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市场调查报告书
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1539296

电子基板层级底部填充·封装木材市场:全球产业分析，规模，占有率，成长，趋势，预测，2024年～2033年

Electronic Board Level Underfill And Encapsulation Material Market: Global Industry Analysis, Size, Share, Growth, Trends, and Forecast, 2024-2033
出版日期: | 出版商: Persistence Market Research | 英文 278 Pages | 商品交期: 2-5个工作天内

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简介目录

Persistence Market Research最近发布了一份关于全球电子板级底部填充和密封剂市场的详细报告。该报告对市场驱动因素、趋势、机会和课题等关键市场动态进行了全面分析，提供了对市场结构的深入见解。

主要的洞察

  • 电子板级底部填充剂和封装剂的市场规模（2024 年）：3.431 亿美元
  • 市场预测金额（2033 年）：5.263 亿美元
  • 全球市场成长率（2024-2033 年复合年增长率）：4.9%

电子板级底部填充/密封剂市场 - 研究范围

电子板级底部填充和密封剂市场包括各种用于保护电子组件和元件（尤其是板级电子组件和元件）免受湿气、灰尘和热循环等环境压力影响的材料。这些材料透过提供机械支撑、减少应力和防止污染物，在提高电子设备的可靠性和使用寿命方面发挥关键作用。该市场服务于多个领域，包括汽车电子、消费电子、工业电子和通讯。对电子小型化的需求不断增长、半导体封装的进步以及电子产品在各行业中的应用不断扩大，推动了成长。

推动市场成长的因素：

有几个关键因素推动全球电子板级底部填充和密封剂市场的发展。对微型电子设备的需求不断增长，特别是在消费性电子和汽车领域，推动了对先进底部填充和封装材料的需求。倒装晶片技术和球栅阵列 (BGA) 技术等半导体封装技术的进步，需要更先进的材料来承受与这些技术相关的增加的热应力和机械应力，这进一步加速了市场的扩张。此外，5G 技术和物联网 (IoT) 趋势的兴起正在推动对高性能电子材料的需求，这些材料可以确保设备在多样化和苛刻环境中的可靠性。加强研发活动，以及引入具有改进的热性能和机械性能的新材料，透过提供更强大的保护电子组件的解决方案来促进市场成长。

市场限制因素：

儘管成长前景广阔，但电子板级底部填充和密封剂市场面临着先进材料的高成本和应用工艺的复杂性相关的课题。保形涂层等替代材料的可用性可能会阻碍市场成长。此外，电子产品进一步小型化的持续推动要求材料开发人员创建满足更小、更复杂设备严格要求的解决方案。解决这些问题需要持续投资研发，以改善材料性能、降低应用成本并提高底部填充和封装解决方案的可靠性。

市场机会：

先进电子设备的日益普及以及恶劣环境中对可靠防护材料的需求不断增加，正在为该市场创造重大机会。开发具有更高导热性、更低热膨胀係数和改进机械性能的新材料，满足了对耐用、有效的底部填充和封装解决方案日益增长的需求。汽车和工业电子领域的扩张为市场成长提供了新的管道，使企业能够进入对强大、可靠的电子产品需求不断增长的新兴市场。战略合作伙伴关係、新技术投资和采用环保材料对于利用新机会和维持市场领先地位至关重要。

本报告解决的关键问题

  • 推动电子基板级底部填充和密封剂市场全球成长的关键因素有哪些？
  • 在各个电子领域中引领采用的底部填充材料和封装材料的类型和用途是什么？
  • 技术进步如何影响电子板级底部填充剂和封装剂市场的竞争格局？
  • 谁是电子板级底部填充剂和封装剂市场的主要参与者？ 他们采取什么策略来保持竞争力？
  • 全球电子板级底部填充和封装材料市场的新趋势和未来前景是什么？

目录

第1章 摘要整理

第2章 市场概要

  • 市场范围/分类
  • 市场定义/范围/限制

第3章 主要市场趋势

  • 影响市场的主要趋势
  • 产品革新/开发趋势

第4章 主要成功因素

  • 产品的采用/使用情形分析
  • 产品的USP/特征
  • 策略性推销策略

第5章 全球市场的需求分析

  • 过去的市场数量(吨)分析，2019年～2023年
  • 现在及未来市场数量(吨)预测，2024年～2033年
  • 与前一年同期比较成长趋势分析

第6章 全球市场 - 价格分析

  • 各地区价格分析:各产品类型
  • 价格的明细
    • 厂商层级的价格设定
    • 分销商层级的价格设定
  • 世界平均价格分析基准

第7章 全球市场的需求(金额或规模，一百万美元)分析

  • 过去的市场金额(一百万美元)分析，2019年～2023年
  • 现在及未来市场金额(一百万美元)预测，2024年～2033年
    • 与前一年同期比较成长趋势分析
    • 绝对额的机会分析

