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市场调查报告书
商品编码
1716431

2032 年临时黏合剂市场预测：按产品类型、材料、应用、最终用户和地区进行的全球分析

Temporary Bonding Adhesive Market Forecasts to 2032 - Global Analysis By Product Type Material, Application, End User and By Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 200+ Pages | 商品交期: 2-3个工作天内

价格

根据 Stratistics MRC 的数据，全球临时黏合剂市场预计在 2025 年达到 2.691 亿美元，到 2032 年将达到 4.763 亿美元，预测期内的复合年增长率为 8.5%。

临时黏合剂是用于晶圆层次电子构装、3D IC 整合和微电子组装等先进製造流程的特殊材料。临时黏合剂利用热释放、紫外线照射或化学溶解等机制来提供牢固但可释放的黏合。这些黏合剂以其精确度和耐热性而闻名，有助于在严苛的条件下稳定精密的基板。它对于实现设备小型化、先进封装和高效高产量比率製造至关重要。

根据世界半导体贸易统计，到 2023 年，欧洲将占全球晶片製造市场的 9%，高于 1990 年的 44%。

晶圆级封装和 3D IC 整合的采用率不断提高

晶圆级封装和 3D IC 整合的日益普及极大地推动了对临时黏合剂的需求。这些先进的封装技术需要高效的键合解决方案，以促进多个组件的无缝集成，提高设备性能并降低成本。此外，向更小、更轻的电子设备的转变也增强了黏合剂在先进製造流程中的使用。此外，高温稳定性和精密客製化黏合剂配方的进步正在推动市场的发展。

相容性问题

相容性问题仍然是临时黏合剂市场面临的主要挑战，尤其是在涉及不同基材和热处理流程的应用中。黏合剂和基材之间的材料特性不匹配会导致性能劣化，影响製造效率和产品可靠性。此外，剥离过程中对黏合剂去除的严格要求进一步使相容性问题复杂化。这些限制阻碍了某些行业的广泛采用，例如汽车和航太，因为这些行业的复杂设计需要多功能的黏合解决方案。

开发永续、环保的黏合剂

监管审查的加强和消费者对环保解决方案的需求正在推动製造商透过生物分解性和无溶剂的黏合配方进行创新。这项进展符合全球减少碳足迹和推广绿色技术的倡议。将生物基聚合物和可再生原料整合到临时黏合剂中，有可能彻底改变产业标准，为电子和医疗保健等领域开闢新的途径。

干式处理或机械晶圆支撑方面的进步

干式处理方法和机械晶圆支撑系统的技术进步对临时黏合剂市场构成了重大威胁。这些替代方法减少了对基于黏合剂的黏合的依赖，简化了生产流程并最大限度地减少了与黏合剂去除相关的併发症。随着领先公司对晶圆处理机械解决方案的投资，无黏合剂技术的采用正在整个产业中获得越来越大的吸引力。

COVID-19的影响：

由于新冠疫情，临时黏合剂市场受到了多方面的影响。供应链中断和製造能力下降影响了黏合剂的生产，导致关键时刻出现短缺。然而，远距工作趋势推动电子和通讯设备需求激增，抵消了部分负面影响。疫情期间，黏合剂技术的创新为高性能应用奠定了基础，并确保了对不确定性的抵御能力。

预测期内，热释放临时黏合剂市场预计将成为最大的市场

预计在预测期内，热释放临时黏合剂部分将占据最大的市场占有率。这些黏合剂在精度和效率方面具有明显的优势，能够在受控的热条件下简化脱粘过程。其在半导体製造和晶圆级封装解决方案中的广泛应用证明了其重要性。热释放黏合剂的进步正在推动黏合强度和热稳定性的提高，以满足业界对高性能黏合剂的需求。

预计在预测期内，先进封装领域将以最高的复合年增长率成长。

由于半导体封装领域迅速采用最尖端科技，预计先进封装领域将在预测期内呈现最高的成长率。临时黏合剂支援 3D IC 整合和扇出晶圆层次电子构装等工艺，在增强设备功能和降低生产成本方面发挥着至关重要的作用。电子设备创新包装设计的日益增长的趋势正在推动该市场的需求。

占比最大的地区：

由于亚太地区在半导体製造和电子产品生产领域占据主导地位，预计预测期内亚太地区将占据最大的市场占有率。中国、台湾和韩国等国家已成为先进技术开发的中心，推动了该地区的黏合剂采用。优惠的政府政策和强大的产业生态系统正在促进该地区的持续成长。此外，本地製造商和国际参与者之间的合作正在加强黏合剂供应链，进一步支持亚太地区的市场扩张。

