例如在一台设备上实现多种功能和时间表，并且这种需求正在增加。此外，世界各地大量的千禧世代正在迅速采用智慧型手錶，因为他们追踪正常工作时间和奢侈消费标准的能力不断增强。
  • 例如，爱立信的数据显示，全球智慧型手机用户数从 2020 年的 59.24 亿跃升至 2021 年的 62.59 亿。到 2027 年，这一数字预计将达到 76.9 亿。
  • 此外，根据诺基亚 2022 年年度行动宽频指数报告，4G 设备生态系统的成长正在推动 4G用户和资料消费量的成长。 2021年，印度智慧型手机出货创下历史新高，超过1.6亿部，其中5G设备3000万部，活跃4G设备比例超过80%，数量已超过1000万部。诺基亚的报告也预测，到 2025 年，智慧型手机用户的采用率将增加至 60-75%。

亚太地区预计将成为成长最快的市场

  • 亚太地区占据全球半导体代晶圆代工厂份额，台积电、三星电子等大公司集中于此。台湾、韩国、日本和中国大陆占据了该地区的主要市场占有率。根据美国工业协会（SIA）的数据，从1990年到2020年，美国在全球晶圆厂装置容量中所占的份额持续下降。同期，亚洲新晶圆厂的开发迅速增加，目前正处于不断增加的速度。它占世界产能的很大份额。
  • 中国有一个非常雄心勃勃的半导体计划。在1500亿美元资金的支持下，该国正在发展国内积体电路产业，并计划製造更多晶片。大中华区，包括香港、中国和台湾，是一个地缘政治热点。中美贸易战正在加剧这个位置所有主要製程技术的地区的紧张局势，迫使许多中国公司投资半导体晶圆代工厂。
  • 中国于 2021 年 3 月公布的新的 2021-2025 年五年计画将加强基础研究确定为首要任务。 2021年中央基础研究经费预估成长11%，远高于计画中R&D整体投入7%及GDP成长6%的目标。半导体已被指定为获得优先资金和资源的七个领域之一。设计公司开发奈米级积体电路，执行电子设备运作的关键任务，例如运算、储存、网路连接和电源管理。由于晶片需求强劲，预计 2021 年利润将增加一倍以上。中国主要半导体晶圆代工厂已拨出创纪录的金额用于2022年的产能开发。中芯国际 (SMIC) 今年预留了 50 亿美元的资本支出，高于 2021 年的 45 亿美元。
  • 中国在 7 奈米晶片生产方面离自力更生越来越近了。据报道，中国在 7 奈米晶片製造製程方面取得了突破性进展，并正在为製造製程的多个环节开发工具和专有技术，以减少对外国设备和材料供应商的依赖。
  • 研究和合作伙伴关係的显着成长进一步提高了市场成长率。例如，LioniX International (LXI) 和中国科学院微电子研究所 (IMECAS) 正在透过积极支援能力和提供两个平台来扩大其光子积体电路 (PIC) 平台合作伙伴关係。 PIC形势的重要平台包括绝缘体上硅 (SOI)、磷化铟 (InP) 和基于氮化硅的 TriPleX 平台。这些平台可透过多计划晶圆 (MPW) 存取取得。

磷化铟晶圆产业概况

磷化铟晶圆製造领域领先製造商的不断增加预计将加剧预测期内竞争公司之间的敌对状态。 JX Nippon Mining 和 Powerway Advanced Materials 等市场老牌企业对整个市场有重大影响。

  • 2022 年 3 月：英特尔公布了在德国新建第二个「巨型晶圆厂」晶片製造地的计划，预计在多个欧洲国家投资 880 亿美元。此外，2021 年 8 月，ACM Research Inc. 推出了斜角蚀刻产品。该工具进一步扩展了 ACM 的综合湿式工具产品，最大限度地减少了边缘污染对后续製程步骤的影响，并提高了晶片製造产量比率。
  • 2022 年 2 月：加拿大政府宣布对加拿大半导体和光电产业进行重大投资。 2.4 亿加元的投资将加强加拿大作为光电领域世界领导者的地位，并加强半导体开发和製造。超过100家国内外半导体公司在加拿大从事微晶片研发。拥有30多个应用研究实验室和5个商业设施，涵盖化合物半导体、电子机械系统（MEMS）和先进封装等领域。

