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市场调查报告书
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1851416

美国温度感测器：市场份额分析、行业趋势、统计数据和成长预测（2025-2030 年）

US Temperature Sensors - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2025 - 2030)
出版日期: | 出版商: Mordor Intelligence | 英文 120 Pages | 商品交期: 2-3个工作天内

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简介目录

据估计，2025 年美国温度感测器市场规模为 19.5 亿美元，预计到 2030 年将达到 27.6 亿美元，预测期（2025-2030 年）复合年增长率为 7.20%。

美国温度感测器市场-IMG1

对亚摄氏度级精度的需求、联邦政府为促进本土半导体生产而提供的奖励，以及电动车价值炼和资料中心冷却系统中即时监控的普及，持续推动着半导体产业的成长。私人半导体投资的流动性已超过4000亿美元，这为依赖製程热诊断的新型工厂提供了可能；同时，自动化工厂和预测性维护计画也在推动感测器的持续维修。分散式光纤解决方案、先进的红外线阵列和人工智慧赋能的边缘设备，正在为能够将测量精度与整合分析相结合的供应商拓宽竞争优势。同时，医疗保健、储能和石化产业日益严格的安全法规，也促使传统有线设备进入积极的更新换代週期。

美国温度感测器市场趋势与洞察

工业4.0和智慧工厂的广泛应用

工业数位化正在透过融合人工智慧、机器人和互联仪器重塑工厂车间，而温度感测正是这一融合的核心。过去仅对少数关键设备进行采样的预测性维护程序，如今已覆盖整个生产线，数百个节点可在机器故障发生前数小时发出温度偏差警报。德克萨斯(TI) 新型感测器中嵌入的边缘人工智慧晶片组可处理本地资料流，实现毫秒级警报，从而触发自动化响应，且无云延迟。 FOUNDATION 现场汇流排和 PROFINET 等互通通讯协定简化了系统集成，而坚固耐用的外壳和更宽的温度范围则确保了在多尘、高振动环境下的可靠运作。因此，美国温度感测器市场持续受益于传统 PLC 网路的替换销售以及来自待开发区智慧工厂的新增需求。

穿戴式装置推动了对温度感测技术的需求。

小型化、低功耗晶粒将临床级温度精度带入日常设备，使消费者能够以±0.1°C的精度追踪体温，从而实现疾病的早期检测。可拉伸基板如今能够贴合皮肤数日而不会引起刺激，双感测器耳道式设计可提供连续读数，完美契合远距远端医疗。对于感测器製造商而言，这些设计上的突破使他们不仅能够在大批量消费通路中应用其技术，还能在同样对功耗要求严格的工业IoT领域中加以利用。因此，美国温度感测器市场正处于快速创新阶段。

半导体和铂族金属价格波动；

镓、锗和铂金价格的波动正在扰乱热电阻（RTD）和精密晶片式探头的成本结构。由于中国在镓和锗提炼主导，美国买家容易受到出口限制的影响。同时，随着燃料电池和触媒转换器触媒转换器需求的激增，铂金薄膜面临供不应求。预算的供不应求导致升级计划延期，这可能会在短期内降低美国温度感测器市场的销售量。

细分市场分析

由于有线设备在安全关键硬布线和现有资料中心控制系统 (DCS) 布线中的可靠性，预计到 2024 年，有线设备仍将占据 69.20% 的收入份额；而无线节点预计将以 10.90% 的复合年增长率增长，这主要得益于其易于改装和安装成本更低。美国无线温度感测器市场预计到 2030 年将达到 8.6 亿美元，反映出资料中心和食品工厂对无线温度感测器的强劲需求。麻省理工学院 (MIT) 开发的自供电能量采集器消除了电池维护的障碍，拓展了其在泵浦、窑炉和旋转设备等领域的应用场景。在大型工厂中，LoRaWAN 和 5G NB-IoT 技术能够以毫瓦级的功率预算实现公里级的覆盖范围，使工厂管理人员无需挖掘电缆沟即可获得精细的温度分布图。

随着跳频和AES-128加密技术的普及，曾经令无线技术备受关注的可靠性问题逐渐消退。边缘微控制器现在能够预处理资料以减少资料包有效载荷，从而缓解工厂骨干网路的拥塞。同时，在核能、製药和航太等产业，有线连接仍然不可或缺，因为这些产业的管治通讯协定要求使用固定电缆和类比输出。供应商若能将混合模式闸道与Wi-Fi或sub-GHz无线电模组结合，从而桥接4-20mA环路，将可充分利用混合部署模式，并提升其在美国温度感测器市场的份额。

