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汽车传感器芯片产业（2023）
市场调查报告书
商品编码
1275651

汽车传感器芯片产业（2023）

Automotive Sensor Chip Industry Report, 2023
出版日期: | 出版商: ResearchInChina | 英文 360 Pages | 商品交期: 最快1-2个工作天内

价格
简介目录

传感器芯片行业调查：传感器芯片在“感知权重提升”的道路上，正进入快速迭代演进的新阶段。

2023上海车展上，“重感知、轻地图”、“城市NOA”、“BEV+Transformer”等众多主机厂和Tier 1供应商纷纷亮相，为加速布局化地图，消除对高精地图的依赖，可以看到“重感知，轻地图”的技术路线已经发生了转变。

在“感知更多”技术路线的推动下，汽车传感器发挥着越来越重要的作用激光雷达、4D成像雷达、8MP CMOS图像传感器（CIS）等新产品在汽车领域迅速涌现，带动传感器需求芯片。 汽车传感器与芯片技术正进入快速迭代演进、快速降本的新阶段。

雷达芯片：中国厂商大跃进，打破海外垄断

汽车雷达芯片市场由 NXP、Infineon 和 TI 等公司主导。 在中国厂商中，加特兰半导体是最早与20多家汽车製造商合作的厂商之一，累计出货量超过300万台，覆盖70多款乘用车车型，其中三分之一为海外客户。 .增加。

4D雷达也在快速渗透中高端车型和自动驾驶车型。 BMW、GM等整车厂和Continental、ZF等Tier 1供应商已在该领域完善布局。 理想汽车、长安汽车、比亚迪汽车、特斯拉汽车、吉利汽车等中国品牌已指定或创建 4D 雷达应用。 搭载4D成像雷达“凤凰”的特斯拉下一代自动驾驶平台“HW4.0”成为市场拐点。

Infineon和NXP在传统雷达芯片领域几乎占据垄断地位。 4G成像雷达作为雷达的主要发展方向，可以更好地服务于城市NOA等高级自动驾驶功能。 中国厂商也在加速布局4D雷达芯片。

Cartera：2022年12月，我们发布了实现4D成像雷达功能，推动L3+自动驾驶发展的下一代新型雷达SoC家族“Andes”。 该系列具有以下主要特点：

  • 采用 22nm 工艺的 4T4R SoC
  • 内置多核 CPU，包括 DSP（数字信号处理器）和 RSP（雷达信号处理器）
  • RGMII/SMGII 千兆以太网
  • 支持灵活的级联
  • 符合 ASIL-B 和 AEC-Q100 1 级要求

牧野微电子：一家专注于4D高精度成像雷达的4D雷达初创公司。 2022年12月，成功研发首款77G雷达芯片；2023年3月，通过“1S0-26262 ASL-D功能安全认证”；进行芯片采购、芯片商业化、生产和交付给Alpha客户。

LiDAR 芯片：向 SoC 集成迈进

2022年后，激光雷达将更多地应用于汽车，中国约有16.4万辆乘用车配备了激光雷达。 LiDAR常用于L2+++乘用车（高速公路+市区NOA功能），多为25万元以上的高端新能源车。 预计到2026年，中国乘用车将安装366.6万个激光雷达。 为一辆 15 万载客量的车辆配备 LiDAR 需要更大的成本降低，这在短期内可能难以实现。

2023年激光雷达的价格竞争将开始，出货价格将低迷至500美元左右，但相比4D雷达的价格（200-300美元），激光雷达将基于SoC，即还是比较高。它会变得更集成，更便宜。

(1) 与收发芯片集成

要在汽车中广泛普及激光雷达，首先需要控製成本。 由于各家厂商的激光雷达发展路线不同，因此存在成本差异。 但收发芯片是核心成本因素 与收发芯片集成是降低 LiDAR 成本的有效途径。

  • 发射器芯片：用集成模块代替分立模块可以减少超过 70% 的物料清单和调试成本；
  • 接收芯片：SPAD 解决方案的小尺寸有利于与读出电路集成，从而进一步降低成本。