第8章 市场背景

  • 宏观经济要素
  • 预测要素 - 相关性及影响
  • 价值链
  • 市场参与企业一览
  • 全球供给 vs 需求方案
  • 生产流程概要
  • 适用的主要法规
  • COVID-19危机的影响
  • 市场动态

第9章 全球市场分析:各产品类型

  • 简介/主要调查结果
  • 过去的市场规模(一百万美元)和数量分析:各产品类型，2019年～2023年
  • 现在及未来市场规模(一百万美元)和数量分析与预测:各产品类型，2024年～2033年
    • 底部填充
    • Gob-top封装
  • 市场魅力分析:各产品类型

第10章 全球市场分析:各材料类型

  • 简介/主要调查结果
  • 过去的市场规模(一百万美元)和数量分析:各材料类型，2019年～2023年
  • 现在及未来市场规模(一百万美元)和数量分析与预测:各材料类型，2024年～2033年
    • 石英/硅
    • 氧化铝为基础的
    • 环氧树脂为基础的
    • 胺甲酸乙酯为基础的
    • 丙烯为基础的
    • 其他
  • 市场魅力分析:各材料类型

第11章 全球市场分析:各面板类型

  • 简介/主要调查结果
  • 过去的市场规模(一百万美元)和数量分析:各面板类型，2019年～2023年
  • 现在及未来市场规模(一百万美元)和数量分析与预测:各面板类型，2024年～2033年
    • CSP(晶片级封装)
    • BGA(球栅阵列)
    • 覆晶
  • 市场魅力分析:各面板类型

第12章 全球市场分析:各地区

  • 简介
  • 过去的市场规模(一百万美元)和数量分析:各地区，2019年～2023年
  • 目前市场规模(一百万美元)和数量分析与预测:各地区，2024年～2033年
    • 北美
    • 南美
    • 欧洲
    • 南亚·太平洋
    • 东亚
    • 中东·非洲
  • 市场魅力分析:各地区

第13章 北美市场分析

第14章 南美市场分析

第15章 欧洲市场分析

第16章 南亚·太平洋市场分析

第17章 东亚市场分析

第18章 中东·非洲市场分析

第19章 主要国家的市场分析

  • 简介
  • 美国市场分析
  • 加拿大市场分析
  • 墨西哥市场分析
  • 巴西市场分析
  • 德国市场分析
  • 义大利市场分析
  • 法国市场分析
  • 英国市场分析
  • 西班牙市场分析
  • 荷比卢三国市场分析
  • 俄罗斯市场分析
  • 中国市场分析
  • 日本市场分析
  • 韩国市场分析
  • 印度市场分析
  • 东南亚国家联盟市场分析
  • 澳洲·纽西兰分析
  • 波湾合作理事会各国市场分析
  • 土耳其市场分析

第20章 市场结构分析

  • 市场分析:各企业层级
  • 市场集中
  • 主要企业的市场占有率分析
  • 市场影响分析

第21章 竞争分析

  • 竞争仪表板
  • 竞争基准
  • 竞争的详细资讯
    • Henkel AG and Co. KGaA
    • Namics Corporation
    • AI Technology, Inc.
    • Protavic International
    • HB Fuller Company
    • ASE Group
    • Hitachi Chemical Co., Ltd.
    • Indium Corporation
    • Zymet
    • YINCAE Advanced Materials, LLC
    • LORD Corporation
    • Sanyu Rec Co., Ltd.
    • The Dow Chemical Company
    • Epoxy Technology, Inc.
    • Panasonic Corporation
    • Dymax Corporation
    • ELANTAS GmbH

第22章 所使用的前提条件与缩写

第23章 调查手法

简介目录
Product Code: PMRREP19783

Persistence Market Research has recently published an extensive report on the global Electronic Board Level Underfill and Encapsulation Material Market. This report offers a comprehensive analysis of the key market dynamics, including drivers, trends, opportunities, and challenges, providing deep insights into the market structure.