热电偶可覆盖高达 2300 度C 的极端温度，预计到 2024 年将贡献 32.30% 的收入。同时，分散式光纤系统正以 11.90% 的复合年增长率快速成长，因为产业对空间解析度的需求远高于点检测。 DTS 预测，到 2030 年，美国温度感测器市场规模将超过 4.7 亿美元。无电磁干扰的光纤线路可穿过高压舱和感应炉等电子设备容易故障的场所。 Luna Innovations 的高解析度装置可实现亚毫米级的精度，用于绘製电池模组和低温管道的分布图。

在製药无尘室和计量实验室等需要±0.1 度C精度的场所，电阻式温度检测器仍占据主导地位。热敏电阻器用于检测对成本敏感的设备，而红外线阵列则为预测性释放提供了热成像技术。支援HART、Modbus和乙太网路通讯协定的混合型变送器简化了与数位孪生的整合。能够提供全套感测元件、头戴式传送器和分析韧体的供应商将增强其经常性收入，并巩固其在美国温度感测器市场的地位。

其他福利：

  • Excel格式的市场预测（ME）表
  • 3个月的分析师支持

目录

第一章 引言

  • 研究假设和市场定义
  • 调查范围

第二章调查方法

第三章执行摘要

第四章 市场情势

  • 市场概览
  • 市场驱动因素
    • 工业4.0和智慧工厂的广泛应用
    • 穿戴式装置对温度感测的需求日益增长
    • 汽车电子产品和电动车对温度控管的要求日益提高
    • 用于mRNA疫苗分发的低温运输联网感测器
    • 资料中心液冷技术的快速发展需要分散式感测技术。
    • 联邦政府的回流激励措施促进了工厂内部热过程感测器的发展
  • 市场限制
    • 半导体和铂族金属价格波动
    • 较长的设计週期会延迟受监管区域的感测器更换。
    • 关键基础设施中无线感测器的网路安全问题
    • 光纤安装人员短缺限制了分散式感测技术的应用。
  • 监管环境
  • 技术展望
  • 波特五力分析
    • 供应商的议价能力
    • 买方的议价能力
    • 新进入者的威胁
    • 替代品的威胁
    • 竞争对手之间的竞争

第五章 市场规模与成长预测

  • 按类型
    • 有线
    • 无线的
  • 透过技术
    • 红外线的
    • 热电偶
    • 电阻温度检测器（RTD）
    • 热敏电阻器
    • 温度变送器
    • 光纤
    • 其他的
  • 按最终用户行业划分
    • 化工/石油化工
    • 石油和天然气
    • 金属和采矿
    • 发电
    • 饮食
    • 车
    • 医疗的
    • 航太/军事
    • 消费性电子产品
    • 其他终端用户产业
  • 连结性别
    • 接触
    • 非接触式
  • 透过应用环境
    • 工业製程监控
    • 暖通空调和楼宇自动化
    • 医疗保健和穿戴式设备
    • 电动汽车电池管理
    • 资料中心和电讯

第六章 竞争情势

  • 市场集中度
  • 策略趋势
  • 市占率分析
  • 公司简介
    • Texas Instruments Inc.
    • Honeywell International Inc.
    • TE Connectivity Ltd
    • Analog Devices Inc.
    • Siemens AG
    • Panasonic Corp.
    • ABB Ltd
    • Emerson Electric Co.
    • STMicroelectronics
    • Microchip Technology Inc.
    • NXP Semiconductors NV
    • Robert Bosch GmbH
    • DENSO Corp.
    • FLIR Systems（Teledyne）
    • Omron Corp.
    • Maxim Integrated（ADI）
    • Fluke Process Instruments
    • Sensirion AG
    • Amphenol Advanced Sensors
    • Silixa Ltd
    • AP Sensing GmbH

第七章 市场机会与未来展望

简介目录
Product Code: 52101

The US Temperature Sensors Market size is estimated at USD 1.95 billion in 2025, and is expected to reach USD 2.76 billion by 2030, at a CAGR of 7.20% during the forecast period (2025-2030).

US Temperature Sensors - Market - IMG1

Sub-degree accuracy demands, federal incentives that strengthen on-shore semiconductor production, and the diffusion of real-time monitoring across electric-vehicle (EV) value chains and data-center cooling systems keep the growth engine running. Liquidity in private semiconductor investments already past USD 400 billion has unlocked new fabs that rely on in-process thermal diagnostics, while autonomous factories and predictive maintenance programs drive continuous sensor retrofits. Distributed fiber-optic solutions, advanced infrared arrays, and AI-enabled edge devices are widening the competitive moat for suppliers able to pair measurement precision with integrated analytics. At the same time, tighter safety regulations in healthcare, energy storage, and petrochemical sites ensure that replacement cycles remain brisk even in legacy wired installations.