激光雷达芯片是国外厂商擅长的技术，但近年来中国厂商也在致力于相关技术的研发。 发射芯片方面，中国厂商已经开始上游VCSEL芯片设计，接收芯片方面，中国初创企业正在向SPAD和SiPM芯片进军，其中有QuantaEye和FortSense进行SPAD/SiPM的研发，我正在努力。

FortSense：2019年开始布局SPAD激光雷达芯片研发，2021年流片，2022年9月通过汽车认证。 获得 5 家以上 OEM LiDAR 首选供应商的认可。 2022年12月C轮融资结束，募集资金将用于激光雷达芯片的研发。

Hesai Technology：近年来，我们一直专注于激光雷达芯片的研发。 Hesai Technology于2018年开始研发LiDAR SoC，并製定了开发多代芯片型收发器（V1.0、V1.5、V2.0、V3.0等）的战略。 其中，对于V2.0，接收端由SiPM升级为SPAD阵列，集成CMOS工艺下的探测器和电路功能模块，对于V3.0架构，VCSEL面阵辅助芯片，有望完成开发基于 SPAD 检测器的面阵 SoC。

Hesai远距离半固态激光雷达AT128：采用自主研发的车用芯片。 它在一块电路板上集成了 128 个扫描通道，用于基于芯片的固态电子扫描。

Hesai新一代全固态填隙雷达FT120：在一颗芯片上集成了由数万个激光接收通道组成的面阵，激光的发射和接收完全在芯片内进行。 它的零件比传统激光雷达少得多，而且比 AT 系列更具成本效益。

(2)单芯片激光雷达方案

为了降低激光雷达的成本，需要采用光子集成工艺来集成各种光电器件，正从异质材料集成向单芯片集成发展。 该工艺是将製备好的硅片切入单晶硅衬底，在单晶硅衬底上外延生长III-V族材料，具有易于封装、可靠性高、集成度高等优点。

2023 年初，Mobileye 首次展示了其下一代 FMCW LiDAR。 准确的说，它是一颗波长为1320nm的LiDAR SoC。 基于Intel的芯片型硅光子工艺，该产品可以同时测量距离和速度。

基于芯片的硅光子FMCW固态LiDAR技术路线可能是未来LiDAR发展的首选方向，包括FMCW、固态分布式扫描、硅光子等关键技术。 FMCW LiDAR作为一条新的技术路线，在技术上仍面临诸多挑战。除了Mobileye、Aeva、Aurora等海外厂商外，还引入了Inxuntech、LuminWave等中国厂商。

视觉传感器芯片：企业排列8MP产品的竞争

车载摄像头硬件包括镜头、CIS 和图像信号处理器 (ISP)。 因此，进入壁垒较高的汽车CIS市场被安森美半导体、Omnivision、Sony等公司占据。 未来，更高像素数和更高动态范围（HDR）的产品有望得到发展，除了传统的ISP，目前的ISP集成解决方案将ISP集成到CIS和SOC中。

CIS 朝着更高的像素数发展

随着高级自动驾驶的实现，对车载摄像头的图像质量提出了更高的要求。 一般来说，摄像头的像素数越高，图像质量越好，汽车製造商和自动驾驶供应商获得的有用信息也就越多。 8MP摄像头将在车内加速 2023年初推出的小鹏P7i配备8MP摄像头，用于智能驾驶辅助解决方案。

前视是最需要8MP高分辨率摄像头的应用场景。 目前，主要的汽车CIS供应商已经成功部署了8MP CIS产品。

SmartSens：于 2022 年 11 月发布了 SC850AT。 这款传感器产品支持8.3MP分辨率，采用SmartSens SmartClarity?-2创新成像技术架构和升级自研Raw域算法，有效保护图像细节，提升整体图像效果。 除了 Staggered HDR，SmartSens 独有的 PixGain HDR□ 技术支持 140dB HDR 以获得更准确的图像信息，即使在復杂的照明条件下也能准确捕捉明暗细节以确保

