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市场调查报告书
商品编码
1643098

晶片贴装设备：市场占有率分析、产业趋势与统计、成长预测（2025-2030 年）

Die Attach Equipment - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2025 - 2030)
出版日期: | 出版商: Mordor Intelligence | 英文 120 Pages | 商品交期: 2-3个工作天内

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简介目录

预计 2025 年晶片贴装设备市场规模为 15.4 亿美元，到 2030 年将达到 20.7 亿美元，预测期内（2025-2030 年）的复合年增长率为 6.09%。

晶片贴装设备-市场-IMG1

物联网 (IoT) 设备中堆迭晶粒技术的日益广泛使用推动了成长。最近的趋势表明，由于医疗、军事、光电和无线电子等新兴和成熟的应用，对混合电路的需求仍然强劲。

关键亮点

  • C2W 混合键合是一种很有前景的新技术，可实现直接 Cu-Cu 键合，并可取代 TCB 用于 3D 堆迭记忆体和高阶逻辑应用。然而，C2W 混合键结仍处于起步阶段。预计该技术将于2022-2023年在2.5D逻辑装置市场推出，大幅推动设备市场的成长。
  • 对 AuSn 共晶晶片黏接技术的需求将推动市场发展。传统上，晶片采用各种各样的晶片粘接产品进行粘接，包括金属填充的导电环氧树脂、高铅焊料和金硅焊料，以确保它们在设备的整个使用寿命内可靠地运行。
  • 然而，发热量不断增加的趋势、设备小型化的需求、RoHS和REACH的建立以及向GaAs晶片的过渡限制了传统材料的使用。对高设备可靠性的需求促使工程师评估各种用于晶粒黏合的新材料。
  • 提案的焊料预製件是共晶金锡，可用于大规模生产或在实验室中使用 Palomar Technologies 晶片焊接机。该设备能够完成完整的晶片黏接过程，包括高精度拾取和放置基板、共晶金锡预製件和组件、共晶晶片黏接和使用电脑控制脉衝热台（PHS）进行脉衝热回流焊接。
  • 对分立功率元件的需求正在推动市场的发展。作为传统电线和带状接头的替代品，铜夹正变得越来越受欢迎。晶片黏接特性是分立功率元件封装解决方案的特性。宽能带隙半导体晶粒技术（SiC 和 GaN）的采用带来了新的创新封装解决方案，包括银烧结晶片黏接（材料包括环氧模塑料和互连材料）。
  • EV/HEV 应用中从分立 SiC 到 SiC 模组的逐步过渡、嵌入式晶粒封装系统以及多晶片系统中 GaN 装置的整合只是这些趋势的几个例子。这导致对分立功率元件晶片贴装设备的需求增加。
  • 然而，加工过程中的尺寸变化、使用寿命以及设备加工过程中运动部件的机械不平衡等因素可能会对设备功能构成挑战并限制市场的发展。

晶片贴装设备市场趋势

LED 越来越受欢迎

  • 晶片黏接材料是中功率、高功率和高功率LED 性能和可靠性的关键。随着LED渗透率的不断提高，对晶片贴装设备的需求也日益增加。为特定的晶片结构和应用选择合适的晶片黏合材料取决于许多考虑因素，包括封装製程（产量和产量比率）、性能（散热和光输出）、可靠性（流明维持率）和成本。共晶金锡、载银环氧树脂、焊料、硅胶和烧结材料均已用于 LED 晶片黏合。
  • 例如，SFE提供一种环氧胶粘合方法，其LED环氧固晶机的索引时间为0.2秒/週期（90％的运行率），晶片尺寸为250*250标准，并描述了透过两个相机进行导线架识别。此软体功能包括自动安装水平和拾取水平教学功能。
  • 此外，导电黏合剂（主要是含银环氧树脂）是 LED 最广泛使用的热晶片黏接材料（以单位数计算）。它们与现有的后处理封装设备相容，并提供具有吸引力的性价比（通常高达 50W/mK 的热性能以及二次回流焊接相容性）。由于它附着在裸硅上，因此它是没有后端金属化的晶粒的首选材料，例如硅上的 GaN。
  • 此外，儘管LED市场上有许多对手和竞争者，但ASM是该市场上最突出的参与企业之一，其LED环氧树脂高速晶片焊接机AD830在LED市场占据主导地位。随着越来越多的国家希望逐步淘汰传统灯泡，LED 继续占据市场主导地位。根据联合研究中心的数据，LED 营收渗透率正在上升，预计到 2025 年将达到 75.8%。这推动了晶片贴装设备市场的需求。
  • 此外，2022 年 9 月，Palomar Technologies 宣布推出其新型晶片贴片机 3880-II，该产品荣获 2022 年军事+航空航天电子创新奖。新机器包括可最大限度提高生产率、减少高达 95% 的编程时间并提高整体黏合机生产率的选项。

