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市场调查报告书
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1652744

电子市场中的 PUR 黏合剂：全球产业分析、规模、份额、成长、趋势和预测，2025-2032 年

PUR Adhesives in Electronics Market: Global Industry Analysis, Size, Share, Growth, Trends, and Forecast, 2025 - 2032
出版日期: | 出版商: Persistence Market Research | 英文 222 Pages | 商品交期: 2-5个工作天内

价格
简介目录

Persistence Market Research 最近发布了一份关于电子领域 PUR 黏合剂全球市场的详尽报告。该报告对关键市场动态进行了全面的分析，包括市场驱动因素、趋势、机会和挑战，并对市场结构提供了深入的见解。

关键见解

  • 电子产业 PUR 胶合剂市场规模（2025 年预测）：43.606 亿美元
  • 预计市场价值（2032F）：6,568,900,000 美元
  • 全球市场成长率（2025-2032 年复合年增长率）：6.0%

电子市场中的 PUR 黏合剂 - 研究范围：

电子领域的 PUR 黏合剂市场包括用于电子元件黏合、封装和密封应用的反应性聚氨酯接着剂。这些黏合剂具有优异的机械强度、防潮性和热稳定性，适用于家用电子电器、汽车电子和工业电子应用。市场涉及广泛的领域，包括电路基板、感测器、半导体和显示面板。成长的动力来自对更小、更强大的电子产品的需求不断增长、黏合剂配方的进步以及 PUR 黏合剂在关键电子组装过程中的广泛使用。

市场成长动力：

有几个关键因素推动了全球电子产品 PUR 黏合剂市场的发展。电子製造业对耐用、柔韧黏合剂的需求不断增长，对市场成长做出了巨大贡献。由于 PUR 黏合剂具有出色的黏合能力和抵抗环境因素的能力，因此电子元件向轻量化和紧凑化的转变正在增加其使用。智慧电子、5G 基础设施和电动车 (EV) 的技术进步进一步扩大了 PUR 黏合剂在高性能应用领域的范围。此外，人们对永续性和环保黏合剂的日益重视，促进了无溶剂和低VOC PUR黏合剂的开发，这种黏合剂越来越多地被各行各业采用。

市场限制：

儘管成长前景看好，但电子市场中的 PUR 黏合剂面临材料成本高和加工复杂性相关的挑战。需要特殊的固化条件和精确的应用技术，这会增加生产成本。此外，环氧树脂和硅胶黏合剂等替代黏合剂技术的竞争可能会限制市场渗透。对 PUR 黏合剂在高温应用中的长期稳定性以及对环境标准的合规性的担忧增加了进一步的挑战。解决这些问题需要持续投入研究和技术进步，以提高黏合剂的性能和成本效益。

市场机会：

由于先进电子应用对可靠黏合剂的需求不断增长，该市场提供了巨大的机会。开发具有增强导热性和电绝缘性的新一代 PUR 黏合剂可满足高性能电子组件的需求。物联网（IoT）、穿戴式技术和软性电子产品的扩展为 PUR 黏合剂提供了新的成长途径，尤其是在高密度电路基板和智慧设备领域。策略联盟、自动化投资和生物基 PUR 黏合剂的引入对于利用新机会和维持市场领导至关重要。

本报告探讨的关键问题

  • 推动电子市场 PUR 黏合剂全球成长的关键因素有哪些？
  • 哪些黏合剂配方和技术在各种应用中被广泛采用？
  • 技术进步如何影响电子市场中 PUR 黏合剂的竞争格局？
  • 电子市场 PUR 黏合剂的主要企业是谁？
  • 全球PUR胶黏剂市场的新趋势与未来前景如何？