US Temperature Sensors Market Trends and Insights

Expansion of Industry 4.0 and smart-factory adoption

Industrial digitalization reshapes factory floors by fusing AI, robotics, and connected instrumentation, and temperature sensing sits at the heart of that convergence. Predictive maintenance programs that once sampled a few key assets now blanket entire production lines with hundreds of nodes that flag thermal deviations hours before mechanical breakdowns. Edge AI chipsets embedded in new sensors from Texas Instruments crunch local data streams so millisecond-level alerts can trigger automated responses without cloud latency. Interoperable protocols such as FOUNDATION Fieldbus and PROFINET simplify system integration, while ruggedized housings and extended temperature ranges ensure reliable service in dusty, high-vibration zones. As a result, the US temperature sensors market keeps enjoying replacement sales into heritage PLC networks and fresh demand from green-field smart factories.

Growing demand for temperature sensing in wearable consumer electronics

Miniaturized, low-power die have brought clinical-grade temperature accuracy into everyday devices, letting consumers track core body temperature within +-0.1 °C for early illness detection. Stretchable substrates now conform to skin for days without irritation, and dual-sensor ear-canal designs deliver continuous readings that fit into telehealth workflows. Fifth-generation cellular links and edge computing chips send encrypted streams to healthcare dashboards so clinicians can intervene remotely, a capability valued by aging-in-place programs. For sensor makers, these design wins offer high-volume consumer channels plus technology leverage across industrial IoT where power budgets are equally tight. The resulting pull keeps the US temperature sensors market on a steep innovation curve.

Volatility in semiconductor and platinum-group metal prices

Price swings in gallium, germanium, and platinum upset cost structures for RTDs and high-precision chip-based probes. China's command of gallium and germanium refining keeps US buyers vulnerable to export restrictions, while platinum thin films face supply tightness amid intensified fuel-cell and catalytic-converter demand. Budget uncertainty can delay upgrade projects, trimming near-term volumes inside the US temperature sensors market.

Other drivers and restraints analyzed in the detailed report include:

  1. Rising automotive electronics and EV thermal-management requirements
  2. Adoption of cold-chain IoT sensors for mRNA-vaccine logistics
  3. Cyber-security concerns over wireless sensors in critical infrastructure

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

Wired devices retained 69.20% of 2024 revenue thanks to hard-wired reliability in safety-critical loops and existing DCS cabling, yet wireless nodes are scaling 10.90% CAGR on retrofit ease and lower installation costs. The US temperature sensors market size for wireless products is forecast to reach USD 0.86 billion by 2030, reflecting robust adoption in data centers and food plants. Self-powered harvesters developed at MIT remove battery maintenance barriers and widen use cases in pumps, kilns, and rotating equipment. In sprawling factories, LoRaWAN and 5G NB-IoT enable kilometer-scale reach with milliwatt power budgets, giving plant managers granular heat maps without trenching cable.

Reliability fears that once shadowed wireless have faded as frequency-hopping and AES-128 encryption become standard. Edge microcontrollers now pre-process readings to slash packet payloads, reducing congestion on factory backbones. Meanwhile, wired incumbency endures in nuclear, pharma, and aerospace lines where governance protocols require fixed cabling and analog outputs. Suppliers that bundle mixed-mode gateways bridging 4-20 mA loops with Wi-Fi or Sub-GHz radios capitalize on hybrid roll-outs and expand their stake in the US temperature sensors market.

Thermocouples brought in 32.30% of 2024 turnover by covering extreme heat up to 2,300 °C, but distributed fiber-optic systems are rocketing at 11.90% CAGR as industries crave spatial resolution over point checks. The US temperature sensors market size for DTS is projected to exceed USD 470 million by 2030. Immune to EMI, fiber lines navigate high-voltage bays and induction furnaces where electronics fail. High-definition units from Luna Innovations achieve sub-millimeter granularity, mapping battery modules and cryogenic pipelines alike.

Resistance Temperature Detectors still dominate pharma cleanrooms and metrology labs that stipulate +-0.1 °C accuracy. Thermistors capture cost-sensitive appliances, while infrared arrays unlock thermal imaging for predictive maintenance. Hybrid transmitters delivering HART, Modbus, or Ethernet protocols simplify integration into digital twins. Vendors that supply full stacks sensing element, head-mount transmitter, and analytics firmware bolster recurring revenue and deepen their position inside the US temperature sensors market.

US Temperature Sensors Market Report is Segmented by Type (Wired, Wireless), Technology (Infrared, Thermocouple, RTD, Thermistor and More), End-User Industry (Chemical and Petrochemical, Oil and Gas, Metal and Mining and More), Connectivity (Contact, Non-Contact), Application Environment (Industrial Process Monitoring, HVAC and Building Automation and More). The Market Forecasts are Provided in Terms of Value (USD).

