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市场调查报告书
商品编码
1861224

半导体底部填充材料：全球市场份额和排名、总销售额和需求预测（2025-2031 年）

Underfills for Semiconductor - Global Market Share and Ranking, Overall Sales and Demand Forecast 2025-2031
出版日期: | 出版商: QYResearch | 英文 159 Pages | 商品交期: 2-3个工作天内

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全球半导体底部填充剂市场预计在 2024 年达到 7.2 亿美元，预计到 2031 年将达到 14.17 亿美元，2025 年至 2031 年的复合年增长率为 10.0%。

本报告对近期与半导体底部填充相关的关税调整和国际战略反制措施进行了全面评估，包括跨境产业布局、资本配置模式、区域经济相互依存关係和供应链重组。

市场研究估计，到 2024 年，全球半导体底部填充材料的产量将约为 250-300 吨。价格因产品规格而异，整体价格分布为每公斤 2,500-3,000 美元。

半导体底部填充材料在半导体封装製程中至关重要，主要用于增强封装的结构强度和可靠性。这些材料通常用于填充晶片和基板之间的间隙，确保封装即使在外部压力、热循环和其他环境因素的影响下也能保持完好无损。底部填充材料具有优异的流动性，能够快速填充晶片和基板之间的间隙。它们还能承受极端温度变化，并减少热膨胀係数不匹配所引起的应力。随着电子产品日益小型化和复杂化，半导体封装技术面临新的挑战，底部填充材料也因此成为半导体产业不可或缺的组成部分。

目前，半导体应用领域对底部填充材料的需求正在迅速增长，尤其是在智慧型手机、平板电脑、笔记型电脑、汽车电子和高阶消费性电子等领域。这些领域对电子元件的高可靠性、高耐久性和高性能要求，推动了底部填充材料的快速发展。此外，5G通讯、物联网和人工智慧等新兴技术的兴起，也推动了对电子设备更高可靠性和更长使用寿命的需求，从而带动了全球底部填充材料的强劲增长。

半导体底部填充材料市场的成长主要受以下几个关键因素所驱动。首先，随着智慧型手机、平板电脑、汽车电子和工业自动化等领域对更高性能、更低功耗和小型化电子设备的需求不断增长，对底部填充材料的需求也不断扩大。 5G、人工智慧和物联网等新兴技术的发展进一步推动了对更可靠、更耐用材料的需求。其次，封装技术的进步，特别是系统级封装（SiP）和3D封装等先进晶片封装方法的应用，正在拓展底部填充材料的应用范围，从而推动市场成长。此外，消费者对智慧产品的需求不断增长，也促进了该市场的快速扩张。

然而，底部填充材料市场面临许多挑战。首先，材料成本相对较高，且生产成本往往不断上涨，尤其是高性能底部填充材料，它们需要高纯度化学品和先进的製造流程。其次，半导体产业的快速技术进步和新材料的涌现可能对底部填充材料构成风险。此外，全球经济的不确定性和供应链波动，特别是原材料价格上涨，可能会影响底部填充材料的生产和供应，并给市场带来压力。另外，更严格的环境法规和材料回收要求也可能影响底部填充材料的製造流程和使用。

下游市场对高可靠性、长寿命电子产品的需求不断增长，推动了底部填充材料市场的发展。随着5G、自动驾驶、智慧製造等高科技领域的快速发展，汽车电子、通讯设备和智慧终端设备对封装材料的要求也日益提高。在这些领域，底部填充材料能够显着提升晶片封装的可靠性，并减少温度波动和机械衝击造成的故障。此外，智慧家居设备和穿戴式装置等高端家用电器需求的不断增长，以及全球消费者消费习惯的升级，进一步拓展了底部填充材料的应用潜力。

本报告旨在按地区/国家、类型和应用对全球半导体底部填充剂市场进行全面分析，重点关注总销售量、收入、价格、市场份额和主要企业的排名。

本报告以销售量（吨）和收入（百万美元）为单位，对半导体底部填充材料的市场规模、估算和预测进行了呈现，基准年为2024年，并涵盖了2020年至2031年的历史数据和预测数据。定量和定性分析将帮助读者制定半导体底部填充材料的业务和成长策略，评估市场竞争，分析自身在当前市场中的地位，并做出明智的商业决策。

市场区隔

公司

  • Henkel
  • NAMICS Corporation
  • Panasonic Lexcm
  • Resonac（Showa Denko）
  • Hanstars
  • Shin-Etsu Chemical
  • MacDermid Alpha
  • ThreeBond
  • Parker LORD
  • Nagase ChemteX
  • Bondline
  • AIM Solder
  • Zymet
  • Panacol-Elosol GmbH
  • Dover
  • Darbond Technology
  • Yantai Hightite Chemicals
  • Sunstar
  • DeepMaterial
  • SINY
  • GTA Material
  • HBFuller
  • Fuji Chemical
  • United Adhesives
  • Asec Co.,Ltd.

按类型分類的细分市场

  • 晶圆级和麵板级底部填充
  • 基板级底部填充

流动性板块

  • CUF
  • NCF

应用领域

  • 工业电子
  • 家用电子电器
  • 汽车电子
  • 其他的

按地区

  • 北美洲
    • 美国
    • 加拿大
  • 亚太地区
    • 中国
    • 日本
    • 韩国
    • 东南亚
    • 印度
    • 澳洲
    • 亚太其他地区
  • 欧洲
    • 德国
    • 法国
    • 英国
    • 义大利
    • 荷兰
    • 北欧国家
    • 其他欧洲
  • 拉丁美洲
    • 墨西哥
    • 巴西
    • 其他拉丁美洲
  • 中东和非洲
    • 土耳其
    • 沙乌地阿拉伯
    • 阿拉伯聯合大公国
    • 其他中东和非洲地区

The global market for Underfills for Semiconductor was estimated to be worth US$ 720 million in 2024 and is forecast to a readjusted size of US$ 1417 million by 2031 with a CAGR of 10.0% during the forecast period 2025-2031.

This report provides a comprehensive assessment of recent tariff adjustments and international strategic countermeasures on Underfills for Semiconductor cross-border industrial footprints, capital allocation patterns, regional economic interdependencies, and supply chain reconfigurations.

According to market research, the global output of Underfills for Semiconductor in 2024 is estimated to be approximately 250-300 tons. Prices vary significantly depending on product specifications, with an overall price range of $2,500-3,000 per kilogram.

Underfill materials for semiconductors are crucial in the packaging process of semiconductors, primarily used to enhance the structural strength and reliability of the package. These materials are typically applied in the gaps between chips and substrates to ensure the package remains undamaged under external pressures, thermal cycling, and other environmental factors. Underfills possess excellent fluidity, allowing them to quickly fill the gaps between the chip and substrate. They can also withstand extreme temperature variations, reducing stresses caused by thermal expansion mismatches. As electronic products continue to miniaturize and become more intelligent, semiconductor packaging technology faces new challenges, making underfills an indispensable part of the semiconductor industry.

Currently, the demand for underfill materials in semiconductor applications is growing rapidly, particularly in sectors such as smartphones, tablets, laptops, automotive electronics, and high-end consumer electronics. These sectors require electronic components with high reliability, durability, and performance, driving the rapid development of the underfill market. Additionally, with the rise of new technologies like 5G communication, IoT, and AI, which demand even higher reliability and longer lifespan for electronic devices, the underfill market is experiencing robust growth worldwide.