目录

第一章执行摘要

第二章 市场概况

  • 市场范围和定义
  • 市场动态
    • 驱动程式
    • 限制因素
    • 机会
    • 任务
    • 主要趋势
  • 组件类型生命週期分析
  • 电子市场中的 PUR 黏合剂：价值链
    • 原物料供应商名单
    • 製造商列表
    • 经销商名单
    • 应用程式列表
    • 盈利分析
  • 波特五力分析
  • 地缘政治紧张局势：市场影响
  • 宏观经济因素
    • 全球产业展望
    • 全球GDP成长前景
    • 全球母市场概览
  • 预测因子－相关性和影响力
  • 监管和技术格局

第 3 章。

  • 主要亮点
    • 市场规模（单位）预测
    • 市场规模及与前一年同期比较率
    • 绝对商机
  • 市场规模（百万美元）分析及预测
    • 2019 年至 2023 年历史市场规模分析
    • 目前市场规模预测，2025-2032
  • 全球电子产品中聚氨酯胶黏剂的展望：元件类型
    • 简介/主要发现
    • 2019 年至 2023 年按组件类型分類的历史市场规模（百万美元）和销售量（单位）分析
    • 当前市场规模（百万美元）和销售（单位）预测，2025-2032 年，按组件类型划分
      • 热导率
      • 电导率
      • 紫外线固化
      • 其他的
  • 市场吸引力分析-元件类型
  • 全球电子产品中聚氨酯胶黏剂的展望：应用
    • 简介/主要发现
    • 2019 年至 2023 年历史市场规模（百万美元）和销售（单位）分析，按应用
    • 当前市场规模（百万美元）和 2025 年至 2032 年销售（单位）预测（按应用划分）
      • 表面黏着型元件
      • 灌封和封装
      • 三防胶
      • 其他的
  • 市场吸引力分析：应用

4. 全球电子产业 PUR 胶合剂市场区域展望

  • 主要亮点
  • 2019 年至 2023 年按地区分類的历史市场规模（百万美元）和销售量（单位）分析
  • 2025 年至 2032 年各地区目前市场规模（百万美元）及销售量（单位）预测
    • 北美洲
    • 欧洲
    • 东亚
    • 南亚和大洋洲
    • 拉丁美洲
    • 中东和非洲
  • 市场吸引力分析：地区

第 5 章 北美电子 PUR 黏合剂市场展望：历史（2019-2023 年）与预测（2025-2032 年）

6. 欧洲电子 PUR 胶合剂市场展望（2019-2023）及预测（2025-2032）

第 7 章。

8. 南亚和大洋洲电子 PUR 黏合剂市场展望（2019-2023）和预测（2025-2032）

第 9 章。

第 10 章。

第十一章 竞争格局

  • 2024 年市场占有率分析
  • 市场结构
    • 市场竞争加剧图
    • 竞争仪錶板
    • 表观产品体积
  • 公司简介（详情－概述、财务状况、策略、最新发展）
    • Henkel AG &Co. KGaA
    • 3M
    • HB Fuller
    • Dow Chemical Company
    • Sika AG
    • Avery Dennison
    • Master Bond Inc.
    • Lord Corporation
    • Huntsman Corporation
    • Permabond
    • DELO Industries Adhesives
    • Panacol
    • ITW Polymers Adhesives

第十二章 附录

1.调查方法

2. 调查前提

H12.3. 首字母缩写与简称

简介目录
Product Code: PMRREP33796

Persistence Market Research has recently published an extensive report on the global PUR Adhesives in Electronics Market. This report offers a comprehensive analysis of the key market dynamics, including drivers, trends, opportunities, and challenges, providing deep insights into the market structure.

Key Insights:

  • PUR Adhesives in Electronics Market Size (2025E): USD 4360.6 Mn
  • Projected Market Value (2032F): USD 6568.9 Mn
  • Global Market Growth Rate (CAGR 2025 to 2032): 6.0%

PUR Adhesives in Electronics Market - Report Scope:

The PUR Adhesives in Electronics Market encompasses a range of reactive polyurethane adhesives used for bonding, encapsulation, and sealing applications in electronic components. These adhesives offer excellent mechanical strength, moisture resistance, and thermal stability, making them suitable for applications in consumer electronics, automotive electronics, and industrial electronics. The market serves diverse segments such as circuit boards, sensors, semiconductors, and display panels. Growth is driven by the increasing demand for miniaturized and high-performance electronic devices, advancements in adhesive formulations, and the expanding application of PUR adhesives in critical electronic assembly processes.

