市场调查报告书
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1397907
全球柔性印刷电路板 (FPCB) 市场评估:按类型、材料、产业、地区、机会、预测(2016-2030 年)Flexible Printed Circuit Board Market Assessment, By Type, By Material, By Industry, By Region, Opportunities and Forecast, 2016-2030F |
全球柔性印刷电路板 (FPCB) 市场规模将从 2022 年的 155.8 亿美元增至 2030 年的 355.9 亿美元,在 2023-2030 年预测期内复合年增长率为 10.8%。成长预期。 市场正在迅速扩张。 这种扩张主要是由于重要的消费性电子、汽车和医疗产业的需求增加。 设备小型化、重量轻和技术进步的趋势正在增加对 FPCB 的需求,因为 FPCB 具有灵活性、节省空间的设计和改进的电气性能。 此外,柔性显示器、物联网设备和电动车等技术的发展正在推动市场发展。 由于柔性电路的不断进步和接受度的不断提高,FPCB 市场在未来几年可能会保持上升趋势。
由于其固有的优势,2023 年电子製造前景预计柔性 PCB 的采用将显着激增。 随着人们对通货膨胀、劳动力成本和零件短缺的担忧日益加剧,PCB 的灵活性已成为一项战略资产。 产业研究表明,全球不确定性正在推动多品种、小批量生产的趋势,这与柔性印刷电路板 (FPCB) 的多功能性是一致的。 随着公司探索回流选项,柔性印刷电路板的适应性和空间效率正在帮助建立有弹性和高效的供应链。 此外,对永续电子产品不断增长的需求与柔性印刷电路板的环保特性相匹配,有助于减少环境足迹。
穿戴式装置趋势将大大促进市场成长,并在未来一段时间内为製造商提供利润丰厚的机会。 随着穿戴式装置在健康和健身、智慧手錶和医疗设备等多个行业中不断普及,对灵活、轻巧的电子元件的需求不断增长。 FPCB 是柔性混合电子 (FHE) 的关键技术,可实现穿戴式装置所需的可弯曲和紧凑设计。
FPCB 市场的製造商可以利用这一趋势,根据可穿戴技术的独特需求调整生产能力。 客製化、小型化和提高耐用性对于穿戴式 FPCB 至关重要。 随着穿戴式装置市场的扩大,FPCB 製造商有机会满足创新设计要求,并能够无缝整合到各种穿戴式应用中。 与 Tapecon 等经验丰富的 FHE 製造合作伙伴的早期合作可以增强 FPCB 的开发和可扩展性,使製造商能够在这个充满活力且不断增长的市场中保持领先地位。
对环保和永续电子产品的日益重视是柔性印刷电路板需求增加的主要原因。 FPCB 透过消除材料浪费和减少能源消耗来支持这一环保趋势。 其灵活、轻巧的设计可以精确利用材料并消除製造过程中的浪费。 此外,FPCB 製造通常采用节能方法,以满足永续发展目标。 随着环境法规和消费者偏好优先考虑绿色技术,FPCB 因其能够为更环保和永续的电子产品做出贡献而变得比传统刚性 PCB 更受青睐。 这清楚地表明FPCB在促进电子产业的环保实践方面可以发挥至关重要的作用。
高密度互连技术对于塑造市场至关重要,并将在未来一段时间内为製造商提供重要机会。 HDI PCB 具有更高的互连密度,并使用雷射钻孔微孔、堆迭孔、交错孔和焊盘内孔阵列等先进功能。 高密度互连技术使电路板变得更小,使其成为空间受限应用的理想选择,尤其是快速成长的穿戴式装置和可携式电子产品。
HDI FPCB易于在一侧放置许多元件,改善讯号传输,适合射频电路等高频应用。 随着消费者偏好转向更小、功能更强大的设备,利用HDI 技术的製造商可以满足这些需求,提高成本效率、提高性能,并在动态柔性印刷电路板(FPCB) 市场中的竞争中获得动力保障。
本报告研究和分析了全球柔性印刷电路板 (FPCB) 市场,提供市场规模和预测、市场动态以及主要参与者的现状和前景。
Global flexible printed circuit board market size was valued at USD 15.58 billion in 2022, expected to reach USD 35.59 billion in 2030, with a CAGR of 10.8% for the forecast period between 2023 and 2030. The flexible printed circuit board market is expanding rapidly. This expansion is driven mostly by rising demand in important consumer electronics, automotive, and healthcare sectors. The trend toward smaller, lighter, and more technologically advanced devices has raised the demand for FPCBs due to their flexibility, space-saving design, and enhanced electrical performance. Furthermore, developing technologies like flexible displays, IoT devices, and electric cars propel the market forward. The FPCB market will likely maintain its rising trend in the coming years, owing to continued advancements and increased acceptance of flexible circuitry.
