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2025年全球构装基板市场研究报告
市场调查报告书
商品编码
1895193

2025年全球构装基板市场研究报告

Global Package Substrates Market Research Report 2025
出版日期: | 出版商: QYResearch | 英文 292 Pages | 商品交期: 2-3个工作天内

价格

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全球构装基板（IC基板）市场预计到2024年将达到129亿美元，到2031年将达到211.7亿美元。

预计在 2025 年至 2031 年的预测期内，其复合年增长率将达到 8.01%。

目前，构装基板主要由总部位于日本、韩国、台湾和中国当地的製造商生产。到2024年，台湾将成为最大的生产地，占全球市场份额的28.03%，其次是韩国（27.4%）、中国当地（22%）和日本（17.17%）。

全球积体电路基板（构装基板）市场结构上分为以下几个部分：ABF层压基板（尤其是用于伺服器/AI CPU、GPU和网路ASIC等高引脚数、大尺寸封装的FC-BGA基板）、BT树脂基板（广泛应用于行动/消费性电子应用以及众多汽车/工业集成电路的主流BGA/CSP封装基板）和模组/PRF构装基板（例如SiPRF）。后者强调大规模生产、严格的尺寸控制和强大的可靠性。供应仍高度集中在东亚（日本、台湾、韩国和中国），欧洲则拥有部分高端产能。受资料中心运算需求和异质整合技术发展的驱动，市场需求正转向更大尺寸、更高堆迭密度和更精细线宽/线间距的ABF基板。后疫情时代，该产业也正经历「两极週期」。儘管消费/PC相关基板的需求调整迅速，但伺服器/AI专用板（ABF）往往需要较长的认证週期和多年的平台蓝图来支撑。近期产能活动（例如，推出与资料中心处理器相关的新型大批量基板的产量）表明，即使整体电子产业週期有所放缓，主要供应商仍优先投资高阶专用板。

2024 年全球 ABF基板市场价值为 54 亿美元，预计到 2031 年将达到 105 亿美元，在 2025-2031 年预测期内的复合年增长率为 10.73%。

全球BT基板市场预计到2024年将达到74.1亿美元，到2031年将达到103.8亿美元，在2025-2031年的预测期内，复合年增长率将达到5.56%。

2024 年全球 MIS基板市场价值为 9,600 万美元，预计到 2031 年将达到 2.55 亿美元，在 2025-2031 年预测期内的复合年增长率为 13.62%。

全球主要的构装基板製造商包括 Unimicron、Ibiden、南亚PCB、新光电气工业株式会社、金硕互连技术、AT&S、三星马达、京瓷、凸版印刷等。截至2024年，全球前10大供应商约占总营收的77.4%。

全球主要的ABF基板製造商包括Unimicron、Ibiden、南亚PCB、新光电气工业株式会社、金硕互连、AT&S、Semco、京瓷、拓普纳等。 2024年，全球前七大公司以收益为准约占市场占有率的92.44%。

全球领先的 MIS基板製造商包括台湾的 PPt、中国的 MiSpak Technology 和马来西亚的 QDOS。

先进封装技术正日益影响技术和产品趋势。基板不再是“被动载体”，而是晶片组、2.5D/3D整合以及高频宽记忆体（HBM）生态系统的关键推动因素。这些技术要求更高的互连密度、更优异的翘曲控制以及在不断提高的资料速率下更高的讯号完整性。这正推动着产业蓝图朝着更精细的线/空通孔（采用半增材製造流程 (mSAP)）、改进的雷射通孔形成、高精度抗蚀剂(LDI)、薄芯/无芯结构以及更高的堆迭密度发展，同时保持高产量产量比率和可靠性。在材料方面，由于基板性能越来越决定封装的整体性能和可製造性，供应商不断追求更低的损耗和更高的绝缘体（例如，ABF级层压材料）的热机械稳定性。同时，人们正在探索「下一代基板技术」（例如，玻璃芯基板），以提高未来运算封装的互连密度、尺寸稳定性和供电供给能力，这表明基板蓝图正在进入向新材料和新製程过渡的阶段，而不是简单的增量扩展。

从价值链角度来看，上游工程的核心是介电/层压材料（ABF型薄膜/树脂）、BT环氧树脂、铜箔、玻璃布/玻璃芯层压板、阻焊层压板/光阻剂、电镀化学品以及专用设备（雷射钻孔、成像/LDI、电镀线、层压/压机、AOI/检测、可靠性测试）。由于任何一种原材料的供应限制，特别是先进层压介电材料和高端製程设备的供应限制，都可能造成瓶颈，因此上游材料製造商不断宣布与人工智慧/高效能运算（AI/HPC）成长预测相符的多年产能和技术扩张计画。下游，基板流入与OSAT（外包组装和测试）公司以及IDM/代工厂相关的高效能封装生产线，这些生产线随后供应给以伺服器/资料中心、HPC/AI加速器和网路/电信基础设施为驱动的终端市场。此外，个人电脑、智慧型手机和汽车电子产品也存在週期性需求。展望未来，该产业的重点仍将位于亚洲，但政策和供应链韧性目标正在推动选择性在地化。例如，美国很早就支持在国内生产先进封装的玻璃基板，这显示美国长期致力于关键基板技术的地理多元化。短期内，终端市场的需求和运转率仍不均衡（人工智慧领域较为稳定，而消费领域则较易受週期性影响）。然而，从结构上看，前景依然乐观，因为基板逐渐成为先进封装规模化生产的阻碍因素，无论从技术、经济或产能建设时间来看都是如此。

调查范围

本报告全面介绍了全球构装基板市场，结合定量和定性分析，旨在帮助读者制定业务和成长策略，评估市场竞争，分析公司在当前市场中的地位，并就构装基板做出明智的商业决策。

本报告以2020年至2031年的历史数据和预测数据为基础，以2024年为基准年，提供构装基板市场规模、估算和预测，单位包括产量/出货量（千平方公尺）和收入（百万美元）。报告全面细分了全球构装基板市场，包括按地区、产品类型、应用和主要企业分類的市场规模。

为了更深入了解市场，本报告提供了竞争格局、主要竞争对手及其市场地位的概况，并探讨了技术趋势和新产品开发。

本报告为构装基板製造商、新参与企业以及与产业链相关企业提供整体市场和各个细分市场（按公司、类型、应用和地区）的收入、产量和平均价格资讯。

市场区隔

公司

  • Unimicron
  • Ibiden
  • Nan Ya PCB
  • Shinko Electric Industries
  • Kinsus Interconnect Technology
  • AT&S;
  • Samsung Electro-Mechanics
  • Kyocera
  • Toppan
  • Zhen Ding Technology
  • Daeduck Electronics
  • Zhuhai Access Semiconductor
  • LG InnoTek
  • Shennan Circuit
  • Shenzhen Fastprint Circuit Tech
  • Korea Circuit
  • FICT LIMITED
  • AKM Meadville
  • Shenzhen Hemei Jingyi Semiconductor Technology
  • Simmtech
  • HOREXS
  • ASE Material
  • PPt
  • MiSpak Technology
  • QDOS

按类型分類的细分市场

  • FCBGA
  • FCCSP
  • 其他的

应用领域

  • PC
  • 伺服器和资料中心
  • 高效能运算/人工智慧晶片
  • 沟通
  • 智慧型手机
  • 穿戴式装置和家用电子电器
  • 汽车电子
  • 其他的

依材料类型

  • ABF基板
  • BT基板
  • MIS基板

按晶片类型

  • 非储存积体电路基板
  • 记忆体基板

按地区

  • 日本
  • 韩国
  • 台湾
  • 中国
  • 东南亚

The global package substrates (IC substrates) market was valued at US$ 12.9 billion in 2024 and is anticipated to reach US$ 21.17 billion by 2031, witnessing a CAGR of 8.01% during the forecast period 2025-2031.