Market Growth Drivers:

Several key factors are driving the global PUR Adhesives in Electronics Market. The rising demand for durable and flexible adhesives in electronic device manufacturing is significantly contributing to market growth. The shift toward lightweight and compact electronic components has increased the use of PUR adhesives due to their superior bonding capabilities and resistance to environmental factors. Technological advancements in smart electronics, 5G infrastructure, and electric vehicles (EVs) have further expanded the scope of PUR adhesives in high-performance applications. Additionally, the growing emphasis on sustainability and eco-friendly adhesives has led to the development of solvent-free and low-VOC PUR adhesives, enhancing their adoption in various industries.

Market Restraints:

Despite promising growth prospects, the PUR Adhesives in Electronics Market faces challenges related to high material costs and processing complexities. The requirement for specialized curing conditions and precise application techniques can increase production costs. Additionally, competition from alternative adhesive technologies, such as epoxy and silicone-based adhesives, may limit market penetration. Concerns regarding the long-term stability of PUR adhesives in high-temperature applications and regulatory compliance with environmental standards further add to the challenges. Addressing these issues requires continuous investment in research and technological advancements to enhance adhesive performance and cost-effectiveness.

Market Opportunities:

The market presents significant opportunities driven by the increasing demand for high-reliability adhesives in advanced electronic applications. The development of next-generation PUR adhesives with enhanced thermal conductivity and electrical insulation properties caters to the need for high-performance electronic assemblies. The expansion of the Internet of Things (IoT), wearable technology, and flexible electronics provides new growth avenues for PUR adhesives, particularly in high-density circuit boards and smart devices. Strategic collaborations, investments in automation, and the introduction of bio-based PUR adhesives are essential for capitalizing on emerging opportunities and maintaining market leadership.

Key Questions Answered in the Report:

  • What are the primary factors driving the growth of the PUR Adhesives in Electronics Market globally?
  • Which adhesive formulations and technologies are leading the adoption in various applications?
  • How are technological advancements influencing the competitive landscape of the PUR Adhesives in Electronics Market?
  • Who are the key players in the PUR Adhesives in Electronics Market, and what strategies are they employing to stay competitive?
  • What are the emerging trends and future prospects in the global PUR Adhesives in Electronics Market?

Competitive Intelligence and Business Strategy:

Leading players in the global PUR Adhesives in Electronics Market, including Henkel AG & Co. KGaA, 3M Company, H.B. Fuller Company, and Sika AG, focus on innovation, product differentiation, and strategic collaborations to gain a competitive edge. These companies invest in R&D to develop advanced adhesive solutions with improved thermal stability, electrical insulation, and sustainability attributes. Collaborations with electronics manufacturers, material scientists, and research institutions facilitate market access and promote new technology adoption. Emphasis on automation, sustainable manufacturing practices, and advanced adhesive application techniques fosters market growth and enhances brand reputation in the evolving PUR Adhesives in Electronics Market landscape.

Key Companies Profiled:

  • Henkel AG & Co. KGaA
  • 3M
  • H.B Fuller
  • Dow Chemical Company
  • Sika AG
  • Avery Dennison
  • Master Bond Inc.
  • Lord Corporation
  • Huntsman Corporation
  • Permabond
  • DELO Industries Adhesives
  • Panacol
  • ITW Polymers Adhesives

PUR Adhesives in Electronics Market Research Segmentation

By Component Type:

  • Thermal Conductive
  • Electrically Conductive
  • UV Curing
  • Others

By Application:

  • Surface-mount devices
  • Potting & Encapsulation
  • Conformal Coatings
  • Others

By Region:

  • North America
  • Europe
  • East Asia
  • South Asia & Oceania
  • Latin America
  • Middle East & Africa

Table of Contents

1. Executive Summary

  • 1.1. Global PUR Adhesives in Electronics Market Snapshot, 2025 - 2032
  • 1.2. Market Opportunity Assessment, 2025 - 2032, US$ Mn
  • 1.3. Key Market Trends
  • 1.4. Future Market Projections
  • 1.5. Premium Market Insights
  • 1.6. Industry Developments and Key Market Events
  • 1.7. PMR Analysis and Recommendations

2. Market Overview

  • 2.1. Market Scope and Definition
  • 2.2. Market Dynamics
    • 2.2.1. Drivers
    • 2.2.2. Restraints
    • 2.2.3. Opportunity
    • 2.2.4. Challenges
    • 2.2.5. Key Trends
  • 2.3. Component Type Lifecycle Analysis
  • 2.4. PUR Adhesives in Electronics Market: Value Chain
    • 2.4.1. List of Raw Material Supplier
    • 2.4.2. List of Manufacturers
    • 2.4.3. List of Distributors
    • 2.4.4. List of Applications
    • 2.4.5. Profitability Analysis
  • 2.5. Porter Five Force's Analysis
  • 2.6. Geopolitical Tensions: Market Impact
  • 2.7. Macro-Economic Factors
    • 2.7.1. Global Sectorial Outlook
    • 2.7.2. Global GDP Growth Outlook
    • 2.7.3. Global Parent Market Overview
  • 2.8. Forecast Factors - Relevance and Impact
  • 2.9. Regulatory and Technology Landscape

3. Global PUR Adhesives in Electronics Market Outlook: Historical (2019 - 2023) and Forecast (2025 - 2032)

  • 3.1. Key Highlights
    • 3.1.1. Market Volume (Units) Projections
    • 3.1.2. Market Size and Y-o-Y Growth
    • 3.1.3. Absolute $ Opportunity
  • 3.2. Market Size (US$ Mn) Analysis and Forecast
    • 3.2.1. Historical Market Size Analysis, 2019 - 2023
    • 3.2.2. Current Market Size Forecast, 2025 - 2032
  • 3.3. Global PUR Adhesives in Electronics Market Outlook: Component Type
    • 3.3.1. Introduction / Key Findings
    • 3.3.2. Historical Market Size (US$ Mn) and Volume (Units) Analysis By Component Type, 2019 - 2023
    • 3.3.3. Current Market Size (US$ Mn) and Volume (Units) Forecast By Component Type, 2025 - 2032
      • 3.3.3.1. Thermal Conductive
      • 3.3.3.2. Electrically Conductive
      • 3.3.3.3. UV Curing
      • 3.3.3.4. Others
  • 3.4. Market Attractiveness Analysis: Component Type
  • 3.5. Global PUR Adhesives in Electronics Market Outlook: Application
    • 3.5.1. Introduction / Key Findings
    • 3.5.2. Historical Market Size (US$ Mn) and Volume (Units) Analysis By Application, 2019 - 2023
    • 3.5.3. Current Market Size (US$ Mn) and Volume (Units) Forecast By Application, 2025 - 2032
      • 3.5.3.1. Surface-mount devices
      • 3.5.3.2. Potting & Encapsulation
      • 3.5.3.3. Conformal Coatings
      • 3.5.3.4. Others
  • 3.6. Market Attractiveness Analysis: Application

4. Global PUR Adhesives in Electronics Market Outlook: Region

  • 4.1. Key Highlights
  • 4.2. Historical Market Size (US$ Mn) and Volume (Units) Analysis By Region, 2019 - 2023
  • 4.3. Current Market Size (US$ Mn) and Volume (Units) Forecast By Region, 2025 - 2032
    • 4.3.1. North America
    • 4.3.2. Europe
    • 4.3.3. East Asia
    • 4.3.4. South Asia and Oceania
    • 4.3.5. Latin America
    • 4.3.6. Middle East & Africa (MEA)
  • 4.4. Market Attractiveness Analysis: Region

