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市场调查报告书
商品编码
1630276
类基板PCB：市场占有率分析、产业趋势、成长预测（2025-2030）Substrate-Like-PCB - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2025 - 2030) |
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简介目录
基板PCB 市场预计在预测期内复合年增长率为 12%
主要亮点
- PCB基板用作PCB基板和设备主体的其余部分之间的介质，不会导致设备断电或故障。两个单元之间的联网电缆用于有效地将讯号传输到连接的组件，从而减少连接总数，从而减少总功耗。
- 随着向 5G 的转变，智慧型手机OEM越来越多地采用这种 SLP 技术，这是市场成长的关键驱动力。为5G提供SoC的联发科宣布，2020年出货量将翻倍，生产全球近40%的智慧型手机SoC。这表明对 5G 设备的需求不断增长，预计将在预测期内推动基板PCB 的成长。
- 随着汽车产量和销售量的增加，它们越来越多地配备先进的安全功能，其中一些是政府机构强制要求的，这产生了对提供更大便利和舒适的系统的需求。混合动力电动车（HEV）和纯电动车的需求不断增长是预测期内推动市场成长的关键因素。
- 也存在阻碍整体市场成长的挑战。缺乏技术纯熟劳工、缺乏标准和通讯协定等因素限制了市场成长。此外，复杂的整合系统和与类 PCB基板相关的高成本设定预计将在预测期内减缓成长。
- 随着物联网、5G和智慧汽车等技术趋势的发展，需要更小的PCB尺寸和更高效能的基板。因此，PCB基板将大规模使用，以支援这些技术趋势。
- 基板製造一直是全球晶片供应链的主要障碍。该行业是一个相对较新的领域，利润率低导致市场投资不足。此外，疫情对现有商业订单造成严重压力，全球晶片短缺限制了个人电脑销售，迫使工厂閒置，并在封锁条件下增加了电子设备的成本。
基板PCB市场趋势
汽车产业推动市场成长
- 如今，汽车越来越依赖电子元件。与过去电子电路仅用于前灯开关和雨刷不同，今天的汽车使用了许多电子元件。
- 透过将 PCB 融入特定和新颖的应用中，现代汽车受益于不断进步的电子电路技术。感测器应用在汽车中已经很普遍，通常需要使用射频、微波和毫米波等高频讯号运行的 PCB。事实上，雷达技术以前仅用于军用车辆，现在已广泛应用于现代汽车中，帮助驾驶员避免碰撞、监控盲点以及在巡航控制期间适应交通状况。
- 软硬复合PCB 现在是物联网设备设计中实现高耐用性的关键候选者。使用各种小基板透过软布线连接在一起，而不是单一实心基板。汽车的高振动环境会给传统刚性 PCB 带来巨大的压力。因此，许多汽车电子製造商正在用更耐振动、更小、更轻的柔性PCB取代刚性PCB。
- 汽车的高振动环境给传统刚性PCB带来了巨大的压力。因此，许多车载电子製造商正在用更小、更轻、抗振性更好的柔性PCB取代刚性PCB。
- 汽车生产和销售的增加，以及先进安全功能的增加（其中一些是政府机构强制要求的），需要提供更大便利性和舒适性的系统。混合动力电动车（HEV）和纯电动车的需求不断增长是预测期内推动市场成长的关键因素。
亚太地区可望成为快速成长的市场
- 亚太地区已成为基板PCB的新兴市场，成为全球关注的主要投资和业务拓展机会。全球超过一半的行动用户位于亚太地区，包括中国和印度。此外，该地区正在见证用户从 3G 到 4G 和 5G 技术的模式转移。
- 推动亚太地区类基板PCB市场成长的关键因素包括智慧型手机普及率的提高、对连接解决方案的需求不断增长、网路用户数量的增加、频宽密集型应用的扩展以及该地区通讯基础设施的扩展。大多数智慧型手机供应商都是亚太地区的公司，预计亚太地区在预测期内对基板PCB 的需求将会很大。
- 来自韩国、台湾和日本的基板PCB 製造商主导着生产活动。例如，台湾 ZD Tech 和日本 Meiko 等公司正在为越南和中国的多个智慧型手机客户扩建新的基板PCB 生产线。台湾已成为基板PCB技术发展的领先地区之一。人们认为，中国将透过台湾的技术转移逐步获得基板PCB的技术诀窍。
- 截至2021年4月，已有70个国家和城市宣布到2050年100%零排放或淘汰内燃机。例如，为了实现这一目标，日本政府制定了2050年在日本消除使用内燃机汽车的目标。该国已开始向电动车购买者提供临时补贴。
- 2021年6月，AT&S宣布选择马来西亚作为其在东南亚的首个生产设施，生产高阶印刷基板（PCB）和积体电路（IC）基板。