Currently the package substrates are mainly produced by manufactuers headquartered in Japan, South Korea, China Taiwan and China Mainland. China Taiwan is the largest producer of package substrates with global share 28.03% in 2024, followed by South Korea (27.4%), China Mainland (22%) and Japan (17.17%).

The global IC substrate (package substrate) market is structurally segmented by ABF build-up substrates (especially FC-BGA for high-pin-count, large-body packages used in server/AI CPUs, GPUs, networking ASICs), BT resin substrates (widely used in mainstream BGA/CSP for mobile/consumer and many automotive/industrial ICs), plus module/memory-oriented substrates (e.g., SiP/RF modules and memory package substrates) that emphasize high volume, tight dimensional control, and robust reliability. Supply remains highly concentrated in East Asia (Japan/Taiwan/Korea/China), while Europe has selective high-end capacity; the demand mix has been migrating toward larger, more layer-dense, tighter line/space ABF substrates driven by data center compute and heterogeneous integration. In the post-pandemic period, the industry has also shown a "split cycle": consumer/PC-related substrate demand can correct quickly, while server/AI-oriented ABF tends to be supported by long qualification cycles and multi-year platform roadmaps. Recent capacity moves (e.g., new high-volume substrate manufacturing ramps tied to data-center processors) underscore that leading suppliers still prioritize high-end ABF investment even when parts of the broader electronics cycle soften.

The global ABF substrates market was valued at US$ 5.4 billion in 2024 and is anticipated to reach US$ 10.5 billion by 2031, witnessing a CAGR of 10.73% during the forecast period 2025-2031.

The global BT substrates market was valued at US$ 7.41 billion in 2024 and is anticipated to reach US$ 10.38 billion by 2031, witnessing a CAGR of 5.56% during the forecast period 2025-2031.

The global MIS substrates market was valued at US$ 96 million in 2024 and is anticipated to reach US$ 255 million by 2031, witnessing a CAGR of 13.62% during the forecast period 2025-2031.

The key global manufacturers of package substrates include Unimicron, Ibiden, Nan Ya PCB, Shinko Electric Industries, Kinsus Interconnect Technology, AT&S, Samsung Electro-Mechanics, Kyocera, and Toppan, etc. In 2024, the world's top ten vendors accounted for approximately 77.4% of the revenue.

The global key manufacturers of ABF Substrate include Unimicron, Ibiden, Nan Ya PCB, Shinko Electric Industries, Kinsus Interconnect, AT&S, Semco, Kyocera, and TOPPAN, etc. In 2024, the global top seven players had a share approximately 92.44% in terms of revenue.

The global key manufacturers of MIS Substrate include China Taiwanese PPt, Chineses MiSpak Technology and Malaysian QDOS.

Technology and product trends are increasingly shaped by advanced packaging. The substrate is no longer a "passive carrier" but a key enabler for chiplets, 2.5D/3D integration, and high-bandwidth memory (HBM) ecosystems, which require more routing density, better warpage control, and higher signal integrity at rising data rates. Industry roadmaps therefore push finer L/S via semi-additive processes (mSAP), improved laser via formation, tighter registration (LDI), thinner cores/coreless structures, and higher layer counts-all while maintaining yield and reliability at scale. On the materials side, suppliers are continuously upgrading dielectrics (e.g., ABF-class build-up materials) for lower loss and better thermo-mechanical stability, because substrate performance increasingly gates overall package performance and manufacturability. Meanwhile, the "next substrate curve" (e.g., glass-core substrates) is being explored to extend wiring density, dimensional stability, and power delivery for future compute packages, signaling that the substrate roadmap is entering a new materials-and-process transition rather than simple incremental scaling.

From a value-chain perspective, the upstream is dominated by dielectric/build-up materials (ABF-type films/resins), BT epoxy systems, copper foil, glass cloth/core laminates, solder masks/photoresists, plating chemicals, and specialized equipment (laser drilling, imaging/LDI, plating lines, lamination/press, AOI/inspection, reliability test). Tightness in any one of these-particularly advanced build-up dielectrics and high-end process tools-can become a bottleneck, which is why upstream material makers continue to publicize multi-year capacity and technology expansion plans aligned with AI/HPC growth expectations. Downstream, substrates flow into OSATs and IDM/foundry-adjacent advanced packaging lines, then into end markets led by server & data center, HPC/AI accelerators, networking/communication infrastructure, plus cyclical volumes from PCs, smartphones, and automotive electronics. Looking forward, the industry's center of gravity remains in Asia, but policy and supply-chain resilience goals are catalyzing selective localization: the U.S., for example, has backed early-stage domestic manufacturing of glass substrates for advanced packaging, indicating a longer-term push to diversify critical substrate technologies geographically. Near term, demand and utilization will still be uneven by end market (AI strong; consumer more cyclical), but structurally the outlook remains favorable because substrates are increasingly the limiting factor for advanced packaging scaling-technically, economically, and in capacity build time.

Report Scope

This report aims to provide a comprehensive presentation of the global market for Package Substrates, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Package Substrates.

The Package Substrates market size, estimations, and forecasts are provided in terms of output/shipments (Thousand Square Meters) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Package Substrates market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.

For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.

The report will help the Package Substrates manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.

Market Segmentation

By Company

  • Unimicron
  • Ibiden
  • Nan Ya PCB
  • Shinko Electric Industries
  • Kinsus Interconnect Technology
  • AT&S
  • Samsung Electro-Mechanics
  • Kyocera
  • Toppan
  • Zhen Ding Technology
  • Daeduck Electronics
  • Zhuhai Access Semiconductor
  • LG InnoTek
  • Shennan Circuit
  • Shenzhen Fastprint Circuit Tech
  • Korea Circuit
  • FICT LIMITED
  • AKM Meadville
  • Shenzhen Hemei Jingyi Semiconductor Technology
  • Simmtech
  • HOREXS
  • ASE Material
  • PPt
  • MiSpak Technology
  • QDOS

Segment by Type

  • FCBGA
  • FCCSP
  • Others

Segment by Application

  • PCs
  • Server & Data Center
  • HPC/AI Chips
  • Communication
  • Smart Phone
  • Wearable and Consumer Electronics
  • Automotive Electronics
  • Others

By Material Type

  • ABF Substrate
  • BT Substrate
  • MIS Substrate

By Chips Type

  • Non-memory IC Substrate
  • Memory Substrate

By Region

  • Japan
  • South Korea
  • China Taiwan
  • China Mainland
  • Southeast Asia

Chapter Outline:

Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.

Chapter 2: Detailed analysis of Package Substrates manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.

Chapter 3: Production/output, value of Package Substrates by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.

Chapter 4: Consumption of Package Substrates in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.

Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.

Chapter 6: Provides the analysis of various market segments by Material Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.

Chapter 7: Provides the analysis of various market segments by Chips Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.

Chapter 8: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.

Chapter 9: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.

Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.

Chapter 11: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.

Chapter 12: The main points and conclusions of the report.