复合年增长率最高的地区：

在预测期内，由于黏合剂技术的进步和研发投资，预计北美将呈现最高的复合年增长率。该地区对永续实践和创新製造解决方案的关注正在增强其竞争地位。汽车、航太和医疗设备领域对精密黏合剂的强劲需求支撑了该地区的成长。此外，关键行业参与者的存在和专注于材料科学的资金筹措正在推动临时黏合剂的采用率。

免费客製化服务：

订阅此报告的客户可享有以下免费自订选项之一：

  • 公司简介
    • 对其他市场公司（最多 3 家公司）进行全面分析
    • 主要企业的SWOT分析（最多3家公司）
  • 地理细分
    • 根据客户兴趣对主要国家市场进行估计、预测和复合年增长率（註：基于可行性检查）
  • 竞争基准化分析
    • 根据产品系列、地理分布和策略联盟对主要企业基准化分析

目录

第一章执行摘要

第二章 前言

  • 概述
  • 相关利益者
  • 研究范围
  • 调查方法
    • 资料探勘
    • 数据分析
    • 数据检验
    • 研究途径
  • 研究材料
    • 主要研究资料
    • 次级研究资讯来源
    • 先决条件

第三章市场走势分析

  • 驱动程式
  • 限制因素
  • 机会
  • 威胁
  • 产品分析
  • 应用分析
  • 最终用户分析
  • 新兴市场
  • COVID-19的影响

第四章 波特五力分析

  • 供应商的议价能力
  • 买家的议价能力
  • 替代品的威胁
  • 新进入者的威胁
  • 竞争对手之间的竞争

5. 全球临时黏合剂市场（依产品类型）

  • 热剥离临时黏合剂
  • 紫外线固化临时黏合剂
  • 机械剥离胶黏剂
  • 雷射剥离胶
  • 可移除临时性黏合剂
  • 压敏临时黏合剂
  • 可溶性临时黏合剂
  • 其他产品类型

6. 全球临时黏合剂市场（按材料）

  • 旋涂
  • 喷涂
  • 辊涂
  • 模版印刷
  • 其他材料

7. 全球临时黏合剂市场（按应用）

  • 先进封装
  • MEMS（电子机械系统）
  • CMOS（互补型金属氧化物半导体）
  • 光电子
  • 其他应用

8. 全球临时黏合剂市场（按最终用户）

  • 电子产品
  • 半导体
  • 车
  • 航太
  • 医疗设备
  • 其他最终用户

9. 全球临时黏合剂市场（按地区）

  • 北美洲
    • 美国
    • 加拿大
    • 墨西哥
  • 欧洲
    • 德国
    • 英国
    • 义大利
    • 法国
    • 西班牙
    • 其他欧洲国家
  • 亚太地区
    • 日本
    • 中国
    • 印度
    • 澳洲
    • 纽西兰
    • 韩国
    • 其他亚太地区
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 南美洲其他地区
  • 中东和非洲
    • 沙乌地阿拉伯
    • 阿拉伯聯合大公国
    • 卡达
    • 南非
    • 其他中东和非洲地区

第十章 重大进展

  • 协议、伙伴关係、合作和合资企业
  • 收购与合併
  • 新产品发布
  • 业务扩展
  • 其他关键策略

第十一章 公司概况

  • 3M
  • AI Technology, Inc.
  • Brewer Science, Inc
  • Daetec
  • Daxin Materials Corp.
  • Dow Inc.
  • Elmer
  • HD MicroSystems, Ltd.
  • IncE Advanced Materials
  • Micro Materials Inc
  • Nissan Chemical Corporation
  • Promerus
  • TAiCHEM Materials Corporation
  • Tokyo Ohka Kogyo Co., Ltd.
  • YINCAE Advanced Materials, LLC
Product Code: SMRC29242

According to Stratistics MRC, the Global Temporary Bonding Adhesive Market is accounted for $269.1 million in 2025 and is expected to reach $476.3 million by 2032 growing at a CAGR of 8.5% during the forecast period. Temporary bonding adhesives are specialized materials used in advanced manufacturing processes such as wafer-level packaging, 3D IC integration, and microelectronic assembly. They provide secure yet removable adhesion, using mechanisms like thermal release, UV exposure, or chemical dissolution. Known for their high precision and thermal resistance, these adhesives support the stability of delicate substrates under demanding conditions. Their role is essential in enabling device miniaturization, advanced packaging, and efficient high-yield production.

According to World Semiconductor Trade Statistics, Europe held 9% of the global chip manufacturing market in 2023, a sharp appreciable growth of 44% in 1990.

