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市场调查报告书
商品编码
1910506

红外线感测器:市场份额分析、产业趋势与统计、成长预测(2026-2031)

Infrared Sensor - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2026 - 2031)

出版日期: | 出版商: Mordor Intelligence | 英文 120 Pages | 商品交期: 2-3个工作天内

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简介目录

预计红外线感测器市场规模将从 2025 年的 11.9 亿美元成长到 2026 年的 12.7 亿美元,到 2031 年将达到 18 亿美元,2026 年至 2031 年的复合年增长率为 7.12%。

红外线感测器市场-IMG1

这一增长得益于工业4.0自动化计划的不断推进、日益严格的汽车安全法规以及提升检测器灵敏度和成本效益的材料级创新。儘管近红外线(NIR)装置仍是收入的主要来源,但由于热感成像技术在汽车、工业和医疗领域的广泛应用,远红外线(FIR)阵列正经历着最快的成长。封装技术的创新(主要是晶圆级真空技术)持续降低组件成本,而人工智慧赋能的晶片处理技术正将设计重点转向节能型、事件驱动型架构。量子效率、像素间距和动态范围的逐步提升,为预测性维护、气体监测和自适应驾驶辅助等领域创造了新的机会,同时也加剧了传统半导体製造商与敏捷材料专家之间的竞争。

全球红外线感测器市场趋势及展望

工业4.0自动化热潮

将热感仪整合到预测性维护框架中,可在保持高影像品质的同时,将非计划性停机时间减少 53%,从而缩短工厂维修的投资回收期。结合红外线热成像和声发射技术的双感测器节点,可实现增材製造炉和轧延中的异常检测。案例研究表明,采用热电发电机的免维护工业物联网节点正在兴起,可将电池废弃物减少 94%,并将总感测成本降低 70%。基于变压器的预测模型在识别资产健康状况方面达到了 99% 的准确率,使红外线数据成为人工智慧驱动的维护计划的可靠输入。这些技术的进步,共同推动了红外线感测器市场深入融入工业价值链,即使在利润率较低的工厂维修领域,也实现了销售成长。

扩展智慧家庭和家用电子电器平台

封装技术的进步使得基于TMOS的人体存在检测感测器无需笨重的聚光器即可检测4公尺范围内的人体,从而将红外线感测技术扩展到电池供电的智慧恆温器和手势控制设备。多区域飞行时间测距技术将白天的检测距离从170厘米扩展到285厘米,同时将功耗从4.5毫瓦降低到1.6毫瓦。这种效率对于穿戴式装置和智慧音箱至关重要。无铅量子点光电二极体可在1390奈米波长下进行短波红外线(SWIR)成像,满足环保法规要求,并可在OLED显示器后实现安全的脸部认证。对0.05°C温度变化敏感的柔性光热电薄膜为新兴的电子皮肤和扩增实境触觉技术提供了支援。这些创新巩固了家用电子电器作为红外线感测器市场持续需求驱动力的地位。

冷却式红外线检测器高成本且需要低温冷却

由于需要史特灵引擎或焦耳-汤姆森冷却器来维持低温设定点以抑制光子噪声,冷却式检测器组件会产生大量的购买成本和营运成本。即使多级热电模组取得了进步,也尚未能缩小与非冷却式微测辐射热计的成本差距,这限制了它们在价格弹性较大的大众消费品和建筑自动化应用中的普及。

细分市场分析

截至2025年,近红外线模组占整个红外线感测器市场的37.45%。这主要是因为硅基光电二极体和CMOS-ToF晶片的成本曲线符合家用电子电器的水平。意法半导体(STMicroelectronics)的量子点短波红外线(SWIR)原型机,像素间距为1.62µm,量子效率高达60%,实现了个位数美元的晶粒,从而将附加值扩展到了高利润的频谱频宽。同时,NEC的奈米碳管成像器将室温灵敏度提高了三倍,实现了先前只有非製冷型HgCdTe焦平面阵列才能达到的性能。在热感成像需求快速成长的推动下,远红外线(FIR)细分市场正以7.35%的复合年增长率成长,预计将在十年内缩小与近红外线模组的收入差距。