Table of Contents

1 Package Substrates Market Overview

  • 1.1 Product Definition
  • 1.2 Package Substrates by Type
    • 1.2.1 Global Package Substrates Market Value Growth Rate Analysis by Type: 2024 VS 2031
    • 1.2.2 FCBGA Substrates
    • 1.2.3 FCCSP Substrates
    • 1.2.4 Others (WB CSP, WB-BGA, SIP /RF Module Substrates, Memory Substrates, etc.)
  • 1.3 Package Substrates by Material Type
    • 1.3.1 Global Package Substrates Market Value Growth Rate Analysis by Material Type: 2024 VS 2031
    • 1.3.2 ABF Substrate
    • 1.3.3 BT Substrate
    • 1.3.4 MIS Substrate
      • 1.3.4.1 Single-layer MIS
      • 1.3.4.2 Multi-layer MIS
  • 1.4 Package Substrates by Chips Type
    • 1.4.1 Global Package Substrates Market Value Growth Rate Analysis by Chips Type: 2024 VS 2031
    • 1.4.2 Non-memory IC Substrate
    • 1.4.3 Memory Substrate
  • 1.5 Package Substrates by Application
    • 1.5.1 Global Package Substrates Market Value Growth Rate Analysis by Application: 2024 VS 2031
    • 1.5.2 PCs
    • 1.5.3 Server & Data Center
    • 1.5.4 HPC/AI Chips
    • 1.5.5 Communication
    • 1.5.6 Smart Phone
    • 1.5.7 Wearable and Consumer Electronics
    • 1.5.8 Automotive Electronics (Infotainment / ADAS)
    • 1.5.9 Others
  • 1.6 Global Market Growth Prospects
    • 1.6.1 Global Package Substrates Production Value Estimates and Forecasts (2020-2031)
    • 1.6.2 Global Package Substrates Production Capacity Estimates and Forecasts (2020-2031)
    • 1.6.3 Global Package Substrates Production Estimates and Forecasts (2020-2031)
    • 1.6.4 Global Package Substrates Market Average Price Estimates and Forecasts (2020-2031)
  • 1.7 Assumptions and Limitations

2 Market Competition by Manufacturers

  • 2.1 Global Package Substrates Production Market Share by Manufacturers (2020-2025)
  • 2.2 Global Package Substrates Production Value Market Share by Manufacturers (2020-2025)
  • 2.3 Global Package Substrates Company Type and Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
  • 2.4 Global Package Substrates Average Price by Manufacturers (2020-2025)
  • 2.5 Global Key Manufacturers of Package Substrates, Manufacturing Sites & Headquarters
  • 2.6 Global Key Manufacturers of Package Substrates, Product Type & Application
  • 2.7 Global Key Manufacturers of Package Substrates, Date of Enter into This Industry
  • 2.8 Global Package Substrates Market Competitive Situation and Trends
    • 2.8.1 Global Package Substrates Market Concentration Rate
    • 2.8.2 Global 5 and 10 Largest Package Substrates Players Market Share by Revenue
  • 2.9 Mergers & Acquisitions, Expansion

3 Package Substrates Production by Region

  • 3.1 Global Package Substrates Production Value Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
  • 3.2 Global Package Substrates Production Value by Region (2020-2031)
    • 3.2.1 Global Package Substrates Production Value Market Share by Region (2020-2025)
    • 3.2.2 Global Forecasted Production Value of Package Substrates by Region (2026-2031)
  • 3.3 Global Package Substrates Production Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
  • 3.4 Global Package Substrates Production by Region (2020-2031)
    • 3.4.1 Global Package Substrates Production Market Share by Region (2020-2025)
    • 3.4.2 Global Forecasted Production of Package Substrates by Region (2026-2031)
  • 3.5 Global Package Substrates Market Price Analysis by Region (2020-2025)
  • 3.6 Global Package Substrates Production and Value, Year-over-Year Growth
    • 3.6.1 Japan Package Substrates Production Value Estimates and Forecasts (2020-2031)
    • 3.6.2 South Korea Package Substrates Production Value Estimates and Forecasts (2020-2031)
    • 3.6.3 China Taiwan Package Substrates Production Value Estimates and Forecasts (2020-2031)
    • 3.6.4 China Mainland Package Substrates Production Value Estimates and Forecasts (2020-2031)
    • 3.6.5 Southeast Asia Package Substrates Production Value Estimates and Forecasts (2020-2031)

4 Package Substrates Consumption by Region

  • 4.1 Global Package Substrates Consumption Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
  • 4.2 Global Package Substrates Consumption by Region (2020-2031)
    • 4.2.1 Global Package Substrates Consumption by Region (2020-2031)
    • 4.2.2 Global Package Substrates Forecasted Consumption by Region (2026-2031)
  • 4.3 North America
  • 4.4 Europe
  • 4.5 China
  • 4.6 Japan
  • 4.7 South Korea
  • 4.8 China Taiwan
  • 4.9 Southeast Asia

5 Segment by Type

  • 5.1 Global Package Substrates Production by Type (2020-2031)
    • 5.1.1 Global Package Substrates Production by Type (2020-2025)
    • 5.1.2 Global Package Substrates Production by Type (2026-2031)
    • 5.1.3 Global Package Substrates Production Market Share by Type (2020-2031)
  • 5.2 Global Package Substrates Production Value by Type (2020-2031)
    • 5.2.1 Global Package Substrates Production Value by Type (2020-2025)
    • 5.2.2 Global Package Substrates Production Value by Type (2026-2031)
    • 5.2.3 Global Package Substrates Production Value Market Share by Type (2020-2031)
  • 5.3 Global Package Substrates Price by Type (2020-2031)

6 Segment by Material Type

  • 6.1 Global Package Substrates Production by Material Type (2020-2031)
    • 6.1.1 Global Package Substrates Production by Material Type (2020-2025)
    • 6.1.2 Global Package Substrates Production by Material Type (2026-2031)
    • 6.1.3 Global Package Substrates Production Market Share by Material Type (2020-2031)
  • 6.2 Global Package Substrates Production Value by Material Type (2020-2031)
    • 6.2.1 Global Package Substrates Production Value by Material Type (2020-2025)
    • 6.2.2 Global Package Substrates Production Value by Material Type (2026-2031)
    • 6.2.3 Global Package Substrates Production Value Market Share by Material Type (2020-2031)
  • 6.3 Global Package Substrates Price by Material Type (2020-2031)

7 Segment by Chips Type

  • 7.1 Global Package Substrates Production by Chips Type (2020-2031)
    • 7.1.1 Global Package Substrates Production by Chips Type (2020-2025)
    • 7.1.2 Global Package Substrates Production by Chips Type (2026-2031)
    • 7.1.3 Global Package Substrates Production Market Share by Chips Type (2020-2031)
  • 7.2 Global Package Substrates Production Value by Chips Type (2020-2031)
    • 7.2.1 Global Package Substrates Production Value by Chips Type (2020-2025)
    • 7.2.2 Global Package Substrates Production Value by Chips Type (2026-2031)
    • 7.2.3 Global Package Substrates Production Value Market Share by Chips Type (2020-2031)
  • 7.3 Global Package Substrates Price by Chips Type (2020-2031)

8 Segment by Application

  • 8.1 Global Package Substrates Production by Application (2020-2031)
    • 8.1.1 Global Package Substrates Production by Application (2020-2025)
    • 8.1.2 Global Package Substrates Production by Application (2026-2031)
    • 8.1.3 Global Package Substrates Production Market Share by Application (2020-2031)
  • 8.2 Global Package Substrates Production Value by Application (2020-2031)
    • 8.2.1 Global Package Substrates Production Value by Application (2020-2025)
    • 8.2.2 Global Package Substrates Production Value by Application (2026-2031)
    • 8.2.3 Global Package Substrates Production Value Market Share by Application (2020-2031)
  • 8.3 Global Package Substrates Price by Application (2020-2031)