亚太地区占据显着的市场成长

  • 亚太地区在晶片贴装设备产业中占有显着的成长。全球超过 60% 的外包半导体组装和测试（OSAT）公司总部设在亚太地区。这些 OSAT 公司在其半导体製造过程中使用晶片贴装设备。此外，该地区的IDM（集成设备製造商）数量正在增加，预计这将很快推动市场成长。
  • 在中国和台湾，包括光电子、MEMS和MOEMS在内的多种设备被用于智慧型手机、穿戴式装置和白色家电家用电子电器等电子产品的大量生产。所有这些设备在组件组装过程中都需要晶片贴装设备。
  • 此外，预计预测期内韩国、中国以及日本的人口老化将加速对医疗保健服务的需求，为包含 MEMS 压力感测器的人工呼吸器、透析和血压监测设备等提供发展空间。亚太经社会预测，到2025年，该地区60岁及以上人口数量将从目前的9.55人增加到10.64人，到2050年将增加到18.44人，占世界人口的60%。 MEMS压力感测器晶片贴装设备的需求正在促进该市场的成长。
  • 此外，由于政府的倡议，印度正在发展许多智慧城市，并有望采用电子解决方案来实现监控、维护和监视等目的。根据smartcities.gov.in报道，中央政府已拨款9.77亿美元用于建造60个这样的智慧城市。这导致对更多CMOS影像感测器的需求，从而进一步推动市场成长。
  • 高功率雷射在切割、焊接和加工等多种应用领域中得到广泛需求。该公司正在转向雷射技术以利用其高性能和可靠性。雷射二极体的进步极大地增加了对处理环氧树脂和共晶键合技术的设备的需求。
  • 物联网、人工智慧和 ADAS 的发展预计将进一步增加记忆体需求。因此，现在比以前更需要提高储存晶片製造的生产率和后处理设备的可靠性。为了解决这个问题，2022 年 8 月，史丹佛大学的工程师宣布，他们将创建更有效率、更灵活的 AI 晶片，有可能将 AI 的力量带入微型边缘设备，有助于提高记忆体製造的吞吐量和可靠性。

晶片贴装设备产业概况

由于本地和全球参与企业的存在，晶片贴装设备市场竞争激烈，因此市场呈现细分化。此外，各公司都致力于透过开发和合作来提高产量和产量比率等设备性能，加剧了市场竞争。主要参与企业包括 Be Semiconductor Industries NV、ASM Pacific Technology Limited 和 Palomar Technologies Inc.

  • 2022 年 10 月，Hermetic Solutions Group (HSG) 从 RHP Technologies 收购了 DiaCool 的智慧财产权。这扩大了 HSG 的产品线，并将在未来许多年为客户提供更多选择。 HSG 用于散热器、晶片片和散热器的 DiaCool 钻石复合材料为客户提供了比传统层压板和 MMC 材料更显着的优势。
  • 2022年10月，Kulicke和Soffa赢得了多个热压解决方案的新订单，并成功向主要客户交付了其第一台助焊剂热压键合机（TCB），继续保持其在先进LED组装领域的地位。