製造商正在推出混合模组,将近红外线 (NIR) 和远红外线 (FIR) 整合到单一光学系统中,从而简化相机对准并增强移动机器人的场景理解能力。这些双波段平台正在拓展红外线感测器在加值分析领域的市场,尤其是在环境光线变化或烟雾导致能见度低,影响 RGB 视觉的情况下。

被动式红外线感测器功耗低至毫瓦级,是电池供电的智慧家庭节点不可或缺的一部分,预计到2025年将占据红外线感测器市场61.20%的份额。在全球范围内,新建商业建筑的能源标准强制要求安装人体感应感测器,这进一步巩固了市场需求,光是加州第24号法规修正案就推动了数千万台感测器的年销售量。同时,在雷射雷达相关应用的推动下,主动式红外线感测器预计到2031年将以7.55%的复合年增长率成长。这些应用利用客製化光束,为室内机器人和自动导引运输车(AGV)提供深度感知。低成本的850奈米和940奈米垂直共振腔面射型雷射(VCSEL)现已与单光子崩溃式二极体整合在同一块印刷电路板(PCB)上,即使在明亮的日光条件下,也能实现公分级、最远15公尺的侦测距离。结合被动运动侦测和主动检验脉衝的双技术检测器在商业安防领域越来越受欢迎,因为误报率直接影响保险成本。

消费性电子产品待机功耗低于0.5W的监管压力促使被动式架构发展,而车载资讯娱乐系统对手势姿态辨识和人机互动的需求则推动汽车製造商转向主动式近红外线阵列。最终,我们预期软体定义感测器将实现融合,根据环境和电池状态动态切换被动式和主动式模式。

区域分析

北美地区预计在2025年将占总收入的31.55%,这主要得益于成熟的航太供应商、健全的汽车安全法规结构以及积极的智慧製造奖励。联邦政府对半导体产业回流的津贴进一步推动了国内晶圆产能的扩张,并降低了该地区相机製造商面临的地缘政治风险。欧洲紧随其后,这得益于强劲的一级汽车供应商整合和高度的工业自动化,但消费性电子产品成长放缓抑制了其整体扩张速度,使其不如亚太地区。

亚太地区红外线感测器市场正以7.95%的复合年增长率成长,这主要得益于智慧型手机的大规模生产、智慧城市建设的蓬勃发展以及政策支持的自动化升级。中国的锗出口配额政策鼓励了区域内对替代光学材料的投资,加速了当地生态系统的多元化发展。日本凭藉NEC和滨松光子学等公司不断突破检测器的物理极限,保持着技术领先地位;而韩国则利用其先进的封装技术,为民用无人机和安防摄影机提供微测辐射热计。

新兴的中东和非洲市场正开始试用热感摄影机,用于边防安全和电厂安防,这些计画通常由主权财富倡议资助。拉丁美洲在采矿和农业自动化方面正逐步取得进展,利用红外线无人机进行作物监测的试验计画显示出可观的投资回报,但这些计画易受汇率波动和进口关税的影响。

其他福利:

  • Excel格式的市场预测(ME)表
  • 3个月的分析师支持

目录

第一章 引言

  • 研究假设和市场定义
  • 调查范围

第二章调查方法

第三章执行摘要

第四章 市场情势

  • 市场概览
  • 市场驱动因素
    • 快速采用工业4.0自动化
    • 扩展智慧家庭和家用电子电器基础设施
    • 高级驾驶辅助系统和自动驾驶汽车的需求不断增长
    • 严格的安全和环境法规推动了气体监测的发展。
    • 晶圆级真空封装降低了红外线感测器的成本
    • 用于超低功耗事件驱动感测的片上人工智慧
  • 市场限制
    • 冷却式红外线检测器高成本且需要低温冷却
    • 温度漂移导致的重新校准开销
    • 红外线化合物半导体的供应瓶颈
    • 长波红外线(LWIR)技术的出口管制限制
  • 产业价值链分析
  • 监管环境
  • 技术展望
  • 波特五力分析
    • 供应商的议价能力
    • 买方的议价能力
    • 新进入者的威胁
    • 替代品的威胁
    • 竞争对手之间的竞争
  • 对宏观经济趋势的市场评估