Key Insights:

  • Electronic Board Level Underfill and Encapsulation Material Market Size (2024E): USD 343.1 Mn
  • Projected Market Value (2033F): USD 526.3 Mn
  • Global Market Growth Rate (CAGR 2024 to 2033): 4.9%

Electronic Board Level Underfill and Encapsulation Material Market - Report Scope:

The Electronic Board Level Underfill and Encapsulation Material Market encompasses a variety of materials used to protect electronic assemblies and components, especially at the board level, from environmental stressors such as moisture, dust, and thermal cycles. These materials play a critical role in enhancing the reliability and longevity of electronic devices by providing mechanical support, reducing stress, and protecting against contaminants. The market serves diverse segments, including automotive electronics, consumer electronics, industrial electronics, and telecommunications. Growth is driven by increasing demand for miniaturization in electronics, advancements in semiconductor packaging, and the expanding application of electronics in various industries.

Market Growth Drivers:

Several key factors are driving the global Electronic Board Level Underfill and Encapsulation Material Market. The rising demand for miniaturized electronic devices, particularly in the consumer electronics and automotive sectors, boosts the need for advanced underfill and encapsulation materials. Technological advancements in semiconductor packaging, such as flip-chip and ball grid array (BGA) technologies, further fuel the market's expansion by requiring more sophisticated materials that can withstand the increased thermal and mechanical stresses associated with these technologies. Additionally, the growing trend towards 5G technology and the Internet of Things (IoT) drives the demand for high-performance electronic materials that can ensure device reliability in diverse and demanding environments. Enhanced research and development activities, along with the introduction of new materials with improved thermal and mechanical properties, contribute to market growth by offering more robust solutions for electronic assembly protection.

Market Restraints:

Despite promising growth prospects, the Electronic Board Level Underfill and Encapsulation Material Market faces challenges related to the high costs of advanced materials and the complexity of the application processes. Market growth can be hindered by the availability of alternative materials, such as conformal coatings, which may be preferred by some manufacturers due to their lower cost and ease of application. Additionally, the continuous push for further miniaturization in electronics poses challenges for material developers to create solutions that can meet the stringent requirements of smaller and more complex devices. Addressing these issues requires ongoing investment in research and development to improve material properties, reduce application costs, and enhance the reliability of underfill and encapsulation solutions.

Market Opportunities:

The market presents significant opportunities driven by the increasing adoption of advanced electronic devices and the rising demand for reliable protection materials in harsh environments. The development of new materials with enhanced thermal conductivity, lower coefficients of thermal expansion, and improved mechanical properties caters to the growing need for more durable and effective underfill and encapsulation solutions. The expansion of the automotive and industrial electronics sectors provides new channels for market growth, allowing companies to tap into emerging markets where the demand for rugged and reliable electronics is on the rise. Strategic partnerships, investments in new technologies, and the introduction of environmentally friendly materials are essential for capitalizing on emerging opportunities and maintaining market leadership.

Key Questions Answered in the Report:

  • What are the primary factors driving the growth of the Electronic Board Level Underfill and Encapsulation Material Market globally?
  • Which types and applications of underfill and encapsulation materials are leading the adoption in various electronic segments?
  • How are technological advancements influencing the competitive landscape of the Electronic Board Level Underfill and Encapsulation Material Market?
  • Who are the key players in the Electronic Board Level Underfill and Encapsulation Material Market, and what strategies are they employing to stay competitive?
  • What are the emerging trends and future prospects in the global Electronic Board Level Underfill and Encapsulation Material Market?

Competitive Intelligence and Business Strategy:

Leading players in the global Electronic Board Level Underfill and Encapsulation Material Market, including Henkel AG & Co. KGaA, NAMICS Corporation, and H.B. Fuller, focus on innovation, product differentiation, and strategic collaborations to gain a competitive edge. These companies invest in R&D to develop advanced underfill and encapsulation materials and explore new applications across various electronic sectors. Collaborations with semiconductor manufacturers, research organizations, and industry stakeholders facilitate market access and promote new material adoption. Emphasis on high-performance products, environmentally sustainable solutions, and comprehensive marketing strategies fosters market growth and enhances brand loyalty in the evolving Electronic Board Level Underfill and Encapsulation Material Market landscape.