5. North America PUR Adhesives in Electronics Market Outlook: Historical (2019 - 2023) and Forecast (2025 - 2032)

  • 5.1. Key Highlights
  • 5.2. Pricing Analysis
  • 5.3. Historical Market Size (US$ Mn) and Volume (Units) Analysis By Market, 2019 - 2023
    • 5.3.1. By Country
    • 5.3.2. By Component Type
    • 5.3.3. By Application
  • 5.4. Current Market Size (US$ Mn) and Volume (Units) Forecast By Country, 2025 - 2032
    • 5.4.1. U.S.
    • 5.4.2. Canada
  • 5.5. Current Market Size (US$ Mn) and Volume (Units) Forecast By Component Type, 2025 - 2032
    • 5.5.1. Thermal Conductive
    • 5.5.2. Electrically Conductive
    • 5.5.3. UV Curing
    • 5.5.4. Others
  • 5.6. Current Market Size (US$ Mn) and Volume (Units) Forecast By Application, 2025 - 2032
    • 5.6.1. Surface-mount devices
    • 5.6.2. Potting & Encapsulation
    • 5.6.3. Conformal Coatings
    • 5.6.4. Others
  • 5.7. Market Attractiveness Analysis

6. Europe PUR Adhesives in Electronics Market Outlook: Historical (2019 - 2023) and Forecast (2025 - 2032)

  • 6.1. Key Highlights
  • 6.2. Pricing Analysis
  • 6.3. Historical Market Size (US$ Mn) and Volume (Units) Analysis By Market, 2019 - 2023
    • 6.3.1. By Country
    • 6.3.2. By Component Type
    • 6.3.3. By Application
  • 6.4. Current Market Size (US$ Mn) and Volume (Units) Forecast By Country, 2025 - 2032
    • 6.4.1. Germany
    • 6.4.2. France
    • 6.4.3. U.K.
    • 6.4.4. Italy
    • 6.4.5. Spain
    • 6.4.6. Russia
    • 6.4.7. Turkey
    • 6.4.8. Rest of Europe
  • 6.5. Current Market Size (US$ Mn) and Volume (Units) Forecast By Component Type, 2025 - 2032
    • 6.5.1. Thermal Conductive
    • 6.5.2. Electrically Conductive
    • 6.5.3. UV Curing
    • 6.5.4. Others
  • 6.6. Current Market Size (US$ Mn) and Volume (Units) Forecast By Application, 2025 - 2032
    • 6.6.1. Surface-mount devices
    • 6.6.2. Potting & Encapsulation
    • 6.6.3. Conformal Coatings
    • 6.6.4. Others
  • 6.7. Market Attractiveness Analysis

7. East Asia PUR Adhesives in Electronics Market Outlook: Historical (2019 - 2023) and Forecast (2025 - 2032)

  • 7.1. Key Highlights
  • 7.2. Pricing Analysis
  • 7.3. Historical Market Size (US$ Mn) and Volume (Units) Analysis By Market, 2019 - 2023
    • 7.3.1. By Country
    • 7.3.2. By Component Type
    • 7.3.3. By Application
  • 7.4. Current Market Size (US$ Mn) and Volume (Units) Forecast By Country, 2025 - 2032
    • 7.4.1. China
    • 7.4.2. Japan
    • 7.4.3. South Korea
  • 7.5. Current Market Size (US$ Mn) and Volume (Units) Forecast By Component Type, 2025 - 2032
    • 7.5.1. Thermal Conductive
    • 7.5.2. Electrically Conductive
    • 7.5.3. UV Curing
    • 7.5.4. Others
  • 7.6. Current Market Size (US$ Mn) and Volume (Units) Forecast By Application, 2025 - 2032
    • 7.6.1. Surface-mount devices
    • 7.6.2. Potting & Encapsulation
    • 7.6.3. Conformal Coatings
    • 7.6.4. Others
  • 7.7. Market Attractiveness Analysis