The electronics manufacturing landscape 2023 sees a notable surge in adopting flexible PCBs, driven by their intrinsic advantages. Amid rising concerns over inflation, labor costs, and component shortages, the flexibility of PCBs has become a strategic asset. According to industry studies, the trend towards high-mix, low-volume production, amplified by global uncertainties, aligns with the versatility of flexible printed circuit boards. As companies explore reshoring options, flexible printed circuit boards' adaptability and space efficiency contribute to establishing resilient and efficient supply chains. Moreover, the growing demand for sustainable electronics aligns with the eco-friendly attributes of flexible printed circuit boards, contributing to a reduced environmental footprint.
For instance, in April 2021, Siemens introduced PCBflow, a revolutionary cloud-based solution fostering secure collaboration between PCB designers and manufacturers. The pioneering software, driven by Valor NPI, accelerates the design-to-manufacturing transition, providing swift design for manufacturability analysis and handling over 1000 DFM checks. It enhances communication and optimizes designs for seamless integration.
The trend in wearables significantly contributes to the growth of the flexible printed circuit board market, presenting lucrative opportunities for manufacturers in the upcoming period. As wearables continue to gain popularity in various industries, including health and fitness, smartwatches, and medical devices, the demand for flexible and lightweight electronic components rises. FPCBs, a key technology in flexible hybrid electronics (FHE), enable the bendable and compact designs required for wearable devices.
Manufacturers in the FPCB market can capitalize on this trend by aligning their production capabilities with the specific needs of wearable technology. Customization, miniaturization, and increased durability are essential for FPCBs catering to wearables. As the wearables market expands, FPCB manufacturers have the opportunity to innovate and address evolving design requirements, ensuring seamless integration into a wide range of wearable applications. Early collaboration with experienced FHE manufacturing partners, like Tapecon, can enhance the development and scalability of FPCBs, allowing manufacturers to stay at the forefront of this dynamic and growing market.
The growing emphasis on eco-friendly and sustainable electronics is a key driver behind the increasing demand for flexible printed circuit boards. FPCBs support this environmentally conscious trend by mitigating material waste and reducing energy consumption. Their flexible, lightweight design allows for precise material utilization, eliminating unnecessary waste in the production process. Furthermore, FPCB manufacturing often employs energy-efficient methods, aligning with sustainability objectives. As environmental regulations and consumer preferences prioritize green technologies, FPCBs are becoming preferred over traditional rigid PCBs for their ability to contribute to more environmentally responsible and sustainable electronic products. It underscores their crucial role in advancing eco-friendly practices in the electronics industry.
For example, in November 2023, Elephantech secured USD 26.23 million in Series D financing, totaling USD 67.26 billion since inception. The funds will amplify mass production of P-Flex, an eco-friendly PCB, bolster global sales, and advance metal inkjet printing tech.
High-density interconnect technology is pivotal in shaping the landscape of the flexible printed circuit board market, offering manufacturers significant opportunities in the upcoming period. HDI PCBs, characterized by enhanced wiring density, use advanced features such as laser drilled microvias, stacked vias, staggered vias, and via-in-pad arrangements. High-density interconnect technology allows for more compact and smaller circuit boards, making it an ideal choice for applications with space constraints, particularly in the rapidly growing market of wearables and portable electronic devices.