List of Companies Covered in this Report:

  1. Texas Instruments Inc.
  2. Honeywell International Inc.
  3. TE Connectivity Ltd
  4. Analog Devices Inc.
  5. Siemens AG
  6. Panasonic Corp.
  7. ABB Ltd
  8. Emerson Electric Co.
  9. STMicroelectronics
  10. Microchip Technology Inc.
  11. NXP Semiconductors NV
  12. Robert Bosch GmbH
  13. DENSO Corp.
  14. FLIR Systems (Teledyne)
  15. Omron Corp.
  16. Maxim Integrated (ADI)
  17. Fluke Process Instruments
  18. Sensirion AG
  19. Amphenol Advanced Sensors
  20. Silixa Ltd
  21. AP Sensing GmbH

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumptions and Market Definition
  • 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

  • 4.1 Market Overview
  • 4.2 Market Drivers
    • 4.2.1 Expansion of Industry 4.0 and smart-factory adoption
    • 4.2.2 Growing demand for temperature sensing in wearable consumer electronics
    • 4.2.3 Rising automotive electronics and EV thermal-management requirements
    • 4.2.4 Adoption of cold-chain IoT sensors for mRNA-vaccine logistics
    • 4.2.5 Rapid growth of data-center liquid-cooling needs distributed sensing
    • 4.2.6 Federal on-shoring incentives boosting in-fab thermal-process sensors
  • 4.3 Market Restraints
    • 4.3.1 Volatility in semiconductor and platinum-group metal prices
    • 4.3.2 Lengthy design-in cycles slow sensor replacement in regulated sectors
    • 4.3.3 Cyber-security concerns over wireless sensors in critical infrastructure
    • 4.3.4 Shortage of fiber-optic installers curbs distributed sensing roll-out
  • 4.4 Regulatory Landscape
  • 4.5 Technological Outlook
  • 4.6 Porter's Five Forces Analysis
    • 4.6.1 Bargaining Power of Suppliers
    • 4.6.2 Bargaining Power of Buyers
    • 4.6.3 Threat of New Entrants
    • 4.6.4 Threat of Substitutes
    • 4.6.5 Competitive Rivalry Intensity

5 MARKET SIZE AND GROWTH FORECASTS (VALUE)

  • 5.1 By Type
    • 5.1.1 Wired
    • 5.1.2 Wireless
  • 5.2 By Technology
    • 5.2.1 Infrared
    • 5.2.2 Thermocouple
    • 5.2.3 Resistance Temperature Detector (RTD)
    • 5.2.4 Thermistor
    • 5.2.5 Temperature Transmitter
    • 5.2.6 Fiber Optic
    • 5.2.7 Others
  • 5.3 By End-user Industry
    • 5.3.1 Chemical and Petrochemical
    • 5.3.2 Oil and Gas
    • 5.3.3 Metal and Mining
    • 5.3.4 Power Generation
    • 5.3.5 Food and Beverage
    • 5.3.6 Automotive
    • 5.3.7 Medical
    • 5.3.8 Aerospace and Military
    • 5.3.9 Consumer Electronics
    • 5.3.10 Other End-user Industries
  • 5.4 By Connectivity
    • 5.4.1 Contact
    • 5.4.2 Non-Contact
  • 5.5 By Application Environment
    • 5.5.1 Industrial Process Monitoring
    • 5.5.2 HVAC and Building Automation
    • 5.5.3 Healthcare and Wearables
    • 5.5.4 Electric-Vehicle Battery Management
    • 5.5.5 Data Centers and Telecom

6 COMPETITIVE LANDSCAPE

  • 6.1 Market Concentration
  • 6.2 Strategic Moves
  • 6.3 Market Share Analysis
  • 6.4 Company Profiles (includes Global level Overview, Market level overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share for key companies, Products and Services, and Recent Developments)
    • 6.4.1 Texas Instruments Inc.
    • 6.4.2 Honeywell International Inc.
    • 6.4.3 TE Connectivity Ltd
    • 6.4.4 Analog Devices Inc.
    • 6.4.5 Siemens AG
    • 6.4.6 Panasonic Corp.
    • 6.4.7 ABB Ltd
    • 6.4.8 Emerson Electric Co.
    • 6.4.9 STMicroelectronics
    • 6.4.10 Microchip Technology Inc.
    • 6.4.11 NXP Semiconductors NV
    • 6.4.12 Robert Bosch GmbH
    • 6.4.13 DENSO Corp.
    • 6.4.14 FLIR Systems (Teledyne)
    • 6.4.15 Omron Corp.
    • 6.4.16 Maxim Integrated (ADI)
    • 6.4.17 Fluke Process Instruments
    • 6.4.18 Sensirion AG
    • 6.4.19 Amphenol Advanced Sensors
    • 6.4.20 Silixa Ltd
    • 6.4.21 AP Sensing GmbH

7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK

  • 7.1 White-space and Unmet-need Assessment