其他福利

  • Excel 格式的市场预测 (ME) 表
  • 3 个月分析师支持

目录

第一章简介

  • 研究假设和市场定义
  • 调查范围

第二章调查方法

第三章执行摘要

第四章市场洞察

  • 市场概况
  • 产业吸引力－波特五力分析
    • 供应商的议价能力
    • 买方议价能力
    • 新进入者的威胁
    • 替代产品的威胁
    • 竞争公司之间的敌意强度
  • 产业价值链分析
  • 技术简介
  • 评估 COVID-19 对产业的影响

第五章市场动态

  • 市场驱动因素
    • 光电器件的使用增加
    • 资料通讯业务及5G成长
  • 市场限制因素
    • 与其他替代方案的竞争

第六章市场区隔

  • 依直径
    • 50.8 毫米或 2 英寸
    • 76.2 毫米或 3 英寸
    • 100 毫米或 4 吋或以上
  • 按最终用户行业应用
    • 家用电器
    • 电讯
    • 医疗保健
    • 其他最终用户行业应用
  • 按地区
    • 北美洲
    • 欧洲
    • 亚太地区
    • 世界其他地区

第七章 竞争形势

  • 公司简介
    • AXT Inc.
    • Wafer World Inc.
    • Logitech Ltd.
    • Western Minmetals（SC）Corporation
    • Century Goldray Semiconductor Co. Ltd
    • Semiconductor Wafer Inc.
    • Ding Ten Industrial Inc.
    • Sumitomo Electric Semiconductor Materials Inc.（Sumitomo Electric Industries Ltd）
    • Xiamen Powerway Advanced Material Co. Ltd
    • JX Nippon Mining &Metals Corporation（Eneos Holdings Inc.）

第八章投资分析

第九章市场机会与未来趋势

简介目录
Product Code: 66420

The Indium Phosphide Wafer Market size is estimated at USD 177.03 million in 2024, and is expected to reach USD 311.15 million by 2029, growing at a CAGR of 11.94% during the forecast period (2024-2029).

Indium Phosphide Wafer - Market

Indium phosphide (InP) has properties that produce highly efficient lasers, modulators, and sensitive photodetectors. It can also generate laser signals and convert and identify those signals back to the electronic form. These are used for company networks and data centers, long-haul optical fiber connections over far distances, wireless connections for 3G, 5G, and LTE base stations, and satellite communication. The growth in such requirements is driving the market.

Key Highlights

  • Indium phosphide wafers are increasingly adopted in the manufacture of LiDAR for automotive, 3D sensing, consumer wearables, and the growth in datacom in the telecommunication sector. This is expected to drive the market during the forecast period. In addition, some of the major applications of InPinclude 5G communications, data center connectivity that uses lights and lasers, fiber optic lasers and detectors, silicon photonics, RF amplifiers, and switches used in military and 5G communications, and infrared thermal imaging in health.
  • Electronic components known as optoelectronic devices detect and regulate light. They convert electrical information into infrared or visible energy and vice versa. It is utilized in photovoltaic power supply, optical fiber communication systems, monitor and control circuits, and electric eyes. Optoelectronic components are used in quantum cascade lasers and injection laser diodes for stimulated emission. LEDs and image sensors are utilized in digital imaging systems, packaging, and safety applications.
  • According to the Ericsson Mobility Report published in November 2020, the global mobile data traffic was estimated to reach around 51 EB (exabytes) per month by the end of 2020. This was projected to grow by a factor of almost 4.5 to reach 226 EB per month in 2026. This figure represents the mobile data that will be consumed by greater than 6 billion people using smartphones, laptops, and a multitude of new devices at a time.
  • The semiconductor silicon wafer serves as the foundation of the electronics industry and is the main component of many microelectronic devices. With the current advances in the technology landscape, electronic mobility, and digitalization, these items are finding use in a wide range of devices. The requirement for additional capability from a single device has also grown dramatically as a result of the need for small-sized gadgets, which boosts the price of the silicon wafer.
  • The COVID-19 pandemic has halted the manufacturing of several items in the semiconductor production equipment industry owing to the continued lockdown in most regions across the world. Lockdown measures reduced the demand for consumer electronic gadgets, which had a global impact on the semiconductor sector. The continued decline in worldwide demand and export shipments for automobiles caused a negative impact on the semiconductor market, which is currently slowing down the demand for semiconductor manufacturing equipment.