Key Companies Profiled:

  • Henkel AG and Co. KGaA
  • Namics Corporation
  • AI Technology, Inc.
  • Protavic International
  • H.B. Fuller Company
  • ASE Group
  • Hitachi Chemical Co., Ltd.
  • Indium Corporation
  • Zymet
  • YINCAE Advanced Materials, LLC
  • LORD Corporation
  • Sanyu Rec Co., Ltd.
  • The Dow Chemical Company
  • Epoxy Technology, Inc.
  • Panasonic Corporation
  • Dymax Corporation
  • ELANTAS GmbH

Electronic Board Level Underfill and Encapsulation Material Market Industry Segmentation

By Product Type

  • Underfills
  • Gob Top Encapsulations

By Material Type

  • Quartz/Silicone
  • Alumina Based
  • Epoxy Based
  • Urethane Based
  • Acrylic Based
  • Others

By Board Type

  • CSP (Chip Scale Package)
  • BGA (Ball Grid array)
  • Flip Chips

By Region

  • North America
  • Latin America
  • Europe
  • East Asia
  • South Asia Pacific
  • Middle East and Africa (MEA)

Table of Contents

1. Executive Summary

  • 1.1. Global Market Outlook
  • 1.2. Demand Side Trends
  • 1.3. Supply Side Trends
  • 1.4. Analysis and Recommendations

2. Market Overview

  • 2.1. Market Coverage / Taxonomy
  • 2.2. Market Definition / Scope / Limitations

3. Key Market Trends

  • 3.1. Key Trends Impacting the Market
  • 3.2. Product Innovation / Development Trends

4. Key Success Factors

  • 4.1. Product Adoption / Usage Analysis
  • 4.2. Product USPs / Features
  • 4.3. Strategic Promotional Strategies

5. Global Market Demand Analysis 2019-2023 and Forecast, 2024-2033

  • 5.1. Historical Market Volume (Tons) Analysis, 2019-2023
  • 5.2. Current and Future Market Volume (Tons) Projections, 2024-2033
  • 5.3. Y-o-Y Growth Trend Analysis

6. Global Market - Pricing Analysis

  • 6.1. Regional Pricing Analysis By Product Type
  • 6.2. Pricing Break-up
    • 6.2.1. Manufacturer Level Pricing
    • 6.2.2. Distributor Level Pricing
  • 6.3. Global Average Pricing Analysis Benchmark

7. Global Market Demand (in Value or Size in US$ Mn) Analysis 2019-2023 and Forecast, 2024-2033

  • 7.1. Historical Market Value (US$ Mn) Analysis, 2019-2023
  • 7.2. Current and Future Market Value (US$ Mn) Projections, 2024-2033
    • 7.2.1. Y-o-Y Growth Trend Analysis
    • 7.2.2. Absolute $ Opportunity Analysis

8. Market Background

  • 8.1. Macro-Economic Factors
    • 8.1.1. Global GDP Growth Overview
    • 8.1.2. Global Semiconductor and Electronics Sector Overview
    • 8.1.3. Other Key Macro-economic Factors
  • 8.2. Forecast Factors - Relevance and Impact
    • 8.2.1. Global Urbanization Growth Outlook
    • 8.2.2. Raw Material Prices
    • 8.2.3. Regulatory Impact Outlook
    • 8.2.4. Application Growth Outlook
    • 8.2.5. Other Key Forecast Factors
  • 8.3. Value Chain
  • 8.4. List of Market Participants
  • 8.5. Global Supply vs Demand Scenario
  • 8.6. Production Process Overview
  • 8.7. Key Applicable Regulations
  • 8.8. Impact of COVID - 19 Crisis
    • 8.8.1. Current Statistics
    • 8.8.2. World Economy / Cluster Projections
    • 8.8.3. Potential of Impact by Taxonomy
    • 8.8.4. Impact on Market Size
    • 8.8.5. Recovery Scenarios
  • 8.9. Market Dynamics
    • 8.9.1. Drivers
    • 8.9.2. Restraints
    • 8.9.3. Opportunity Analysis

9. Global Market Analysis 2019-2023 and Forecast 2024-2033, by Product Type

  • 9.1. Introduction / Key Findings
  • 9.2. Historical Market Size (US$ Mn) and Volume Analysis By Product Type, 2019-2023
  • 9.3. Current and Future Market Size (US$ Mn) and Volume Analysis and Forecast By Product Type, 2024-2033
    • 9.3.1. Underfills
      • 9.3.1.1. Capillary
      • 9.3.1.2. Edge Bonds
    • 9.3.2. Gob Top Encapsulations
  • 9.4. Market Attractiveness Analysis By Product Type

10. Global Market Analysis 2019-2023 and Forecast 2024-2033, By Material Type

  • 10.1. Introduction / Key Findings
  • 10.2. Historical Market Size (US$ Mn) and Volume Analysis By Material Type, 2019-2023
  • 10.3. Current and Future Market Size (US$ Mn) and Volume Analysis and Forecast By Material Type, 2024-2033
    • 10.3.1. Quartz/Silicone
    • 10.3.2. Alumina Based
    • 10.3.3. Epoxy Based
    • 10.3.4. Urethane Based
    • 10.3.5. Acrylic Based
    • 10.3.6. Others
  • 10.4. Market Attractiveness Analysis By Material Type

