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全球电子黏合剂市场 2023-2030Global Electronic Adhesives Market 2023-2030 |
预计在预测期内(2023-2030年),全球电子黏合剂市场将以9.1%的CAGR成长。黏合剂广泛用于电子电路和产品的製造和组装。半导体和电路组装以及晶片连接应用对无毒且环保的电子黏合剂的需求不断增长,导致电子黏合剂的使用不断增加。越来越多地采用能够支援高效和自动化组装流程的黏合剂是支援全球市场成长的关键因素。导热黏合剂是将散热器黏合到 PCB 上的理想选择。这些黏合剂可以快速有效地将热量从敏感电子设备中转移出去,同时具有电绝缘性以防止短路。市场参与者也专注于为半导体製造商推出电子黏合剂解决方案,以进一步促进市场成长。例如,2023 年 11 月,DELO 推出了一种柔性电子黏合剂,可永久密封感测器外壳,从而可靠地保护影像感测器等组件。 DELO DUALBOND BS3770 满足半导体和汽车产业的严格要求,有助于推动自动驾驶领域的创新。
全球电子黏合剂市场按树脂类型、产品类型和最终用途产业进行细分。根据树脂类型,市场细分为环氧树脂、硅酮、聚氨酯 (pu)、丙烯酸和其他树脂(聚酰胺、聚碳酸酯)。根据产品类型,市场分为导电胶、导热胶和其他胶合剂(热熔胶、厌氧胶)。此外,根据最终用途产业,市场细分为电脑、通讯、消费性电子、工业、医疗、运输以及商业航空和国防。在最终用途行业中,消费电子细分市场预计将占据相当大的市场份额,因为黏合剂的发展不断增加,以提供牢固的黏合,同时保护组件免受过度振动、高温、潮湿的破坏性影响、腐蚀、机械衝击和极端环境条件。
在树脂类型中,环氧树脂细分市场预计将在全球电子黏合剂市场中占据相当大的份额。部分成长归因于环氧黏合剂在保护电子元件免受机械应力损坏方面的影响力日益增强。底部填充环氧树脂是智慧型手机、笔记型电脑和其他便携式设备等电子设备製造中的重要组成部分。例如,2022年5月,高品质环氧黏合剂製造商和供应商DeepMaterial推出了两款新产品,彻底改变了严重依赖表面保护材料以及各种半导体和电子电器的晶片测试和封装行业——底部填充环氧树脂和一款-组分环氧黏合剂。
全球电子黏合剂市场根据地理位置进一步细分,包括北美(美国和加拿大)、欧洲(英国、义大利、西班牙、德国、法国和欧洲其他地区)、亚太地区(印度、中国、日本) 、韩国和亚洲其他地区)以及世界其他地区(中东和非洲以及拉丁美洲)。其中,由于用于微型设备的先进电子黏合剂的开发,北美预计将在全球市场中占据显着份额,这些黏合剂具有特定的特性,以满足微电子应用的要求。
2023-2030 年全球电子黏合剂市场成长(按地区)
Global Electronic Adhesives Market Size, Share & Trends Analysis Report by Resin Type (Epoxy, Silicone, Polyurethane (PU), Acrylic, and Others), by Product Type (Electrically Conductive Adhesives, Thermally Conductive Adhesives, and Others), and by End-Use Industry (Computers, Communications, Consumer Electronics, Industrial, Medical, Transportation and Commercial Aviation, and Defense), Forecast Period (2023-2030)
The global electronic adhesives market is anticipated to grow at a CAGR of 9.1% during the forecast period (2023-2030). Adhesives are widely used in the manufacture and assembly of electronic circuits and products. The growing demand for non-toxic and eco-friendly electronic adhesives in semiconductor & circuit assembly and die-attachment applications has led to the increasing use of electronic adhesives. The growing adoption of adhesives that can support efficient and automated assembly processes is the key factor supporting the growth of the market globally. Thermally conductive adhesives are ideal for bonding heat sinks to PCBs. These adhesives transfer heat quickly and efficiently away from sensitive electronics, whilst being electrically insulative to prevent short circuits. The market players are also focusing on introducing electronics adhesive for semiconductor manufacturers solutions that further bolster the market growth. For instance, in November 2023, DELO, launched a flexible electronics adhesive that permanently seals sensor housings airtight and thus reliably protects components such as image sensors. DELO DUALBOND BS3770 meets the stringent requirements of the semiconductor and automotive industries and helps drive innovation in autonomous driving.