Indium Phosphide Wafer Market Trends

Consumer Electronics Segment Expected to Drive the Market

  • Wearable technology, a developing trend, integrates electronics into daily activities and addresses the changing lifestyles with the ability to be worn on any part of the body. Factors such as the ability to connect to the internet and provide data exchange options between a network and a device are leading to the trend of wearable technology.
  • According to Cisco Systems, the number of connected wearable devices globally has doubled in the span of three years, increasing from 325 million in 2016 to 722 million in 2019. The number of devices is forecasted to be over 1 billion by 2022.
  • Further, according to the Ministry of Internal Affairs and Communications (Japan), as of 2021, over 7% of households in Japan owned a wearable device. The household penetration rate of wearable devices steadily increased throughout the surveyed period (2014-2021), rising from 0.5% in 2014 to 5% in 2020.
  • The rising rates of urbanization in various parts of the world have driven the demand for advanced, aesthetically appealing products that possess the ability to serve the consumers' requirements better, such as multiple features in one device and time schedules. Moreover, the vast millennial population across the globe has been quick to adopt smartwatches, owing to the increased spending ability on their regular work hours tracking and luxury standards.
  • For instance, according to Ericsson, the number of smartphone subscriptions worldwide witnessed an upsurge from 5,924 million in 2020 to 6,259 million in 2021. The number is estimated to reach 7,690 million in 2027.
  • Further, according to the Nokia annual mobile broadband index report 2022, the growing ecosystem of 4G-capable devices is driving the growth in 4G subscribers and data consumption. India recorded the highest-ever shipment of over 160 million smartphones, including 30 million 5G devices, in 2021, with active 4G capable devices crossing 80% and the number of active 5G capable devices crossing 10 million. The Nokia report also forecasted that user adoption will increase to 60-75% of the smartphone user base by 2025.

Asia-Pacific Expected to be the Fastest-growing Market

  • The Asia-Pacific region commands a prominent share of semiconductor foundries globally, with major companies such as TSMC and Samsung Electronics. Taiwan, South Korea, Japan, and China have a significant market share in the region. According to the US Semiconductor Industry Association (SIA), the US share of the global installed wafer fab capacity constantly declined from 1990 to 2020. During the same period, Asia saw a meteoric rise in developing new fabs to the point where it now accounts for a significant share of the world's capacity.
  • China has a very ambitious semiconductor agenda. Backed by USD 150 billion in funding, the country is developing its domestic IC industry and plans to make more of its chips. Greater China, which encompasses Hong Kong, China, and Taiwan, is a geopolitical hotspot. The US-China trade war is compounding tensions in an area where all the leading process technology is located, forcing many Chinese companies to invest in their semiconductor foundries.
  • China's new five-year plan for 2021-2025, announced in March 2021, established that boosting basic research was a critical priority. The central government's spending on basic research was expected to increase by 11% in 2021, well above the 7% planned for the overall R&D investment and the 6% target for GDP growth. Semiconductors were designated as one of the seven areas that will be given priority in terms of funding and resources. Firms involved in design develop nanometer-scale integrated circuits that perform the critical tasks that make electronic devices work, such as computing, storage, network connectivity, and power management. The profit was estimated to more than double in 2021 because of the robust chip demand. China's leading semiconductor foundry set aside a record sum for capacity development in 2022. This year, Semiconductor Manufacturing International Corp (SMIC) set aside USD 5 billion for capital spending, up from USD 4.5 billion in 2021.
  • China is moving significantly closer to self-reliance in 7 nm chip production. China has made breakthroughs in its 7 nm chip-making process, reportedly developing tools and know-hows for several segments of the manufacturing process amid efforts to reduce reliance on foreign equipment and material vendors.
  • The significant research and partnership growth further bolsters the market growth rate. For instance, LioniXInternational (LXI) and the Institute of Microelectronics Chinese Academy of Science (IMECAS) agreed to expand their Photonic Integrated Circuit (PIC) platform partnership by actively supporting the functionality and offering both platforms. The critical platforms in the PIC landscape include Silicon On Insulator (SOI), Indium Phosphide (InP), and the silicon nitride-based TriPleXplatform. These platforms are available through Multi-Project Wafer (MPW) access.