The growth of the semiconductor underfill market is driven by several key factors. First, with the increasing demand for high-performance, low-power, and miniaturized electronic devices in sectors such as smartphones, tablets, automotive electronics, and industrial automation, the need for underfill materials is also expanding. The development of emerging technologies like 5G, AI, and IoT is further pushing the demand for more reliable and durable materials. Second, as packaging technologies advance, particularly with the adoption of more sophisticated chip packaging methods such as system-in-package (SiP) and 3D packaging, the application scope of underfill materials is also expanding, thereby driving market growth. Additionally, the increasing consumer demand for smart products is also contributing to the rapid expansion of this market.

However, the underfill market faces certain challenges. First, the material cost is relatively high, particularly for high-performance underfills that require the use of high-purity chemicals and sophisticated manufacturing processes, which increases production costs. Secondly, the rapid pace of technological advancements in the semiconductor industry and the emergence of new materials may pose a risk of substitution for underfills. Additionally, global economic uncertainties and fluctuations in supply chains, especially the rise in raw material prices, could affect the production and supply of underfill materials, placing pressure on the market. Moreover, stricter environmental regulations and material recycling requirements may influence the production processes and usage of underfill materials.

The increasing demand for high-reliability and long-lifespan electronic products in downstream markets is driving the growth of the underfill market. As high-tech fields like 5G, autonomous driving, and smart manufacturing develop, automotive electronics, communication devices, and smart terminal devices are placing higher demands on packaging materials. In these sectors, underfills can significantly enhance the reliability of chip packaging, reducing failures caused by temperature fluctuations and mechanical shocks. Additionally, with global consumer upgrading, the rising demand for high-end consumer electronics such as smart home devices and wearables further expands the application prospects of underfill materials.

This report aims to provide a comprehensive presentation of the global market for Underfills for Semiconductor, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Underfills for Semiconductor by region & country, by Type, and by Application.

The Underfills for Semiconductor market size, estimations, and forecasts are provided in terms of sales volume (Tons) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Underfills for Semiconductor.

Market Segmentation

By Company

  • Henkel
  • NAMICS Corporation
  • Panasonic Lexcm
  • Resonac (Showa Denko)
  • Hanstars
  • Shin-Etsu Chemical
  • MacDermid Alpha
  • ThreeBond
  • Parker LORD
  • Nagase ChemteX
  • Bondline
  • AIM Solder
  • Zymet
  • Panacol-Elosol GmbH
  • Dover
  • Darbond Technology
  • Yantai Hightite Chemicals
  • Sunstar
  • DeepMaterial
  • SINY
  • GTA Material
  • H.B.Fuller
  • Fuji Chemical
  • United Adhesives
  • Asec Co.,Ltd.

Segment by Type

  • Wafer and Panel-Level Underfill
  • Board-Level Underfill

Segment by Flow-ablility

  • CUF
  • NCF

Segment by Application

  • Industrial Electronics
  • Consumer Electronics
  • Automotive Electronics
  • Others

By Region

  • North America
    • United States
    • Canada
  • Asia-Pacific
    • China
    • Japan
    • South Korea
    • Southeast Asia
    • India
    • Australia
    • Rest of Asia-Pacific
  • Europe
    • Germany
    • France
    • U.K.
    • Italy
    • Netherlands
    • Nordic Countries
    • Rest of Europe
  • Latin America
    • Mexico
    • Brazil
    • Rest of Latin America
  • Middle East & Africa
    • Turkey
    • Saudi Arabia
    • UAE
    • Rest of MEA

Chapter Outline

Chapter 1: Introduces the report scope of the report, global total market size (value, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.

Chapter 2: Detailed analysis of Underfills for Semiconductor manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.

Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.

Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.

Chapter 5: Sales, revenue of Underfills for Semiconductor in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.

Chapter 6: Sales, revenue of Underfills for Semiconductor in country level. It provides sigmate data by Type, and by Application for each country/region.

Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.

Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.

Chapter 9: Conclusion.

Table of Contents

1 Market Overview

  • 1.1 Underfills for Semiconductor Product Introduction
  • 1.2 Global Underfills for Semiconductor Market Size Forecast
    • 1.2.1 Global Underfills for Semiconductor Sales Value (2020-2031)
    • 1.2.2 Global Underfills for Semiconductor Sales Volume (2020-2031)
    • 1.2.3 Global Underfills for Semiconductor Sales Price (2020-2031)
  • 1.3 Underfills for Semiconductor Market Trends & Drivers
    • 1.3.1 Underfills for Semiconductor Industry Trends
    • 1.3.2 Underfills for Semiconductor Market Drivers & Opportunity
    • 1.3.3 Underfills for Semiconductor Market Challenges
    • 1.3.4 Underfills for Semiconductor Market Restraints
  • 1.4 Assumptions and Limitations
  • 1.5 Study Objectives
  • 1.6 Years Considered

2 Competitive Analysis by Company

  • 2.1 Global Underfills for Semiconductor Players Revenue Ranking (2024)
  • 2.2 Global Underfills for Semiconductor Revenue by Company (2020-2025)
  • 2.3 Global Underfills for Semiconductor Players Sales Volume Ranking (2024)
  • 2.4 Global Underfills for Semiconductor Sales Volume by Company Players (2020-2025)
  • 2.5 Global Underfills for Semiconductor Average Price by Company (2020-2025)
  • 2.6 Key Manufacturers Underfills for Semiconductor Manufacturing Base and Headquarters
  • 2.7 Key Manufacturers Underfills for Semiconductor Product Offered
  • 2.8 Key Manufacturers Time to Begin Mass Production of Underfills for Semiconductor
  • 2.9 Underfills for Semiconductor Market Competitive Analysis
    • 2.9.1 Underfills for Semiconductor Market Concentration Rate (2020-2025)
    • 2.9.2 Global 5 and 10 Largest Manufacturers by Underfills for Semiconductor Revenue in 2024
    • 2.9.3 Global Top Manufacturers by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Underfills for Semiconductor as of 2024)
  • 2.10 Mergers & Acquisitions, Expansion

3 Segmentation by Type

  • 3.1 Introduction by Type
    • 3.1.1 Wafer and Panel-Level Underfill
    • 3.1.2 Board-Level Underfill
  • 3.2 Global Underfills for Semiconductor Sales Value by Type
    • 3.2.1 Global Underfills for Semiconductor Sales Value by Type (2020 VS 2024 VS 2031)
    • 3.2.2 Global Underfills for Semiconductor Sales Value, by Type (2020-2031)
    • 3.2.3 Global Underfills for Semiconductor Sales Value, by Type (%) (2020-2031)
  • 3.3 Global Underfills for Semiconductor Sales Volume by Type
    • 3.3.1 Global Underfills for Semiconductor Sales Volume by Type (2020 VS 2024 VS 2031)
    • 3.3.2 Global Underfills for Semiconductor Sales Volume, by Type (2020-2031)
    • 3.3.3 Global Underfills for Semiconductor Sales Volume, by Type (%) (2020-2031)
  • 3.4 Global Underfills for Semiconductor Average Price by Type (2020-2031)