- 从地区情况来看，台湾、日本、中国等亚太国家在全球PCB市场中占有较大份额。根据台湾国家统计局2021年10月发布的数据，2020年PCB产量为5,740万平方英尺，较2019年成长9.083%。随着大规模努力和投资继续配合各自的环境和健康法规，中国和印度预计未来将与台湾竞争。
类基板PCB产业概况
基板PCB市场得到整合，行业主要企业占据了大部分市场占有率。主要企业包括景硕科技、Ibiden、华通製造、大德电子、欣兴科技、振鼎科技、名光电子、迅达科技和奥特斯。
- 2022 年 5 月—美国TTM Technologies 宣布计划在马来西亚槟城开设新的高度自动化印刷电路基板(PCB) 製造工厂。在马来西亚的扩张是为了回应人们对先进技术、PCB供应链弹性和区域多样性日益增长的担忧。
其他好处
- Excel 格式的市场预测 (ME) 表
- 3 个月分析师支持
目录
第一章简介
- 研究假设和市场定义
- 调查范围
第二章调查方法
第三章执行摘要
第四章市场洞察
- 市场概况
- 产业吸引力－波特五力分析
- 供应商的议价能力
- 买方议价能力
- 新进入者的威胁
- 替代品的威胁
- 竞争公司之间敌对关係的强度
- 产业价值链分析
第五章市场动态
- 市场驱动因素
- 家用电子电器和智慧型装置的需求增加
- 市场限制因素
- 由于采用类基板 PCB，设置成本较高
第六章 市场细分
- 目的
- 家用电子电器
- 车
- 通讯设备
- 其他的
- 地区
- 北美洲
- 欧洲
- 亚太地区
- 其他的
第七章 竞争格局
- 公司简介
- Kinsus Interconnect Technology Corp.
- Ibiden Co.Ltd.
- Compeq Manufacturing Co. Ltd.
- Daeduck Electronics Co. Ltd.
- Unimicron Technology Corporation
- Zhen Ding Technology
- TTM Technologies
- Meiko Electronics
- Austria Technologie & Systemtechnik Aktiengesellschaft
（奥特斯）
- Korea Circuit
- LG Innotek Co.Ltd
- Samsung Electro - Mechanics
第八章投资分析
第9章市场的未来
简介目录
Product Code: 66813
The Substrate-Like-PCB Market is expected to register a CAGR of 12% during the forecast period.
Key Highlights
- A PCB substrate is used as a medium between the PCB Board and the rest of the device body without the loss of any power or misfiring of the device. Interconnectors between both units are utilized to efficiently transfer signals to connected components, reducing the total number of connections and, consequently, the total power consumption.
- Smartphone OEMs are increasingly using this SLP technology with a shift toward 5G, which is acting as the main driver for the growth of the market. MediaTek, which offers 5G SoCs, announced a doubled shipment in 2020, announcing that they manufactured nearly 40% of global smartphone SoCs. This indicates the growing demand for 5G devices, which is estimated to fuel the growth of substrate-like PCBs during the forecast period.
