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市场调查报告书
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1934802

中国工业感测器市场：市场占有率分析、产业趋势与统计、成长预测（2026-2031）

China Industrial Sensors - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2026 - 2031)
出版日期: | 出版商: Mordor Intelligence | 英文 161 Pages | 商品交期: 2-3个工作天内

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简介目录

2025年中国工业感测器市场价值88.4亿美元，预计2031年将达到176.2亿美元，高于2026年的99.2亿美元。

预测期（2026-2031 年）的复合年增长率预计为 12.18%。

中国工业感测器市场-IMG1

这一成长动能反映了该国向智慧製造转型、全国推行工业4.0以及为降低进口依赖而推出的广泛在地化奖励。在工厂数位化预算中，感测器维修的支出占比已达15%以上，而《网路安全法》对边缘运算的要求也推动了国产设备的普及。电动车产量激增、工业园区严格的碳排放管理法规以及不断扩展的预测性维护计划，进一步推动了汽车、流程和能源资产中多感测器技术的应用。竞争格局仍较为分散，大型外资企业为遵守采购法规而进行在地化生产，而本土新兴企业则透过併购系统（MEMS）升级提升自身价值。

中国工业感测器市场趋势及洞察

工业4.0的加速普及推动智慧工厂的感测器维修。

工厂正从独立的自动化孤岛向整合感测器网路转型，这些网路能够将持续资料传输到内部人工智慧平台。在2,000亿元人民币的公共资金中，约有15%被累计给了感测器，由此催生了一系列捆绑硬体、网路连接和分析服务的服务包。与西方工厂常见的逐步维修不同，中国製造商通常会在一次停产期内完成整条生产线的改造。网路安全法中关于边缘运算的规定要求进行本地资料处理，这进一步推动了对国产人工智慧设备的需求。

政府激励措施鼓励国产感测器本地化

北京当局将感测器列为“关键技术”，由此带来了补贴、税收优惠和快速划拨土地等一系列政策，每年采购额超过500亿元。预计到2027年，中国对高端MEMS的进口依赖度将从2024年的80%以上降至50%以下。目前，国际主要製造商正纷纷成立合资企业，将核心製造流程引入中国，加速技术转移，并提升本土人才能力。

对高阶MEMS晶粒进口的高度依赖推高了元件成本。

先进的 MEMS晶粒主要来自台湾、韩国和德国，继续占精密级晶片供应的 70% 以上。在 2024 年半导体短缺期间，前置作业时间延长至 26 週，与完全在地采购相比，元件成本增加了 35-40%，降低了对成本敏感领域的价格竞争力。

细分市场分析

到2025年，压力感测器将占中国工业感测器市场26.42%的份额，其应用范围广泛，包括汽车煞车系统、石油化学管道和空调控制等。随着关键设备的预测性维护计划需要持续的压力回馈迴路，该细分市场的收入预计将稳定成长。气体感测器预计将以13.56%的复合年增长率快速成长，这主要得益于碳排放监测法规的实施以及先进的电化学和光声技术在烟囱、电池工厂和废气洗涤设备中的应用。温度和液位感测器在製药、食品加工和水处理行业中保持稳定的订单，这主要受监管部门对详细温度和液位记录的要求所驱动。流量感测器和磁场感测器分别越来越多地应用于智慧城市供水网路和电动汽车马达控制设备。加速感应器和横摆角速度感测器正被整合到国内汽车製造商的自动驾驶研发流程中。

产品配置正从分立元件转向将压力、温度和振动资料整合到单一MEMS堆迭中的封装。供应商正与自动化厂商合作设计这些混合产品，以缩短安装时间并简化总线级布线。分析订阅服务的捆绑进一步模糊了硬体和业务收益之间的界限，为在这两个领域都占据主导地位的现有企业提供了可持续的竞争优势。对气体检测模组日益增长的需求正在推动MEMS晶粒製造商与封装专家之间的合作，后者拥有即使在严苛的工业环境中也能封装脆弱结构的先进技术。