4 Segmentation by Flow-ablility

  • 4.1 Introduction by Flow-ablility
    • 4.1.1 CUF
    • 4.1.2 NCF
  • 4.2 Global Underfills for Semiconductor Sales Value by Flow-ablility
    • 4.2.1 Global Underfills for Semiconductor Sales Value by Flow-ablility (2020 VS 2024 VS 2031)
    • 4.2.2 Global Underfills for Semiconductor Sales Value, by Flow-ablility (2020-2031)
    • 4.2.3 Global Underfills for Semiconductor Sales Value, by Flow-ablility (%) (2020-2031)
  • 4.3 Global Underfills for Semiconductor Sales Volume by Flow-ablility
    • 4.3.1 Global Underfills for Semiconductor Sales Volume by Flow-ablility (2020 VS 2024 VS 2031)
    • 4.3.2 Global Underfills for Semiconductor Sales Volume, by Flow-ablility (2020-2031)
    • 4.3.3 Global Underfills for Semiconductor Sales Volume, by Flow-ablility (%) (2020-2031)
  • 4.4 Global Underfills for Semiconductor Average Price by Flow-ablility (2020-2031)

5 Segmentation by Application

  • 5.1 Introduction by Application
    • 5.1.1 Industrial Electronics
    • 5.1.2 Consumer Electronics
    • 5.1.3 Automotive Electronics
    • 5.1.4 Others
  • 5.2 Global Underfills for Semiconductor Sales Value by Application
    • 5.2.1 Global Underfills for Semiconductor Sales Value by Application (2020 VS 2024 VS 2031)
    • 5.2.2 Global Underfills for Semiconductor Sales Value, by Application (2020-2031)
    • 5.2.3 Global Underfills for Semiconductor Sales Value, by Application (%) (2020-2031)
  • 5.3 Global Underfills for Semiconductor Sales Volume by Application
    • 5.3.1 Global Underfills for Semiconductor Sales Volume by Application (2020 VS 2024 VS 2031)
    • 5.3.2 Global Underfills for Semiconductor Sales Volume, by Application (2020-2031)
    • 5.3.3 Global Underfills for Semiconductor Sales Volume, by Application (%) (2020-2031)
  • 5.4 Global Underfills for Semiconductor Average Price by Application (2020-2031)

6 Segmentation by Region

  • 6.1 Global Underfills for Semiconductor Sales Value by Region
    • 6.1.1 Global Underfills for Semiconductor Sales Value by Region: 2020 VS 2024 VS 2031
    • 6.1.2 Global Underfills for Semiconductor Sales Value by Region (2020-2025)
    • 6.1.3 Global Underfills for Semiconductor Sales Value by Region (2026-2031)
    • 6.1.4 Global Underfills for Semiconductor Sales Value by Region (%), (2020-2031)
  • 6.2 Global Underfills for Semiconductor Sales Volume by Region
    • 6.2.1 Global Underfills for Semiconductor Sales Volume by Region: 2020 VS 2024 VS 2031
    • 6.2.2 Global Underfills for Semiconductor Sales Volume by Region (2020-2025)
    • 6.2.3 Global Underfills for Semiconductor Sales Volume by Region (2026-2031)
    • 6.2.4 Global Underfills for Semiconductor Sales Volume by Region (%), (2020-2031)
  • 6.3 Global Underfills for Semiconductor Average Price by Region (2020-2031)
  • 6.4 North America
    • 6.4.1 North America Underfills for Semiconductor Sales Value, 2020-2031
    • 6.4.2 North America Underfills for Semiconductor Sales Value by Country (%), 2024 VS 2031
  • 6.5 Europe
    • 6.5.1 Europe Underfills for Semiconductor Sales Value, 2020-2031
    • 6.5.2 Europe Underfills for Semiconductor Sales Value by Country (%), 2024 VS 2031
  • 6.6 Asia Pacific
    • 6.6.1 Asia Pacific Underfills for Semiconductor Sales Value, 2020-2031
    • 6.6.2 Asia Pacific Underfills for Semiconductor Sales Value by Region (%), 2024 VS 2031
  • 6.7 South America
    • 6.7.1 South America Underfills for Semiconductor Sales Value, 2020-2031
    • 6.7.2 South America Underfills for Semiconductor Sales Value by Country (%), 2024 VS 2031
  • 6.8 Middle East & Africa
    • 6.8.1 Middle East & Africa Underfills for Semiconductor Sales Value, 2020-2031
    • 6.8.2 Middle East & Africa Underfills for Semiconductor Sales Value by Country (%), 2024 VS 2031

7 Segmentation by Key Countries/Regions

  • 7.1 Key Countries/Regions Underfills for Semiconductor Sales Value Growth Trends, 2020 VS 2024 VS 2031
  • 7.2 Key Countries/Regions Underfills for Semiconductor Sales Value and Sales Volume
    • 7.2.1 Key Countries/Regions Underfills for Semiconductor Sales Value, 2020-2031
    • 7.2.2 Key Countries/Regions Underfills for Semiconductor Sales Volume, 2020-2031
  • 7.3 United States
    • 7.3.1 United States Underfills for Semiconductor Sales Value, 2020-2031
    • 7.3.2 United States Underfills for Semiconductor Sales Value by Type (%), 2024 VS 2031
    • 7.3.3 United States Underfills for Semiconductor Sales Value by Application, 2024 VS 2031
  • 7.4 Europe
    • 7.4.1 Europe Underfills for Semiconductor Sales Value, 2020-2031
    • 7.4.2 Europe Underfills for Semiconductor Sales Value by Type (%), 2024 VS 2031
    • 7.4.3 Europe Underfills for Semiconductor Sales Value by Application, 2024 VS 2031
  • 7.5 China
    • 7.5.1 China Underfills for Semiconductor Sales Value, 2020-2031
    • 7.5.2 China Underfills for Semiconductor Sales Value by Type (%), 2024 VS 2031
    • 7.5.3 China Underfills for Semiconductor Sales Value by Application, 2024 VS 2031
  • 7.6 Japan
    • 7.6.1 Japan Underfills for Semiconductor Sales Value, 2020-2031
    • 7.6.2 Japan Underfills for Semiconductor Sales Value by Type (%), 2024 VS 2031
    • 7.6.3 Japan Underfills for Semiconductor Sales Value by Application, 2024 VS 2031
  • 7.7 South Korea
    • 7.7.1 South Korea Underfills for Semiconductor Sales Value, 2020-2031
    • 7.7.2 South Korea Underfills for Semiconductor Sales Value by Type (%), 2024 VS 2031
    • 7.7.3 South Korea Underfills for Semiconductor Sales Value by Application, 2024 VS 2031
  • 7.8 Southeast Asia
    • 7.8.1 Southeast Asia Underfills for Semiconductor Sales Value, 2020-2031
    • 7.8.2 Southeast Asia Underfills for Semiconductor Sales Value by Type (%), 2024 VS 2031
    • 7.8.3 Southeast Asia Underfills for Semiconductor Sales Value by Application, 2024 VS 2031
  • 7.9 India
    • 7.9.1 India Underfills for Semiconductor Sales Value, 2020-2031
    • 7.9.2 India Underfills for Semiconductor Sales Value by Type (%), 2024 VS 2031
    • 7.9.3 India Underfills for Semiconductor Sales Value by Application, 2024 VS 2031