- Increasing automobile production and sales and the increased incorporation of advanced safety features, some of which are mandated by government bodies, demand convenience and comfort systems. The growing demand for hybrid electric vehicles (HEV) and battery electric vehicles are the major factors that may drive the market growth during the forecast period.
- Certain challenges will hinder the overall market growth. Factors such as a shortage of skilled labor and the absence of standards and protocols limit the market growth. Furthermore, complicated integrated systems and high-cost setups associated with substrate-like PCB are expected to slow growth during the forecast period.
- With the rising trends in technologies such as IoT, 5G, and smart cars, it is required that the size of the PCB would be miniaturized and the substrates become much more powerful. Thus, substrate-like PCB will be used at a massive scale to support these technological trends.
- Substrate manufacturing has been a massive restraint on the global chip supply chain. The sector's relatively newer origins paired with low margins have forced underinvestment in the market. Moreover, the pandemic forced a severe strain on the existing order of operations, enforced a global chip shortage that constricted personal computer sales, enforced idle plants, and raised costs for electronic devices under lockdown conditions.
Substrate Like PCB Market Trends
Automotive Industry to Drive the Market Growth
- Currently, automobiles increasingly rely on electronic components. Unlike in the past, when electronic circuits were solely used for headlight switches and windshield wipers, current automobiles make extensive use of electronics.
- By incorporating PCBs into certain novel applications, the latest autos take the benefit of ever-advancing electronic circuit technology. Sensor applications, which are already popular in autos, frequently require PCBs that work with high-frequency signals, such as RF, microwave, or millimeter-wave frequencies. In fact, radar technology, which was formerly only used in military vehicles, is also widely used in modern automobiles to help drivers avoid collisions, monitor blind spots, and adjust to traffic conditions when on cruise control.
- Currently, rigid-flex PCBs have been witnessing significant traction candidates for achieving high durability in IoT device design. Instead of one solid board, they feature various smaller ones joined with flexible wiring. The high-vibration environment of an automobile can put a conventional rigid PCB under a lot of stress. As a result, many automotive electronics manufacturers are employing flexible PCBs instead of rigid PCBs, which are more vibration resistant while being smaller and lighter.
- The high-vibration environment of an automobile can put a conventional rigid PCB under a lot of stress. As a result, many automotive electronics manufacturers are employing flexible PCBs instead of rigid PCBs, which are more vibration resistant while being smaller and lighter.
- Increasing automobile production and sales and the increased incorporation of advanced safety features, some of which are mandated by government bodies, demand convenience and comfort systems. The growing demand for hybrid electric vehicles (HEV) and battery electric vehicles are the major factors that will drive market growth during the forecast period.
Asia Pacific is Expected to be the Fastest Growing Market
- Asia-Pacific is an emerging market for substrate-like PCBs as it has become a global focal point for significant investments and business expansion opportunities. Globally, more than half of the mobile subscribers are present in Asia-Pacific, such as in China and India. Moreover, there has been a paradigm shift of users from 3G to 4G and 5G technology in this region.
- Key factors that are driving the substrate-like-PCB market growth in the Asia-Pacific region include the increasing adoption of smartphones, rising demand for connectivity solutions, a growing number of internet users, expanding bandwidth-intensive applications, and expansion of telecommunications infrastructure in the region. The majority of the smartphone providers are from the Asia-Pacific region; it is expected that there will be a significant demand for substrate-like-PCB in the Asia-Pacific region during the forecast period.
- Substrate-like-PCB manufacturers from South Korea, Taiwan, and Japan are dominating production activities. For instance, players like Taiwan-headquartered ZD Tech and japan-headquartered Meiko are expanding new substrate-like-PCB production lines in Vietnam and China for more than one smartphone customer. Taiwan has become one of the major places for the development of substrate-like-PCB technology. Certainly, China will gain substrate-like-PCB technical know-how progressively with technology transfer from the major player.