The global electronic adhesives market is segmented on the resin type, product type, and end-use industry. Based on the resin type, the market is sub-segmented into epoxy, silicone, polyurethane (pu), acrylic and others (polyamide, polycarbonate). Based on the Product Type, the market is sub-segmented into electrically conductive adhesives, thermally conductive adhesives and others (hot melt adhesives, anaerobic adhesive). Further, on the basis of end-use industry, the market is sub-segmented into computers, communications, consumer electronics, industrial, medical, transportation and commercial aviation and defense. Among the end-use industry, the consumer electronics sub-segment is anticipated to hold a considerable share of the market owing to the rise in development of adhesive for provide a strong bond while protecting components against the damaging effects of excessive vibration, heat, moisture, corrosion, mechanical shock, and extreme environmental conditions.
Among the resin type, the epoxy sub-segment is expected to hold a considerable share of the global electronic adhesives market. The segmental growth is attributed to the growing influence of epoxy adhesive to protect electronic components from damage caused by mechanical stress. Underfill epoxy is an essential component in the manufacturing of electronic devices such as smartphones, laptops, and other portable devices. For instance, in May 2022, DeepMaterial, a manufacturer and supplier of high-quality epoxy adhesives, launched two new products that revolutionize the chip testing and packaging industry that heavily relies on surface protection materials and various semiconductor and electronic appliances - underfill epoxy and one-component epoxy adhesive.
The global electronic adhesives market is further segmented based on geography including North America (the US, and Canada), Europe (UK, Italy, Spain, Germany, France, and the Rest of Europe), Asia-Pacific (India, China, Japan, South Korea, and Rest of Asia), and the Rest of the World (the Middle East & Africa, and Latin America). Among these, North America is anticipated to hold a prominent share of the market across the globe, owing to the development of advanced electronics adhesives used for miniaturized devices formulated with specific characteristics to meet the requirements of microelectronic applications.
Global Electronic Adhesives Market Growth, by Region 2023-2030
Source: OMR Analysis
Among all regions, the Asia-Pacific regions is anticipated to grow at a considerable CAGR over the forecast period. Regional growth is attributed to increasing demand for wearable devices is a driving the growth of the electronics adhesives market. Wearable devices have gained immense demand in region owing to their ability to integrate technology into accessories, providing convenience, connectivity, and enhanced functionalities to users.
Various adhesives based on physical properties such as solubility, compatibility, thermal properties, water absorbency and electrical properties are designed in a functional unit. For instance, in May 2022, JSR Corp. launched a new material (HAG) that is highly adhesive and dispersive to full-scale development of fifth-generation (5G) and sixth-generation (6G) mobile communications systems and autonomous driving technology, various applications and devices are being developed in the fields of communications and mobility electronics.
The major companies serving the electronic adhesives market include 3M, DELO Industrie Klebstoffe GmbH & Co. KGaA, H.B. Fuller, Henkel AG & Co. KGaA, The Dow Chemical Company, and others. The market players are considerably contributing to the market growth by the adoption of various strategies including mergers and acquisitions, partnerships, collaborations, funding, and new product launches, to stay competitive in the market. For instance, in May 2023, Arkema acquired Polytec PT, which specialized in adhesives for batteries and electronics. This bolt-on acquisition is part of the Group's strategy to become a full system provider and support its customers to develop sustainable solutions for the batteries and electronics markets.