预计到2025年，汽车产业将占中国工业感测器市场27.35%的份额，反映了中国无与伦比的汽车组装量和快速的电气化进程。新能源汽车（NEV）配备的感测器数量约为燃油车（ICE）的2.5倍，即使总产量趋于稳定，需求依然强劲。电池温度控管、高精度电流监测以及用于自动驾驶的惯性测量单元（IMU）是高附加价值细分市场。随着民航业的復苏和军事预算的增加，航太航太和国防领域的采购需求正在回升，推动了对能够承受振动、辐射和极端温度的坚固耐用型压力感测器和惯性装置的订单激增。

医疗保健产业正以14.18%的复合年增长率快速成长，这主要得益于全国医院数位化以及老龄化社会中远端患者监护技术的进步。用于输液泵的一次性MEMS压力感测器、用于穿戴式装置的非侵入式光学模组以及用于麻醉工作站的气体感测器，代表日益广泛的临床应用。电子和半导体製造工厂正在持续推动无尘洁净室监测的大规模采购项目。同时，发电公司正在将感测阵列整合到太阳能和风能发电设施以及併网设备中。石油天然气、食品饮料和污水处理产业正在透过增强型感测器来改善安全和品质通讯协定，从而更好地服务其终端用户群。

中国工业感测器市场报告按产品类型（压力、温度、液位等）、最终用户（汽车、航太与军事、化学与石化等）、感测技术（MEMS、非MEMS等）、外形规格（分离式感测器、整合模组、无线智慧节点）和地区进行细分。市场预测以美元以金额为准。

其他福利：

  • Excel格式的市场预测（ME）表
  • 3个月的分析师支持

目录

第一章 引言

  • 研究假设和市场定义
  • 调查范围

第二章调查方法

第三章执行摘要

第四章 市场情势

  • 市场概览
  • 市场驱动因素
    • 工业4.0的引进正在加速智慧工厂感测器的维修。
    • 政府激励措施促进国内感测器生产的本地化
    • 电动车产量快速成长，带动多感测器需求增加。
    • 预测性维护计划推动了对压力和振动感测器的需求
    • 工业园区强制实施碳计量推动了对流量和气体感测器的需求。
    • 人工智慧驱动的边缘分析为中小企业提供感测器即服务
  • 市场限制
    • 对高阶MEMS晶粒进口的高度依赖推高了元件成本。
    • 各国标准分散，使OEM认证变得复杂。
    • 12吋MEMS晶圆短缺导致本地压力晶片的大规模生产延迟。
    • 欧盟新的网路安全规则增加了出口感测器的加密成本。
  • 宏观经济因素的影响
  • 产业价值链分析
  • 监管环境
  • 技术展望
  • 波特五力分析
    • 新进入者的威胁
    • 买方的议价能力
    • 供应商的议价能力
    • 替代品的威胁
    • 竞争对手之间的竞争

第五章 市场规模与成长预测

  • 依产品类型
    • 压力
    • 温度
    • 等级
    • 流动
    • 磁场
    • 加速度和偏航率
    • 气体
  • 最终用户
    • 车
    • 航太/军事
    • 化工/石油化工
    • 医疗保健
    • 电子和半导体
    • 发电
    • 石油和天然气
    • 食品/饮料
    • 水和污水处理
    • 其他最终用户
  • 透过检测技术
    • MEMS
    • 非MEMS（散装）
    • 光学/光电
    • 磁性/霍尔
  • 按外形规格
    • 分立感测器
    • 整合模组
    • 无线智慧节点
  • 按地区
    • 华东
    • 华南
    • 华北
    • 华中地区
    • 中国东北
    • 中国西南地区
    • 中国西北地区