Market Dynamics:

Driver:

Increasing adoption of wafer-level packaging and 3D IC integration

Rising adoption of wafer-level packaging and 3D IC integration has significantly propelled the demand for temporary bonding adhesives. These advanced packaging techniques require efficient adhesive solutions to facilitate seamless integration of multiple components, improving device performance and reducing costs. Moreover, the shift towards miniaturization and lightweight electronic devices has bolstered the use of bonding adhesives in sophisticated manufacturing processes. Furthermore, advancements in adhesive formulations tailored for high-temperature stability and precision are driving the market forward.

Restraint:

Compatibility issues

Compatibility issues remain a major challenge for the temporary bonding adhesive market, particularly in applications involving diverse substrates and thermal processes. The mismatch of material properties between adhesives and substrates can lead to performance degradation, affecting manufacturing efficiency and product reliability. Additionally, stringent requirements for adhesive removal during debonding processes further complicate compatibility concerns. Such limitations hinder broader adoption in certain industries, such as automotive and aerospace, where complex designs necessitate versatile bonding solutions.

Opportunity:

Development of sustainable and environmentally friendly adhesives

Increasing regulatory scrutiny and consumer demand for eco-friendly solutions are encouraging manufacturers to innovate with biodegradable and solvent-free adhesive formulations. Such advancements align with global initiatives toward reducing carbon footprints and promoting green technologies. The integration of bio-based polymers and renewable raw materials into temporary adhesives could revolutionize industry standards, opening new avenues in sectors like electronics and healthcare.

Threat:

Advances in dry handling or mechanical wafer support

Technological advances in dry handling methods or mechanical wafer support systems pose a significant threat to the temporary bonding adhesive market. These alternative approaches reduce reliance on adhesive-based bonding, streamlining production processes and minimizing complications related to adhesive removal. With major players investing in mechanical solutions for wafer handling, the adoption of adhesive-free technologies is gaining traction across industries.

Covid-19 Impact:

The temporary bonding adhesive market experienced mixed consequences due to the COVID-19 pandemic. Supply chain disruptions and reduced manufacturing capacities impacted adhesive production, creating shortages during critical times. However, the surge in demand for electronics and telecommunication devices, fuelled by remote working trends, counterbalanced some of the negative impacts. Innovations in adhesive technologies during the pandemic period supported high-performance applications, ensuring resilience against uncertainties.

The thermal release temporary bonding adhesives segment is expected to be the largest during the forecast period

The thermal release temporary bonding adhesives segment is expected to account for the largest market share during the forecast period. These adhesives offer distinct advantages in terms of precision and efficiency, enabling simplified debonding processes under controlled thermal conditions. Their widespread application across semiconductor manufacturing and wafer-level packaging solutions underscores their significance. Advancements in thermal release adhesives are fostering improved bonding strength and heat stability, meeting industry demands for high-performance adhesives.

The advanced packaging segment is expected to have the highest CAGR during the forecast period

Over the forecast period, the advanced packaging segment is predicted to witness the highest growth rate driven by the rapid adoption of cutting-edge technologies in semiconductor packaging. Temporary bonding adhesives play a pivotal role in supporting processes like 3D IC integration and fan-out wafer-level packaging, enhancing device functionality and reducing production costs. The growing trend toward innovative packaging designs for electronic devices bolsters demand within this market.

Region with largest share:

During the forecast period, the Asia Pacific region is expected to hold the largest market share supported by its dominance in semiconductor manufacturing and electronics production. Countries such as China, Taiwan, and South Korea serve as hubs for advanced technology development, driving adhesive adoption in the region. Favorable government policies and robust industrial ecosystems contribute to sustained growth in this region. Additionally, collaborations among local manufacturers and international players strengthen the adhesive supply chain, further boosting market expansion in Asia Pacific.

Region with highest CAGR:

Over the forecast period, the North America region is anticipated to exhibit the highest CAGR fueled by advancements in adhesive technologies and investments in research and development. The region's focus on sustainable practices and innovative manufacturing solutions enhances its competitive edge. Strong demand for high-precision adhesives in automotive, aerospace, and medical device sectors supports regional growth. Furthermore, the presence of key industry players and dedicated funding for material sciences drive adoption rates of temporary bonding adhesives.

Key players in the market

Some of the key players in Temporary Bonding Adhesive Market include 3M, AI Technology, Inc., Brewer Science, Inc., Daetec, Daxin Materials Corp., Dow Inc., Elmer, HD MicroSystems, Ltd., IncE Advanced Materials, Micro Materials Inc, Nissan Chemical Corporation, Promerus, TAiCHEM Materials Corporation, Tokyo Ohka Kogyo Co., Ltd and YINCAE Advanced Materials, LLC.

