首页 > 市场调查报告书 > 电子零件/半导体

半导体生产设备

市场调查报告书

商品编码

1523377

全球半导体前端设备市场：市场占有率分析、产业趋势/统计、成长预测（2024-2029）

Global Semiconductor Front-end Equipment - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2024 - 2029)

出版日期: 2024年07月15日 | 出版商:

Mordor Intelligence | 英文 148 Pages | 商品交期: 2-3个工作天内

价格

※ 本网页内容可能与最新版本有所差异。详细情况请与我们联繫。

简介目录

预计2024年全球半导体前端设备市场规模将达993.6亿美元，2024年至2029年复合年增长率为8.65%，2029年将达1504.2亿美元。

前端处理需要许多复杂的步骤才能将晶圆转变为成品设备。这些阶段包括晶圆清洗、氧化、微影製程化的光刻、蚀刻、沉淀、掺杂和金属化等步骤。检查和测量设备用于製程控制。这是对晶圆的检查，以识别可能导致最终产品出现问题的不规则之处。除此之外，还使用光学技术，通常需要电子束检查来发现微小缺陷。

主要亮点

儘管半导体产业低迷，但主要前端设备製造商仍实现创纪录的收益，因此对半导体前端设备的需求预计将大幅成长，而不是短期调整。这是由产能增加、新工厂计划以及整个前端设备市场对先进技术和解决方案的高需求所推动的。
晶圆厂设备，包括晶圆加工设备、晶圆厂设备和掩膜/光罩设备，继去年强劲销售后，预计2023年将处于略低水平，而这种缩小规模代表着重大改善手段。这项向上修正主要是由于中国强劲的资本投资。市场在应对地缘政治挑战带来的不确定性的同时不断增长，这些挑战包括美国和荷兰政府的出口管制限制，以及对通货膨胀、利率上升和某些经济体国内生产总值增长下降的全球宏观担忧。
家用电器是成长最快的行业，为市场扩张做出了贡献。智慧型手机的使用预计将随着人口的增加而增加，是该市场的主要驱动因素。由于对平板电脑、智慧型手机、笔记型电脑、个人电脑、穿戴式装置等的需求不断增长，消费性电子产品正在推动该产业的发展。随着半导体的进步，机器学习等新的市场领域正在迅速整合。
未来最令人兴奋的「双赢」技术，例如人工智慧、物联网、量子运算和增强型无线网络，现在都由半导体提供动力。随着世界将突破性技术无缝整合到生活的各个方面，半导体和微电子技术正在不断发展，以满足不断变化的数位环境的复杂需求。巨量资料和人工智慧正在推动这一成长，需要更小、更强大的晶片，这使得它们的製造变得更加困难，并增加了对创新的需求。
资料储存、运算能力和演算法的快速进步正在推动人工智慧系统的开发和部署。数位设备和互联网使用的增加导致了大量资料的产生。人工智慧系统依赖大型资料集来学习和提高效能。
物联网 (IoT)、巨量资料、云端製造、网实整合系统 (CPS)、服务互联网 (IoS)、机器人、扩增实境(AR) 和其他新兴技术都包含在工业 4.0 思维模式中。采用这些技术来创建更智慧的工业流程非常重要，这将融合一些未来的工业进步并整合物理世界和数位世界。
随着全球在家工作趋势的发展，对云端服务的需求将会激增，资料中心供应商将需要扩展其能力。因此，全球对晶片和记忆体的需求将会增加。 SEMI 报告称，对 300mm 晶圆厂的投资正在大幅增加。根据预测，2020年至2024年间，该产业将新增至少38座300毫米晶圆厂。
这一快速成长将使晶圆产能增加约180万片，总合超过700万片。值得注意的是，台湾计划建造 11 座新的量产工厂，而中国大陆则计划建造 8 座。此外，台积电正在亚利桑那州建造一座新的 300 毫米晶圆厂。 2024年终，300mm量产工厂数量预计将达到161家。