8 Company Profiles

  • 8.1 Henkel
    • 8.1.1 Henkel Company Information
    • 8.1.2 Henkel Introduction and Business Overview
    • 8.1.3 Henkel Underfills for Semiconductor Sales, Revenue, Price and Gross Margin (2020-2025)
    • 8.1.4 Henkel Underfills for Semiconductor Product Offerings
    • 8.1.5 Henkel Recent Development
  • 8.2 NAMICS Corporation
    • 8.2.1 NAMICS Corporation Company Information
    • 8.2.2 NAMICS Corporation Introduction and Business Overview
    • 8.2.3 NAMICS Corporation Underfills for Semiconductor Sales, Revenue, Price and Gross Margin (2020-2025)
    • 8.2.4 NAMICS Corporation Underfills for Semiconductor Product Offerings
    • 8.2.5 NAMICS Corporation Recent Development
  • 8.3 Panasonic Lexcm
    • 8.3.1 Panasonic Lexcm Company Information
    • 8.3.2 Panasonic Lexcm Introduction and Business Overview
    • 8.3.3 Panasonic Lexcm Underfills for Semiconductor Sales, Revenue, Price and Gross Margin (2020-2025)
    • 8.3.4 Panasonic Lexcm Underfills for Semiconductor Product Offerings
    • 8.3.5 Panasonic Lexcm Recent Development
  • 8.4 Resonac (Showa Denko)
    • 8.4.1 Resonac (Showa Denko) Company Information
    • 8.4.2 Resonac (Showa Denko) Introduction and Business Overview
    • 8.4.3 Resonac (Showa Denko) Underfills for Semiconductor Sales, Revenue, Price and Gross Margin (2020-2025)
    • 8.4.4 Resonac (Showa Denko) Underfills for Semiconductor Product Offerings
    • 8.4.5 Resonac (Showa Denko) Recent Development
  • 8.5 Hanstars
    • 8.5.1 Hanstars Company Information
    • 8.5.2 Hanstars Introduction and Business Overview
    • 8.5.3 Hanstars Underfills for Semiconductor Sales, Revenue, Price and Gross Margin (2020-2025)
    • 8.5.4 Hanstars Underfills for Semiconductor Product Offerings
    • 8.5.5 Hanstars Recent Development
  • 8.6 Shin-Etsu Chemical
    • 8.6.1 Shin-Etsu Chemical Company Information
    • 8.6.2 Shin-Etsu Chemical Introduction and Business Overview
    • 8.6.3 Shin-Etsu Chemical Underfills for Semiconductor Sales, Revenue, Price and Gross Margin (2020-2025)
    • 8.6.4 Shin-Etsu Chemical Underfills for Semiconductor Product Offerings
    • 8.6.5 Shin-Etsu Chemical Recent Development
  • 8.7 MacDermid Alpha
    • 8.7.1 MacDermid Alpha Company Information
    • 8.7.2 MacDermid Alpha Introduction and Business Overview
    • 8.7.3 MacDermid Alpha Underfills for Semiconductor Sales, Revenue, Price and Gross Margin (2020-2025)
    • 8.7.4 MacDermid Alpha Underfills for Semiconductor Product Offerings
    • 8.7.5 MacDermid Alpha Recent Development
  • 8.8 ThreeBond
    • 8.8.1 ThreeBond Company Information
    • 8.8.2 ThreeBond Introduction and Business Overview
    • 8.8.3 ThreeBond Underfills for Semiconductor Sales, Revenue, Price and Gross Margin (2020-2025)
    • 8.8.4 ThreeBond Underfills for Semiconductor Product Offerings
    • 8.8.5 ThreeBond Recent Development
  • 8.9 Parker LORD
    • 8.9.1 Parker LORD Company Information
    • 8.9.2 Parker LORD Introduction and Business Overview
    • 8.9.3 Parker LORD Underfills for Semiconductor Sales, Revenue, Price and Gross Margin (2020-2025)
    • 8.9.4 Parker LORD Underfills for Semiconductor Product Offerings
    • 8.9.5 Parker LORD Recent Development
  • 8.10 Nagase ChemteX
    • 8.10.1 Nagase ChemteX Company Information
    • 8.10.2 Nagase ChemteX Introduction and Business Overview
    • 8.10.3 Nagase ChemteX Underfills for Semiconductor Sales, Revenue, Price and Gross Margin (2020-2025)
    • 8.10.4 Nagase ChemteX Underfills for Semiconductor Product Offerings
    • 8.10.5 Nagase ChemteX Recent Development
  • 8.11 Bondline
    • 8.11.1 Bondline Company Information
    • 8.11.2 Bondline Introduction and Business Overview
    • 8.11.3 Bondline Underfills for Semiconductor Sales, Revenue, Price and Gross Margin (2020-2025)
    • 8.11.4 Bondline Underfills for Semiconductor Product Offerings
    • 8.11.5 Bondline Recent Development
  • 8.12 AIM Solder
    • 8.12.1 AIM Solder Company Information
    • 8.12.2 AIM Solder Introduction and Business Overview
    • 8.12.3 AIM Solder Underfills for Semiconductor Sales, Revenue, Price and Gross Margin (2020-2025)
    • 8.12.4 AIM Solder Underfills for Semiconductor Product Offerings
    • 8.12.5 AIM Solder Recent Development
  • 8.13 Zymet
    • 8.13.1 Zymet Company Information
    • 8.13.2 Zymet Introduction and Business Overview
    • 8.13.3 Zymet Underfills for Semiconductor Sales, Revenue, Price and Gross Margin (2020-2025)
    • 8.13.4 Zymet Underfills for Semiconductor Product Offerings
    • 8.13.5 Zymet Recent Development
  • 8.14 Panacol-Elosol GmbH
    • 8.14.1 Panacol-Elosol GmbH Company Information
    • 8.14.2 Panacol-Elosol GmbH Introduction and Business Overview
    • 8.14.3 Panacol-Elosol GmbH Underfills for Semiconductor Sales, Revenue, Price and Gross Margin (2020-2025)
    • 8.14.4 Panacol-Elosol GmbH Underfills for Semiconductor Product Offerings
    • 8.14.5 Panacol-Elosol GmbH Recent Development
  • 8.15 Dover
    • 8.15.1 Dover Company Information
    • 8.15.2 Dover Introduction and Business Overview
    • 8.15.3 Dover Underfills for Semiconductor Sales, Revenue, Price and Gross Margin (2020-2025)
    • 8.15.4 Dover Underfills for Semiconductor Product Offerings
    • 8.15.5 Dover Recent Development
  • 8.16 Darbond Technology
    • 8.16.1 Darbond Technology Company Information
    • 8.16.2 Darbond Technology Introduction and Business Overview
    • 8.16.3 Darbond Technology Underfills for Semiconductor Sales, Revenue, Price and Gross Margin (2020-2025)
    • 8.16.4 Darbond Technology Underfills for Semiconductor Product Offerings
    • 8.16.5 Darbond Technology Recent Development
  • 8.17 Yantai Hightite Chemicals
    • 8.17.1 Yantai Hightite Chemicals Company Information
    • 8.17.2 Yantai Hightite Chemicals Introduction and Business Overview
    • 8.17.3 Yantai Hightite Chemicals Underfills for Semiconductor Sales, Revenue, Price and Gross Margin (2020-2025)
    • 8.17.4 Yantai Hightite Chemicals Underfills for Semiconductor Product Offerings
    • 8.17.5 Yantai Hightite Chemicals Recent Development
  • 8.18 Sunstar
    • 8.18.1 Sunstar Company Information
    • 8.18.2 Sunstar Introduction and Business Overview
    • 8.18.3 Sunstar Underfills for Semiconductor Sales, Revenue, Price and Gross Margin (2020-2025)
    • 8.18.4 Sunstar Underfills for Semiconductor Product Offerings
    • 8.18.5 Sunstar Recent Development
  • 8.19 DeepMaterial
    • 8.19.1 DeepMaterial Company Information
    • 8.19.2 DeepMaterial Introduction and Business Overview
    • 8.19.3 DeepMaterial Underfills for Semiconductor Sales, Revenue, Price and Gross Margin (2020-2025)
    • 8.19.4 DeepMaterial Underfills for Semiconductor Product Offerings
    • 8.19.5 DeepMaterial Recent Development
  • 8.20 SINY
    • 8.20.1 SINY Company Information
    • 8.20.2 SINY Introduction and Business Overview
    • 8.20.3 SINY Underfills for Semiconductor Sales, Revenue, Price and Gross Margin (2020-2025)
    • 8.20.4 SINY Underfills for Semiconductor Product Offerings
    • 8.20.5 SINY Recent Development
  • 8.21 GTA Material
    • 8.21.1 GTA Material Company Information
    • 8.21.2 GTA Material Introduction and Business Overview
    • 8.21.3 GTA Material Underfills for Semiconductor Sales, Revenue, Price and Gross Margin (2020-2025)
    • 8.21.4 GTA Material Underfills for Semiconductor Product Offerings
    • 8.21.5 GTA Material Recent Development
  • 8.22 H.B.Fuller
    • 8.22.1 H.B.Fuller Company Information
    • 8.22.2 H.B.Fuller Introduction and Business Overview
    • 8.22.3 H.B.Fuller Underfills for Semiconductor Sales, Revenue, Price and Gross Margin (2020-2025)
    • 8.22.4 H.B.Fuller Underfills for Semiconductor Product Offerings
    • 8.22.5 H.B.Fuller Recent Development
  • 8.23 Fuji Chemical
    • 8.23.1 Fuji Chemical Company Information
    • 8.23.2 Fuji Chemical Introduction and Business Overview
    • 8.23.3 Fuji Chemical Underfills for Semiconductor Sales, Revenue, Price and Gross Margin (2020-2025)
    • 8.23.4 Fuji Chemical Underfills for Semiconductor Product Offerings
    • 8.23.5 Fuji Chemical Recent Development
  • 8.24 United Adhesives
    • 8.24.1 United Adhesives Company Information
    • 8.24.2 United Adhesives Introduction and Business Overview
    • 8.24.3 United Adhesives Underfills for Semiconductor Sales, Revenue, Price and Gross Margin (2020-2025)
    • 8.24.4 United Adhesives Underfills for Semiconductor Product Offerings
    • 8.24.5 United Adhesives Recent Development
  • 8.25 Asec Co.,Ltd.
    • 8.25.1 Asec Co.,Ltd. Company Information
    • 8.25.2 Asec Co.,Ltd. Introduction and Business Overview
    • 8.25.3 Asec Co.,Ltd. Underfills for Semiconductor Sales, Revenue, Price and Gross Margin (2020-2025)
    • 8.25.4 Asec Co.,Ltd. Underfills for Semiconductor Product Offerings
    • 8.25.5 Asec Co.,Ltd. Recent Development