9 Key Companies Profiled

  • 9.1 Unimicron
    • 9.1.1 Unimicron Package Substrates Company Information
    • 9.1.2 Unimicron Package Substrates Product Portfolio
    • 9.1.3 Unimicron Package Substrates Production, Value, Price and Gross Margin (2020-2025)
    • 9.1.4 Unimicron Main Business and Markets Served
    • 9.1.5 Unimicron Recent Developments/Updates
  • 9.2 Ibiden
    • 9.2.1 Ibiden Package Substrates Company Information
    • 9.2.2 Ibiden Package Substrates Product Portfolio
    • 9.2.3 Ibiden Package Substrates Production, Value, Price and Gross Margin (2020-2025)
    • 9.2.4 Ibiden Main Business and Markets Served
    • 9.2.5 Ibiden Recent Developments/Updates
  • 9.3 Nan Ya PCB
    • 9.3.1 Nan Ya PCB Package Substrates Company Information
    • 9.3.2 Nan Ya PCB Package Substrates Product Portfolio
    • 9.3.3 Nan Ya PCB Package Substrates Production, Value, Price and Gross Margin (2020-2025)
    • 9.3.4 Nan Ya PCB Main Business and Markets Served
    • 9.3.5 Nan Ya PCB Recent Developments/Updates
  • 9.4 Shinko Electric Industries
    • 9.4.1 Shinko Electric Industries Package Substrates Company Information
    • 9.4.2 Shinko Electric Industries Package Substrates Product Portfolio
    • 9.4.3 Shinko Electric Industries Package Substrates Production, Value, Price and Gross Margin (2020-2025)
    • 9.4.4 Shinko Electric Industries Main Business and Markets Served
    • 9.4.5 Shinko Electric Industries Recent Developments/Updates
  • 9.5 Kinsus Interconnect Technology
    • 9.5.1 Kinsus Interconnect Technology Package Substrates Company Information
    • 9.5.2 Kinsus Interconnect Technology Package Substrates Product Portfolio
    • 9.5.3 Kinsus Interconnect Technology Package Substrates Production, Value, Price and Gross Margin (2020-2025)
    • 9.5.4 Kinsus Interconnect Technology Main Business and Markets Served
    • 9.5.5 Kinsus Interconnect Technology Recent Developments/Updates
  • 9.6 AT&S
    • 9.6.1 AT&S Package Substrates Company Information
    • 9.6.2 AT&S Package Substrates Product Portfolio
    • 9.6.3 AT&S Package Substrates Production, Value, Price and Gross Margin (2020-2025)
    • 9.6.4 AT&S Main Business and Markets Served
    • 9.6.5 AT&S Recent Developments/Updates
  • 9.7 Samsung Electro-Mechanics
    • 9.7.1 Samsung Electro-Mechanics Package Substrates Company Information
    • 9.7.2 Samsung Electro-Mechanics Package Substrates Product Portfolio
    • 9.7.3 Samsung Electro-Mechanics Package Substrates Production, Value, Price and Gross Margin (2020-2025)
    • 9.7.4 Samsung Electro-Mechanics Main Business and Markets Served
    • 9.7.5 Samsung Electro-Mechanics Recent Developments/Updates
  • 9.8 Kyocera
    • 9.8.1 Kyocera Package Substrates Company Information
    • 9.8.2 Kyocera Package Substrates Product Portfolio
    • 9.8.3 Kyocera Package Substrates Production, Value, Price and Gross Margin (2020-2025)
    • 9.8.4 Kyocera Main Business and Markets Served
    • 9.8.5 Kyocera Recent Developments/Updates
  • 9.9 Toppan
    • 9.9.1 Toppan Package Substrates Company Information
    • 9.9.2 Toppan Package Substrates Product Portfolio
    • 9.9.3 Toppan Package Substrates Production, Value, Price and Gross Margin (2020-2025)
    • 9.9.4 Toppan Main Business and Markets Served
    • 9.9.5 Toppan Recent Developments/Updates
  • 9.10 Zhen Ding Technology
    • 9.10.1 Zhen Ding Technology Package Substrates Company Information
    • 9.10.2 Zhen Ding Technology Package Substrates Product Portfolio
    • 9.10.3 Zhen Ding Technology Package Substrates Production, Value, Price and Gross Margin (2020-2025)
    • 9.10.4 Zhen Ding Technology Main Business and Markets Served
    • 9.10.5 Zhen Ding Technology Recent Developments/Updates
  • 9.11 Daeduck Electronics
    • 9.11.1 Daeduck Electronics Package Substrates Company Information
    • 9.11.2 Daeduck Electronics Package Substrates Product Portfolio
    • 9.11.3 Daeduck Electronics Package Substrates Production, Value, Price and Gross Margin (2020-2025)
    • 9.11.4 Daeduck Electronics Main Business and Markets Served
    • 9.11.5 Daeduck Electronics Recent Developments/Updates
  • 9.12 Zhuhai Access Semiconductor
    • 9.12.1 Zhuhai Access Semiconductor Package Substrates Company Information
    • 9.12.2 Zhuhai Access Semiconductor Package Substrates Product Portfolio
    • 9.12.3 Zhuhai Access Semiconductor Package Substrates Production, Value, Price and Gross Margin (2020-2025)
    • 9.12.4 Zhuhai Access Semiconductor Main Business and Markets Served
    • 9.12.5 Zhuhai Access Semiconductor Recent Developments/Updates
  • 9.13 LG InnoTek
    • 9.13.1 LG InnoTek Package Substrates Company Information
    • 9.13.2 LG InnoTek Package Substrates Product Portfolio
    • 9.13.3 LG InnoTek Package Substrates Production, Value, Price and Gross Margin (2020-2025)
    • 9.13.4 LG InnoTek Main Business and Markets Served
    • 9.13.5 LG InnoTek Recent Developments/Updates
  • 9.14 Shennan Circuit (GreaTech Substrates Co., Ltd. (GTS))
    • 9.14.1 Shennan Circuit Package Substrates Company Information
    • 9.14.2 Shennan Circuit Package Substrates Product Portfolio
    • 9.14.3 Shennan Circuit Package Substrates Production, Value, Price and Gross Margin (2020-2025)
    • 9.14.4 Shennan Circuit Main Business and Markets Served
    • 9.14.5 Shennan Circuit Recent Developments/Updates
  • 9.15 Shenzhen Fastprint Circuit Tech
    • 9.15.1 Shenzhen Fastprint Circuit Tech Package Substrates Company Information
    • 9.15.2 Shenzhen Fastprint Circuit Tech Package Substrates Product Portfolio
    • 9.15.3 Shenzhen Fastprint Circuit Tech Package Substrates Production, Value, Price and Gross Margin (2020-2025)
    • 9.15.4 Shenzhen Fastprint Circuit Tech Main Business and Markets Served
    • 9.15.5 Shenzhen Fastprint Circuit Tech Recent Developments/Updates
  • 9.16 Korea Circuit
    • 9.16.1 Korea Circuit Package Substrates Company Information
    • 9.16.2 Korea Circuit Package Substrates Product Portfolio
    • 9.16.3 Korea Circuit Package Substrates Production, Value, Price and Gross Margin (2020-2025)
    • 9.16.4 Korea Circuit Main Business and Markets Served
    • 9.16.5 Korea Circuit Recent Developments/Updates
  • 9.17 FICT LIMITED
    • 9.17.1 FICT LIMITED Package Substrates Company Information
    • 9.17.2 FICT LIMITED Package Substrates Product Portfolio
    • 9.17.3 FICT LIMITED Package Substrates Production, Value, Price and Gross Margin (2020-2025)
    • 9.17.4 FICT LIMITED Main Business and Markets Served
    • 9.17.5 FICT LIMITED Recent Developments/Updates
  • 9.18 AKM Meadville
    • 9.18.1 AKM Meadville Package Substrates Company Information
    • 9.18.2 AKM Meadville Package Substrates Product Portfolio
    • 9.18.3 AKM Meadville Package Substrates Production, Value, Price and Gross Margin (2020-2025)
    • 9.18.4 AKM Meadville Main Business and Markets Served
    • 9.18.5 AKM Meadville Recent Developments/Updates
  • 9.19 Shenzhen Hemei Jingyi Semiconductor Technology
    • 9.19.1 Shenzhen Hemei Jingyi Semiconductor Technology Package Substrates Company Information
    • 9.19.2 Shenzhen Hemei Jingyi Semiconductor Technology Package Substrates Product Portfolio
    • 9.19.3 Shenzhen Hemei Jingyi Semiconductor Technology Package Substrates Production, Value, Price and Gross Margin (2020-2025)
    • 9.19.4 Shenzhen Hemei Jingyi Semiconductor Technology Main Business and Markets Served
    • 9.19.5 Shenzhen Hemei Jingyi Semiconductor Technology Recent Developments/Updates
  • 9.20 Simmtech
    • 9.20.1 Simmtech Package Substrates Company Information
    • 9.20.2 Simmtech Package Substrates Product Portfolio
    • 9.20.3 Simmtech Package Substrates Production, Value, Price and Gross Margin (2020-2025)
    • 9.20.4 Simmtech Main Business and Markets Served
    • 9.20.5 Simmtech Recent Developments/Updates
  • 9.21 HOREXS
    • 9.21.1 HOREXS Package Substrates Company Information
    • 9.21.2 HOREXS Package Substrates Product Portfolio
    • 9.21.3 HOREXS Package Substrates Production, Value, Price and Gross Margin (2020-2025)
    • 9.21.4 HOREXS Main Business and Markets Served
  • 9.22 ASE Material
    • 9.22.1 ASE Material Package Substrates Company Information
    • 9.22.2 ASE Material Package Substrates Product Portfolio
    • 9.22.3 ASE Material Package Substrates Production, Value, Price and Gross Margin (2020-2025)
    • 9.22.4 ASE Material Main Business and Markets Served
    • 9.22.5 ASE Material Recent Developments/Updates
  • 9.23 PPt
    • 9.23.1 PPt Package Substrates Company Information
    • 9.23.2 PPt Package Substrates Product Portfolio
    • 9.23.3 PPt Package Substrates Production, Value, Price and Gross Margin (2020-2025)
    • 9.23.4 PPt Main Business and Markets Served
  • 9.24 MiSpak Technology
    • 9.24.1 MiSpak Technology Package Substrates Company Information
    • 9.24.2 MiSpak Technology Package Substrates Product Portfolio
    • 9.24.3 MiSpak Technology Package Substrates Production, Value, Price and Gross Margin (2020-2025)
    • 9.24.4 MiSpak Technology Main Business and Markets Served
  • 9.25 QDOS
    • 9.25.1 QDOS Package Substrates Company Information
    • 9.25.2 QDOS Package Substrates Product Portfolio
    • 9.25.3 QDOS Package Substrates Production, Value, Price and Gross Margin (2020-2025)
    • 9.25.4 QDOS Main Business and Markets Served