此外，这款芯片的量产时间定于 2023 年第二季度。

ISP：向整合发展

有两种类型的 ISP 解决方案：独立的和集成的。 独立ISP功能强大但价格昂贵，而集成ISP具有成本低、占地面积小、功耗低等优点，但处理能力相对较弱。 近年来，除了ISP嵌入式CIS之外，各大厂商还大力布局ISP嵌入式SOC。

ISP集成CIS：通过将ISP集成到CIS中，可以达到节省空间和降低功耗的目的。 主要是一些独联体领导人我们正在介绍该选项。 2023 年 1 月，Omnivision 宣布推出用于汽车 360 度环视系统 (SVS) 和后视摄像头 (RVC) 的新型 1.3 兆像素 (MP) OX01E20 片上系统 (SoC)。 OX01E20 是一款具有 LED 闪烁抑制 (LFM) 和 140db 高动态范围 (HDR) 功能的优质产品。 它具有 3 微米图像传感器、高级图像信号处理器 (ISP)、全功能失真校正/透视校正 (DC/PC) 和屏幕显示 (OSD)。

ISP集成SOC：将ISP从CIS中取出，直接集成到自动驾驶主控SoC中的方法，可以显着降低传感硬件的成本，允许去掉ISP不仅解决了高像素摄像头带来的严重散热问题，也有助于进一步减小车载摄像头的电路板尺寸和功耗。集成模块。

《汽车传感器芯片行业报告2023》亮点：

  • 汽车传感器芯片产业概况、产业政策/标准制定、市场规模等；
  • 汽车传感器芯片行业主要细分领域（车载摄像头芯片、雷达芯片、激光雷达芯片等）（产品结构、技术趋势、市场规模、市场格局等）
  • 主要汽车雷达芯片供应商（产品线布局、主要产品性能、新品开发、产品应用等）；
  • 主要车用激光雷达芯片供应商（产品线布局、主要产品性能、新品开发、产品应用等）；
  • 主要汽车视觉传感器芯片供应商（产品阵容、主要产品性能、新产品开发、产品应用等）

本报告对汽车传感器芯片行业进行研究和分析，提供市场规模和预测、技术趋势、主要供应商概况等。

内容

第一章自动驾驶传感器芯片产业概况

  • 汽车自动驾驶传感器芯片概述
  • 行业政策和标准

第二章雷达芯片产业

  • 雷达行业概览
  • 雷达结构
  • 雷达芯片应用趋势
  • 4D雷达芯片应用趋势
  • 雷达芯片市场规模及格局

第三章激光雷达芯片产业

  • LiDAR 行业概览
  • LiDAR 产品和成本结构
  • 激光雷达芯片技术趋势
  • 激光雷达芯片市场规模及格局

第四章视觉传感器芯片产业

  • 汽车摄像头行业概览
  • 视觉芯片
  • 车载摄像头CIS芯片
  • 车载摄像头 ISP

第五章雷达芯片供应商

  • Infineon
  • NXP
  • STMicroelectronics
  • TI
  • ADI
  • Vayyar
  • Uhnder
  • Arbe
  • Calterah Semiconductor
  • Andar Technologies
  • SGR Semiconductors
  • Runchip
  • 其他

第六章激光雷达芯片供应商

  • LeddarTech
  • Ouster
  • Lumentum
  • Mobileye
  • Lumotive
  • LuminWave
  • visionICs
  • Xilight
  • ABAX Sensing
  • Vertilite
  • Hesai Technology
  • China Science Photon Chip
  • Fortsense
  • DAO Sensing
  • 其他

第七章视觉传感器芯片供应商

  • ON Semiconductor
  • Samsung Electronics
  • Sony
  • NXP
  • Nextchip
  • OmniVision Technology
  • SmartSens
  • GalaxyCore
  • Metoak
  • Rockchip
  • Fullhan Microelectronics
  • 其他
简介目录
Product Code: ZHP129

Sensor chip industry research: driven by the "more weight on perception" route, sensor chips are entering a new stage of rapid iterative evolution.