半导体前端设备市场趋势

半导体製造工厂成为最大终端用户产业

设计阶段结束后，半导体晶片在晶圆厂和代工厂製造。在前端製造中，晶片是在称为晶圆的圆形硅片或不太常见的其他半导体材料上製造的。
製造是将设计转变为晶片的过程，依赖各种小型企业和材料。首先，在熔炉中形成硅圆柱体，然后将其切割成盘状晶圆。半导体製造设施（「晶圆厂」）分两个步骤製造晶片：在硅内的材料层中形成电晶体和其他电气装置，以及在硅上方的绝缘层中形成电气装置之间的金属互连，并将其製成晶圆。电气设备和互连结合形成电路。
总部位于美国、台湾、韩国、日本和中国的公司控制着全球大部分半导体製造工厂的市场占有率和製造能力，而这些公司的实际所在地也位于这些国家。开发半导体产品需要许多企业协调工作（从材料到物流）。由于半导体装置製造流程的复杂性，开发成本也不断上升。公司利用各种经营模式来减少开支并依靠半导体生存。
2023年11月，中国引进了42套微影术系统，价值8.168亿美元。荷兰提供了16套微影术系统，总成本为7.627亿美元，比前一年成长了十倍。此外，10月中国也从荷兰进口了21套系统。日本Canon、尼康也向中国供应曝光设备。因此，半导体製造厂对前端设备的需求预计将上调。
预计明年全球经济復苏和新一代网路（包括 5G基地台和 Wi-Fi 6 技术）的持续推出，以及智慧型手机、伺服器、笔记型电脑、电视和汽车市场的成长，将增加零件需求。
根据欧洲5G观察站预测，截至2023年，德国将成为欧盟成员国中拥有5G基地台数量最多的国家，安装基地台约9万个。本土/回流已成为政治上的热门话题，因为这些晶片的设计和製造及其研究可以提供数十万个高薪工作。这就是铸造厂和设备製造商在自己的后院规划和规划巨额投资的原因。例如，东京电子宣布计划投资超过6亿美元在日本建造设备製造设施。
IDM透过投资晶圆製造能力继续发挥重要作用。例如，2023 年 6 月，英特尔和德国政府宣布签署了一份修订后的意向书，计划在马德堡建设耗资超过 300 亿欧元的最先进晶圆製造地，打造欧洲首批半导体工厂中的两座.根据韩国媒体报道，该公司将于 2023 年 12 月从 ASML 收购六套高数值孔径 EUV 曝光系统，并计划于 2024 年出货。此次收购被视为在2nm节点超越三星和台积电的秘密武器。
2023年7月，三星宣布将在德克萨斯州奥斯汀市占地1,200英亩的土地上建造一座耗资170亿美元的半导体製造厂。中国和台湾之间的地缘政治紧张局势导致晶片製造商转向美国寻找製造地。凭藉低税率和新的补贴，德克萨斯已成为经商的好地方。全球半导体製造设备製造商正在韩国扩建其工厂。它计划在未来20年投资2,300亿美元在新的国内生产基地，吸引其他参与者并培育其晶片供应结构。

预计中国将占较大市场占有率

根据CSET的数据，中国在除组装和包装工具之外的所有主要领域都拥有显着的市场占有率。然而，中国在微影术设备方面面临最大的挑战，特别是极紫外线（微影术）和深紫外线（DUV）微影术。
压印微影术、电子束、雷射微影术、抗蚀剂加工设备、光掩模检查和修復工具是主要障碍。过去几年，中国持续投资进口先进微影术设备以支援晶片产业。
然而，凭藉其技术力，中国正在不断增加对前端设备的依赖，并进行大规模投资将其推向市场。
2023年12月，中国微影术设备专家上海微电子设备集团（SMEE）宣布推出首款能够使用尖端28奈米级製程技术加工晶圆的机器。这项重要成就凸显了SMEE致力于打造先进微影术设备的决心。该装置名为 SSA/800-10W，标誌着该公司的一个重要里程碑。
在日本和中国之间的技术对峙不断升级的情况下，美国的製裁旨在阻碍中国在开发世界上最尖端晶片方面取得进展。中芯国际和其他晶片製造商致力于透过推进晶片生产来增强国家自主权。中芯国际利用先进的微影术设备，与本土设备製造商密切合作，并寻求华为的外部支持，以提高先进节点製程的产量比率。
随着美国对中国技术的製裁持续，该地区正在努力实现自给自足。中国政府正大力投资先进晶片技术的研发。它还鼓励本地製造商将重点转向高节点晶片，这些晶片在经济和电动汽车（EV）等新兴行业中具有多种应用。政府不断倡议和当地供应商增加投资以提高国内晶片产量预计将为前端市场创造显着需求。
根据中国汽车工业协会统计，2023年8月中国新能源汽车销量约84.6万辆，其中搭乘用电动车80.8万辆，商用电动车3.9万辆。乘用车纯电动车（BEV）销量55.9万辆，乘用车插电混合（PHEV）销量24.8万辆。