8. South Asia & Oceania PUR Adhesives in Electronics Market Outlook: Historical (2019 - 2023) and Forecast (2025 - 2032)

  • 8.1. Key Highlights
  • 8.2. Pricing Analysis
  • 8.3. Historical Market Size (US$ Mn) and Volume (Units) Analysis By Market, 2019 - 2023
    • 8.3.1. By Country
    • 8.3.2. By Component Type
    • 8.3.3. By Application
  • 8.4. Current Market Size (US$ Mn) and Volume (Units) Forecast By Country, 2025 - 2032
    • 8.4.1. India
    • 8.4.2. Southeast Asia
    • 8.4.3. ANZ
    • 8.4.4. Rest of South Asia & Oceania
  • 8.5. Current Market Size (US$ Mn) and Volume (Units) Forecast By Component Type, 2025 - 2032
    • 8.5.1. Thermal Conductive
    • 8.5.2. Electrically Conductive
    • 8.5.3. UV Curing
    • 8.5.4. Others
  • 8.6. Current Market Size (US$ Mn) and Volume (Units) Forecast By Application, 2025 - 2032
    • 8.6.1. Surface-mount devices
    • 8.6.2. Potting & Encapsulation
    • 8.6.3. Conformal Coatings
    • 8.6.4. Others
  • 8.7. Market Attractiveness Analysis

9. Latin America PUR Adhesives in Electronics Market Outlook: Historical (2019 - 2023) and Forecast (2025 - 2032)

  • 9.1. Key Highlights
  • 9.2. Pricing Analysis
  • 9.3. Historical Market Size (US$ Mn) and Volume (Units) Analysis By Market, 2019 - 2023
    • 9.3.1. By Country
    • 9.3.2. By Component Type
    • 9.3.3. By Application
  • 9.4. Current Market Size (US$ Mn) and Volume (Units) Forecast By Country, 2025 - 2032
    • 9.4.1. Brazil
    • 9.4.2. Mexico
    • 9.4.3. Rest of Latin America
  • 9.5. Current Market Size (US$ Mn) and Volume (Units) Forecast By Component Type, 2025 - 2032
    • 9.5.1. Thermal Conductive
    • 9.5.2. Electrically Conductive
    • 9.5.3. UV Curing
    • 9.5.4. Others
  • 9.6. Current Market Size (US$ Mn) and Volume (Units) Forecast By Application, 2025 - 2032
    • 9.6.1. Surface-mount devices
    • 9.6.2. Potting & Encapsulation
    • 9.6.3. Conformal Coatings
    • 9.6.4. Others
  • 9.7. Market Attractiveness Analysis

10. Middle East & Africa PUR Adhesives in Electronics Market Outlook: Historical (2019 - 2023) and Forecast (2025 - 2032)

  • 10.1. Key Highlights
  • 10.2. Pricing Analysis
  • 10.3. Historical Market Size (US$ Mn) and Volume (Units) Analysis By Market, 2019 - 2023
    • 10.3.1. By Country
    • 10.3.2. By Component Type
    • 10.3.3. By Application
  • 10.4. Current Market Size (US$ Mn) and Volume (Units) Forecast By Country, 2025 - 2032
    • 10.4.1. GCC
    • 10.4.2. Egypt
    • 10.4.3. South Africa
    • 10.4.4. Northern Africa
    • 10.4.5. Rest of Middle East & Africa
  • 10.5. Current Market Size (US$ Mn) and Volume (Units) Forecast By Component Type, 2025 - 2032
    • 10.5.1. Thermal Conductive
    • 10.5.2. Electrically Conductive
    • 10.5.3. UV Curing
    • 10.5.4. Others
  • 10.6. Current Market Size (US$ Mn) and Volume (Units) Forecast By Application, 2025 - 2032
    • 10.6.1. Surface-mount devices
    • 10.6.2. Potting & Encapsulation
    • 10.6.3. Conformal Coatings
    • 10.6.4. Others
  • 10.7. Market Attractiveness Analysis