At the Auto Shanghai 2023, "more weight on perception, less weight on maps", "urban NOA", and "BEV+Transformer" abounded of OEMs and Tier 1 suppliers. It can be seen that major manufacturers have turned to the technology route of "more weight on perception, less weight maps", to speed up their layout of urban NOA and break their dependence on HD maps.

Driven by the "more weight on perception" technology route, automotive sensors play a more important role. New products like LiDAR, 4D imaging radar, and 8MP CMOS image sensor (CIS) are quickly applied in vehicles, pushing up the demand for sensor chips. Automotive sensor and chip technologies are entering a new stage of rapid iterative evolution and fast cost reduction.

Radar chip: Chinese vendors have made breakthroughs and broken overseas monopoly.

The automotive radar chip market is dominated by such companies as NXP, Infineon, and TI; among Chinese vendors, Calterah Semiconductor as an early starter has forged partnerships with more than 20 automotive OEMs, on designated projects for over 70 passenger car models, and has shipped a total of over 3 million pieces, one third of which were to overseas customers.

4D radars rapidly penetrate into mid- and high-end models and autonomous models. OEMs such as BMW and GM, and Tier 1 suppliers like Continental and ZF have completed the layout in this field. Quite a few Chinese brands including Li Auto, Changan, BYD, Tesla and Geely have designated or spawned and applied 4D radars. HW4.0, Tesla's next-generation autonomous driving platform equipped with a "Phoenix" 4D imaging radar, has become a tipping point in market.

In the field of conventional radar chips, Infineon and NXP are almost in a monopoly position. As the main development direction of radars, 4G imaging radars can better serve advanced autonomous driving functions such as urban NOA. Chinese manufacturers are also expediting layout of 4D radar chips.

Calterah: in December 2022, announced Andes, its next-generation new radar SoC family that enables 4D imaging radar functions and promotes the development of L3+ autonomous driving, with the following key features:

  • 4T4R SoC using 22nm process
  • Multi-core CPU, including DSP (digital signal processor) and RSP (radar signal processor)
  • Gigabit Ethernet with RGMII/SGMII
  • Support for flexible cascading
  • Subject to ASIL-B & AEC-Q100 Grade 1 requirements

Muye Microelectronics: a 4D radar start-up specializes in 4D high-precision imaging radars. In December 2022, it successfully developed the first 77G radar chip; in March 2023, passed the "1S0-26262 ASL-D functional safety certification"; in April 2023, closed the Pre-A funding round and raised RMB100 million, which is spent for chip productization, and production and delivery to Alpha customers.

LiDAR chip: develop towards SoC integration.

Since 2022, much more LiDARs have been used in vehicles, and about 164,000 passenger cars have been installed with LiDARs in China. LiDARs are often used in L2+++ passenger cars (with the highway + urban NOA function), most of which are high-end new energy vehicles valued at over RMB250,000. It is estimated that in 2026, 3.666 million LiDARs will be installed in passenger cars in China. If LiDARs are mounted on RMB150,000 passenger cars, a bigger cost reduction will be required. This may be hard to achieve in the short run.

In 2023, the LiDAR price war has begun, and the shipping price has slumped to around USD500, but still relatively high compared to the price (USD200-300) of 4D radars. Based on SoCs, LiDARs will be further integrated and become cheaper.

(1) Integration with transceiver chips

The wide adoption of LiDARs in vehicles first needs cost control. Different LiDAR routes of manufacturers lead to differential costs. Yet transceiver chips are the main cost component. The integration with transceiver chips is an effective way to cut down the cost of LiDARs.

  • Transmitter chip: replacing discrete modules with integrated modules can slash the cost of materials and debugging by more than 70%;
  • Receiver chip: the small size of the SPAD solution favors the integration with the readout circuit, which can further reduce the cost.