9 Industry Chain Analysis

  • 9.1 Underfills for Semiconductor Industrial Chain
  • 9.2 Underfills for Semiconductor Upstream Analysis
    • 9.2.1 Key Raw Materials
    • 9.2.2 Raw Materials Key Suppliers
    • 9.2.3 Manufacturing Cost Structure
  • 9.3 Midstream Analysis
  • 9.4 Downstream Analysis (Customers Analysis)
  • 9.5 Sales Model and Sales Channels
    • 9.5.1 Underfills for Semiconductor Sales Model
    • 9.5.2 Sales Channel
    • 9.5.3 Underfills for Semiconductor Distributors

10 Research Findings and Conclusion

11 Appendix

  • 11.1 Research Methodology
    • 11.1.1 Methodology/Research Approach
      • 11.1.1.1 Research Programs/Design
      • 11.1.1.2 Market Size Estimation
      • 11.1.1.3 Market Breakdown and Data Triangulation
    • 11.1.2 Data Source
      • 11.1.2.1 Secondary Sources
      • 11.1.2.2 Primary Sources
  • 11.2 Author Details
  • 11.3 Disclaimer

List of Tables

  • Table 1. Underfills for Semiconductor Market Trends
  • Table 2. Underfills for Semiconductor Market Drivers & Opportunity
  • Table 3. Underfills for Semiconductor Market Challenges
  • Table 4. Underfills for Semiconductor Market Restraints
  • Table 5. Global Underfills for Semiconductor Revenue by Company (2020-2025) & (US$ Million)
  • Table 6. Global Underfills for Semiconductor Revenue Market Share by Company (2020-2025)
  • Table 7. Global Underfills for Semiconductor Sales Volume by Company (2020-2025) & (Tons)
  • Table 8. Global Underfills for Semiconductor Sales Volume Market Share by Company (2020-2025)
  • Table 9. Global Market Underfills for Semiconductor Price by Company (2020-2025) & (US$/kg)
  • Table 10. Key Manufacturers Underfills for Semiconductor Manufacturing Base and Headquarters
  • Table 11. Key Manufacturers Underfills for Semiconductor Product Type
  • Table 12. Key Manufacturers Time to Begin Mass Production of Underfills for Semiconductor
  • Table 13. Global Underfills for Semiconductor Manufacturers Market Concentration Ratio (CR5 and HHI)
  • Table 14. Global Top Manufacturers Market Share by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Underfills for Semiconductor as of 2024)
  • Table 15. Mergers & Acquisitions, Expansion Plans
  • Table 16. Global Underfills for Semiconductor Sales Value by Type: 2020 VS 2024 VS 2031 (US$ Million)
  • Table 17. Global Underfills for Semiconductor Sales Value by Type (2020-2025) & (US$ Million)
  • Table 18. Global Underfills for Semiconductor Sales Value by Type (2026-2031) & (US$ Million)
  • Table 19. Global Underfills for Semiconductor Sales Market Share in Value by Type (2020-2025)
  • Table 20. Global Underfills for Semiconductor Sales Market Share in Value by Type (2026-2031)
  • Table 21. Global Underfills for Semiconductor Sales Volume by Type: 2020 VS 2024 VS 2031 (Tons)
  • Table 22. Global Underfills for Semiconductor Sales Volume by Type (2020-2025) & (Tons)
  • Table 23. Global Underfills for Semiconductor Sales Volume by Type (2026-2031) & (Tons)
  • Table 24. Global Underfills for Semiconductor Sales Market Share in Volume by Type (2020-2025)
  • Table 25. Global Underfills for Semiconductor Sales Market Share in Volume by Type (2026-2031)
  • Table 26. Global Underfills for Semiconductor Price by Type (2020-2025) & (US$/kg)
  • Table 27. Global Underfills for Semiconductor Price by Type (2026-2031) & (US$/kg)
  • Table 28. Global Underfills for Semiconductor Sales Value by Flow-ablility: 2020 VS 2024 VS 2031 (US$ Million)
  • Table 29. Global Underfills for Semiconductor Sales Value by Flow-ablility (2020-2025) & (US$ Million)
  • Table 30. Global Underfills for Semiconductor Sales Value by Flow-ablility (2026-2031) & (US$ Million)
  • Table 31. Global Underfills for Semiconductor Sales Market Share in Value by Flow-ablility (2020-2025)
  • Table 32. Global Underfills for Semiconductor Sales Market Share in Value by Flow-ablility (2026-2031)
  • Table 33. Global Underfills for Semiconductor Sales Volume by Flow-ablility: 2020 VS 2024 VS 2031 (Tons)
  • Table 34. Global Underfills for Semiconductor Sales Volume by Flow-ablility (2020-2025) & (Tons)
  • Table 35. Global Underfills for Semiconductor Sales Volume by Flow-ablility (2026-2031) & (Tons)
  • Table 36. Global Underfills for Semiconductor Sales Market Share in Volume by Flow-ablility (2020-2025)
  • Table 37. Global Underfills for Semiconductor Sales Market Share in Volume by Flow-ablility (2026-2031)
  • Table 38. Global Underfills for Semiconductor Price by Flow-ablility (2020-2025) & (US$/kg)
  • Table 39. Global Underfills for Semiconductor Price by Flow-ablility (2026-2031) & (US$/kg)
  • Table 40. Global Underfills for Semiconductor Sales Value by Application: 2020 VS 2024 VS 2031 (US$ Million)
  • Table 41. Global Underfills for Semiconductor Sales Value by Application (2020-2025) & (US$ Million)
  • Table 42. Global Underfills for Semiconductor Sales Value by Application (2026-2031) & (US$ Million)
  • Table 43. Global Underfills for Semiconductor Sales Market Share in Value by Application (2020-2025)
  • Table 44. Global Underfills for Semiconductor Sales Market Share in Value by Application (2026-2031)
  • Table 45. Global Underfills for Semiconductor Sales Volume by Application: 2020 VS 2024 VS 2031 (Tons)
  • Table 46. Global Underfills for Semiconductor Sales Volume by Application (2020-2025) & (Tons)
  • Table 47. Global Underfills for Semiconductor Sales Volume by Application (2026-2031) & (Tons)
  • Table 48. Global Underfills for Semiconductor Sales Market Share in Volume by Application (2020-2025)
  • Table 49. Global Underfills for Semiconductor Sales Market Share in Volume by Application (2026-2031)
  • Table 50. Global Underfills for Semiconductor Price by Application (2020-2025) & (US$/kg)