- As of April 2021, 70 subnational and city governments announced 100% zero-emission vehicle targets or the phaseout of internal combustion engine vehicles before 2050. For instance, Japan's government has set a goal of eliminating the use of internal combustion engine vehicles in the country by 2050 to help achieve this goal. The country has begun granting one-time subsidies to buyers of electric vehicles.
- In June 2021, AT&S announced that it chose Malaysia as its first production plant in Southeast Asia for the manufacturing of high-end printed circuit boards (PCB) and integrated circuit (IC) substrates.
- Geographically, Asia-Pacific countries, such as Taiwan, Japan, and China, occupy a significant share of the global PCB landscape. According to Taiwan National Statistics published in October 2021, PCB production in 2020 increased by 57.4 million square feet, or 9.083%, as compared to 2019. China and India are expected to match Taiwan in the future, as massive efforts and investments have been ongoing in parallel with environmental and health-based regulations placed by China and India, respectively.
Substrate Like PCB Industry Overview
The Substrate-Like-PCB Market is consolidated because the majority of the market share is owned by top players in the industry. Some of the key players include Kinsus Interconnect Technology Corp., Ibiden Co.Ltd., Compeq Manufacturing Co. Ltd., Daeduck Electronics Co. Ltd., Unimicron Technology Corporation, Zhen Ding Technology, Meiko Electronics, TTM Technologies, AT&S, among others.
- May 2022 - TTM Technologies Inc (TTM), located in the United States, announced a plan to establish a new, highly automated printed circuit board (PCB) manufacturing factory in Penang, Malaysia, with a proposed capital investment of USD 130 million by 2025. The Malaysian expansion addresses rising concerns about advanced technology, PCB supply chain resilience, and regional diversity.
Additional Benefits:
- The market estimate (ME) sheet in Excel format
- 3 months of analyst support
TABLE OF CONTENTS
1 INTRODUCTION
- 1.1 Study Assumptions and Market Definition
- 1.2 Scope of the Study
2 RESEARCH METHODOLOGY
3 EXECUTIVE SUMMARY
4 MARKET INSIGHTS
- 4.1 Market Overview
- 4.2 Industry Attractiveness - Porter's Five Forces Analysis
- 4.2.1 Bargaining Power of Suppliers
- 4.2.2 Bargaining Power of Buyers
- 4.2.3 Threat of New Entrants
- 4.2.4 Threat of Substitute Products
- 4.2.5 Intensity of Competitive Rivalry
- 4.3 Industry Value Chain Analysis
5 MARKET DYNAMICS
- 5.1 Market Drivers
- 5.1.1 Increasing Demand for Consumer Electronics and Smart Devices
- 5.2 Market Restraints
- 5.2.1 Higher Setup Cost Associated with Substrate-like-PCB
6 MARKET SEGMENTATION
- 6.1 Application
- 6.1.1 Consumer Electronics
- 6.1.2 Automotives
- 6.1.3 Communication
- 6.1.4 Other Applications
- 6.2 Geography
- 6.2.1 North America
- 6.2.2 Europe
- 6.2.3 Asia Pacific
- 6.2.4 Rest of the World
7 COMPETITIVE LANDSCAPE
- 7.1 Company Profiles
- 7.1.1 Kinsus Interconnect Technology Corp.
- 7.1.2 Ibiden Co.Ltd.
- 7.1.3 Compeq Manufacturing Co. Ltd.
- 7.1.4 Daeduck Electronics Co. Ltd.
- 7.1.5 Unimicron Technology Corporation
- 7.1.6 Zhen Ding Technology
- 7.1.7 TTM Technologies
- 7.1.8 Meiko Electronics
- 7.1.9 Austria Technologie & Systemtechnik Aktiengesellschaft
(AT&S)
- 7.1.10 Korea Circuit
- 7.1.11 LG Innotek Co.Ltd
- 7.1.12 Samsung Electro - Mechanics