LiDAR chip technique is mastered by foreign manufacturers, but Chinese vendors have also worked to develop related technologies in recent years. In the case of transmitter chips, Chinese manufacturers have begun to step into upstream VCSEL chip design; as concerns receiver chips, Chinese start-ups march into SPAD and SiPM chips, among which QuantaEye and FortSense concentrate their efforts on SPAD/SiPM R&D.

FortSense: it has started deploying SPAD LiDAR chip R&D from 2019. It taped out in 2021, and passed automotive certification in September 2022. It has been favored by designated LiDAR suppliers of over 5 automakers. In December 2022, it closed the C funding round, with the raised funds to be used to develop LiDAR chips.

Hesai Technology: in recent years, it has been committed to developing LiDAR chips. Hesai Technology has started developing LiDAR SoCs since 2018, and has made the strategy for developing multiple generations of chip-based transceivers (V1.0, V1.5, V2.0, V3.0, etc.). Wherein, for V2.0, the receiving end is upgraded from SiPM to SPAD array for integration of detectors and circuit function modules under the CMOS technology; as for the V3.0 architecture, it is expected to complete the development of the VCSEL area array driver chip and the area array SoC based on SPAD detector.

Hesai's long-range semi-solid-state LiDAR AT128: it is equipped with a self-developed automotive chip. A single circuit board integrates 128 scanning channels for chip-based solid-state electronic scanning.

Hesai's new-generation all-solid-state gap filler radar FT120: a single chip integrates an area array composed of tens of thousands of laser receiving channels for laser emission and reception completely through the chip. With much fewer components than conventional LiDARs, it is more cost-effective than the AT family.

(2) Single-chip LiDAR solution

LiDAR cost reduction needs to use the photonic integration process to integrate various optoelectronic devices, which is evolving from heterogeneous materials integration to single-chip integration, a process to slot the prepared silicon wafer to the monocrystalline silicon substrate, and then grow the group III-V materials on the monocrystalline silicon substrate in an epitaxial way. Despite high difficulty, the process offers benefits of low loss, easy to package, high reliability, and high integration.

In early 2023, Mobileye demonstrated its next-generation FMCW LiDAR for the first time. To be precise, it is a LiDAR SoC with a wavelength of 1320nm. Based on Intel's chip-level silicon photonics process, this product can measure distance and speed at the same time.

The chip-based silicon photonics FMCW solid-state LiDAR technology route may become a preferred direction in future LiDAR development, involving such key technologies as FMCW, solid-state dispersion scanning and silicon photonics. As a new technology route, FMCW LiDAR still poses a lot of technical challenges. In addition to foreign manufacturers like Mobileye, Aeva and Aurora, Chinese vendors such as Inxuntech and LuminWave have also made deployments.

Vision sensor chips: giants race to lay out 8MP products.

Automotive camera hardware includes lens, CIS and image signal processor (ISP). Thereof, automotive CIS with a high entry threshold is an oligopolistic market in which dominant competitors include ON Semiconductor, OmniVision and Sony. In the future the products will tend to have high pixel and high dynamic range (HDR). As well as conventional ISPs, the current ISP integrated solutions also integrate ISP into CIS or SOC.

CIS develops towards high pixel.

The development of high-level autonomous driving requires increasingly high imaging quality of automotive cameras. Generally speaking, the higher the pixel of cameras, the better the imaging quality and the more useful information automakers/autonomous driving providers can get. The pace of using 8MP cameras in vehicles quickens. Xpeng P7i launched in early 2023 packs an 8MP camera for intelligent driving assistance solutions.

Front view is the application scenario with the most urgent need for 8MP high-resolution cameras. Currently, mainstream automotive CIS suppliers have successfully deployed 8MP CIS products.

SmartSens: it announced SC850AT in November 2022. This sensor product supports 8.3MP resolution, and adopts SmartSens SmartClarity®-2 innovative imaging technology architecture and the upgraded self-developed Raw domain algorithms that can effectively protect image details and improve overall image effects. In addition to Staggered HDR, it also supports SmartSens' unique PixGain HDR® technology to achieve 140dB HDR, and can capture more accurate image information, ensuring its ability to accurately capture details in brightness and darkness in complex lighting conditions.

