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市场调查报告书
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1696239

全球可脱黏黏合剂市场 - 2025 至 2032 年

Global De-bondable Adhesives Market - 2025-2032

出版日期: | 出版商: DataM Intelligence | 英文 180 Pages | 商品交期: 最快1-2个工作天内

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简介目录

2024 年全球可脱黏黏合剂市场规模达到 4.2 亿美元,预计到 2032 年将达到 8.0 亿美元,在 2025-2032 年预测期内的复合年增长率为 8.52%。

由于各行各业对永续、可返工黏合解决方案的需求不断增加,可脱黏黏合剂市场正在大幅扩张。这些黏合剂广泛应用于电子、汽车、建筑和医疗应用,具有易于拆卸且不损坏基材的优点。人们对可回收性、可修復性和材料回收的日益关注推动了市场成长。

可脱黏胶黏剂的发展趋势

向循环经济原则的转变增加了对易于进行材料回收和再循环的可脱粘黏合剂的需求。电子和汽车等行业越来越多地使用这些黏合剂来遵守严格的环境法规。

随着对轻质材料和模组化组装的日益关注,汽车和航太工业正在采用可脱粘粘合剂用于面板粘合、内饰组装和部件修理等应用。此项采用增强了永续性和易维护性。

动态的

驱动因素:对循环经济解决方案的需求不断增加

对循环经济和永续产品生命週期的日益重视是可脱黏黏合剂市场发展的主要驱动力。各行各业都致力于减少浪费并提高材料的可回收性,从而增加了可逆黏合剂的使用。尤其是电子业,正在利用这些黏合剂轻鬆拆卸组件,从而减少电子垃圾。

同样,汽车行业正在采用这些黏合剂实现轻量化模组化设计,提高可修復性和可持续性。据欧洲环境署称,循环经济措施到 2030 年可使工业材料需求减少 20%,进一步推动市场成长。

限制:开发成本高,认知有限

儘管可脱黏黏合剂具有诸多优点,但它也面临研发成本高以及最终用户认知度有限的挑战。开发具有可控脱粘机制的智慧黏合剂需要先进的材料科学和创新的工程技术,从而增加生产成本。

此外,依赖传统黏合剂的行业可能会因不熟悉其应用和性能优势而犹豫是否采用可脱粘替代品。尤其是中小型企业可能难以证明转向这些先进黏合解决方案所产生的更高成本是合理的,从而抑制了市场扩张。

目录

第 1 章:方法与范围

第 2 章:定义与概述

第 3 章:执行摘要

第 4 章:动态

  • 影响因素
    • 驱动程式
      • 可重工和可回收胶合剂的需求不断增加
    • 限制
      • 成本高且性能受限
    • 机会
    • 影响分析

第五章:产业分析

  • 波特五力分析
  • 供应链分析
  • 价值链分析
  • 定价分析
  • 监理与合规性分析
  • 人工智慧与自动化影响分析
  • 研发与创新分析
  • 永续性与绿色技术分析
  • 技术路线图
  • 专利格局
  • DMI 意见

第 6 章:按类型

  • 热脱黏黏合剂
  • 紫外线/光剥离黏合剂
  • 化学可剥离黏合剂
  • 电离黏合剂
  • 其他的

第 7 章:按构成

  • 反应性
  • 非反应性
  • 杂交种

第 8 章:按形式

  • 液体黏合剂
  • 薄膜黏合剂
  • 糊状黏合剂

第 9 章:依最终用途产业

  • 电学
  • 汽车
  • 医疗保健
  • 航太和国防
  • 建造
  • 其他的

第 10 章:按地区

  • 北美洲
    • 我们
    • 加拿大
    • 墨西哥
  • 欧洲
    • 德国
    • 英国
    • 法国
    • 义大利
    • 西班牙
    • 欧洲其他地区
  • 南美洲
    • 巴西
    • 阿根廷
    • 南美洲其他地区
  • 亚太
    • 中国
    • 印度
    • 日本
    • 澳洲
    • 亚太其他地区
  • 中东和非洲

第 11 章:竞争格局

  • 竞争格局
  • 市场定位/份额分析
  • 併购分析

第 12 章:公司简介

  • Henkel AG & Co. KGaA
    • 公司概况
    • 产品组合和描述
    • 财务概览
    • 关键进展
  • 3M Company
  • Flanders Make
  • Conagen, Inc.
  • ATSP Innovations

第 13 章:附录

简介目录
Product Code: CH9396

Global de-bondable adhesives market reached US$0.42 billion in 2024 and is expected to reach US$0.80 billion by 2032, growing at a CAGR of 8.52% during the forecast period 2025-2032.

The de-bondable adhesives market is expanding significantly due to the increasing demand for sustainable and reworkable bonding solutions across various industries. These adhesives are widely utilized in electronics, automotive, construction, and medical applications, offering the advantage of easy disassembly without damaging substrates. The rising focus on recyclability, repairability, and material recovery is fueling market growth.

De-bondable Adhesives Trends

The shift towards circular economy principles has increased the demand for de-bondable adhesives that facilitate easy material recovery and recycling. Industries such as electronics and automotive are increasingly incorporating these adhesives to comply with stringent environmental regulations.