第六章 竞争情势

  • 市场集中度
  • 策略趋势
  • 市占率分析
  • 公司简介
    • Honeywell International Inc.
    • Emerson Electric Co.（Rosemount Inc.）
    • STMicroelectronics NV
    • TE Connectivity Ltd.（First Sensor AG）
    • Shanghai Zhaohui Pressure Apparatus Co., Ltd.
    • Ninghai Sendo Sensor Co., Ltd.
    • TM Automation Instruments Co., Ltd.
    • Xi'an UTOP Measurement Instrument Co., Ltd.
    • Ericco International Limited
    • Henan Hanwei Electronics Co., Ltd.
    • Amphenol Advanced Sensors
    • All Sensors Corporation
    • Pepperl+Fuchs SE
    • SICK AG
    • Keyence Corporation
    • Omron Corporation
    • Yikoo Intelligent Technology Co., Ltd.
    • Sodilong Automation Co., Ltd.
    • ABB Ltd.
    • Siemens AG（Process Instrumentation）
    • Baumer Group
    • Infineon Technologies AG
    • Bosch Sensortec GmbH

第七章 市场机会与未来展望

简介目录
Product Code: 91011

The China industrial sensors market was valued at USD 8.84 billion in 2025 and estimated to grow from USD 9.92 billion in 2026 to reach USD 17.62 billion by 2031, at a CAGR of 12.18% during the forecast period (2026-2031).

China Industrial Sensors - Market - IMG1

This momentum reflects the country's pivot toward smart manufacturing, its nationwide Industry 4.0 roll-outs, and wide-ranging localization incentives that reduce import exposure. Factory digitization budgets increasingly earmark 15% of total spending for sensor retrofits, while edge-processing mandates under the Cybersecurity Law favor domestically built devices. Surging electric-vehicle (EV) output, strict carbon accounting rules at industrial parks, and expansive predictive maintenance programs further raise multi-sensor penetration across automotive, process, and energy assets. Competitive dynamics remain moderately fragmented as foreign majors localize production to comply with procurement rules and domestic challengers ascend the value curve through mergers, acquisitions, and MEMS upgrades.

China Industrial Sensors Market Trends and Insights

Industry 4.0 Deployment Accelerates Smart-Factory Sensor Retrofits

Factories are replacing stand-alone automation islands with unified sensor networks that stream continuous data to in-house AI platforms. Public funding of CNY 200 billion earmarked for smart upgrades reserves roughly 15% for sensors, creating a wave of bulk contracts that bundle hardware, connectivity, and analytics subscriptions. Unlike gradual retrofits common in Western plants, Chinese manufacturers often re-equip entire lines in a single shutdown window. Edge computing clauses in the Cybersecurity Law require local data processing, channeling demand toward domestically produced, AI-ready devices.

Government Incentives for Domestic Sensor Localization

Beijing's classification of sensors as a "critical technology" unlocks subsidies, tax breaks, and fast-track land allotments worth more than CNY 50 billion in annual procurement volume. The import dependence for high-end MEMS is expected to decline from over 80% in 2024 to below 50% by 2027. Foreign leaders are now pursuing joint ventures that embed core fabrication stages within China, accelerating technology transfer and scaling local workforce capabilities.

High Import Dependence for High-End MEMS Dies Inflates BOM Costs

Advanced MEMS dies, largely sourced from Taiwan, South Korea, and Germany, continue to account for more than 70% of the precision-grade supply. Lead times stretched to 26 weeks during the 2024 chip crunch, increasing the bill of materials by 35-40% compared to fully localized alternatives, and dampening price competitiveness in cost-sensitive sectors.

Other drivers and restraints analyzed in the detailed report include:

  1. EV Production Surge Increases Multi-Sensor Demand
  2. Predictive-Maintenance Programs Boost Pressure and Vibration Sensors
  3. 12-Inch MEMS Wafer Shortages Delay Localized Pressure-Chip Ramp-Up

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

Pressure devices claimed a 26.42% share of the Chinese industrial sensors market in 2025, underscoring their cross-sector ubiquity in automotive braking, petrochemical pipelines, and HVAC controls. Segment revenue is expected to climb steadily as predictive-maintenance schemes mandate continuous pressure feedback loops in critical assets. Gas sensors, driven by carbon-monitoring laws, are projected to deliver the swiftest ascent at a 13.56% CAGR, incorporating sophisticated electrochemical and photoacoustic designs into smokestacks, battery plants, and waste-gas scrubbers. Temperature and level sensors consistently sustain orders from pharmaceuticals, food processing, and water treatment, where regulatory regimes require granular thermal and fill-level logging. Flow and magnetic field sensors are experiencing rising allocations in smart-city water grids and EV motor controllers, respectively, while acceleration and yaw-rate units are being integrated into autonomous-driving R&D cycles among domestic OEMs.