The volume production of the chip is scheduled in the second quarter of 2023.

ISP: evolve towards integration.

There are two types of ISP solutions: independent and integrated. Wherein, independent ISPs are powerful but with high cost, while integrated ISPs have the benefits of low cost, small area and low power consumption but with relatively weak processing capabilities. In recent years major vendors have vigorously deployed ISP-integrated SOC in addition to ISP-integrated CIS.

ISP-integrated CIS: the integration of ISP into CIS can achieve the aim of saving space and reducing power consumption. It is mainly some CIS leaders that introduce relevant solutions. In January 2023, OmniVision announced its new 1.3-megapixel (MP) OX01E20 system-on-chip (SoC) for automotive 360-degree surround view systems (SVS) and rear-view cameras (RVC). The OX01E20 brings top-of-the-line LED flicker mitigation (LFM) and 140db high dynamic range (HDR) capabilities. It features a 3-micron image sensor, an advanced image signal processor (ISP), and full-featured distortion correction/perspective correction (DC/PC) and on-screen display (OSD).

ISP-integrated SOC: the way of removing the ISP from the CIS and directly integrating it into the main control SoC for autonomous driving enable a big reduction in the cost of perception hardware, and the removal of the ISP from the camera can not only solve the serious problem of heat dissipation caused by high-pixel cameras, but also help to further reduce circuit board size and power consumption for automotive cameras. Almost all autonomous driving domain control SoCs integrate the ISP module.

“ Automotive Sensor Chip Industry Report, 2023” highlights the following:

  • Automotive sensor chip industry (overview, formulation of industrial policies and standards, market size, etc.);
  • Main automotive sensor chip industry segments (automotive camera chip, radar chip, LiDAR chip, etc.) (product structure, technology trends, market size, market pattern, etc.)
  • Main automotive radar chip suppliers (product line layout, performance of main products, development of new products, product application, etc.);
  • Main automotive LiDAR chip suppliers (product line layout, performance of main products, development of new products, product application, etc.);
  • Main automotive vision sensor chip suppliers (product line layout, performance of main products, development of new products, product application, etc.).

Table of Contents

1 Overview of Autonomous Driving Sensor Chip Industry

  • 1.1 Overview of Automotive Autonomous Driving Sensor Chips
    • 1.1.1 Types of Autonomous Driving Sensor Chips
    • 1.1.2 Process of Applying Autonomous Driving Sensor Chips in Vehicles
    • 1.1.3 Installation Scale of Autonomous Driving Sensor Chips in Vehicles
  • 1.2 Industrial Policies and Standards
    • 1.2.1 The Latest Standard Dynamics during 2022-2023: "Guidelines for the Construction of the National Automotive Chip Standard System (2023)" (1)
    • 1.2.2 The Latest Standard Dynamics during 2022-2023: "Guidelines for the Construction of the National Automotive Chip Standard System (2023)" (2)
    • 1.2.3 Certification Thresholds for Automotive Chips

