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市场调查报告书
商品编码
1872059
CMP垫片:全球市场份额和排名、总收入和需求预测(2025-2031年)CMP Pads - Global Market Share and Ranking, Overall Sales and Demand Forecast 2025-2031 |
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全球 CMP垫片市场预计在 2024 年达到 11.38 亿美元,预计到 2031 年将达到 18.1 亿美元,2025 年至 2031 年的复合年增长率为 6.8%。
本报告对近期关税调整和国际战略反制措施对 CMP垫片的跨境产业布局、资本配置模式、区域经济相互依存关係和供应链重组进行了全面评估。
化学机械抛光 (CMP) 是一种结合化学和机械(或研磨)作用的工艺,用于去除材料并获得极其光滑平整的表面。化学机械抛光 (CMP) 通常与化学机械平坦化 (CMP) 相关联,后者是一种利用化学反应去除表面材料的抛光工艺。 CMP 是半导体产业生产积体电路和储存磁碟的标准製造流程。当目标是去除表面材料时,称为化学机械抛光;而当目标是使表面平整时,则称为化学机械平坦化。由于摩擦和腐蚀的协同效应,CMP 被认为是一种摩擦化学製程。 CMP垫片(化学机械抛光垫片)是一种透过物理和化学抛光製程平滑半导体晶圆表面的产品,可提高半导体整合度。
受电动车、可再生能源和5G基础设施对碳化硅(SiC)功率装置需求激增的推动,碳化硅化学机械抛光(CMP)垫片市场正快速发展。预计2024年全球SiC CMP垫片市场规模将达4,797万美元,到2031年将达到2.0418亿美元,2025年至2031年的复合年增长率(CAGR)为17.15%。碳化硅(SiC)化学机械抛光(CMP)垫片是支撑新一代功率电子技术的关键基础技术,其市场竞争动态和技术挑战也十分独特。
考虑到成本以及晶圆尺寸对积体电路性能和效率的影响,晶圆尺寸增大已成为必然趋势,目前8吋和12吋晶圆已成为主流。预计未来将发展到18吋晶圆。然而,晶圆尺寸越大,製造对应的CMP垫片的难度就越高。随着下游尺寸的成长成为必然趋势,开发大尺寸垫片对于占据市场主导地位至关重要,否则企业将被淘汰。随着积体电路性能的不断提升,CMP垫片的抛光性能也必须随之提高,未来的性能要求将更加严格。
目前,中国有多家市场导向型企业尚未获得海外认证,因此无法出口。下游企业主要集中在日本、台湾、韩国以及欧美(美国除外)。除欧美以外,这些国家在CMP抛光垫片市场占据了较大份额。电子产业主要集中在亚太地区,但当前的政治状况并不乐观。特别是2020年,可能是中国近30年来面临的最严重的政治危机。鑑于当前的贸易摩擦和中国的国际政治因素,这为国内CMP抛光垫片製造商提供了主导市场的绝佳机会,预计未来几年国家政策投资将会增加。因此,中国企业将抓住机会,在未来几年大力发展国内生产。为了获得市场主导地位,湖北鼎龙预计将大幅降低产品价格,这可能会迅速扩大市场份额。
新进入者需要大量资金,这使得小规模公司难以进入该行业。 CMP垫片对技术和加工流程要求很高,目前市场由美国公司主导。市场不仅受价格影响,产品性能也扮演至关重要的角色。主要企业在卓越的性能、丰富的产品线、先进的技术和完善的售后服务方面具有优势,因此占据了高端市场的大部分份额。展望未来几年,预计各品牌之间的价格差异将缩小,毛利率的波动也将随之加剧。
现有製造商必须不断提高技术门槛,以阻止新进入者。他们必须降低成本和价格,才能迅速占领市场,扩大客户群,并建立市场主导地位。打造品牌形象并为进入消费品市场奠定基础至关重要。只有采取这些措施,他们才能在激烈的市场竞争中获得更大的市场份额。
儘管市场对化学机械抛光(CMP)垫片表现出浓厚的兴趣,但该市场仍面临许多重大的准入壁垒。首先,该行业高度专业化,需要材料科学、表面化学和晶圆製程整合的深厚技术专长。其次,严格的性能要求,包括平整度、缺陷率以及与特定抛光液的兼容性,要求垫片供应商必须经过半导体晶圆厂的全面认证流程,这可能需要数年时间。此外,该市场由少数几家拥有长期合作关係和专有技术的老牌企业主导,新进业者很难获得市场认可。高昂的研发成本、精密製造方面的资本投入以及对全球支持体系的需求也构成了巨大的挑战。
本报告旨在对全球 CMP垫片市场进行全面分析,重点关注总销售量、收入、价格、企业市场占有率和主要企业的排名,并按地区/国家、类型和应用对 CMP垫片进行分析。
CMP垫片市场规模、估算和预测以销售(千)和收入(百万美元)为单位呈现,以 2024 年为基准年,并包含 2020 年至 2031 年的历史数据和预测数据。定量和定性分析将帮助读者制定 CMP垫片的业务和成长策略,评估市场竞争,分析自身在当前市场中的地位,并做出明智的商业决策。
市场区隔
公司
按类型分類的细分市场
应用领域
按地区
The global market for CMP Pads was estimated to be worth US$ 1138 million in 2024 and is forecast to a readjusted size of US$ 1810 million by 2031 with a CAGR of 6.8% during the forecast period 2025-2031.