半导体前端设备产业概况

半导体前端设备市场半固定的主要企业包括Applied Materials Inc.、ASML Holding NV、Tokyo Electron Limited、LAM Research Corporation 和KLA Corporation。市场参与者正在采取合作伙伴关係、创新和收购等策略来加强其产品供应并获得可持续的竞争优势。

2024 年 2 月 - ASML Holding NV 推出其最新晶片製造机“High-NA”，售价 3.5 亿欧元，重量相当于两架空中巴士 A320。英特尔已为其奥勒冈工厂确保了首批出货量，晶片生产预计将于明年底开始。该机器可实现8奈米厚的半导体线路，比传统线路小1.7倍，并增加晶片的电晶体密度，以提高处理速度和记忆体。
2024 年 1 月 - Applied Materials Inc. 与 Google 合作推进扩增实境(AR) 技术。此次合作将利用应用材料公司的材料工程专业知识和Google的平台，为下一代 AR 体验开发轻量级视觉显示系统。其目的是加速多代 AR 产品、应用和服务的开发。

其他福利

Excel 格式的市场预测 (ME) 表
3 个月分析师支持

The front-end procedure necessitates a multitude of intricate phases to convert a wafer into a completed device. These steps incorporate wafer cleaning, oxidation, and photolithography to pattern devices, along with etching, deposition, doping, and metallization steps. Inspection and metrology equipment is utilized for process control. This is when the wafers are inspected to identify irregularities that potentially induce issues with the end product. In addition to this, optical techniques are also used, and e-beam inspection is often needed to find the smallest defects.

Key Highlights

The demand for semiconductor front-end equipment is expected to observe a noteworthy surge as some of the major front-end equipment-producing companies observed record-breaking revenue against a backdrop of a downturn in the semiconductor industry instead of the mild and short-term correction. It was driven by capacity expansion, new fab projects, and high demand for advanced technologies and solutions across the front-end equipment market.
After registering a record of significant sales last year, the wafer fab equipment, which includes wafer processing, fab facilities, and mask/reticle equipment, is projected to be a bit low in 2023, and this contraction marks a significant improvement. The upward revision is primarily due to China's strong equipment spending. The market grew managing uncertainties created by geopolitical challenges, including the US and Dutch governments' export control regulations and global macro concerns around inflation, rising interest rates, and lower GDP growth in certain economies.
Consumer electronics is the fastest-growing segment, contributing to market expansion. The use of smartphones, anticipated to rise with population growth, is the key driver of this market. Consumer electronics drive the industry due to increased demand for tablets, smartphones, laptops, computers, and wearable gadgets. As semiconductors advance, new market areas, such as machine learning, are rapidly being integrated.
The most fascinating "must-win" technologies of the future, such as artificial intelligence, the Internet of Things, quantum computing, and enhanced wireless networks, are currently supported by semiconductors. Semiconductors and microelectronics are advancing to satisfy the complicated demands of a constantly changing digital environment as the world seamlessly integrates breakthrough technology into every aspect of life. Big Data and AI drive this increase and call for smaller, more powerful chips, making their production more difficult and increasing the need for technological innovation.
Rapid advancements in data storage, computing power, and algorithms have enabled the development and deployment of AI systems. The increased use of digital devices and the Internet has generated extensive volumes of data. AI systems rely on large datasets to train and improve their performance.
The Internet of Things (IoT), big data, cloud manufacturing, cyber-physical systems (CPS), the Internet of Services (IoS), robotics, augmented reality, and other emerging technologies are included in the Industry 4.0 idea. Creating additional smart industrial processes depends on adopting these technologies, which will unite the physical and digital worlds by encompassing several future industrial advancements.
As global work-from-home trends gain momentum, the demand for cloud services surges, prompting data center providers to expand their capacities. This, in turn, fuels the global appetite for chips and memory. SEMI reports a notable uptick in investments in 300 mm fabs. Projections suggest that the industry will witness the addition of a minimum of 38 new 300 mm fabs between 2020 and 2024.
This surge is set to boost the capacity by approximately 1.8 million wafers, pushing the total beyond 7 million. Notably, Taiwan is slated to host 11 of these new volume fabs, with China following closely with eight. Additionally, TSMC is in the process of constructing a new 300 mm fab in Arizona. By the close of 2024, the tally of 300 mm volume fabs is anticipated to hit a significant 161 units.