10 Industry Chain and Sales Channels Analysis

  • 10.1 Package Substrates Industry Chain Analysis
  • 10.2 Package Substrates Raw Material Supply Analysis
    • 10.2.1 Key Raw Materials
    • 10.2.2 Raw Materials Key Suppliers
  • 10.3 Package Substrates Production Mode & Process Analysis
    • 10.3.1 ABF Substrates Technology Roadmap
    • 10.3.2 BT Substrates Technology Roadmap
    • 10.3.3 MIS Substrates Technology Roadmap
  • 10.4 Package Substrates Sales and Marketing
  • 10.5 Package Substrates Customer Analysis

11 Package Substrates Market Dynamics

  • 11.1 Package Substrates Industry Trends
  • 11.2 Package Substrates Market Drivers
  • 11.3 Package Substrates Market Challenges
  • 11.4 Package Substrates Market Restraints

12 Research Findings and Conclusion

13 Methodology and Data Source

  • 13.1 Methodology/Research Approach
    • 13.1.1 Research Programs/Design
    • 13.1.2 Market Size Estimation
    • 13.1.3 Market Breakdown and Data Triangulation
  • 13.2 Data Source
    • 13.2.1 Secondary Sources
    • 13.2.2 Primary Sources
  • 13.3 Author List
  • 13.4 Disclaimer
  • Table 1. Global Package Substrates Market Value by Type, (US$ Million) & (2024 VS 2031)
  • Table 2. Global Package Substrates Market Value by Material Type, (US$ Million) & (2024 VS 2031)
  • Table 3. Global Package Substrates Market Value by Chips Type, (US$ Million) & (2024 VS 2031)
  • Table 4. Global Package Substrates Market Value by Application, (US$ Million) & (2024 VS 2031)
  • Table 5. Global Package Substrates Production by Manufacturers (2020-2025) & (Thousand Square Meters)
  • Table 6. Global Package Substrates Production Market Share by Manufacturers (2020-2025)
  • Table 7. Global Package Substrates Production Value by Manufacturers (2020-2025) & (US$ Million)
  • Table 8. Global Package Substrates Production Value Share by Manufacturers (2020-2025)
  • Table 9. Global Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Production Value in Package Substrates as of 2024)
  • Table 10. Global Market Package Substrates Average Price by Manufacturers (USD/Square Meter) & (2020-2025)
  • Table 11. Global Key Manufacturers of Package Substrates, Manufacturing Sites & Headquarters
  • Table 12. Global Key Manufacturers of Package Substrates, Product Type & Application
  • Table 13. Global Key Manufacturers of Package Substrates, Date of Enter into This Industry
  • Table 14. Global Package Substrates Manufacturers Market Concentration Ratio (CR5 and HHI)
  • Table 15. Mergers & Acquisitions, Expansion Plans
  • Table 16. Global Package Substrates Production Value Growth Rate by Region: 2020 VS 2024 VS 2031 (US$ Million)
  • Table 17. Global Package Substrates Production Value (US$ Million) by Region (2020-2025)
  • Table 18. Global Package Substrates Production Value Market Share by Region (2020-2025)
  • Table 19. Global Package Substrates Production Value (US$ Million) Forecast by Region (2026-2031)
  • Table 20. Global Package Substrates Production Value Market Share Forecast by Region (2026-2031)
  • Table 21. Global Package Substrates Production Comparison by Region: 2020 VS 2024 VS 2031 (Thousand Square Meters)
  • Table 22. Global Package Substrates Production (Thousand Square Meters) by Region (2020-2025)
  • Table 23. Global Package Substrates Production Market Share by Region (2020-2025)
  • Table 24. Global Package Substrates Production (Thousand Square Meters) Forecast by Region (2026-2031)
  • Table 25. Global Package Substrates Production Market Share Forecast by Region (2026-2031)
  • Table 26. Global Package Substrates Market Average Price (USD/Square Meter) by Region (2020-2025)
  • Table 27. Global Package Substrates Market Average Price (USD/Square Meter) by Region (2026-2031)
  • Table 28. Global Package Substrates Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (Thousand Square Meters)
  • Table 29. Global Package Substrates Consumption by Region (2020-2025) & (Thousand Square Meters)
  • Table 30. Global Package Substrates Consumption Market Share by Region (2020-2025)
  • Table 31. Global Package Substrates Forecasted Consumption by Region (2026-2031) & (Thousand Square Meters)
  • Table 32. Global Package Substrates Forecasted Consumption Market Share by Region (2020-2025)
  • Table 33. Global Package Substrates Production (Thousand Square Meters) by Type (2020-2025)
  • Table 34. Global Package Substrates Production (Thousand Square Meters) by Type (2026-2031)
  • Table 35. Global Package Substrates Production Market Share by Type (2020-2025)
  • Table 36. Global Package Substrates Production Market Share by Type (2026-2031)
  • Table 37. Global Package Substrates Production Value (US$ Million) by Type (2020-2025)
  • Table 38. Global Package Substrates Production Value (US$ Million) by Type (2026-2031)
  • Table 39. Global Package Substrates Production Value Market Share by Type (2020-2025)
  • Table 40. Global Package Substrates Production Value Market Share by Type (2026-2031)
  • Table 41. Global Package Substrates Price (USD/Square Meter) by Type (2020-2025)
  • Table 42. Global Package Substrates Price (USD/Square Meter) by Type (2026-2031)
  • Table 43. Global Package Substrates Production (Thousand Square Meters) by Material Type (2020-2025)
  • Table 44. Global Package Substrates Production (Thousand Square Meters) by Material Type (2026-2031)
  • Table 45. Global Package Substrates Production Market Share by Material Type (2020-2025)
  • Table 46. Global Package Substrates Production Market Share by Material Type (2026-2031)
  • Table 47. Global Package Substrates Production Value (US$ Million) by Material Type (2020-2025)
  • Table 48. Global Package Substrates Production Value (US$ Million) by Material Type (2026-2031)
  • Table 49. Global Package Substrates Production Value Market Share by Material Type (2020-2025)
  • Table 50. Global Package Substrates Production Value Market Share by Material Type (2026-2031)
  • Table 51. Global Package Substrates Price (USD/Square Meter) by Material Type (2020-2025)
  • Table 52. Global Package Substrates Price (USD/Square Meter) by Material Type (2026-2031)
  • Table 53. Global Package Substrates Production (Thousand Square Meters) by Chips Type (2020-2025)
  • Table 54. Global Package Substrates Production (Thousand Square Meters) by Chips Type (2026-2031)
  • Table 55. Global Package Substrates Production Market Share by Chips Type (2020-2025)