  • Table 51. Global Underfills for Semiconductor Price by Application (2026-2031) & (US$/kg)
  • Table 52. Global Underfills for Semiconductor Sales Value by Region, (2020 VS 2024 VS 2031) & (US$ Million)
  • Table 53. Global Underfills for Semiconductor Sales Value by Region (2020-2025) & (US$ Million)
  • Table 54. Global Underfills for Semiconductor Sales Value by Region (2026-2031) & (US$ Million)
  • Table 55. Global Underfills for Semiconductor Sales Value by Region (2020-2025) & (%)
  • Table 56. Global Underfills for Semiconductor Sales Value by Region (2026-2031) & (%)
  • Table 57. Global Underfills for Semiconductor Sales Volume by Region (Tons): 2020 VS 2024 VS 2031
  • Table 58. Global Underfills for Semiconductor Sales Volume by Region (2020-2025) & (Tons)
  • Table 59. Global Underfills for Semiconductor Sales Volume by Region (2026-2031) & (Tons)
  • Table 60. Global Underfills for Semiconductor Sales Volume by Region (2020-2025) & (%)
  • Table 61. Global Underfills for Semiconductor Sales Volume by Region (2026-2031) & (%)
  • Table 62. Global Underfills for Semiconductor Average Price by Region (2020-2025) & (US$/kg)
  • Table 63. Global Underfills for Semiconductor Average Price by Region (2026-2031) & (US$/kg)
  • Table 64. Key Countries/Regions Underfills for Semiconductor Sales Value Growth Trends, (US$ Million): 2020 VS 2024 VS 2031
  • Table 65. Key Countries/Regions Underfills for Semiconductor Sales Value, (2020-2025) & (US$ Million)
  • Table 66. Key Countries/Regions Underfills for Semiconductor Sales Value, (2026-2031) & (US$ Million)
  • Table 67. Key Countries/Regions Underfills for Semiconductor Sales Volume, (2020-2025) & (Tons)
  • Table 68. Key Countries/Regions Underfills for Semiconductor Sales Volume, (2026-2031) & (Tons)
  • Table 69. Henkel Company Information
  • Table 70. Henkel Introduction and Business Overview
  • Table 71. Henkel Underfills for Semiconductor Sales (Tons), Revenue (US$ Million), Price (US$/kg) and Gross Margin (2020-2025)
  • Table 72. Henkel Underfills for Semiconductor Product Offerings
  • Table 73. Henkel Recent Development
  • Table 74. NAMICS Corporation Company Information
  • Table 75. NAMICS Corporation Introduction and Business Overview
  • Table 76. NAMICS Corporation Underfills for Semiconductor Sales (Tons), Revenue (US$ Million), Price (US$/kg) and Gross Margin (2020-2025)
  • Table 77. NAMICS Corporation Underfills for Semiconductor Product Offerings
  • Table 78. NAMICS Corporation Recent Development
  • Table 79. Panasonic Lexcm Company Information
  • Table 80. Panasonic Lexcm Introduction and Business Overview
  • Table 81. Panasonic Lexcm Underfills for Semiconductor Sales (Tons), Revenue (US$ Million), Price (US$/kg) and Gross Margin (2020-2025)
  • Table 82. Panasonic Lexcm Underfills for Semiconductor Product Offerings
  • Table 83. Panasonic Lexcm Recent Development
  • Table 84. Resonac (Showa Denko) Company Information
  • Table 85. Resonac (Showa Denko) Introduction and Business Overview
  • Table 86. Resonac (Showa Denko) Underfills for Semiconductor Sales (Tons), Revenue (US$ Million), Price (US$/kg) and Gross Margin (2020-2025)
  • Table 87. Resonac (Showa Denko) Underfills for Semiconductor Product Offerings
  • Table 88. Resonac (Showa Denko) Recent Development
  • Table 89. Hanstars Company Information
  • Table 90. Hanstars Introduction and Business Overview
  • Table 91. Hanstars Underfills for Semiconductor Sales (Tons), Revenue (US$ Million), Price (US$/kg) and Gross Margin (2020-2025)
  • Table 92. Hanstars Underfills for Semiconductor Product Offerings
  • Table 93. Hanstars Recent Development
  • Table 94. Shin-Etsu Chemical Company Information
  • Table 95. Shin-Etsu Chemical Introduction and Business Overview
  • Table 96. Shin-Etsu Chemical Underfills for Semiconductor Sales (Tons), Revenue (US$ Million), Price (US$/kg) and Gross Margin (2020-2025)
  • Table 97. Shin-Etsu Chemical Underfills for Semiconductor Product Offerings
  • Table 98. Shin-Etsu Chemical Recent Development
  • Table 99. MacDermid Alpha Company Information
  • Table 100. MacDermid Alpha Introduction and Business Overview
  • Table 101. MacDermid Alpha Underfills for Semiconductor Sales (Tons), Revenue (US$ Million), Price (US$/kg) and Gross Margin (2020-2025)
  • Table 102. MacDermid Alpha Underfills for Semiconductor Product Offerings
  • Table 103. MacDermid Alpha Recent Development
  • Table 104. ThreeBond Company Information
  • Table 105. ThreeBond Introduction and Business Overview
  • Table 106. ThreeBond Underfills for Semiconductor Sales (Tons), Revenue (US$ Million), Price (US$/kg) and Gross Margin (2020-2025)
  • Table 107. ThreeBond Underfills for Semiconductor Product Offerings
  • Table 108. ThreeBond Recent Development
  • Table 109. Parker LORD Company Information
  • Table 110. Parker LORD Introduction and Business Overview
  • Table 111. Parker LORD Underfills for Semiconductor Sales (Tons), Revenue (US$ Million), Price (US$/kg) and Gross Margin (2020-2025)
  • Table 112. Parker LORD Underfills for Semiconductor Product Offerings
  • Table 113. Parker LORD Recent Development
  • Table 114. Nagase ChemteX Company Information
  • Table 115. Nagase ChemteX Introduction and Business Overview
  • Table 116. Nagase ChemteX Underfills for Semiconductor Sales (Tons), Revenue (US$ Million), Price (US$/kg) and Gross Margin (2020-2025)
  • Table 117. Nagase ChemteX Underfills for Semiconductor Product Offerings
  • Table 118. Nagase ChemteX Recent Development
  • Table 119. Bondline Company Information
  • Table 120. Bondline Introduction and Business Overview
  • Table 121. Bondline Underfills for Semiconductor Sales (Tons), Revenue (US$ Million), Price (US$/kg) and Gross Margin (2020-2025)