Semiconductor Front-End Equipment Market Trends

Semiconductor Fabrication Plant to be the Largest End-user Industry

After the design stage, semiconductor chips are manufactured or fabricated in facilities called fabs or foundries. In front-end fabrication, chips are manufactured on circular sheets of silicon or, less commonly, other semiconducting materials called wafers, typically about 8 or 12 inches in diameter.
Fabrication is a process that turns designs into chips, relying on various SMEs and materials. First, a furnace forms a cylinder of silicon, which is cut into disc-shaped wafers. Semiconductor fabrication facilities ("fabs") make chips into wafers in two steps: forming transistors and other electrical devices in material layers within the silicon and forming metal interconnects between the electrical devices in insulating layers above the silicon. Together, the electrical devices and interconnects form circuits.
Firms headquartered in the United States, Taiwan, South Korea, Japan, and China control most of the world's fab market share and fab capacity, which are also physically located in these countries. Semiconductor product development requires working harmoniously for many businesses (from materials to logistics). The complex process of fabricating semiconductor devices has also increased the development cost. Companies have leveraged different business models to lower expenditures and survive in semiconductors.
In November 2023, China brought 42 lithography systems worth USD 816.8 million. The Netherlands supplied 16 lithography systems, totaling USD 762.7 million, a tenfold increase from the previous year. Additionally, China imported 21 systems from the Netherlands in October. Japanese companies Canon and Nikon also supplied China with lithography tools. Thus, an upward revision is expected in the demand for front-end equipment in semiconductor fabrication plants.
The global economy is expected to recover, and the demand for components is expected to rise owing to not only growth in the smartphone, server, notebook computer, TV, and automobile markets next year but also the continued rollout of next-generation networks, including 5G base stations and Wi-Fi 6 technologies.
According to the European 5G Observatory, as of 2023, Germany had the maximum 5G base stations among European Union (EU) member states, with approximately 90,000 base stations installed. The design and manufacturing of these chips and their research can provide hundreds of thousands of high-paying jobs, making onshoring/re-shoring a popular topic politically. It is why foundries and equipment companies are planning and mapping enormous investments in their backyards. For instance, TEL announced plans to invest more than USD 600 million in equipment manufacturing facilities in Japan.
IDMs still play a significant role by investing in wafer fabrication capacities. For instance, in June 2023, Intel and the German government announced signing a revised letter of intent for planning a leading-edge wafer fabrication site in Magdeburg with more than EUR 30 billion for two first-of-a-kind European semiconductor facilities. In December 2023, the company reportedly acquired six high-NA EUV lithography machines from ASML, which is scheduled for shipment in 2024, according to South Korean media outlets. This acquisition is expected to be its secret weapon to overtake Samsung and TSMC at the 2nm node.
In July 2023, Samsung announced it would spend USD 17 billion to build a semiconductor fabrication plant on a 1,200-acre plot of land in Austin, Texas. Owing to the geopolitical tension between China and Taiwan, chipmakers turned to the United States for manufacturing. Due to low taxes and new subsidies, Texas has emerged as a suitable place to do business. Global semiconductor manufacturing equipment companies are expanding facilities in South Korea. The company plans to invest USD 230 billion over the next 20 years in a new domestic production hub, attracting other players and fostering a chip supply system.

China is Expected to Hold a Significant Market Share

According to CSET, China holds a noteworthy market share in all major segments besides assembly and packaging tools. However, China faces the greatest challenge in lithography tools, particularly extreme ultraviolet (EUV) photolithography and deep ultraviolet (DUV) photolithography.
Imprint lithography, e-beam, laser lithography, resist processing equipment, photomask inspection, and repair tools pose significant obstacles. Over the past few years, China has consistently invested in importing advanced lithography equipment to support its chip industry.
However, with its technological capabilities, the country constantly strives to enhance its self-dependency on front-end equipment and invest significantly to introduce it into the market.
In December 2023, Shanghai Micro Electronics Equipment Group (SMEE), a Chinese company specializing in lithography tools, unveiled its inaugural machine capable of processing wafers using a cutting-edge 28nm-class process technology. This significant achievement highlights SMEE's dedication to constructing advanced lithography machines. The scanner, known as SSA/800-10W, marks a significant milestone for the company.
US sanctions have been formulated to impede China's progress in developing the most cutting-edge chips globally as the technological rivalry between the two countries intensifies. SMIC and other chip manufacturers are dedicated to enhancing the nation's autonomy by advancing chip production. SMIC collaborates closely with local tool manufacturers, utilizing its advanced lithography equipment, and seeks external assistance from Huawei to enhance yields in advanced node processes.
Due to the continuous US sanctions on Chinese technology, the area strives for self-sufficiency. The Chinese government is investing substantially in the research and development of advanced chip technology. It also encourages local manufacturers to shift their focus to higher-node chips with various uses in the economy and emerging industries like electric vehicles (EVs). The growing government initiatives and the increasing investments by local vendors to boost domestic chip production are expected to create a notable demand for the front-end market.
According to CAAM, in August 2023, China's new energy vehicle sales were approximately 846,000 units, of which 808,000 were passenger electric vehicles and 39,000 were commercial electric vehicles. The sales of passenger battery electric vehicles (BEVs) and passenger plug-in hybrid electric vehicles (PHEVs) were 559,000 and 248,000 units, respectively.