11. Global Market Analysis 2019-2023 and Forecast 2024-2033, By Board Type

  • 11.1. Introduction / Key Findings
  • 11.2. Historical Market Size (US$ Mn) and Volume Analysis By Board Type, 2019-2023
  • 11.3. Current and Future Market Size (US$ Mn) and Volume Analysis and Forecast By Board Type, 2024-2033
    • 11.3.1. CSP (Chip Scale Package
    • 11.3.2. BGA (Ball Grid array)
    • 11.3.3. Flip Chips
  • 11.4. Market Attractiveness Analysis By Board Type

12. Global Market Analysis 2019-2023 and Forecast 2024-2033, by Region

  • 12.1. Introduction
  • 12.2. Historical Market Size (US$ Mn) and Volume Analysis By Region, 2019-2023
  • 12.3. Current Market Size (US$ Mn) and Volume Analysis and Forecast By Region, 2024-2033
    • 12.3.1. North America
    • 12.3.2. Latin America
    • 12.3.3. Europe
    • 12.3.4. South Asia and Pacific
    • 12.3.5. East Asia
    • 12.3.6. Middle East and Africa
  • 12.4. Market Attractiveness Analysis By Region

13. North America Market Analysis 2019-2023 and Forecast 2024-2033

  • 13.1. Introduction
  • 13.2. Pricing Analysis
  • 13.3. Historical Market Size (US$ Mn) and Volume Trend Analysis By Market Taxonomy, 2019-2023
  • 13.4. Market Size (US$ Mn) and Volume Forecast By Market Taxonomy, 2024-2033
    • 13.4.1. By Country
      • 13.4.1.1. U.S.
      • 13.4.1.2. Canada
    • 13.4.2. By Product Type
    • 13.4.3. By Material Type
    • 13.4.4. By Board Type
  • 13.5. Market Attractiveness Analysis
    • 13.5.1. By Country
    • 13.5.2. By Product Type
    • 13.5.3. By Material Type
    • 13.5.4. By Board Type
  • 13.6. Market Trends
  • 13.7. Key Market Participants - Intensity Mapping
  • 13.8. Drivers and Restraints - Impact Analysis

14. Latin America Market Analysis 2019-2023 and Forecast 2024-2033

  • 14.1. Introduction
  • 14.2. Pricing Analysis
  • 14.3. Historical Market Size (US$ Mn) and Volume Trend Analysis By Market Taxonomy, 2019-2023
  • 14.4. Market Size (US$ Mn) and Volume Forecast By Market Taxonomy, 2024-2033
    • 14.4.1. By Country
      • 14.4.1.1. Brazil
      • 14.4.1.2. Mexico
      • 14.4.1.3. Rest of Latin America
    • 14.4.2. By Product Type
    • 14.4.3. By Material Type
    • 14.4.4. By Board Type
  • 14.5. Market Attractiveness Analysis
    • 14.5.1. By Country
    • 14.5.2. By Product Type
    • 14.5.3. By Material Type
    • 14.5.4. By Board Type
  • 14.6. Market Trends
  • 14.7. Key Market Participants - Intensity Mapping
  • 14.8. Drivers and Restraints - Impact Analysis

15. Europe Market Analysis 2019-2023 and Forecast 2024-2033

  • 15.1. Introduction
  • 15.2. Pricing Analysis
  • 15.3. Historical Market Size (US$ Mn) and Volume Trend Analysis By Market Taxonomy, 2019-2023
  • 15.4. Market Size (US$ Mn) and Volume Forecast By Market Taxonomy, 2024-2033
    • 15.4.1. By Country
      • 15.4.1.1. Germany
      • 15.4.1.2. Italy
      • 15.4.1.3. France
      • 15.4.1.4. U.K.
      • 15.4.1.5. Spain
      • 15.4.1.6. BENELUX
      • 15.4.1.7. Russia
      • 15.4.1.8. Rest of Europe
    • 15.4.2. By Product Type
    • 15.4.3. By Material Type
    • 15.4.4. By Board Type
  • 15.5. Market Attractiveness Analysis
    • 15.5.1. By Country
    • 15.5.2. By Product Type
    • 15.5.3. By Material Type
    • 15.5.4. By Board Type
  • 15.6. Market Trends
  • 15.7. Key Market Participants - Intensity Mapping
  • 15.8. Drivers and Restraints - Impact Analysis