  • Table 122. Bondline Underfills for Semiconductor Product Offerings
  • Table 123. Bondline Recent Development
  • Table 124. AIM Solder Company Information
  • Table 125. AIM Solder Introduction and Business Overview
  • Table 126. AIM Solder Underfills for Semiconductor Sales (Tons), Revenue (US$ Million), Price (US$/kg) and Gross Margin (2020-2025)
  • Table 127. AIM Solder Underfills for Semiconductor Product Offerings
  • Table 128. AIM Solder Recent Development
  • Table 129. Zymet Company Information
  • Table 130. Zymet Introduction and Business Overview
  • Table 131. Zymet Underfills for Semiconductor Sales (Tons), Revenue (US$ Million), Price (US$/kg) and Gross Margin (2020-2025)
  • Table 132. Zymet Underfills for Semiconductor Product Offerings
  • Table 133. Zymet Recent Development
  • Table 134. Panacol-Elosol GmbH Company Information
  • Table 135. Panacol-Elosol GmbH Introduction and Business Overview
  • Table 136. Panacol-Elosol GmbH Underfills for Semiconductor Sales (Tons), Revenue (US$ Million), Price (US$/kg) and Gross Margin (2020-2025)
  • Table 137. Panacol-Elosol GmbH Underfills for Semiconductor Product Offerings
  • Table 138. Panacol-Elosol GmbH Recent Development
  • Table 139. Dover Company Information
  • Table 140. Dover Introduction and Business Overview
  • Table 141. Dover Underfills for Semiconductor Sales (Tons), Revenue (US$ Million), Price (US$/kg) and Gross Margin (2020-2025)
  • Table 142. Dover Underfills for Semiconductor Product Offerings
  • Table 143. Dover Recent Development
  • Table 144. Darbond Technology Company Information
  • Table 145. Darbond Technology Introduction and Business Overview
  • Table 146. Darbond Technology Underfills for Semiconductor Sales (Tons), Revenue (US$ Million), Price (US$/kg) and Gross Margin (2020-2025)
  • Table 147. Darbond Technology Underfills for Semiconductor Product Offerings
  • Table 148. Darbond Technology Recent Development
  • Table 149. Yantai Hightite Chemicals Company Information
  • Table 150. Yantai Hightite Chemicals Introduction and Business Overview
  • Table 151. Yantai Hightite Chemicals Underfills for Semiconductor Sales (Tons), Revenue (US$ Million), Price (US$/kg) and Gross Margin (2020-2025)
  • Table 152. Yantai Hightite Chemicals Underfills for Semiconductor Product Offerings
  • Table 153. Yantai Hightite Chemicals Recent Development
  • Table 154. Sunstar Company Information
  • Table 155. Sunstar Introduction and Business Overview
  • Table 156. Sunstar Underfills for Semiconductor Sales (Tons), Revenue (US$ Million), Price (US$/kg) and Gross Margin (2020-2025)
  • Table 157. Sunstar Underfills for Semiconductor Product Offerings
  • Table 158. Sunstar Recent Development
  • Table 159. DeepMaterial Company Information
  • Table 160. DeepMaterial Introduction and Business Overview
  • Table 161. DeepMaterial Underfills for Semiconductor Sales (Tons), Revenue (US$ Million), Price (US$/kg) and Gross Margin (2020-2025)
  • Table 162. DeepMaterial Underfills for Semiconductor Product Offerings
  • Table 163. DeepMaterial Recent Development
  • Table 164. SINY Company Information
  • Table 165. SINY Introduction and Business Overview
  • Table 166. SINY Underfills for Semiconductor Sales (Tons), Revenue (US$ Million), Price (US$/kg) and Gross Margin (2020-2025)
  • Table 167. SINY Underfills for Semiconductor Product Offerings
  • Table 168. SINY Recent Development
  • Table 169. GTA Material Company Information
  • Table 170. GTA Material Introduction and Business Overview
  • Table 171. GTA Material Underfills for Semiconductor Sales (Tons), Revenue (US$ Million), Price (US$/kg) and Gross Margin (2020-2025)
  • Table 172. GTA Material Underfills for Semiconductor Product Offerings
  • Table 173. GTA Material Recent Development
  • Table 174. H.B.Fuller Company Information
  • Table 175. H.B.Fuller Introduction and Business Overview
  • Table 176. H.B.Fuller Underfills for Semiconductor Sales (Tons), Revenue (US$ Million), Price (US$/kg) and Gross Margin (2020-2025)
  • Table 177. H.B.Fuller Underfills for Semiconductor Product Offerings
  • Table 178. H.B.Fuller Recent Development
  • Table 179. Fuji Chemical Company Information
  • Table 180. Fuji Chemical Introduction and Business Overview
  • Table 181. Fuji Chemical Underfills for Semiconductor Sales (Tons), Revenue (US$ Million), Price (US$/kg) and Gross Margin (2020-2025)
  • Table 182. Fuji Chemical Underfills for Semiconductor Product Offerings
  • Table 183. Fuji Chemical Recent Development
  • Table 184. United Adhesives Company Information
  • Table 185. United Adhesives Introduction and Business Overview
  • Table 186. United Adhesives Underfills for Semiconductor Sales (Tons), Revenue (US$ Million), Price (US$/kg) and Gross Margin (2020-2025)
  • Table 187. United Adhesives Underfills for Semiconductor Product Offerings
  • Table 188. United Adhesives Recent Development
  • Table 189. Asec Co.,Ltd. Company Information
  • Table 190. Asec Co.,Ltd. Introduction and Business Overview
  • Table 191. Asec Co.,Ltd. Underfills for Semiconductor Sales (Tons), Revenue (US$ Million), Price (US$/kg) and Gross Margin (2020-2025)
  • Table 192. Asec Co.,Ltd. Underfills for Semiconductor Product Offerings
  • Table 193. Asec Co.,Ltd. Recent Development
  • Table 194. Key Raw Materials Lists
  • Table 195. Raw Materials Key Suppliers Lists
  • Table 196. Underfills for Semiconductor Downstream Customers
  • Table 197. Underfills for Semiconductor Distributors List
  • Table 198. Research Programs/Design for This Report
  • Table 199. Key Data Information from Secondary Sources
  • Table 200. Key Data Information from Primary Sources