The product mix is shifting from discrete components toward integrated packages that consolidate pressure, temperature, and vibration data in a single MEMS stack. Suppliers co-design these hybrids with automation vendors to shorten installation time and simplify bus-level wiring. Bundled analytics subscriptions further blur the line between hardware and service revenue, giving incumbents that master both domains an enduring advantage. The growing appeal of gas-sensing modules encourages partnerships between MEMS die makers and packaging specialists who can encapsulate fragile structures for harsh industrial atmospheres.

Automotive lines absorbed 27.35% of the Chinese industrial sensors market size in 2025, reflecting the nation's unrivaled vehicle assembly volume and its rapid electrification curve. New-energy vehicles embed roughly 2.5X more sensors than internal-combustion models, boosting demand even as total unit output plateaus. Battery thermal management, high-precision current monitoring, and inertial measurement units for autonomy represent the highest-value niches. Aerospace and defense procurements are reviving as commercial flights rebound and military budgets expand, channeling orders for ruggedized pressure and inertial devices that withstand vibration, radiation, and extreme temperatures.

Medical applications, advancing at a 14.18% CAGR, benefit from nationwide hospital digitization and remote-patient monitoring for an aging population. Disposable MEMS pressure sensors in infusion pumps, non-invasive optical modules in wearables, and gas sensors in anesthetic workstations illustrate a widening clinical scope. Electronics and semiconductor fabs continue sizable purchasing programs for particle-free clean-room monitoring, while power-generation utilities integrate sensing arrays across solar, wind, and grid-balancing equipment. Oil, gas, food, beverage, and wastewater sectors modernize with sensor-enhanced safety and quality protocols, rounding out the end-user spectrum.

The China Industrial Sensors Market Report is Segmented by Product Type (Pressure, Temperature, Level, and More), End User (Automotive, Aerospace and Military, Chemical and Petrochemical, and More), Sensing Technology (MEMS, Non-MEMS, and More), Form Factor (Discrete Sensors, Integrated Modules, and Wireless Smart Nodes), and Region. The Market Forecasts are Provided in Terms of Value USD.

List of Companies Covered in this Report:

  1. Honeywell International Inc.
  2. Emerson Electric Co. (Rosemount Inc.)
  3. STMicroelectronics N.V.
  4. TE Connectivity Ltd. (First Sensor AG)
  5. Shanghai Zhaohui Pressure Apparatus Co., Ltd.
  6. Ninghai Sendo Sensor Co., Ltd.
  7. TM Automation Instruments Co., Ltd.
  8. Xi'an UTOP Measurement Instrument Co., Ltd.
  9. Ericco International Limited
  10. Henan Hanwei Electronics Co., Ltd.
  11. Amphenol Advanced Sensors
  12. All Sensors Corporation
  13. Pepperl+Fuchs SE
  14. SICK AG
  15. Keyence Corporation
  16. Omron Corporation
  17. Yikoo Intelligent Technology Co., Ltd.
  18. Sodilong Automation Co., Ltd.
  19. ABB Ltd.
  20. Siemens AG (Process Instrumentation)
  21. Baumer Group
  22. Infineon Technologies AG
  23. Bosch Sensortec GmbH

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumptions and Market Definition
  • 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