第五章 市场规模与成长预测

  • 按类型
    • 近红外线(NIR)
    • 红外线的
    • 远红外线 (FIR)
  • 透过运作机制
    • 积极的
    • 被动的
  • 透过使用
    • 运动感应
    • 温度测量
    • 安全与监控
    • 气体和火灾侦测
    • 光谱学
    • 其他用途
  • 按最终用户行业划分
    • 卫生保健
    • 航太与国防
    • 商业用途
    • 製造业
    • 石油和天然气
    • 其他终端用户产业
  • 按地区
    • 北美洲
      • 美国
      • 加拿大
      • 墨西哥
    • 南美洲
      • 巴西
      • 阿根廷
      • 其他南美洲
    • 欧洲
      • 德国
      • 英国
      • 法国
      • 义大利
      • 西班牙
      • 其他欧洲地区
    • 亚太地区
      • 中国
      • 日本
      • 印度
      • 韩国
      • ASEAN
      • 亚太其他地区
    • 中东和非洲
      • 中东
        • 沙乌地阿拉伯
        • 阿拉伯聯合大公国
        • 其他中东地区
      • 非洲
        • 南非
        • 埃及
        • 其他非洲地区

第六章 竞争情势

  • 市场集中度
  • 策略趋势
  • 市占率分析
  • 公司简介
    • Murata Manufacturing Co. Ltd
    • STMicroelectronics NV
    • Excelitas Technologies
    • Teledyne Imaging Inc.
    • Mitsubishi Electric Corporation
    • Amphenol Advanced Sensors(Amphenol Corporation)
    • SENBA Sensing Technology Co. Ltd
    • Nippon Ceramic Co. Ltd
    • Panasonic Corporation
    • Broadcom Inc.
    • Melexis NV
    • Hamamatsu Photonics kk
    • InfraTec GmbH
    • Honeywell International Inc.
    • Texas Instruments Incorporated
    • Analog Devices Inc.
    • ifm electronic GmbH
    • In-situ Inc.
    • OMRON Corporation
    • Sensirion AG

第七章 市场机会与未来展望

简介目录
Product Code: 63854

The Infrared Sensor market is expected to grow from USD 1.19 billion in 2025 to USD 1.27 billion in 2026 and is forecast to reach USD 1.8 billion by 2031 at 7.12% CAGR over 2026-2031.

Infrared Sensor - Market - IMG1

The expansion is underpinned by rising Industry 4.0 automation projects, stricter automotive safety mandates, and material-level breakthroughs that improve detector sensitivity and cost efficiency. Near-infrared (NIR) devices remain the revenue cornerstone, yet far-infrared (FIR) arrays are moving fastest as thermal imaging proliferates in automotive, industrial, and medical settings. Packaging innovation chiefly wafer-level vacuum techniques, continues to compress bill-of-materials costs, while AI-enabled on-chip processing reshapes design priorities toward power-aware, event-driven architectures. Incremental gains in quantum efficiency, pixel pitch, and dynamic range are translating into new opportunities in predictive maintenance, gas monitoring, and adaptive driver assistance, thereby sharpening competition among established semiconductor houses and agile materials specialists.