16. South Asia and Pacific Market Analysis 2019-2023 and Forecast 2024-2033

  • 16.1. Introduction
  • 16.2. Pricing Analysis
  • 16.3. Historical Market Size (US$ Mn) and Volume Trend Analysis By Market Taxonomy, 2019-2023
  • 16.4. Market Size (US$ Mn) and Volume Forecast By Market Taxonomy, 2024-2033
    • 16.4.1. By Country
      • 16.4.1.1. India
      • 16.4.1.2. Association of Southeast Asian Nations
      • 16.4.1.3. Australia and New Zealand
      • 16.4.1.4. Rest of South Asia and Pacific
    • 16.4.2. By Product Type
    • 16.4.3. By Material Type
    • 16.4.4. By Board Type
  • 16.5. Market Attractiveness Analysis
    • 16.5.1. By Country
    • 16.5.2. By Product Type
    • 16.5.3. By Material Type
    • 16.5.4. By Board Type
  • 16.6. Market Trends
  • 16.7. Key Market Participants - Intensity Mapping
  • 16.8. Drivers and Restraints - Impact Analysis

17. East Asia Market Analysis 2019-2023 and Forecast 2024-2033

  • 17.1. Introduction
  • 17.2. Pricing Analysis
  • 17.3. Historical Market Size (US$ Mn) and Volume Trend Analysis By Market Taxonomy, 2019-2023
  • 17.4. Market Size (US$ Mn) and Volume Forecast By Market Taxonomy, 2024-2033
    • 17.4.1. By Country
      • 17.4.1.1. China
      • 17.4.1.2. Japan
      • 17.4.1.3. South Korea
    • 17.4.2. By Product Type
    • 17.4.3. By Material Type
    • 17.4.4. By Board Type
  • 17.5. Market Attractiveness Analysis
    • 17.5.1. By Country
    • 17.5.2. By Product Type
    • 17.5.3. By Material Type
    • 17.5.4. By Board Type
  • 17.6. Market Trends
  • 17.7. Key Market Participants - Intensity Mapping
  • 17.8. Drivers and Restraints - Impact Analysis

18. Middle East and Africa Market Analysis 2019-2023 and Forecast 2024-2033

  • 18.1. Introduction
  • 18.2. Pricing Analysis
  • 18.3. Historical Market Size (US$ Mn) and Volume Trend Analysis By Market Taxonomy, 2019-2023
  • 18.4. Market Size (US$ Mn) and Volume Forecast By Market Taxonomy, 2024-2033
    • 18.4.1. By Country
      • 18.4.1.1. Gulf Corporation Council Countries
      • 18.4.1.2. Turkey
      • 18.4.1.3. Northern Africa
      • 18.4.1.4. South Africa
      • 18.4.1.5. Rest of Middle East and Africa
    • 18.4.2. By Product Type
    • 18.4.3. By Material Type
    • 18.4.4. By Board Type
  • 18.5. Market Attractiveness Analysis
    • 18.5.1. By Country
    • 18.5.2. By Product Type
    • 18.5.3. By Material Type
    • 18.5.4. By Board Type
  • 18.6. Market Trends
  • 18.7. Key Market Participants - Intensity Mapping
  • 18.8. Drivers and Restraints - Impact Analysis