  • 4.1 Market Overview
  • 4.2 Market Drivers
    • 4.2.1 Industry 4.0 deployment accelerates smart-factory sensor retrofits
    • 4.2.2 Government incentives for domestic sensor localization
    • 4.2.3 EV production surge increases multi-sensor demand
    • 4.2.4 Predictive-maintenance programs boost pressure and vibration sensors
    • 4.2.5 Mandated carbon-accounting at industrial parks drives flow and gas sensors
    • 4.2.6 AI-enabled edge analytics makes sensor-as-a-service viable for SMEs
  • 4.3 Market Restraints
    • 4.3.1 High import dependence for high-end MEMS dies inflates BOM costs
    • 4.3.2 Fragmented national standards complicate OEM qualification
    • 4.3.3 12-inch MEMS wafer shortages delay localized pressure-chip ramp-up
    • 4.3.4 New EU cybersecurity rules add encryption cost to export-grade sensors
  • 4.4 Impact of Macroeconomic Factors
  • 4.5 Industry Value Chain Analysis
  • 4.6 Regulatory Landscape
  • 4.7 Technological Outlook
  • 4.8 Porter's Five Forces Analysis
    • 4.8.1 Threat of New Entrants
    • 4.8.2 Bargaining Power of Buyers
    • 4.8.3 Bargaining Power of Suppliers
    • 4.8.4 Threat of Substitutes
    • 4.8.5 Intensity of Competitive Rivalry

5 MARKET SIZE AND GROWTH FORECASTS (VALUE)

  • 5.1 By Product Type
    • 5.1.1 Pressure
    • 5.1.2 Temperature
    • 5.1.3 Level
    • 5.1.4 Flow
    • 5.1.5 Magnetic Field
    • 5.1.6 Acceleration and Yaw Rate
    • 5.1.7 Gas
  • 5.2 By End User
    • 5.2.1 Automotive
    • 5.2.2 Aerospace and Military
    • 5.2.3 Chemical and Petrochemical
    • 5.2.4 Medical
    • 5.2.5 Electronics and Semiconductor
    • 5.2.6 Power Generation
    • 5.2.7 Oil and Gas
    • 5.2.8 Food and Beverage
    • 5.2.9 Water and Wastewater
    • 5.2.10 Other End Users
  • 5.3 By Sensing Technology
    • 5.3.1 MEMS
    • 5.3.2 Non-MEMS (Bulk)
    • 5.3.3 Optical / Photoelectric
    • 5.3.4 Magnetic / Hall
  • 5.4 By Form Factor
    • 5.4.1 Discrete Sensors
    • 5.4.2 Integrated Modules
    • 5.4.3 Wireless Smart Nodes
  • 5.5 By Region
    • 5.5.1 East China
    • 5.5.2 South China
    • 5.5.3 North China
    • 5.5.4 Central China
    • 5.5.5 Northeast China
    • 5.5.6 Southwest China
    • 5.5.7 Northwest China

6 COMPETITIVE LANDSCAPE

  • 6.1 Market Concentration
  • 6.2 Strategic Moves
  • 6.3 Market Share Analysis
  • 6.4 Company Profiles (includes Global level Overview, Market level overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share for key companies, Products and Services, and Recent Developments)
    • 6.4.1 Honeywell International Inc.
    • 6.4.2 Emerson Electric Co. (Rosemount Inc.)
    • 6.4.3 STMicroelectronics N.V.
    • 6.4.4 TE Connectivity Ltd. (First Sensor AG)
    • 6.4.5 Shanghai Zhaohui Pressure Apparatus Co., Ltd.
    • 6.4.6 Ninghai Sendo Sensor Co., Ltd.
    • 6.4.7 TM Automation Instruments Co., Ltd.
    • 6.4.8 Xi'an UTOP Measurement Instrument Co., Ltd.
    • 6.4.9 Ericco International Limited
    • 6.4.10 Henan Hanwei Electronics Co., Ltd.
    • 6.4.11 Amphenol Advanced Sensors
    • 6.4.12 All Sensors Corporation
    • 6.4.13 Pepperl+Fuchs SE
    • 6.4.14 SICK AG
    • 6.4.15 Keyence Corporation
    • 6.4.16 Omron Corporation
    • 6.4.17 Yikoo Intelligent Technology Co., Ltd.
    • 6.4.18 Sodilong Automation Co., Ltd.
    • 6.4.19 ABB Ltd.
    • 6.4.20 Siemens AG (Process Instrumentation)
    • 6.4.21 Baumer Group
    • 6.4.22 Infineon Technologies AG
    • 6.4.23 Bosch Sensortec GmbH

7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK

  • 7.1 White-space and Unmet-need assessment