Key Developments:

In December 2024, Dow launched DOWSIL(TM) EA-3838 Fast Adhesive, a fast-curing silicone adhesive that achieves bond strength in just five minutes. This innovation aims to reduce energy usage and enhance manufacturing efficiency.

In April 2024, Nissan Chemical began mass production of a temporary bonding adhesive used in 3D semiconductor packaging. This adhesive facilitates the attachment of silicon wafers to glass substrates during polishing and stacking processes, allowing for damage-free removal.

Product Types Covered:

  • Thermal Release Temporary Bonding Adhesives
  • UV-Curable Temporary Bonding Adhesives
  • Mechanical Debonding Adhesives
  • Laser Debonding Adhesives
  • Peelable Temporary Bonding Adhesives
  • Pressure-Sensitive Temporary Bonding Adhesives
  • Dissolvable Temporary Bonding Adhesives
  • Other Product Types

Materials Covered:

  • Spin Coating
  • Spray Coating
  • Roll Coating
  • Stencil Printing
  • Other Materials

Applications Covered:

  • Advanced Packaging
  • MEMS (Micro-Electro-Mechanical Systems)
  • CMOS (Complementary Metal-Oxide-Semiconductor)
  • Optoelectronics
  • Other Applications

End Users Covered:

  • Electronics
  • Semiconductor
  • Automotive
  • Aerospace
  • Medical Devices
  • Other End Users

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2024, 2025, 2026, 2028, and 2032
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Product Analysis
  • 3.7 Application Analysis
  • 3.8 End User Analysis
  • 3.9 Emerging Markets
  • 3.10 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global Temporary Bonding Adhesive Market, By Product Type

  • 5.1 Introduction
  • 5.2 Thermal Release Temporary Bonding Adhesives
  • 5.3 UV-Curable Temporary Bonding Adhesives
  • 5.4 Mechanical Debonding Adhesives
  • 5.5 Laser Debonding Adhesives
  • 5.6 Peelable Temporary Bonding Adhesives
  • 5.7 Pressure-Sensitive Temporary Bonding Adhesives
  • 5.8 Dissolvable Temporary Bonding Adhesives
  • 5.9 Other Product Types

6 Global Temporary Bonding Adhesive Market, By Material

  • 6.1 Introduction
  • 6.2 Spin Coating
  • 6.3 Spray Coating
  • 6.4 Roll Coating
  • 6.5 Stencil Printing
  • 6.6 Other Materials

7 Global Temporary Bonding Adhesive Market, By Application

  • 7.1 Introduction
  • 7.2 Advanced Packaging
  • 7.3 MEMS (Micro-Electro-Mechanical Systems)
  • 7.4 CMOS (Complementary Metal-Oxide-Semiconductor)
  • 7.5 Optoelectronics
  • 7.6 Other Applications

8 Global Temporary Bonding Adhesive Market, By End User

  • 8.1 Introduction
  • 8.2 Electronics
  • 8.3 Semiconductor
  • 8.4 Automotive
  • 8.5 Aerospace
  • 8.6 Medical Devices
  • 8.7 Other End Users

9 Global Temporary Bonding Adhesive Market, By Geography

  • 9.1 Introduction
  • 9.2 North America
    • 9.2.1 US
    • 9.2.2 Canada
    • 9.2.3 Mexico
  • 9.3 Europe
    • 9.3.1 Germany
    • 9.3.2 UK
    • 9.3.3 Italy
    • 9.3.4 France
    • 9.3.5 Spain
    • 9.3.6 Rest of Europe
  • 9.4 Asia Pacific
    • 9.4.1 Japan
    • 9.4.2 China
    • 9.4.3 India
    • 9.4.4 Australia
    • 9.4.5 New Zealand
    • 9.4.6 South Korea
    • 9.4.7 Rest of Asia Pacific
  • 9.5 South America
    • 9.5.1 Argentina
    • 9.5.2 Brazil
    • 9.5.3 Chile
    • 9.5.4 Rest of South America
  • 9.6 Middle East & Africa
    • 9.6.1 Saudi Arabia
    • 9.6.2 UAE
    • 9.6.3 Qatar
    • 9.6.4 South Africa
    • 9.6.5 Rest of Middle East & Africa

10 Key Developments

  • 10.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 10.2 Acquisitions & Mergers
  • 10.3 New Product Launch
  • 10.4 Expansions
  • 10.5 Other Key Strategies