With the increasing focus on lightweight materials and modular assembly, the automotive and aerospace industries are adopting de-bondable adhesives for applications such as panel bonding, interior assembly, and component repair. This adoption enhances sustainability and ease of maintenance.

Dynamic

Driver: Increasing Demand for Circular Economy Solutions

The growing emphasis on a circular economy and sustainable product life cycles is a major driver for the de-bondable adhesives market. Industries are focusing on reducing waste and enhancing the recyclability of materials, leading to increased adoption of reversible adhesives. The electronics sector, in particular, is leveraging these adhesives for easy disassembly of components, thereby reducing electronic waste.

Similarly, the automotive industry is adopting these adhesives for lightweight modular designs, improving repairability and sustainability. According to the European Environment Agency, the circular economy initiatives could reduce material demand in industries by 20% by 2030, further propelling market growth.

Restraint: High Development Costs and Limited Awareness

Despite their advantages, de-bondable adhesives face challenges related to high research and development costs and limited awareness among end-users. The development of smart adhesives with controlled debonding mechanisms requires advanced material science and innovative engineering, increasing production costs.

Additionally, industries that rely on traditional adhesives may be hesitant to adopt de-bondable alternatives due to unfamiliarity with their applications and performance benefits. Small and medium enterprises, in particular, may find it difficult to justify the higher costs associated with switching to these advanced bonding solutions, thereby restraining market expansion.

Segment Analysis

The global de-bondable adhesives market is segmented based on type, composition, form, end-use industry, and region.

The electronics and electrical applications segment holds the largest share in the global de-bondable adhesives market, driven by increasing demand for miniaturization, flexible electronics, and reworkable components. These adhesives are widely used in chip packaging, printed circuit boards (PCBs), display panels, and semiconductor assembly, allowing manufacturers to perform repairs and modifications efficiently.

Additionally, with the rising adoption of 5G technology, demand for high-frequency PCBs and optoelectronic devices is escalating, further propelling market growth. Leading electronic manufacturers, including Apple, Samsung, and Intel, are investing in advanced bonding solutions to enhance device performance and sustainability. Similarly, in semiconductor manufacturing, de-bondable adhesives facilitate wafer handling, chip stacking, and die-attach processes, improving yield and reducing material waste.

Geographical Penetration

Rapid Industrialization Drives the Market in the Asia-Pacific Region.

The Asia-Pacific region dominates the global de-bondable adhesives market, driven by rapid industrialization, expanding electronics manufacturing, and increasing government support for sustainable solutions. Countries such as China, Japan, South Korea, and India are witnessing high demand for adhesives in consumer electronics, automotive, and semiconductor industries. Meanwhile, India's rising automotive and electronics sectors, supported by government initiatives like "Make in India" and PLI schemes, are fostering the adoption of de-bondable adhesives in EV battery assembly and consumer gadgets.

China, the world's largest electronics producer, accounts for over 35% of global semiconductor manufacturing. The Chinese government's "Made in China 2025" initiative is accelerating the adoption of advanced adhesives in flexible electronics and microelectronics production. Japan and South Korea, home to leading electronics giants like Sony, Panasonic, Samsung, and LG, are investing heavily in reworkable adhesives for OLED displays, foldable devices, and high-performance computing components.

Competitive Landscape

The major players in the market include Henkel AG & Co. KGaA, 3M Company, Flanders Make, Conagen, Inc., and ATSP Innovations.

By Type

  • Thermally De-bondable Adhesives
  • UV/Photo-Debondable Adhesives
  • Chemically De-bondable Adhesives
  • Electrically De-bondable Adhesives
  • Others

By Composition

  • Reactive
  • Non-reactive
  • Hybrid

By Form

  • Liquid Adhesives
  • Film Adhesives
  • Paste Adhesives

By End-Use Industry

  • Electronics and Electrical
  • Automotive
  • Healthcare and Medical
  • Aerospace and Defense
  • Construction
  • Others

By Region

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • France
    • Italy
    • Spain
    • Rest of Europe
  • South America
    • Brazil
    • Argentina
    • Rest of South America
  • Asia-Pacific
    • China
    • India
    • Japan
    • Australia
    • Rest of Asia-Pacific
  • Middle East and Africa

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Target Audience 2024

  • Manufacturers/ Buyers
  • Industry Investors/Investment Bankers
  • Research Professionals
  • Emerging Companies

Table of Contents

1. Methodology and Scope

  • 1.1. Research Methodology
  • 1.2. Research Objective and Scope of the Report

2. Definition and Overview

3. Executive Summary

  • 3.1. Snippet by Type
  • 3.2. Snippet by Composition
  • 3.3. Snippet by Form
  • 3.4. Snippet by End-Use Industry
  • 3.5. Snippet by Region

4. Dynamics

  • 4.1. Impacting Factors
    • 4.1.1. Drivers
      • 4.1.1.1. Increasing Demand for Reworkable and Recyclable Adhesives
    • 4.1.2. Restraints
      • 4.1.2.1. High Cost and Performance Limitations
    • 4.1.3. Opportunity
    • 4.1.4. Impact Analysis