This report provides a comprehensive assessment of recent tariff adjustments and international strategic countermeasures on CMP Pads cross-border industrial footprints, capital allocation patterns, regional economic interdependencies, and supply chain reconfigurations.
Chemical mechanical polishing/planarization (CMP) is a process that removes materials by a combination of chemical and mechanical (or abrasive) actions to achieve highly smooth and planar material surfaces. Chemical-mechanical polishing (CMP) is often associated with chemical-mechanical planarization which is a polishing process assisted by chemical reactions to remove surface materials. CMP is a standard manufacturing process practiced at the semiconductor industry to fabricate integrated circuits and memory disks. When the purpose is to remove surface materials, it is referred to as chemical-mechanical polishing. However, when the purpose is to flatten a surface, it is referred to as chemical-mechanical planarization. CMP is considered to be a tribochemical process because of the synergy between friction and corrosion. CMP Pad (Chemical Mechanical Polishing Pad) is a product which increases semiconductor integration by smoothening the semiconductor wafer surface through physical and chemical polishing processes.
The silicon carbide (SiC) chemical mechanical planarization (CMP) pads market is evolving rapidly, driven by the booming demand for SiC power devices in electric vehicles (EVs), renewable energy, and 5G infrastructure. The global SiC CMP Pads market was valued at US$ 47.97 million in 2024 and is expected to reach US$ 204.18 million by 2031, growing at a CAGR of 17.15% during 2025-2031. The silicon carbide (SiC) chemical mechanical planarization (CMP) pad market is a critical enabler for next-generation power electronics, with distinct competitive dynamics and technological challenges.
At present, considering the cost and the influence of the size of silicon wafers on the performance and efficiency of integrated circuits, the increase in the size of wafers is an inevitable trend and a mainstream trend, in particular, 8-inch and 12-inch. Wafer may develop in the direction of 18 inches in the future. However, the larger the size, the more difficult it is to produce the corresponding CMP pad. When the downstream size becomes an inevitable trend, in order to occupy the market, it is necessary to be able to develop large-size pad, otherwise it will be eliminated by the market. With the expectation of the superior performance improvement of integrated circuits, the polishing performance of CMP pads has to be increased, so its performance in the future must be more stringent.
Several of the current market-oriented enterprises in China have not obtained foreign certifications, so there is no export for the time being. Because downstream companies are mainly concentrated in Japan, Taiwan, South Korea, Europe and the United States and other countries, in addition to Europe and South Korea, these countries have a relatively large market position of CMP polishing pads in several other regions. The electronics industry is mainly concentrated in the Asia-Pacific region, but the current political situation is not optimistic, especially in 2020, it may be the most serious year for China's political crisis in the past 30 years. Due to the current trade frictions and China's current international political factors, it may be the best time for domestic CMP pad manufacturers to occupy the market, and the country's policy investment will increase in the coming years. Therefore, Chinese companies will usher in opportunities for localization in the next few years. We predict that in order to occupy the market, Hubei Dinglong may actively lower the price of the product and madly occupy the market.
New investment requires large capital, and it is difficult for small-scale enterprises to enter the industry. CMP Pads has higher requirements on technology level and processing technology. At present, the market is occupied by American companies. The market is not only influenced by the price, but also influenced by the product performance. The leading companies own the advantages on better performance, more abundant product's types, better technical and impeccable after-sales service. Consequently, they take the majority of the market share of high-end market. Looking to the future years, prices gap between different brands will go narrowing. Similarly, there will be fluctuation in gross margin.
For manufacturers that have already entered, they need to constantly raise the technical threshold to prevent more companies from entering; by reducing costs and reducing prices, they will quickly occupy the market, develop incremental customer markets, and establish market share advantages; create a brand image and lay an advantage for entering the consumer goods market. Only in this way can we have a larger market share of capital in the fierce competition.
Despite this interest, the CMP pad market poses several significant barriers to entry. First, the industry is highly specialized and requires deep technical expertise in materials science, surface chemistry, and wafer process integration. Second, stringent performance requirements - such as planarity, defectivity, and compatibility with specific slurries - mean that pad suppliers must go through extensive qualification processes with semiconductor fabs, which can take years. Additionally, the market is dominated by a few entrenched players with long-term relationships and proprietary technologies, making it difficult for newcomers to gain design-ins. High R&D costs, capital investment in precision manufacturing, and the need for global support infrastructure also pose substantial challenges.
This report aims to provide a comprehensive presentation of the global market for CMP Pads, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of CMP Pads by region & country, by Type, and by Application.
The CMP Pads market size, estimations, and forecasts are provided in terms of sales volume (K Pcs) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding CMP Pads.
Market Segmentation
By Company
Segment by Type
Segment by Application
By Region
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (value, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of CMP Pads manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of CMP Pads in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of CMP Pads in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.