HDI FPCBs facilitate the placement of more components on a single side, improving signal transmission and making them suitable for high-frequency applications like RF circuits. As consumer preferences shift towards smaller and more powerful devices, manufacturers leveraging HDI technology can meet these demands, ensuring cost-effectiveness, improved performance, and a competitive edge in dynamic flexible printed circuit board market.
Study reveals that Asia-Pacific commands a substantial portion of the global flexible printed circuit board market, propelled by robust electronics manufacturing ecosystems in countries like China, Japan, and South Korea. The region benefits from extensive technological infrastructure, skilled workforce, and significant investments in research and development. Furthermore, the substantial presence of major electronic device manufacturers amplifies the demand for FPCBs. This dominance is emphasized by the region's efficient large-scale production of FPCBs, establishing it as a pivotal player in global market.
For instance, in June 2023, Japan accelerated semiconductor industry efforts with a potential JSR Corp buyout, TSMC's USD 7 billion chip plant, Micron's USD 3.5 billion investment, and Samsung's chip line. The state-backed fund supports growth plans.
Globally, governments are actively supporting the growth of the flexible printed circuit board market. Their policies encourage innovation, expand manufacturing capabilities, and provide incentives for research and development, all of which contribute to building a strong, flexible printed circuit board ecosystem. Particularly in Asia, governments are offering tax benefits and infrastructure support to attract global electronics assembly leaders. Efforts are underway to stabilize tariffs and create an investor-friendly climate, ultimately boosting the competitiveness of flexible printed circuit board manufacturers globally. These initiatives are part of a broader strategy to establish countries as key players in the global electronics supply chain, emphasizing adaptability and innovation.
For instance, in December 2022, The Ministry of Environment, Forest, and Climate Change in India emphasized the formalization and regulation of the e-waste recycling sector. The E-Waste (Management) Rules, 2016, and the newly notified E-Waste (Management) Rules, 2022, introduce Extended Producer Responsibility (EPR) and set recycling targets, including the inclusion of 106 Electronic and Electrical Equipment (EEE) items. The rules aim to enhance environmental sustainability and safety in the dismantling and recycling e-waste, providing a comprehensive framework for flexible printed circuit board disposal and management.
The flexible printed circuit board market experienced a dual impact from COVID-19. Initially, the pandemic fueled demand for flexible printed circuit boards in the medical electronics sector owing to the increased need for medical devices. However, disruptions in global supply chain and trade tensions between the United States and China reduced demand for flexible PCBs, notably in Apple's supply chain. As the world transitions to the post-pandemic landscape, the FPCB market is anticipated to rebound, with an ongoing focus on medical applications and the rising demand for IoT devices and HDI technology.
The Russia-Ukraine war has impacted the flexible printed circuit board market, revealing challenges in controlling technology diversion. As sanctions aim to restrict semiconductor exports to Russia, reports indicate Western semiconductors still appear in Russian weapons, raising concerns about illicit purchases and counterfeiting. The complexity of global supply chains, dual-use issues, and the longevity of chip use pose significant challenges. Efforts to control technology flow face hurdles, emphasizing the need for collaborative action. The war underscores the importance of addressing the broad range of challenges to prevent unintended applications of FPCBs in military systems, highlighting the industry's commitment to compliance.
Industry leaders like Siemens Aktiengesellschaft, Fujikura Printed Circuits Ltd., Sumitomo Electric Group, Nitto Denko Corporation, and Flexible Circuit Technologies, Inc., play a crucial role. These companies shape the market with their advanced technologies and wide market presence. The demand for FPCBs is rising, especially in consumer electronics and automotive areas. The market looks promising, with expectations of continued growth. Collaboration, technology advancements, and strategic partnerships among these key players are anticipated to drive innovation and meet the changing needs of the flexible printed circuit boards market.
In October 2023, Cicor's acquisition of STS Defence enhanced its position in high-reliability electronics for aerospace and defense. The integration of STS Defence's capabilities strengthens Cicor's ability to provide innovative solutions, contributing to its competitiveness in flexible printed circuit board market.
All segments will be provided for all regions and countries covered:
Companies mentioned above DO NOT hold any order as per market share and can be changed as per information available during research work.