5. Industry Analysis

  • 5.1. Porter's Five Force Analysis
  • 5.2. Supply Chain Analysis
  • 5.3. Value Chain Analysis
  • 5.4. Pricing Analysis
  • 5.5. Regulatory and Compliance Analysis
  • 5.6. AI & Automation Impact Analysis
  • 5.7. R&D and Innovation Analysis
  • 5.8. Sustainability & Green Technology Analysis
  • 5.9. Technology Roadmap
  • 5.10. Patent Landscape
  • 5.11. DMI Opinion

6. By Type

  • 6.1. Introduction
    • 6.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
    • 6.1.2. Market Attractiveness Index, By Type
  • 6.2. Thermally De-bondable Adhesives*
    • 6.2.1. Introduction
    • 6.2.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
  • 6.3. UV/Photo-De-bondable Adhesives
  • 6.4. Chemically De-bondable Adhesives
  • 6.5. Electrically De-bondable Adhesives
  • 6.6. Others

7. By Composition

  • 7.1. Introduction
    • 7.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By Composition
    • 7.1.2. Market Attractiveness Index, By Composition
  • 7.2. Reactive*
    • 7.2.1. Introduction
    • 7.2.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
  • 7.3. Non-reactive
  • 7.4. Hybrid

8. By Form

  • 8.1. Introduction
    • 8.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By Form
    • 8.1.2. Market Attractiveness Index, By Form
  • 8.2. Liquid Adhesives*
    • 8.2.1. Introduction
    • 8.2.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
  • 8.3. Film Adhesives
  • 8.4. Paste Adhesives

9. By End-Use Industry

  • 9.1. Introduction
    • 9.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-Use Industry
    • 9.1.2. Market Attractiveness Index, By End-Use Industry
  • 9.2. Electronics and Electrical*
    • 9.2.1. Introduction
    • 9.2.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
  • 9.3. Automotive
  • 9.4. Healthcare and Medical
  • 9.5. Aerospace and Defense
  • 9.6. Construction
  • 9.7. Others

10. By Region

  • 10.1. Introduction
    • 10.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By Region
    • 10.1.2. Market Attractiveness Index, By Region
  • 10.2. North America
    • 10.2.1. Introduction
    • 10.2.2. Key Region-Specific Dynamics
    • 10.2.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
    • 10.2.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Composition
    • 10.2.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By Form
    • 10.2.6. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-Use Industry
    • 10.2.7. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
      • 10.2.7.1. US
      • 10.2.7.2. Canada
      • 10.2.7.3. Mexico
  • 10.3. Europe
    • 10.3.1. Introduction
    • 10.3.2. Key Region-Specific Dynamics
    • 10.3.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
    • 10.3.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Composition
    • 10.3.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By Form
    • 10.3.6. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-Use
    • 10.3.7. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
      • 10.3.7.1. Germany
      • 10.3.7.2. UK
      • 10.3.7.3. France
      • 10.3.7.4. Italy
      • 10.3.7.5. Spain
      • 10.3.7.6. Rest of Europe
  • 10.4. South America
    • 10.4.1. Introduction
    • 10.4.2. Key Region-Specific Dynamics
    • 10.4.3. Key Region-Specific Dynamics
    • 10.4.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
    • 10.4.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By Composition
    • 10.4.6. Market Size Analysis and Y-o-Y Growth Analysis (%), By Form
    • 10.4.7. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-Use
    • 10.4.8. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
      • 10.4.8.1. Brazil
      • 10.4.8.2. Argentina
      • 10.4.8.3. Rest of South America
  • 10.5. Asia-Pacific
    • 10.5.1. Introduction
    • 10.5.2. Key Region-Specific Dynamics
    • 10.5.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
    • 10.5.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Composition
    • 10.5.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By Form
    • 10.5.6. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-Use
    • 10.5.7. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
      • 10.5.7.1. China
      • 10.5.7.2. India
      • 10.5.7.3. Japan
      • 10.5.7.4. Australia
      • 10.5.7.5. Rest of Asia-Pacific
  • 10.6. Middle East and Africa
    • 10.6.1. Introduction
    • 10.6.2. Key Region-Specific Dynamics
    • 10.6.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
    • 10.6.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Composition
    • 10.6.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By Form
    • 10.6.6. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-Use

11. Competitive Landscape

  • 11.1. Competitive Scenario
  • 11.2. Market Positioning/Share Analysis
  • 11.3. Mergers and Acquisitions Analysis

12. Company Profiles

  • 12.1. Henkel AG & Co. KGaA*
    • 12.1.1. Company Overview
    • 12.1.2. Product Portfolio and Description
    • 12.1.3. Financial Overview
    • 12.1.4. Key Developments
  • 12.2. 3M Company
  • 12.3. Flanders Make
  • 12.4. Conagen, Inc.
  • 12.5. ATSP Innovations

LIST NOT EXHAUSTIVE

13. Appendix

  • 13.1. About Us and Services
  • 13.2. Contact Us