11 Company Profiling

  • 11.1 3M
  • 11.2 AI Technology, Inc.
  • 11.3 Brewer Science, Inc
  • 11.4 Daetec
  • 11.5 Daxin Materials Corp.
  • 11.6 Dow Inc.
  • 11.7 Elmer
  • 11.8 HD MicroSystems, Ltd.
  • 11.9 IncE Advanced Materials
  • 11.10 Micro Materials Inc
  • 11.11 Nissan Chemical Corporation
  • 11.12 Promerus
  • 11.13 TAiCHEM Materials Corporation
  • 11.14 Tokyo Ohka Kogyo Co., Ltd.
  • 11.15 YINCAE Advanced Materials, LLC

List of Tables

  • Table 1 Global Temporary Bonding Adhesive Market Outlook, By Region (2024-2032) ($MN)
  • Table 2 Global Temporary Bonding Adhesive Market Outlook, By Product Type (2024-2032) ($MN)
  • Table 3 Global Temporary Bonding Adhesive Market Outlook, By Thermal Release Temporary Bonding Adhesives (2024-2032) ($MN)
  • Table 4 Global Temporary Bonding Adhesive Market Outlook, By UV-Curable Temporary Bonding Adhesives (2024-2032) ($MN)
  • Table 5 Global Temporary Bonding Adhesive Market Outlook, By Mechanical Debonding Adhesives (2024-2032) ($MN)
  • Table 6 Global Temporary Bonding Adhesive Market Outlook, By Laser Debonding Adhesives (2024-2032) ($MN)
  • Table 7 Global Temporary Bonding Adhesive Market Outlook, By Peelable Temporary Bonding Adhesives (2024-2032) ($MN)
  • Table 8 Global Temporary Bonding Adhesive Market Outlook, By Pressure-Sensitive Temporary Bonding Adhesives (2024-2032) ($MN)
  • Table 9 Global Temporary Bonding Adhesive Market Outlook, By Dissolvable Temporary Bonding Adhesives (2024-2032) ($MN)
  • Table 10 Global Temporary Bonding Adhesive Market Outlook, By Other Product Types (2024-2032) ($MN)
  • Table 11 Global Temporary Bonding Adhesive Market Outlook, By Material (2024-2032) ($MN)
  • Table 12 Global Temporary Bonding Adhesive Market Outlook, By Spin Coating (2024-2032) ($MN)
  • Table 13 Global Temporary Bonding Adhesive Market Outlook, By Spray Coating (2024-2032) ($MN)
  • Table 14 Global Temporary Bonding Adhesive Market Outlook, By Roll Coating (2024-2032) ($MN)
  • Table 15 Global Temporary Bonding Adhesive Market Outlook, By Stencil Printing (2024-2032) ($MN)
  • Table 16 Global Temporary Bonding Adhesive Market Outlook, By Other Materials (2024-2032) ($MN)
  • Table 17 Global Temporary Bonding Adhesive Market Outlook, By Application (2024-2032) ($MN)
  • Table 18 Global Temporary Bonding Adhesive Market Outlook, By Advanced Packaging (2024-2032) ($MN)
  • Table 19 Global Temporary Bonding Adhesive Market Outlook, By MEMS (Micro-Electro-Mechanical Systems) (2024-2032) ($MN)
  • Table 20 Global Temporary Bonding Adhesive Market Outlook, By CMOS (Complementary Metal-Oxide-Semiconductor) (2024-2032) ($MN)
  • Table 21 Global Temporary Bonding Adhesive Market Outlook, By Optoelectronics (2024-2032) ($MN)
  • Table 22 Global Temporary Bonding Adhesive Market Outlook, By Other Applications (2024-2032) ($MN)
  • Table 23 Global Temporary Bonding Adhesive Market Outlook, By End User (2024-2032) ($MN)
  • Table 24 Global Temporary Bonding Adhesive Market Outlook, By Electronics (2024-2032) ($MN)
  • Table 25 Global Temporary Bonding Adhesive Market Outlook, By Semiconductor (2024-2032) ($MN)
  • Table 26 Global Temporary Bonding Adhesive Market Outlook, By Automotive (2024-2032) ($MN)
  • Table 27 Global Temporary Bonding Adhesive Market Outlook, By Aerospace (2024-2032) ($MN)
  • Table 28 Global Temporary Bonding Adhesive Market Outlook, By Medical Devices (2024-2032) ($MN)
  • Table 29 Global Temporary Bonding Adhesive Market Outlook, By Other End Users (2024-2032) ($MN)

Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.