Semiconductor Front-End Equipment Industry Overview

The semiconductor front-end equipment market is semi-consolidated, with major players like Applied Materials Inc., ASML Holding NV, Tokyo Electron Limited, LAM Research Corporation, and KLA Corporation. Market players are adopting strategies such as partnerships, innovations, and acquisitions to enhance their product offerings and gain sustainable competitive advantage.

February 2024 - ASML Holding NV unveiled its latest chipmaking machine, the High-NA extreme ultraviolet, priced at EUR 350 million, weighing as much as two Airbus A320s. Intel Corp. secured the first shipment for its Oregon factory, with chip production set to begin late next year. The machine achieves 8-nanometer thick semiconductor lines, 1.7 times smaller than its predecessor, enhancing chip transistor density for increased processing speeds and memory.
January 2024 - Applied Materials Inc. collaborated with Google to advance augmented reality (AR) technologies. This partnership leverages Applied Materials' expertise in materials engineering with Google's platforms to develop lightweight visual display systems for the next era of AR experiences. The goal is to expedite the creation of multiple generations of AR products, applications, and services.

Additional Benefits:

The market estimate (ME) sheet in Excel format
3 months of analyst support

1 INTRODUCTION

1.1 Study Assumptions and Market Definition
1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET INSIGHTS

4.1 Market Overview
4.2 Industry Attractiveness - Porter's Five Forces Analysis
- 4.2.1 Bargaining Power of Suppliers
- 4.2.2 Bargaining Power of Buyers
- 4.2.3 Threat of New Entrants
- 4.2.4 Threat of Substitute Products
- 4.2.5 Degree of Competition
4.3 Industry Value Chain Analysis
4.4 Impact of COVID-19 Pandemic on the Market

5 MARKET DYNAMICS

5.1 Market Drivers
- 5.1.1 Increasing Needs of Consumer Electronic Devices Boosting the Manufacturing Prospects
- 5.1.2 Proliferation of Artificial Intelligence, IoT, and Connected Devices Across Industry Verticals
5.2 Market Restraints
- 5.2.1 Dynamic Nature of Technologies Requires Several Changes in Manufacturing Equipment

6 MARKET SEGMENTATION

6.1 By Type
- 6.1.1 Lithography Equipment
- 6.1.2 Etching Equipment
- 6.1.3 Deposition Equipment
- 6.1.4 Other Equipment Types
6.2 By End-user Industry
- 6.2.1 Semiconductor Fabrication Plant
- 6.2.2 Semiconductor Electronics Manufacturing
6.3 By Geography***
- 6.3.1 United States
- 6.3.2 Europe
- 6.3.3 China
- 6.3.4 South Korea
- 6.3.5 Taiwan
- 6.3.6 Japan
- 6.3.7 Latin America
- 6.3.8 Middle East and Africa

7 COMPETITIVE LANDSCAPE

7.1 Company Profiles*
- 7.1.1 Applied Materials Inc.
- 7.1.2 ASML Holding NV
- 7.1.3 Tokyo Electron Limited
- 7.1.4 LAM Research Corporation
- 7.1.5 KLA Corporation
- 7.1.6 Nikon Corporation
- 7.1.7 VEECO Instruments Inc.
- 7.1.8 Plasma Therm
- 7.1.9 Hitachi High -Technologies Corporation
- 7.1.10 Carl Zeiss AG
- 7.1.11 Screen Holdings Co. Ltd

8 INVESTMENTS ANALYSIS

9 FUTURE OF THE MARKET

02-2729-4219

+886-2-2729-4219

License/价格

全球半导体前端设备市场：市场占有率分析、产业趋势/统计、成长预测（2024-2029）

Global Semiconductor Front-end Equipment - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2024 - 2029)