其他福利

  • Excel 格式的市场预测 (ME) 表
  • 3 个月的分析师支持

目录

第 1 章 简介

  • 研究假设和市场定义
  • 研究范围

第二章调查方法

第三章执行摘要

第四章 市场动态

  • 市场概况
  • 市场驱动因素
    • AuSn 共晶晶片黏接技术需求不断成长
    • 分立功率装置的需求
    • LED 领域强劲成长
  • 市场限制
    • 加工和使用寿命期间的尺寸变化和机械不平衡
  • 产业价值链分析
  • 产业吸引力-五力分析
    • 新进入者的威胁
    • 购买者/消费者的议价能力
    • 供应商的议价能力
    • 替代品的威胁
    • 竞争对手之间的竞争强度
  • COVID-19 市场影响评估

第五章 市场区隔

  • 类型
    • 晶片焊接机
    • 覆晶接合机
  • 连接技术
    • 环氧树脂
    • 共晶
    • 软焊料
    • 混合关节
    • 其他连接技术
  • 应用
    • 记忆
    • RF &MEMS
    • LED
    • CMOS影像感测器
    • 逻辑
    • 光电子学/光电
    • 其他的
  • 地区
    • 北美洲
    • 欧洲
    • 亚洲
    • 澳洲和纽西兰
    • 拉丁美洲
    • 中东和非洲

第六章 竞争格局

  • 公司简介
    • Palomar Technologies, Inc.
    • Shinkawa Ltd.
    • MicroAssembly Technologies, Ltd.
    • ASM Pacific Technology Limited
    • Be Semiconductor Industries NV
    • Kulicke and Soffa Industries, Inc.
    • Dr. Tresky AG
    • Fasford Technology Co Ltd.
    • Inseto UK Limited
    • Anza Technology Inc.

第七章投资分析

第八章 市场机会与未来趋势

简介目录
Product Code: 69683

The Die Attach Equipment Market size is estimated at USD 1.54 billion in 2025, and is expected to reach USD 2.07 billion by 2030, at a CAGR of 6.09% during the forecast period (2025-2030).

Die Attach Equipment - Market - IMG1

Growth is fueled by the increased use of stacked die technology in the Internet of Things (IoT) devices. In recent trends, the demand for hybrid circuits has remained strong due to emerging and existing applications in medical, military, photonics, wireless electronics, etc.

Key Highlights

  • C2W hybrid bonding is a promising emerging technology that can enable direct Cu- Cu bonding and replace TCB for 3D stacked memory and high-end logic applications. However, C2W hybrid bonding is still in its early stages level. It is expected to hit the market in 2022/23 for logic devices with 2.5D structures, significantly assisting the equipment market's growth.
  • The demand for the AuSn Eutectic Die-Attach technique drives the market. Traditionally, various die-attach products, which include metal-filled conductive epoxies, high lead-containing solders, and gold-silicon solders, were sufficient to mount the chip and have it perform reliably for the life of the device.
  • However, the trend towards increasing heat generation, demand for compact devices, enactment of RoHS and REACH legislation, and the transition to GaAs chips limited the use of conventional materials. The demand for high device reliability has led engineers to evaluate various new materials for their die attachment.
  • The suggested solder preforms are eutectic gold-tin and can be implemented for high volume or lab quantity adoption using a Palomar Technologies' die bonder. This equipment can handle the complete die-attach process, including high-accuracy pick-and-place of substrates, eutectic gold-tin preforms, and components; eutectic die-attach; and pulsed-heat reflow using a computer-controlled Pulse Heat Stage (PHS).
  • The demand for discrete power devices drives the market. Copper clips are becoming increasingly popular as an alternative to traditional wire and ribbon bonding. Die-attach functionality is a feature of packaging solutions for discrete power components. The adoption of wide-bandgap semiconductor die technologies (SiC and GaN) brings new innovative packaging solutions, including silver sintering die-attach (materials include epoxy molding compounds and interconnection materials).
  • The progressive transition from discrete SiC towards SiC modules in EV/HEV applications, the embedded-die packaged systems, and the integration of GaN devices in multichip systems are just a few examples of such a trend. This factor enhances the demand for the die attaches equipment for the discrete power devices.
  • However, primarily dimensional changes during processing and service life and mechanical unbalance of moving parts during processing through equipment challenges the equipment's functionality which could restrain the market.