  • Table 56. Global Package Substrates Production Market Share by Chips Type (2026-2031)
  • Table 57. Global Package Substrates Production Value (US$ Million) by Chips Type (2020-2025)
  • Table 58. Global Package Substrates Production Value (US$ Million) by Chips Type (2026-2031)
  • Table 59. Global Package Substrates Production Value Market Share by Chips Type (2020-2025)
  • Table 60. Global Package Substrates Production Value Market Share by Chips Type (2026-2031)
  • Table 61. Global Package Substrates Price (USD/Square Meter) by Chips Type (2020-2025)
  • Table 62. Global Package Substrates Price (USD/Square Meter) by Chips Type (2026-2031)
  • Table 63. Global Package Substrates Production (Thousand Square Meters) by Application (2020-2025)
  • Table 64. Global Package Substrates Production (Thousand Square Meters) by Application (2026-2031)
  • Table 65. Global Package Substrates Production Market Share by Application (2020-2025)
  • Table 66. Global Package Substrates Production Market Share by Application (2026-2031)
  • Table 67. Global Package Substrates Production Value (US$ Million) by Application (2020-2025)
  • Table 68. Global Package Substrates Production Value (US$ Million) by Application (2026-2031)
  • Table 69. Global Package Substrates Production Value Market Share by Application (2020-2025)
  • Table 70. Global Package Substrates Production Value Market Share by Application (2026-2031)
  • Table 71. Global Package Substrates Price (USD/Square Meter) by Application (2020-2025)
  • Table 72. Global Package Substrates Price (USD/Square Meter) by Application (2026-2031)
  • Table 73. Unimicron Package Substrates Company Information
  • Table 74. Unimicron Package Substrates Specification and Application
  • Table 75. Unimicron Package Substrates Production (Thousand Square Meters), Value (US$ Million), Price (USD/Square Meter) and Gross Margin (2020-2025)
  • Table 76. Unimicron Main Business and Markets Served
  • Table 77. Unimicron Recent Developments/Updates
  • Table 78. Ibiden Package Substrates Company Information
  • Table 79. Ibiden Package Substrates Production (Thousand Square Meters), Value (US$ Million), Price (USD/Square Meter) and Gross Margin (2020-2025)
  • Table 80. Ibiden Main Business and Markets Served
  • Table 81. Ibiden Recent Developments/Updates
  • Table 82. Nan Ya PCB Package Substrates Company Information
  • Table 83. Nan Ya PCB Package Substrates Specification and Application
  • Table 84. Nan Ya PCB Package Substrates Production (Thousand Square Meters), Value (US$ Million), Price (USD/Square Meter) and Gross Margin (2020-2025)
  • Table 85. Nan Ya PCB Main Business and Markets Served
  • Table 86. Nan Ya PCB Recent Developments/Updates
  • Table 87. Shinko Electric Industries Package Substrates Company Information
  • Table 88. Shinko Electric Industries Package Substrates Specification and Application
  • Table 89. Shinko Electric Industries Package Substrates Production (Thousand Square Meters), Value (US$ Million), Price (USD/Square Meter) and Gross Margin (2020-2025)
  • Table 90. Shinko Electric Industries Main Business and Markets Served
  • Table 91. Shinko Electric Industries Recent Developments/Updates
  • Table 92. Kinsus Interconnect Technology Package Substrates Company Information
  • Table 93. Kinsus Interconnect Technology Package Substrates Specification and Application
  • Table 94. Kinsus Interconnect Technology Package Substrates Production (Thousand Square Meters), Value (US$ Million), Price (USD/Square Meter) and Gross Margin (2020-2025)
  • Table 95. Kinsus Interconnect Technology Main Business and Markets Served
  • Table 96. Kinsus Interconnect Technology Recent Developments/Updates
  • Table 97. AT&S Package Substrates Company Information
  • Table 98. AT&S Package Substrates Specification and Application
  • Table 99. AT&S Package Substrates Production (Thousand Square Meters), Value (US$ Million), Price (USD/Square Meter) and Gross Margin (2020-2025)
  • Table 100. AT&S Main Business and Markets Served
  • Table 101. AT&S Recent Developments/Updates
  • Table 102. Samsung Electro-Mechanics Package Substrates Company Information
  • Table 103. Samsung Electro-Mechanics Package Substrates Specification and Application
  • Table 104. Samsung Electro-Mechanics Package Substrates Production (Thousand Square Meters), Value (US$ Million), Price (USD/Square Meter) and Gross Margin (2020-2025)
  • Table 105. Samsung Electro-Mechanics Main Business and Markets Served
  • Table 106. Samsung Electro-Mechanics Recent Developments/Updates
  • Table 107. Kyocera Package Substrates Company Information
  • Table 108. Kyocera Package Substrates Specification and Application
  • Table 109. Kyocera Package Substrates Production (Thousand Square Meters), Value (US$ Million), Price (USD/Square Meter) and Gross Margin (2020-2025)
  • Table 110. Kyocera Main Business and Markets Served
  • Table 111. Kyocera Recent Developments/Updates
  • Table 112. Toppan Package Substrates Company Information
  • Table 113. Toppan Package Substrates Specification and Application
  • Table 114. Toppan Package Substrates Production (Thousand Square Meters), Value (US$ Million), Price (USD/Square Meter) and Gross Margin (2020-2025)
  • Table 115. Toppan Main Business and Markets Served
  • Table 116. Toppan Recent Developments/Updates
  • Table 117. Zhen Ding Technology Package Substrates Company Information
  • Table 118. Zhen Ding Technology Package Substrates Specification and Application
  • Table 119. Zhen Ding Technology Package Substrates Production (Thousand Square Meters), Value (US$ Million), Price (USD/Square Meter) and Gross Margin (2020-2025)
  • Table 120. Zhen Ding Technology Main Business and Markets Served
  • Table 121. Zhen Ding Technology Recent Developments/Updates
  • Table 122. Daeduck Electronics Package Substrates Company Information
  • Table 123. Daeduck Electronics Package Substrates Specification and Application
  • Table 124. Daeduck Electronics Package Substrates Production (Thousand Square Meters), Value (US$ Million), Price (USD/Square Meter) and Gross Margin (2020-2025)
  • Table 125. Daeduck Electronics Main Business and Markets Served
  • Table 126. Daeduck Electronics Recent Developments/Updates
  • Table 127. Zhuhai Access Semiconductor Package Substrates Company Information