Global Infrared Sensor Market Trends and Insights

Surging Adoption of Industry 4.0 Automation

Thermal cameras, embedded in predictive-maintenance frameworks, now reduce unplanned downtime by 53% while maintaining high image fidelity, thereby accelerating payback periods for factory retrofits. Dual-sensor nodes that merge infrared thermography with acoustic emission enable anomaly detection in additive-manufacturing furnaces and rolling mills. Deployments increasingly exploit thermoelectric harvesters to power maintenance-free IIoT nodes that cut battery waste 94% and shrink total sensing cost 70%. Transformer-based predictive models are achieving 99% identification accuracy for equipment health, making infrared data a trusted input for AI-driven maintenance schedules. Together, these advances embed the infrared sensor market more deeply in industrial value chains, driving volume growth even in low-margin plant retrofits.

Expanding Smart-Home and Consumer Electronics Base

Packaging advances allow TMOS-based presence sensors to detect humans four meters away without bulky concentrators, pushing infrared sensing into battery-powered smart thermostats and gesture-controlled appliances. Multi-zone time-of-flight ranging now extends daytime detection from 170 cm to 285 cm while cutting power from 4.5 mW to 1.6 mW, an efficiency leap critical for wearables and smart speakers. Lead-free quantum-dot photodiodes deliver SWIR imaging at 1,390 nm, meeting environmental directives and enabling secure face authentication behind OLED displays. Flexible photothermoelectric films, sensitive to 0.05 °C changes, underpin emerging electronic-skin and AR-haptics categories. These innovations cement consumer electronics as an enduring demand engine for the infrared sensor market.

High Cost and Cryogenic Cooling of Cooled IR Detectors

Cooled detector assemblies impose significant capital and operating expense because Stirling engines or Joule-Thomson coolers must maintain cryogenic set-points for photon noise suppression. Even advances in multi-stage thermoelectric modules have not yet closed the cost gap against uncooled microbolometers, restraining adoption in mass-volume consumer and building-automation niches where price elasticity is high.

Other drivers and restraints analyzed in the detailed report include:

  1. Rising Demand from ADAS and Autonomous Vehicles
  2. Stricter Safety and Environmental Regulations Driving Gas Monitoring
  3. Temperature-Drift Induced Recalibration Overheads

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

Near-infrared modules held 37.45% of overall infrared sensor market share in 2025, largely because silicon-based photodiodes and CMOS-ToF chips align with consumer-electronics cost curves. Quantum-dot SWIR prototypes from STMicroelectronics, featuring 1.62 µm pixel pitch and 60% quantum efficiency, promise single-digit-dollar dies that could swing incremental value toward higher-margin spectral bands. Meanwhile, carbon-nanotube imagers from NEC triple sensitivity at room temperature, creating an uncooled path to performance once reserved for HgCdTe focal-plane arrays. The FIR subset, buoyed by rapid thermal-imaging uptake, is tracking a 7.35% CAGR and is on course to narrow the revenue gap by the decade's close.

Manufacturers are fielding hybrid modules that fuse NIR and FIR into a single optical train, easing camera alignment and broadening scene understanding in mobile robotics. Such dual-band platforms deepen the infrared sensor market size for value-added analytics, particularly where ambient-light variability or smoke obscuration challenges RGB-only vision.

Passive infrared maintained a 61.20% hold on the infrared sensor market size during 2025 owing to its milliwatt-level power draw, which makes it indispensable in battery-powered smart-home nodes. The global roll-out of energy-code-mandated occupancy sensors in new commercial buildings has cemented demand, with California Title 24 revisions alone driving tens of millions of yearly unit sales. Conversely, active infrared is slated for a 7.55% CAGR through 2031, fueled by LiDAR-adjacent applications that exploit modulated beams for depth perception in indoor robotics and AGVs. Low-cost vertical-cavity surface-emitting lasers (VCSELs) at 850 nm and 940 nm now pair with single-photon avalanche diodes on the same PCB, enabling centimeter-grade ranging up to 15 m in broad daylight. Dual-technology detectors combining passive motion triggers with active verification pulses are gaining popularity in commercial security where false alarm rates have direct insurance cost implications.

