市场调查报告书
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1569455
电子黏剂市场规模、份额和成长分析:按形式、按树脂类型、按产品类型、按最终用途行业、按地区 - 行业预测,2024-2031 年Electronic Adhesives Market Size, Share, Growth Analysis, By Form, By Resin Type, By Product Type (Electrically Conductive Adhesives, Thermally Conductive Adhesives), By End-Use Industry, By Region - Industry Forecast 2024-2031 |
2022年全球电子黏剂市场规模为46亿美元,从2023年的48.9亿美元成长到2031年的79.7亿美元,预计复合年增长率为6.30%。
近年来,在电子设备需求不断增长和技术快速进步的推动下,全球电子黏剂市场经历了显着增长。推动该市场的主要产业包括消费性电子、汽车、航太和医疗保健,其中智慧型手机、平板电脑、穿戴式科技和智慧家居设备的消费显着成长。小型化元件的兴起以及软性电子产品和穿戴式电子产品的蓬勃发展趋势进一步刺激了成长。在严格的环境法规和不断提高的消费者意识的推动下,市场的一个主要趋势是转向永续和环保的黏剂解决方案。製造商越来越注重开髮发性有机化合物 (VOC) 水平较低、环境足迹减少的黏剂。对永续性的关注导致水黏剂和无溶剂黏剂的广泛采用,不仅提高了安全性,而且还保持了高性能标准。因此,在创新和永续实践的推动下,美国电子黏剂市场预计在未来几年将实现强劲的复合年增长率,同时满足不同行业不断增长的需求,这反映了更广泛的行业正在转型。
Global Electronic Adhesives Market size was valued at USD 4.6 billion in 2022 and is poised to grow from USD 4.89 billion in 2023 to USD 7.97 billion by 2031, growing at a CAGR of 6.30% during the forecast period (2024-2031).
The global electronic adhesives market has experienced remarkable growth recently, fueled by rising demand for electronic devices and rapid technological advancements. Key sectors driving this market include consumer electronics, automotive, aerospace, and healthcare, with a notable increase in the consumption of smartphones, tablets, wearable technology, and smart home devices. The rise of miniaturized components and the burgeoning trend toward flexible and wearable electronics have further stimulated growth. A significant trend within the market is the shift toward sustainable and eco-friendly adhesive solutions, spurred by stringent environmental regulations and heightened consumer awareness. Manufacturers are increasingly focusing on creating adhesives that feature lower levels of volatile organic compounds (VOCs) and reduced environmental footprints. This focus on sustainability has led to the widespread adoption of water-based and solvent-free adhesives, which not only enhance safety but also maintain high performance standards. As a result, the U.S. electronic adhesives market is forecasted to enjoy a robust compound annual growth rate (CAGR) in the upcoming years, reflecting the broader industry's transition towards innovative, sustainable practices while addressing the growing demands of diverse industries.
Top-down and bottom-up approaches were used to estimate and validate the size of the global electronic adhesives market and to estimate the size of various other dependent submarkets. The research methodology used to estimate the market size includes the following details: The key players in the market were identified through secondary research, and their market shares in the respective regions were determined through primary and secondary research. This entire procedure includes the study of the annual and financial reports of the top market players and extensive interviews for key insights from industry leaders such as CEOs, VPs, directors, and marketing executives. All percentage shares split, and breakdowns were determined using secondary sources and verified through Primary sources. All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data.
global electronic adhesives Market Segmental Analysis
Global Electronic Adhesives Market is segmented by Form, Resin Type, Product Type, End-Use Industry, and region. Based on Form, the market is segmented into Liquid, Paste, Solid. Based on Resin Type, the market is segmented into Epoxy, Silicone, Polyurethane (PU), Acrylic, Others. Based on Product Type, the market is segmented into Electrically Conductive Adhesives (ECAS), Thermally Conductive Adhesives, Others. Based on End-Use Industry, the market is segmented into Computers, Communications, Consumer Electronics, Industrial, Medical, Transportation, Commercial Aviation and Defense. Based on region, the market is segmented into North America, Europe, Asia Pacific, Latin America and Middle East & and Africa.
Driver of the global electronic adhesives Market
The relentless pace of technological advancement and the ensuing miniaturization of electronic components are pivotal market drivers for the global electronic adhesives market. As devices become smaller and more intricate, there is a heightened demand for adhesives that offer superior bonding capabilities, excellent thermal conductivity, and low viscosity to facilitate efficient assembly. These attributes are essential for ensuring the reliability and longevity of compact electronic products. Furthermore, as industries increasingly prioritize performance and durability, the role of electronic adhesives becomes paramount, thus propelling market growth and innovation as manufacturers strive to meet the evolving needs of modern electronics.
Restraints in the global electronic adhesives Market
The global electronic adhesives market faces significant restraints due to the inherent limitations of these adhesives in high-temperature applications. Many electronic adhesives possess specific temperature thresholds, beyond which they may degrade, exhibit reduced adhesion strength, or suffer from thermal expansion mismatches, compromising their functionality. This limitation restricts their use in critical applications requiring high thermal stability, influencing manufacturers' choices and potentially stunting market growth. While ongoing research and development efforts aim to create adhesives capable of withstanding elevated temperatures, the current availability of suitable products remains a challenge, consequently constraining the market's potential and application range across various industries.
Market Trends of the global electronic adhesives Market
The global electronic adhesives market is witnessing a notable trend driven by the escalating demand for miniaturization and advanced packaging technologies across various sectors, particularly in consumer and automotive electronics. As devices continue to shrink in size and increase in complexity, the necessity for high-performance bonding solutions has surged, prompting manufacturers to innovate and develop adhesives that offer superior adhesion, thermal stability, and electrical conductivity. This shift is reshaping the product landscape, with an emphasis on eco-friendly and high-temperature resistant adhesives. Consequently, the market is poised for robust growth, with stakeholders increasingly focusing on technical advancements to meet the evolving needs of the electronic industry.