19. Key Countries Market Analysis

  • 19.1. Introduction
    • 19.1.1. Market Value Proportion Analysis, By Key Countries
    • 19.1.2. Global Vs. Country Growth Comparison
  • 19.2. U.S. Market Analysis
    • 19.2.1. By Product Type
    • 19.2.2. By Material Type
    • 19.2.3. By Board Type
  • 19.3. Canada Market Analysis
    • 19.3.1. By Product Type
    • 19.3.2. By Material Type
    • 19.3.3. By Board Type
  • 19.4. Mexico Market Analysis
    • 19.4.1. By Product Type
    • 19.4.2. By Material Type
    • 19.4.3. By Board Type
  • 19.5. Brazil Market Analysis
    • 19.5.1. By Product Type
    • 19.5.2. By Material Type
    • 19.5.3. By Board Type
  • 19.6. Germany Market Analysis
    • 19.6.1. By Product Type
    • 19.6.2. By Material Type
    • 19.6.3. By Board Type
  • 19.7. Italy Market Analysis
    • 19.7.1. By Product Type
    • 19.7.2. By Material Type
    • 19.7.3. By Board Type
  • 19.8. France Market Analysis
    • 19.8.1. By Product Type
    • 19.8.2. By Material Type
    • 19.8.3. By Board Type
  • 19.9. U.K. Market Analysis
    • 19.9.1. By Product Type
    • 19.9.2. By Material Type
    • 19.9.3. By Board Type
  • 19.10. Spain Market Analysis
    • 19.10.1. By Product Type
    • 19.10.2. By Material Type
    • 19.10.3. By Board Type
  • 19.11. BENELUX Market Analysis
    • 19.11.1. By Product Type
    • 19.11.2. By Material Type
    • 19.11.3. By Board Type
  • 19.12. Russia Market Analysis
    • 19.12.1. By Product Type
    • 19.12.2. By Material Type
    • 19.12.3. By Board Type
  • 19.13. China Market Analysis
    • 19.13.1. By Product Type
    • 19.13.2. By Material Type
    • 19.13.3. By Board Type
  • 19.14. Japan Market Analysis
    • 19.14.1. By Product Type
    • 19.14.2. By Material Type
    • 19.14.3. By Board Type
  • 19.15. South Korea Market Analysis
    • 19.15.1. By Product Type
    • 19.15.2. By Material Type
    • 19.15.3. By Board Type
  • 19.16. India Market Analysis
    • 19.16.1. By Product Type
    • 19.16.2. By Material Type
    • 19.16.3. By Board Type
  • 19.17. Association of Southeast Asian Nations Market Analysis
    • 19.17.1. By Product Type
    • 19.17.2. By Material Type
    • 19.17.3. By Board Type
  • 19.18. Australia and New Zealand Analysis
    • 19.18.1. By Product Type
    • 19.18.2. By Material Type
    • 19.18.3. By Board Type
  • 19.19. Gulf Corporation Council Countries Market Analysis
    • 19.19.1. By Product Type
    • 19.19.2. By Material Type
    • 19.19.3. By Board Type
  • 19.20. Turkey Market Analysis
    • 19.20.1. By Product Type
    • 19.20.2. By Material Type
    • 19.20.3. By Board Type

20. Market Structure Analysis

  • 20.1. Market Analysis by Tier of Companies
  • 20.2. Market Concentration
  • 20.3. Market Share Analysis of Top Players
  • 20.4. Market Presence Analysis
    • 20.4.1. By Regional footprint of Players
    • 20.4.2. Product foot print by Players