Die Attach Equipment Market Trends

LED to Witness Significant Growth

  • Die attach material is key in the performance and reliability of mid, high, and super-high power LEDs. The demand for die-attach equipment is increasing with an increasing LED penetration rate. The selection of suitable die-attach material for a particular chip structure and application depends on various considerations, which include the packaging process (throughput and yield), performance (thermal dissipation output and light output), reliability (lumen maintenance), and cost. Eutectic gold-tin, silver-filled epoxies, solder, silicones, and sintered materials have all been used for LED die attach.
  • For instance, SFE provides an Epoxy Adhesive bonding method where its LED Epoxy Die Bonder machine features an index time of 0.2 Sec /Cycle (90 Percent Rate of Operation) with a chip size of 250 * 250 standards, providing lead frame recognition through 2 Cameras. Its software function provides auto mount level & pick-up level teaching functions.
  • Further, conductive adhesives (mostly silver-filled epoxies) constitute LEDs' most extensive thermal die-attach materials (by unit number). They are compatible with existing back-end packaging equipment and provide an attractive cost/performance balance (typically up to 50 W/mK thermals with secondary reflow compatibility). As they stick to bare silicon, they are the most preferred material for dies without back-end metallization like GaN on silicon.
  • Further, in the LED market, there are a lot of rivals or competitors, and ASM is one of the prominent players in this market, and its LED Epoxy High speed die bonder AD830 dominates in the LED market. As more and more countries are getting close to phasing out conventional bulbs, LEDs are continuing their march to the top of the market. According to Joint Research Center, The penetration rate of LEDs based on sales is raising and is expected to reach a penetration rate of 75.8 % by 2025. This factor enhances the demand for the die attaches equipment market.
  • Furthermore, in September 2022, Palomar Technologies launched a new 3880-II die-bonder, which won the 2022 military+Aerospace electronics Innovation Award. This new machine includes options to maximize productivity, reduce programming time by up to 95% and improve overall bonder productivity.

Asia-Pacific Accounts for Significant Market Growth

  • Asia-Pacific accounted for the significant growth of the die-attach equipment industry. More than 60% of OSAT (Outsourced Semiconductor Assembly And Test) players present across the world have their headquarters in the APAC region. These OSAT companies use die-attach equipment in the semiconductor fabrication process. Additionally, an increasing number of IDMs (Integrated Device Manufacturers) in the region is expected to boost the market growth shortly.
  • In China and Taiwan, the mass production of electronic products, including smartphones, wearables, and white goods, uses several devices, such as optoelectronics, MEMS, and MOEMS. All these devices require die-attach equipment in the assembly process of these components.
  • Further, South Korea, China, and mostly Japan's old age population are anticipated to accelerate the need for healthcare services during the forecast period, thus providing scope for devices, such as ventilators, dialysis, and blood pressure monitoring devices constituting MEMS pressure sensors. ESCAP estimates that the geriatric population in the region, aged 60 years and older, could penetrate at the rate of 10.64 by 2025 with 9.55 in the current year and raise to 18.44 by 2050, which represent 60 percent of the worlds population. The instance caters to the growth of the market due to the demand for die-attach equipment for MEMS pressure sensor.
  • Furthermore, India is also witnessing growth in a number of smart cities, due to government initiatives and are expected to incorporate electronic solutions for purposes, such as surveillance, maintenance, monitoring, etc. According to smartcities.gov.in, the central government has allotted USD 977 million into the development of 60 such smart cities. This leads to the demand for a higher number of CMOS image sensors, which further supports the market growth.
  • High Power lasers are finding extensive demand in industrial sectors for a wide range of applications, including cutting, welding, and fabrication. Companies are moving towards Laser technologies to take advantage of high performance and reliability. The advancement in laser diode significantly increases the demand for equipment, which processes the technique of Epoxy and Eutectic bonding.
  • Further memory demand is expected to increase with the development of IoT, AI, and ADAS. As a result, productivity improvement in memory chip manufacturing and improvement of post-processing device reliability will be required more than in the past. To address this, in August 2022, Stanford engineers created a more efficient and flexible AI chip, which could bring the power of AI into tiny edge devices that contributes to improved throughput and reliability in memory production.