  • Table 128. Zhuhai Access Semiconductor Package Substrates Specification and Application
  • Table 129. Zhuhai Access Semiconductor Package Substrates Production (Thousand Square Meters), Value (US$ Million), Price (USD/Square Meter) and Gross Margin (2020-2025)
  • Table 130. Zhuhai Access Semiconductor Main Business and Markets Served
  • Table 131. Zhuhai Access Semiconductor Recent Developments/Updates
  • Table 132. LG InnoTek Package Substrates Company Information
  • Table 133. LG InnoTek Package Substrates Specification and Application
  • Table 134. LG InnoTek Package Substrates Production (Thousand Square Meters), Value (US$ Million), Price (USD/Square Meter) and Gross Margin (2020-2025)
  • Table 135. LG InnoTek Main Business and Markets Served
  • Table 136. LG InnoTek Recent Developments/Updates
  • Table 137. Shennan Circuit Package Substrates Company Information
  • Table 138. Shennan Circuit Package Substrates Specification and Application
  • Table 139. Shennan Circuit Package Substrates Production (Thousand Square Meters), Value (US$ Million), Price (USD/Square Meter) and Gross Margin (2020-2025)
  • Table 140. Shennan Circuit Main Business and Markets Served
  • Table 141. Shennan Circuit Recent Developments/Updates
  • Table 142. Shenzhen Fastprint Circuit Tech Package Substrates Company Information
  • Table 143. Shenzhen Fastprint Circuit Tech Package Substrates Specification and Application
  • Table 144. Shenzhen Fastprint Circuit Tech Package Substrates Production (Thousand Square Meters), Value (US$ Million), Price (USD/Square Meter) and Gross Margin (2020-2025)
  • Table 145. Shenzhen Fastprint Circuit Tech Main Business and Markets Served
  • Table 146. Shenzhen Fastprint Circuit Tech Recent Developments/Updates
  • Table 147. Korea Circuit Package Substrates Company Information
  • Table 148. Korea Circuit Package Substrates Specification and Application
  • Table 149. Korea Circuit Package Substrates Production (Thousand Square Meters), Value (US$ Million), Price (USD/Square Meter) and Gross Margin (2020-2025)
  • Table 150. Korea Circuit Main Business and Markets Served
  • Table 151. Korea Circuit Recent Developments/Updates
  • Table 152. FICT LIMITED Package Substrates Company Information
  • Table 153. FICT LIMITED Package Substrates Specification and Application
  • Table 154. FICT LIMITED Package Substrates Production (Thousand Square Meters), Value (US$ Million), Price (USD/Square Meter) and Gross Margin (2020-2025)
  • Table 155. FICT LIMITED Main Business and Markets Served
  • Table 156. FICT LIMITED Recent Developments/Updates
  • Table 157. AKM Meadville Package Substrates Company Information
  • Table 158. AKM Meadville Package Substrates Specification and Application
  • Table 159. AKM Meadville Package Substrates Production (Thousand Square Meters), Value (US$ Million), Price (USD/Square Meter) and Gross Margin (2020-2025)
  • Table 160. AKM Meadville Main Business and Markets Served
  • Table 161. AKM Meadville Recent Developments/Updates
  • Table 162. Shenzhen Hemei Jingyi Semiconductor Technology Package Substrates Company Information
  • Table 163. Shenzhen Hemei Jingyi Semiconductor Technology Package Substrates Specification and Application
  • Table 164. Shenzhen Hemei Jingyi Semiconductor Technology Package Substrates Production (Thousand Square Meters), Value (US$ Million), Price (USD/Square Meter) and Gross Margin (2020-2025)
  • Table 165. Shenzhen Hemei Jingyi Semiconductor Technology Main Business and Markets Served
  • Table 166. Shenzhen Hemei Jingyi Semiconductor Technology Recent Developments/Updates
  • Table 167. Simmtech Package Substrates Company Information
  • Table 168. Simmtech Package Substrates Specification and Application
  • Table 169. Simmtech Package Substrates Production (Thousand Square Meters), Value (US$ Million), Price (USD/Square Meter) and Gross Margin (2020-2025)
  • Table 170. Simmtech Main Business and Markets Served
  • Table 171. Simmtech Recent Developments/Updates
  • Table 172. HOREXS Package Substrates Company Information
  • Table 173. HOREXS Package Substrates Specification and Application
  • Table 174. HOREXS Package Substrates Production (Thousand Square Meters), Value (US$ Million), Price (USD/Square Meter) and Gross Margin (2020-2025)
  • Table 175. HOREXS Main Business and Markets Served
  • Table 176. ASE Material Package Substrates Company Information
  • Table 177. ASE Material Package Substrates Specification and Application
  • Table 178. ASE Material Package Substrates Production (Thousand Square Meters), Value (US$ Million), Price (USD/Square Meter) and Gross Margin (2020-2025)
  • Table 179. ASE Material Main Business and Markets Served
  • Table 180. ASE Material Recent Developments/Updates
  • Table 181. PPt Package Substrates Company Information
  • Table 182. PPt Package Substrates Production (Thousand Square Meters), Value (US$ Million), Price (USD/Square Meter) and Gross Margin (2020-2025)
  • Table 183. PPt Main Business and Markets Served
  • Table 184. MiSpak Technology Package Substrates Company Information
  • Table 185. MiSpak Technology MIS Substrates Product Offerings
  • Table 186. MiSpak Technology Package Substrates Production (Thousand Square Meters), Value (US$ Million), Price (USD/Square Meter) and Gross Margin (2020-2025)
  • Table 187. MiSpak Technology Main Business and Markets Served
  • Table 188. QDOS Package Substrates Company Information
  • Table 189. QDOS Package Substrates Specification and Application
  • Table 190. QDOS Package Substrates Production (Thousand Square Meters), Value (US$ Million), Price (USD/Square Meter) and Gross Margin (2020-2025)
  • Table 191. QDOS Main Business and Markets Served
  • Table 192. Key Raw Materials Lists
  • Table 193. Raw Materials Key Suppliers Lists
  • Table 194. ABF Substrates Technology Roadmap
  • Table 195. BT Substrates Technology Roadmap
  • Table 196. Package Substrates Customers List
  • Table 197. Package Substrates Market Trends
  • Table 198. Package Substrates Market Drivers
  • Table 199. Package Substrates Market Drivers
  • Table 200. Package Substrates Market Challenges
  • Table 201. Package Substrates Market Restraints
  • Table 202. Research Programs/Design for This Report
  • Table 203. Key Data Information from Secondary Sources
  • Table 204. Key Data Information from Primary Sources
  • Table 205. Authors List of This Report