11. Competition Landscape

  • 11.1. Market Share Analysis, 2024
  • 11.2. Market Structure
    • 11.2.1. Competition Intensity Mapping By Market
    • 11.2.2. Competition Dashboard
    • 11.2.3. Apparent Product Capacity
  • 11.3. Company Profiles (Details - Overview, Financials, Strategy, Recent Developments)
    • 11.3.1. Henkel AG & Co. KGaA
      • 11.3.1.1. Overview
      • 11.3.1.2. Segments and Product
      • 11.3.1.3. Key Financials
      • 11.3.1.4. Market Developments
      • 11.3.1.5. Market Strategy
    • 11.3.2. 3M
      • 11.3.2.1. Overview
      • 11.3.2.2. Segments and Product
      • 11.3.2.3. Key Financials
      • 11.3.2.4. Market Developments
      • 11.3.2.5. Market Strategy
    • 11.3.3. H.B Fuller
      • 11.3.3.1. Overview
      • 11.3.3.2. Segments and Product
      • 11.3.3.3. Key Financials
      • 11.3.3.4. Market Developments
      • 11.3.3.5. Market Strategy
    • 11.3.4. Dow Chemical Company
      • 11.3.4.1. Overview
      • 11.3.4.2. Segments and Product
      • 11.3.4.3. Key Financials
      • 11.3.4.4. Market Developments
      • 11.3.4.5. Market Strategy
    • 11.3.5. Sika AG
      • 11.3.5.1. Overview
      • 11.3.5.2. Segments and Product
      • 11.3.5.3. Key Financials
      • 11.3.5.4. Market Developments
      • 11.3.5.5. Market Strategy
    • 11.3.6. Avery Dennison
      • 11.3.6.1. Overview
      • 11.3.6.2. Segments and Product
      • 11.3.6.3. Key Financials
      • 11.3.6.4. Market Developments
      • 11.3.6.5. Market Strategy
    • 11.3.7. Master Bond Inc.
      • 11.3.7.1. Overview
      • 11.3.7.2. Segments and Product
      • 11.3.7.3. Key Financials
      • 11.3.7.4. Market Developments
      • 11.3.7.5. Market Strategy
    • 11.3.8. Lord Corporation
      • 11.3.8.1. Overview
      • 11.3.8.2. Segments and Product
      • 11.3.8.3. Key Financials
      • 11.3.8.4. Market Developments
      • 11.3.8.5. Market Strategy
    • 11.3.9. Huntsman Corporation
      • 11.3.9.1. Overview
      • 11.3.9.2. Segments and Product
      • 11.3.9.3. Key Financials
      • 11.3.9.4. Market Developments
      • 11.3.9.5. Market Strategy
    • 11.3.10. Permabond
      • 11.3.10.1. Overview
      • 11.3.10.2. Segments and Product
      • 11.3.10.3. Key Financials
      • 11.3.10.4. Market Developments
      • 11.3.10.5. Market Strategy
    • 11.3.11. DELO Industries Adhesives
      • 11.3.11.1. Overview
      • 11.3.11.2. Segments and Product
      • 11.3.11.3. Key Financials
      • 11.3.11.4. Market Developments
      • 11.3.11.5. Market Strategy
    • 11.3.12. Panacol
      • 11.3.12.1. Overview
      • 11.3.12.2. Segments and Product
      • 11.3.12.3. Key Financials
      • 11.3.12.4. Market Developments
      • 11.3.12.5. Market Strategy
    • 11.3.13. ITW Polymers Adhesives
      • 11.3.13.1. Overview
      • 11.3.13.2. Segments and Product
      • 11.3.13.3. Key Financials
      • 11.3.13.4. Market Developments
      • 11.3.13.5. Market Strategy

12. Appendix

H12.1. Research Methodology

H12.2. Research Assumptions

H12.3. Acronyms and Abbreviations