21. Competition Analysis

  • 21.1. Competition Dashboard
  • 21.2. Competition Benchmarking
  • 21.3. Competition Deep Dive
    • 21.3.1. Henkel AG and Co. KGaA
      • 21.3.1.1. Overview
      • 21.3.1.2. Product Portfolio
      • 21.3.1.3. Key Financials
      • 21.3.1.4. Recent Developments
      • 21.3.1.5. Strategy Overview
        • 21.3.1.5.1. Marketing Strategy
        • 21.3.1.5.2. Product Strategy
    • 21.3.2. Namics Corporation
      • 21.3.2.1. Overview
      • 21.3.2.2. Product Portfolio
      • 21.3.2.3. Key Financials
      • 21.3.2.4. Recent Developments
      • 21.3.2.5. Strategy Overview
        • 21.3.2.5.1. Marketing Strategy
        • 21.3.2.5.2. Product Strategy
    • 21.3.3. AI Technology, Inc.
      • 21.3.3.1. Overview
      • 21.3.3.2. Product Portfolio
      • 21.3.3.3. Key Financials
      • 21.3.3.4. Recent Developments
      • 21.3.3.5. Strategy Overview
        • 21.3.3.5.1. Marketing Strategy
        • 21.3.3.5.2. Product Strategy
    • 21.3.4. Protavic International
      • 21.3.4.1. Overview
      • 21.3.4.2. Product Portfolio
      • 21.3.4.3. Key Financials
      • 21.3.4.4. Recent Developments
      • 21.3.4.5. Strategy Overview
        • 21.3.4.5.1. Marketing Strategy
        • 21.3.4.5.2. Product Strategy
    • 21.3.5. H.B. Fuller Company
      • 21.3.5.1. Overview
      • 21.3.5.2. Product Portfolio
      • 21.3.5.3. Key Financials
      • 21.3.5.4. Recent Developments
      • 21.3.5.5. Strategy Overview
        • 21.3.5.5.1. Marketing Strategy
        • 21.3.5.5.2. Product Strategy
    • 21.3.6. ASE Group
      • 21.3.6.1. Overview
      • 21.3.6.2. Product Portfolio
      • 21.3.6.3. Key Financials
      • 21.3.6.4. Recent Developments
      • 21.3.6.5. Strategy Overview
        • 21.3.6.5.1. Marketing Strategy
        • 21.3.6.5.2. Product Strategy
    • 21.3.7. Hitachi Chemical Co., Ltd.
      • 21.3.7.1. Overview
      • 21.3.7.2. Product Portfolio
      • 21.3.7.3. Key Financials
      • 21.3.7.4. Recent Developments
      • 21.3.7.5. Strategy Overview
        • 21.3.7.5.1. Marketing Strategy
        • 21.3.7.5.2. Product Strategy
    • 21.3.8. Indium Corporation
      • 21.3.8.1. Overview
      • 21.3.8.2. Product Portfolio
      • 21.3.8.3. Key Financials
      • 21.3.8.4. Recent Developments
      • 21.3.8.5. Strategy Overview
        • 21.3.8.5.1. Marketing Strategy
        • 21.3.8.5.2. Product Strategy
    • 21.3.9. Zymet
      • 21.3.9.1. Overview
      • 21.3.9.2. Product Portfolio
      • 21.3.9.3. Key Financials
      • 21.3.9.4. Recent Developments
      • 21.3.9.5. Strategy Overview
        • 21.3.9.5.1. Marketing Strategy
        • 21.3.9.5.2. Product Strategy
    • 21.3.10. YINCAE Advanced Materials, LLC
      • 21.3.10.1. Overview
      • 21.3.10.2. Product Portfolio
      • 21.3.10.3. Key Financials
      • 21.3.10.4. Recent Developments
      • 21.3.10.5. Strategy Overview
        • 21.3.10.5.1. Marketing Strategy
        • 21.3.10.5.2. Product Strategy
    • 21.3.11. LORD Corporation
      • 21.3.11.1. Overview
      • 21.3.11.2. Product Portfolio
      • 21.3.11.3. Key Financials
      • 21.3.11.4. Recent Developments
      • 21.3.11.5. Strategy Overview
        • 21.3.11.5.1. Marketing Strategy
        • 21.3.11.5.2. Product Strategy
    • 21.3.12. Sanyu Rec Co., Ltd.
      • 21.3.12.1. Overview
      • 21.3.12.2. Product Portfolio
      • 21.3.12.3. Key Financials
      • 21.3.12.4. Recent Developments
      • 21.3.12.5. Strategy Overview
        • 21.3.12.5.1. Marketing Strategy
        • 21.3.12.5.2. Product Strategy
    • 21.3.13. The Dow Chemical Company
      • 21.3.13.1. Overview
      • 21.3.13.2. Product Portfolio
      • 21.3.13.3. Key Financials
      • 21.3.13.4. Recent Developments
      • 21.3.13.5. Strategy Overview
        • 21.3.13.5.1. Marketing Strategy
        • 21.3.13.5.2. Product Strategy
    • 21.3.14. Epoxy Technology, Inc.
      • 21.3.14.1. Overview
      • 21.3.14.2. Product Portfolio
      • 21.3.14.3. Key Financials
      • 21.3.14.4. Recent Developments
      • 21.3.14.5. Strategy Overview
        • 21.3.14.5.1. Marketing Strategy
        • 21.3.14.5.2. Product Strategy
    • 21.3.15. Panasonic Corporation
      • 21.3.15.1. Overview
      • 21.3.15.2. Product Portfolio
      • 21.3.15.3. Key Financials
      • 21.3.15.4. Recent Developments
      • 21.3.15.5. Strategy Overview
        • 21.3.15.5.1. Marketing Strategy
        • 21.3.15.5.2. Product Strategy
    • 21.3.16. Dymax Corporation
      • 21.3.16.1. Overview
      • 21.3.16.2. Product Portfolio
      • 21.3.16.3. Key Financials
      • 21.3.16.4. Recent Developments
      • 21.3.16.5. Strategy Overview
        • 21.3.16.5.1. Marketing Strategy
        • 21.3.16.5.2. Product Strategy
    • 21.3.17. ELANTAS GmbH
      • 21.3.17.1. Overview
      • 21.3.17.2. Product Portfolio
      • 21.3.17.3. Key Financials
      • 21.3.17.4. Recent Developments
      • 21.3.17.5. Strategy Overview
        • 21.3.17.5.1. Marketing Strategy
        • 21.3.17.5.2. Product Strategy

22. Assumptions and Acronyms Used

23. Research Methodology