List of Figures

  • Figure 1. Product Picture of Package Substrates
  • Figure 2. Global Package Substrates Market Value by Type, (US$ Million) & (2024 VS 2031)
  • Figure 3. Global Package Substrates Market Share by Type: 2024 VS 2031
  • Figure 4. FCBGA Product Picture
  • Figure 5. FCCSP Product Picture
  • Figure 6. WB-BGA Product Picture
  • Figure 7. WB CSP Product Picture
  • Figure 8. Plastic BGA Substrate
  • Figure 9. SiP (System In Package) Substrate
  • Figure 10. Global Package Substrates Market Value by Material Type, (US$ Million) & (2020-2031)
  • Figure 11. Global Package Substrates Market Share by Material Type: 2024 VS 2031
  • Figure 12. ABF Substrate Product Picture
  • Figure 13. FCCSP Product Picture
  • Figure 14. MIS Substrates Product Picture
  • Figure 15. Single-layer MIS Picture
  • Figure 16. Single-layer MIS Process
  • Figure 17. MiSpak 2-layer MIS Process
  • Figure 18. MiSpak Multi -layer MIS Process
  • Figure 19. PPt 1 & 2 layer MIS Process
  • Figure 20. Global Package Substrates Market Value by Chips Type, (US$ Million) & (2020-2031)
  • Figure 21. Global Package Substrates Market Share by Chips Type: 2024 VS 2031
  • Figure 22. Memory Substrate Product Picture
  • Figure 23. Global Package Substrates Market Value by Application, (US$ Million) & (2024 VS 2031)
  • Figure 24. Global Package Substrates Market Share by Application: 2024 VS 2031
  • Figure 25. PCs: ABF Substrates are widely used in PC's CPU/GPU/Chipset.
  • Figure 26. Server & Data Center
  • Figure 27. HPC/AI Chips
  • Figure 28. Communication
  • Figure 29. Smart Phone
  • Figure 30. Wearable and Consumer Electronics
  • Figure 31. Automotive Electronics
  • Figure 32. Global Package Substrates Production Value (US$ Million), 2020 VS 2024 VS 2031
  • Figure 33. Global Package Substrates Production Value (US$ Million) & (2020-2031)
  • Figure 34. Global Package Substrates Production Capacity (Thousand Square Meters) & (2020-2031)
  • Figure 35. Global Package Substrates Production (Thousand Square Meters) & (2020-2031)
  • Figure 36. Global Package Substrates Average Price (USD/Square Meter) & (2020-2031)
  • Figure 37. Package Substrates Report Years Considered
  • Figure 38. Package Substrates Production Share by Manufacturers in 2024
  • Figure 39. Package Substrates Production Value Share by Manufacturers in 2024
  • Figure 40. The Global 5 and 10 Largest Players: Market Share by Package Substrates Revenue in 2024
  • Figure 41. Global Package Substrates Production Value Comparison by Region: 2020 VS 2024 VS 2031 (US$ Million)
  • Figure 42. Global Package Substrates Production Value Market Share by Region: 2020 VS 2024 VS 2031
  • Figure 43. Global Package Substrates Production Comparison by Region: 2020 VS 2024 VS 2031 (Thousand Square Meters)
  • Figure 44. Global Package Substrates Production Market Share by Region: 2020 VS 2024 VS 2031
  • Figure 45. Japan Package Substrates Production Value (US$ Million) Growth Rate (2020-2031)
  • Figure 46. South Korea Package Substrates Production Value (US$ Million) Growth Rate (2020-2031)
  • Figure 47. China Taiwan Package Substrates Production Value (US$ Million) Growth Rate (2020-2031)
  • Figure 48. China Mainland Package Substrates Production Value (US$ Million) Growth Rate (2020-2031)
  • Figure 49. Southeast Asia Package Substrates Production Value (US$ Million) Growth Rate (2020-2031)
  • Figure 50. Global Package Substrates Consumption by Region: 2020 VS 2024 VS 2031 (Thousand Square Meters)
  • Figure 51. Global Package Substrates Consumption Market Share by Region: 2020 VS 2024 VS 2031
  • Figure 52. North America Package Substrates Consumption and Growth Rate (2020-2031) & (Thousand Square Meters)
  • Figure 53. Europe Package Substrates Consumption and Growth Rate (2020-2031) & (Thousand Square Meters)
  • Figure 54. China Package Substrates Consumption and Growth Rate (2020-2031) & (Thousand Square Meters)
  • Figure 55. Japan Package Substrates Consumption and Growth Rate (2020-2031) & (Thousand Square Meters)
  • Figure 56. South Korea Package Substrates Consumption and Growth Rate (2020-2031) & (Thousand Square Meters)
  • Figure 57. China Taiwan Package Substrates Consumption and Growth Rate (2020-2031) & (Thousand Square Meters)
  • Figure 58. Southeast Asia Package Substrates Consumption and Growth Rate (2020-2031) & (Thousand Square Meters)
  • Figure 59. Global Production Market Share of Package Substrates by Type (2020-2031)
  • Figure 60. Global Production Value Market Share of Package Substrates by Type (2020-2031)
  • Figure 61. Global Package Substrates Price (USD/Square Meter) by Type (2020-2031)
  • Figure 62. Global Production Market Share of Package Substrates by Material Type (2020-2031)
  • Figure 63. Global Production Value Market Share of Package Substrates by Material Type (2020-2031)
  • Figure 64. Global Package Substrates Price (USD/Square Meter) by Material Type (2020-2031)
  • Figure 65. Global Production Market Share of Package Substrates by Chips Type (2020-2031)
  • Figure 66. Global Production Value Market Share of Package Substrates by Chips Type (2020-2031)
  • Figure 67. Global Package Substrates Price (USD/Square Meter) by Chips Type (2020-2031)
  • Figure 68. Global Production Market Share of Package Substrates by Application (2020-2031)
  • Figure 69. Global Production Value Market Share of Package Substrates by Application (2020-2031)
  • Figure 70. Global Package Substrates Price (USD/Square Meter) by Application (2020-2031)
  • Figure 71. PPt C2iM Product Line Up
  • Figure 72. C2iM (xQFN) Advantages
  • Figure 73. PPt MIS Technology Roadmap
  • Figure 74. PPt MIS Material Roadmap
  • Figure 75. PPt MIS Surface Finish Solution
  • Figure 76. Package Substrates Value Chain
  • Figure 77. MiSpak Technology MIS Technology Roadmap
  • Figure 78. MIS Substrates Production Process
  • Figure 79. Bottom-up and Top-down Approaches for This Report
  • Figure 80. Data Triangulation