Regulatory pressure to cut standby energy use below 0.5 W in consumer electronics favors passive architectures, but the drive for gesture recognition and human-machine interaction in infotainment systems is tipping automakers toward active NIR arrays. The eventual convergence is likely to see software-defined sensors that dynamically toggle between passive and active modes based on ambient conditions and battery state.

The Infrared Sensor Market Report is Segmented by Type (Near Infrared (NIR), Infrared, and Far Infrared (FIR)), Working Mechanism (Active, and Passive), Application (Motion Sensing, Temperature Measurement, Security and Surveillance, Spectroscopy, and More), End-User Industry (Healthcare, Aerospace and Defense, Automotive, Commercial Applications, and More), and Geography. The Market Forecasts are Provided in Terms of Value (USD).

Geography Analysis

North America captured 31.55% of 2025 revenue on the back of entrenched aerospace suppliers, a robust automotive safety framework, and active smart-manufacturing incentives. Federal grants directed at semiconductor reshoring further encourage domestic wafer capacity additions, lowering geopolitical risk for local downstream camera makers. Europe follows with strong automotive tier-1 integration and industrial-automation depth; however, slower consumer-electronics growth moderates total expansion relative to Asia-Pacific.

The Asia-Pacific infrared sensor market is tracking an 7.95% CAGR, supported by volume smartphone production, aggressive smart-city rollouts, and policy-backed automation upgrades. China's germanium export quotas sparked regional investment in alternative optical materials, catalyzing local ecosystem diversification. Japan maintains technology leadership via firms such as NEC and Hamamatsu that continually push detector physics boundaries, while South Korea leverages advanced packaging prowess to supply microbolometers for consumer drones and security cameras.

Emerging Middle East and Africa markets are beginning to trial thermal cameras for border security and power-plant safety, with funding often sourced from sovereign-wealth initiatives. Latin America demonstrates gradual traction in mining and agricultural automation; pilot programs deploying infrared-enabled drones for crop-health surveys show promising ROI but remain sensitive to currency volatility and import tariffs.

  1. Murata Manufacturing Co. Ltd
  2. STMicroelectronics NV
  3. Excelitas Technologies
  4. Teledyne Imaging Inc.
  5. Mitsubishi Electric Corporation
  6. Amphenol Advanced Sensors (Amphenol Corporation)
  7. SENBA Sensing Technology Co. Ltd
  8. Nippon Ceramic Co. Ltd
  9. Panasonic Corporation
  10. Broadcom Inc.
  11. Melexis NV
  12. Hamamatsu Photonics kk
  13. InfraTec GmbH
  14. Honeywell International Inc.
  15. Texas Instruments Incorporated
  16. Analog Devices Inc.
  17. ifm electronic GmbH
  18. In-situ Inc.
  19. OMRON Corporation
  20. Sensirion AG

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumptions and Market Definition
  • 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

  • 4.1 Market Overview
  • 4.2 Market Drivers
    • 4.2.1 Surging adoption of Industry 4.0 automation
    • 4.2.2 Expanding smart-home and consumer electronics base
    • 4.2.3 Rising demand from ADAS and autonomous vehicles
    • 4.2.4 Stricter safety and environmental regulations driving gas monitoring
    • 4.2.5 Wafer-level vacuum packaging cutting IR sensor costs
    • 4.2.6 On-chip AI enabling ultra-low-power event-driven sensing
  • 4.3 Market Restraints
    • 4.3.1 High cost and cryogenic cooling of cooled IR detectors
    • 4.3.2 Temperature-drift induced recalibration overheads
    • 4.3.3 Supply bottlenecks for IR-grade compound semiconductors
    • 4.3.4 Export-control restrictions on LWIR technologies
  • 4.4 Industry Value Chain Analysis
  • 4.5 Regulatory Landscape
  • 4.6 Technological Outlook
  • 4.7 Porter's Five Forces Analysis
    • 4.7.1 Bargaining Power of Suppliers
    • 4.7.2 Bargaining Power of Buyers
    • 4.7.3 Threat of New Entrants
    • 4.7.4 Threat of Substitutes
    • 4.7.5 Intensity of Competitive Rivalry
  • 4.8 Assessment of Macro-economic Trends on the Market