Indium Phosphide Wafer Industry Overview

The growing presence of large manufacturers in the indium phosphide wafer manufacturing sector is expected to intensify competitive rivalry during the forecast period. Market incumbents, such as JX Nippon Mining & Metals Corporation and Powerway Advanced Material Co. Ltd, considerably influence the overall market.

  • March 2022: Intel revealed plans for a second new 'Megafab," a chipmaking site in Germany, with an expected USD 88 billion in investments across several European countries. Further, in August 2021, ACM Research Inc. launched its Bevel Etch product, which further expanded ACM's comprehensive offering of wet tools. This tool minimizes the impact of edge contamination for subsequent process steps and improves chip manufacturing yield.
  • February 2022: The Government of Canada announced a significant investment in the Canadian semiconductor and photonics industries. The investment of CAD 240 million will help solidify Canada's role as a global leader in photonics and will bolster the development and manufacturing of semiconductors. Over 100 domestic and international semiconductor companies work on microchip research and development in Canada. There are over 30 applied research laboratories and five commercial facilities for areas including compound semiconductors, microelectromechanical systems (MEMS), and advanced packaging.

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumptions and Market Definition
  • 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET INSIGHTS

  • 4.1 Market Overview
  • 4.2 Industry Attractiveness - Porter's Five Forces Analysis
    • 4.2.1 Bargaining Power of Suppliers
    • 4.2.2 Bargaining Power of Buyers/Consumers
    • 4.2.3 Threat of New Entrants
    • 4.2.4 Threat of Substitute Products
    • 4.2.5 Intensity of Competitive Rivalry
  • 4.3 Industry Value Chain Analysis
  • 4.4 Technology Snapshot
  • 4.5 Assessment of the Impact of COVID-19 on the Industry

5 MARKET DYNAMICS

  • 5.1 Market Drivers
    • 5.1.1 Increasing Use of Optoelectronic Devices
    • 5.1.2 Growth of Datacom Business and 5G
  • 5.2 Market Restraints
    • 5.2.1 Competition from Other Substitutes

6 MARKET SEGMENTATION

  • 6.1 By Diameter
    • 6.1.1 50.8 mm or 2 "
    • 6.1.2 76.2 mm or 3 "
    • 6.1.3 100 mm or 4" and Above
  • 6.2 By End-user Industry Application
    • 6.2.1 Consumer Electronics
    • 6.2.2 Telecommunications
    • 6.2.3 Medical
    • 6.2.4 Other End-user Industry Applications
  • 6.3 By Geography
    • 6.3.1 North America
    • 6.3.2 Europe
    • 6.3.3 Asia-Pacific
    • 6.3.4 Rest of the world

7 COMPETITIVE LANDSCAPE

  • 7.1 Company Profiles
    • 7.1.1 AXT Inc.
    • 7.1.2 Wafer World Inc.
    • 7.1.3 Logitech Ltd.
    • 7.1.4 Western Minmetals (SC) Corporation
    • 7.1.5 Century Goldray Semiconductor Co. Ltd
    • 7.1.6 Semiconductor Wafer Inc.
    • 7.1.7 Ding Ten Industrial Inc.
    • 7.1.8 Sumitomo Electric Semiconductor Materials Inc. (Sumitomo Electric Industries Ltd)
    • 7.1.9 Xiamen Powerway Advanced Material Co. Ltd
    • 7.1.10 JX Nippon Mining & Metals Corporation (Eneos Holdings Inc.)

8 INVESTMENT ANALYSIS

9 MARKET OPPORTUNITIES AND FUTURE TRENDS