Die Attach Equipment Industry Overview

The die-attach equipment market is fragmented as the presence of local and global players penetrates the intense rivalry in the market. Further, players are focusing on improving their equipment performance in terms of throughput and yield through development and partnership, making the market more competitive. Key players are Be Semiconductor Industries N.V., ASM Pacific Technology Limited, Palomar Technologies Inc, etc. Recent developments in the market are -

  • In October 2022, Hermetic Solutions Group (HSG) acquired the Intellectual property of DiaCool, from RHP Technologies. This expands HSG's product lineup and offers customers significantly more options for many years. HSG's DiaCool diamond composite material for heat sinks, die tabs, and heat spreaders provide customers with significant advantages over conventional laminate or MMC materials.
  • In October 2022, Kulicke and Soffa received multiple new purchase orders for its thermo-compression solution and successfully shipped its first Fluxless Thermo-Compression Bonder (TCB) to a key customer and continues its position in the advanced LED Assembly.

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumptions and Market Definition
  • 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET DYNAMICS

  • 4.1 Market Overview
  • 4.2 Market Drivers
    • 4.2.1 Growing Demand of AuSn Eutectic Die-Attach Technology
    • 4.2.2 Demand of Discrete Power Devices
    • 4.2.3 LED Segment to Witness Significant Growth
  • 4.3 Market Restraints
    • 4.3.1 Dimensional Changes During Processing and Service Life and Mechanical Unbalance
  • 4.4 Industry Value Chain Analysis
  • 4.5 Industry Attractiveness - Porter's Five Forces Analysis
    • 4.5.1 Threat of New Entrants
    • 4.5.2 Bargaining Power of Buyers/Consumers
    • 4.5.3 Bargaining Power of Suppliers
    • 4.5.4 Threat of Substitute Products
    • 4.5.5 Intensity of Competitive Rivalry
  • 4.6 Assessment of Impact of COVID-19 on the Market

5 MARKET SEGMENTATION

  • 5.1 Type
    • 5.1.1 Die Bonder
    • 5.1.2 Flip Chip Bonder
  • 5.2 Bonding Technique
    • 5.2.1 Epoxy
    • 5.2.2 Eutectic
    • 5.2.3 Soft Solder
    • 5.2.4 Hybrid Bonding
    • 5.2.5 Other Bonding Techniques
  • 5.3 Application
    • 5.3.1 Memory
    • 5.3.2 RF & MEMS
    • 5.3.3 LED
    • 5.3.4 CMOS Image Sensor
    • 5.3.5 Logic
    • 5.3.6 Optoelectronics / Photonics
    • 5.3.7 Other Applications
  • 5.4 Geography
    • 5.4.1 North America
    • 5.4.2 Europe
    • 5.4.3 Asia
    • 5.4.4 Australia and New Zealand
    • 5.4.5 Latin America
    • 5.4.6 Middle East and Africa

6 COMPETITIVE LANDSCAPE

  • 6.1 Company Profiles
    • 6.1.1 Palomar Technologies, Inc.
    • 6.1.2 Shinkawa Ltd.
    • 6.1.3 MicroAssembly Technologies, Ltd.
    • 6.1.4 ASM Pacific Technology Limited
    • 6.1.5 Be Semiconductor Industries N.V.
    • 6.1.6 Kulicke and Soffa Industries, Inc.
    • 6.1.7 Dr. Tresky AG
    • 6.1.8 Fasford Technology Co Ltd.
    • 6.1.9 Inseto UK Limited
    • 6.1.10 Anza Technology Inc.

7 INVESTMENT ANALYSIS

8 MARKET OPPORTUNITIES AND FUTURE TRENDS