List of Figures

  • Figure 1. Underfills for Semiconductor Product Picture
  • Figure 2. Global Underfills for Semiconductor Sales Value, 2020 VS 2024 VS 2031 (US$ Million)
  • Figure 3. Global Underfills for Semiconductor Sales Value (2020-2031) & (US$ Million)
  • Figure 4. Global Underfills for Semiconductor Sales Volume (2020-2031) & (Tons)
  • Figure 5. Global Underfills for Semiconductor Sales Price (2020-2031) & (US$/kg)
  • Figure 6. Underfills for Semiconductor Report Years Considered
  • Figure 7. Global Underfills for Semiconductor Players Revenue Ranking (2024) & (US$ Million)
  • Figure 8. Global Underfills for Semiconductor Players Sales Volume Ranking (2024) & (Tons)
  • Figure 9. The 5 and 10 Largest Manufacturers in the World: Market Share by Underfills for Semiconductor Revenue in 2024
  • Figure 10. Underfills for Semiconductor Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2020 VS 2024
  • Figure 11. Wafer and Panel-Level Underfill Picture
  • Figure 12. Board-Level Underfill Picture
  • Figure 13. Global Underfills for Semiconductor Sales Value by Type (2020 VS 2024 VS 2031) & (US$ Million)
  • Figure 14. Global Underfills for Semiconductor Sales Value Market Share by Type, 2024 & 2031
  • Figure 15. Global Underfills for Semiconductor Sales Volume by Type (2020 VS 2024 VS 2031) & (Tons)
  • Figure 16. Global Underfills for Semiconductor Sales Volume Market Share by Type, 2024 & 2031
  • Figure 17. Global Underfills for Semiconductor Price by Type (2020-2031) & (US$/kg)
  • Figure 18. CUF Picture
  • Figure 19. NCF Picture
  • Figure 20. Global Underfills for Semiconductor Sales Value by Flow-ablility (2020 VS 2024 VS 2031) & (US$ Million)
  • Figure 21. Global Underfills for Semiconductor Sales Value Market Share by Flow-ablility, 2024 & 2031
  • Figure 22. Global Underfills for Semiconductor Sales Volume by Flow-ablility (2020 VS 2024 VS 2031) & (Tons)
  • Figure 23. Global Underfills for Semiconductor Sales Volume Market Share by Flow-ablility, 2024 & 2031
  • Figure 24. Global Underfills for Semiconductor Price by Flow-ablility (2020-2031) & (US$/kg)
  • Figure 25. Product Picture of Industrial Electronics
  • Figure 26. Product Picture of Consumer Electronics
  • Figure 27. Product Picture of Automotive Electronics
  • Figure 28. Product Picture of Others
  • Figure 29. Global Underfills for Semiconductor Sales Value by Application (2020 VS 2024 VS 2031) & (US$ Million)
  • Figure 30. Global Underfills for Semiconductor Sales Value Market Share by Application, 2024 & 2031
  • Figure 31. Global Underfills for Semiconductor Sales Volume by Application (2020 VS 2024 VS 2031) & (Tons)
  • Figure 32. Global Underfills for Semiconductor Sales Volume Market Share by Application, 2024 & 2031
  • Figure 33. Global Underfills for Semiconductor Price by Application (2020-2031) & (US$/kg)
  • Figure 34. North America Underfills for Semiconductor Sales Value (2020-2031) & (US$ Million)
  • Figure 35. North America Underfills for Semiconductor Sales Value by Country (%), 2024 VS 2031
  • Figure 36. Europe Underfills for Semiconductor Sales Value, (2020-2031) & (US$ Million)
  • Figure 37. Europe Underfills for Semiconductor Sales Value by Country (%), 2024 VS 2031
  • Figure 38. Asia Pacific Underfills for Semiconductor Sales Value, (2020-2031) & (US$ Million)
  • Figure 39. Asia Pacific Underfills for Semiconductor Sales Value by Region (%), 2024 VS 2031
  • Figure 40. South America Underfills for Semiconductor Sales Value, (2020-2031) & (US$ Million)
  • Figure 41. South America Underfills for Semiconductor Sales Value by Country (%), 2024 VS 2031
  • Figure 42. Middle East & Africa Underfills for Semiconductor Sales Value, (2020-2031) & (US$ Million)
  • Figure 43. Middle East & Africa Underfills for Semiconductor Sales Value by Country (%), 2024 VS 2031
  • Figure 44. Key Countries/Regions Underfills for Semiconductor Sales Value (%), (2020-2031)
  • Figure 45. Key Countries/Regions Underfills for Semiconductor Sales Volume (%), (2020-2031)
  • Figure 46. United States Underfills for Semiconductor Sales Value, (2020-2031) & (US$ Million)
  • Figure 47. United States Underfills for Semiconductor Sales Value by Type (%), 2024 VS 2031
  • Figure 48. United States Underfills for Semiconductor Sales Value by Application (%), 2024 VS 2031
  • Figure 49. Europe Underfills for Semiconductor Sales Value, (2020-2031) & (US$ Million)
  • Figure 50. Europe Underfills for Semiconductor Sales Value by Type (%), 2024 VS 2031
  • Figure 51. Europe Underfills for Semiconductor Sales Value by Application (%), 2024 VS 2031
  • Figure 52. China Underfills for Semiconductor Sales Value, (2020-2031) & (US$ Million)
  • Figure 53. China Underfills for Semiconductor Sales Value by Type (%), 2024 VS 2031
  • Figure 54. China Underfills for Semiconductor Sales Value by Application (%), 2024 VS 2031
  • Figure 55. Japan Underfills for Semiconductor Sales Value, (2020-2031) & (US$ Million)
  • Figure 56. Japan Underfills for Semiconductor Sales Value by Type (%), 2024 VS 2031
  • Figure 57. Japan Underfills for Semiconductor Sales Value by Application (%), 2024 VS 2031
  • Figure 58. South Korea Underfills for Semiconductor Sales Value, (2020-2031) & (US$ Million)
  • Figure 59. South Korea Underfills for Semiconductor Sales Value by Type (%), 2024 VS 2031
  • Figure 60. South Korea Underfills for Semiconductor Sales Value by Application (%), 2024 VS 2031
  • Figure 61. Southeast Asia Underfills for Semiconductor Sales Value, (2020-2031) & (US$ Million)
  • Figure 62. Southeast Asia Underfills for Semiconductor Sales Value by Type (%), 2024 VS 2031
  • Figure 63. Southeast Asia Underfills for Semiconductor Sales Value by Application (%), 2024 VS 2031
  • Figure 64. India Underfills for Semiconductor Sales Value, (2020-2031) & (US$ Million)
  • Figure 65. India Underfills for Semiconductor Sales Value by Type (%), 2024 VS 2031
  • Figure 66. India Underfills for Semiconductor Sales Value by Application (%), 2024 VS 2031
  • Figure 67. Underfills for Semiconductor Industrial Chain
  • Figure 68. Underfills for Semiconductor Manufacturing Cost Structure
  • Figure 69. Channels of Distribution (Direct Sales, and Distribution)
  • Figure 70. Bottom-up and Top-down Approaches for This Report
  • Figure 71. Data Triangulation
  • Figure 72. Key Executives Interviewed