5 MARKET SIZE AND GROWTH FORECASTS (VALUE)

  • 5.1 By Type
    • 5.1.1 Near Infrared (NIR)
    • 5.1.2 Infrared
    • 5.1.3 Far Infrared (FIR)
  • 5.2 By Working Mechanism
    • 5.2.1 Active
    • 5.2.2 Passive
  • 5.3 By Application
    • 5.3.1 Motion Sensing
    • 5.3.2 Temperature Measurement
    • 5.3.3 Security and Surveillance
    • 5.3.4 Gas and Fire Detection
    • 5.3.5 Spectroscopy
    • 5.3.6 Other Applications
  • 5.4 By End-user Industry
    • 5.4.1 Healthcare
    • 5.4.2 Aerospace and Defense
    • 5.4.3 Automotive
    • 5.4.4 Commercial Applications
    • 5.4.5 Manufacturing
    • 5.4.6 Oil and Gas
    • 5.4.7 Other End-user Industries
  • 5.5 By Geography
    • 5.5.1 North America
      • 5.5.1.1 United States
      • 5.5.1.2 Canada
      • 5.5.1.3 Mexico
    • 5.5.2 South America
      • 5.5.2.1 Brazil
      • 5.5.2.2 Argentina
      • 5.5.2.3 Rest of South America
    • 5.5.3 Europe
      • 5.5.3.1 Germany
      • 5.5.3.2 United Kingdom
      • 5.5.3.3 France
      • 5.5.3.4 Italy
      • 5.5.3.5 Spain
      • 5.5.3.6 Rest of Europe
    • 5.5.4 Asia Pacific
      • 5.5.4.1 China
      • 5.5.4.2 Japan
      • 5.5.4.3 India
      • 5.5.4.4 South Korea
      • 5.5.4.5 ASEAN
      • 5.5.4.6 Rest of Asia Pacific
    • 5.5.5 Middle East and Africa
      • 5.5.5.1 Middle East
        • 5.5.5.1.1 Saudi Arabia
        • 5.5.5.1.2 United Arab Emirates
        • 5.5.5.1.3 Rest of Middle East
      • 5.5.5.2 Africa
        • 5.5.5.2.1 South Africa
        • 5.5.5.2.2 Egypt
        • 5.5.5.2.3 Rest of Africa

6 COMPETITIVE LANDSCAPE

  • 6.1 Market Concentration
  • 6.2 Strategic Moves
  • 6.3 Market Share Analysis
  • 6.4 Company Profiles (includes Global level Overview, Market level overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share for key companies, Products & Services, and Recent Developments)
    • 6.4.1 Murata Manufacturing Co. Ltd
    • 6.4.2 STMicroelectronics NV
    • 6.4.3 Excelitas Technologies
    • 6.4.4 Teledyne Imaging Inc.
    • 6.4.5 Mitsubishi Electric Corporation
    • 6.4.6 Amphenol Advanced Sensors (Amphenol Corporation)
    • 6.4.7 SENBA Sensing Technology Co. Ltd
    • 6.4.8 Nippon Ceramic Co. Ltd
    • 6.4.9 Panasonic Corporation
    • 6.4.10 Broadcom Inc.
    • 6.4.11 Melexis NV
    • 6.4.12 Hamamatsu Photonics kk
    • 6.4.13 InfraTec GmbH
    • 6.4.14 Honeywell International Inc.
    • 6.4.15 Texas Instruments Incorporated
    • 6.4.16 Analog Devices Inc.
    • 6.4.17 ifm electronic GmbH
    • 6.4.18 In-situ Inc.
    • 6.4.19 OMRON Corporation
    • 6.4.20 Sensirion AG

7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK

  • 7.1 White-space and Unmet-Need Assessment