2 Radar Chip Industry

  • 2.1 Overview of Radar Industry
    • 2.1.1 Workflow of Automotive Radar
    • 2.1.2 Implementation Mode 1 of Radars in Vehicles: OEMs That Rely on External Integration Continue Their Close Coupling Relationships with Chip Vendors
    • 2.1.3 Implementation Mode 2 of Radars in Vehicles: Mighty Automakers Directly Procure Hardware and Outsource the Assembly
    • 2.1.4 Major OEMs in Automotive Radar Industry Chain (1)
    • 2.1.5 Major OEMs in Automotive Radar Industry Chain (2)
  • 2.2 Radar Structure
    • 2.2.1 Structure Diagram of Automotive Radar
    • 2.2.2 Cost Structure of Automotive Radar
    • 2.2.3 Price of Automotive Radar Chip (MICC)
    • 2.2.4 Autonomous Driving Sensor Chip Industry Chain: Radar Chip
  • 2.3 Application Trends of Radar Chips
    • 2.3.1 Intelligent Driving Market Provides A Big Boost to the Demand for Radars and Chips
    • 2.3.2 Technical Requirements for Radar Chips: High Precision, High Power, High Sensitivity
    • 2.3.3 Development Directions of Automotive Radar Chips
    • 2.3.4 Development Direction 1 of Automotive Radar Chips: Chip Integration
    • 2.3.5 Development Direction 2 of Automotive Radar Chips: Policies Facilitate the Development of High-frequency Radar Chips
    • 2.3.6 Development Direction 3 of Automotive Radar Chips: 4D radar
    • 2.3.7 Development Direction 4 of Automotive Radar Chips: Production Process Upgrade (1)
    • 2.3.8 Development Direction 4 of Automotive Radar Chips: Production Process Upgrade (2)
  • 2.4 Application Trends of 4D Radar Chips
    • 2.4.1 Automotive 4D Radar Chip Technology Route
    • 2.4.2 Automotive 4D Radar Chip Packaging and Testing Schemes
    • 2.4.3 Technology Trends of Automotive 4D Radar Chips
    • 2.4.4 4D Radar Chip Installation Scheme 1: Cascading (1)
    • 2.4.5 4D Radar Chip Installation Scheme 1: Cascading (2)
    • 2.4.6 4D Radar Chip Installation Scheme 2: Single-chip Integration
    • 2.4.7 4D Radar Chip Installation Scheme 3: Software Algorithm Support
    • 2.4.8 Comparison between 4D Radar Chip Installation Schemes
    • 2.4.9 Mainstream Automotive 4D Radar Chip Suppliers (1)
    • 2.4.10 Mainstream Automotive 4D Radar Chip Suppliers (2)
    • 2.4.11 Mainstream Automotive 4D Radar Chip Suppliers (3)
  • 2.5 Radar Chip Market Size and Pattern
    • 2.5.1 China's Demand for Passenger Car Radars, 2021-2026E
    • 2.5.2 China's Passenger Car Radar Chip Market Size, 2021-2026E
    • 2.5.3 China's Passenger Car Radar Chip Market Size, 2021-2026E - Attached Table (1)
    • 2.5.4 China's Passenger Car Radar Chip Market Size, 2021-2026E - Attached Table (2)
    • 2.5.5 Automotive Radar Chip Market Structure
    • 2.5.6 Automotive Radar Chip Market Structure: Suppliers Accelerate the Pace of Localization
    • 2.5.7 Automotive Radar Chip Market Structure: Chinese Suppliers (1)
    • 2.5.8 Automotive Radar Chip Market Structure: Chinese Suppliers (2)

3 LiDAR Chip Industry

  • 3.1 Overview of LiDAR Industry
    • 3.1.1 Workflow of LiDAR
    • 3.1.2 LiDAR Industry Chain
    • 3.1.3 LiDAR OEM Model
    • 3.1.4 LiDAR OEM: MEMS Galvanometer OEM
    • 3.1.5 Major OEMs in LiDAR Industry Chain (1)
    • 3.1.6 Major OEMs in LiDAR Industry Chain (2)
  • 3.2 LiDAR Products and Cost Structure
    • 3.2.1 Structure Diagram of Automotive LiDAR
    • 3.2.2 Main Components of Automotive LiDAR (1)
    • 3.2.3 Main Components of Automotive LiDAR (2)
    • 3.2.4 Major Players in LiDAR Transmitter VCSEL Chip Market
    • 3.2.5 Major Players in LiDAR Receiver SPAD/SiPM Chip Market
    • 3.2.6 Cost Structure of Automotive LiDAR
    • 3.2.7 Automotive LiDAR Chip Industry Chain
  • 3.3 Technology Trends of LiDAR Chips
    • 3.3.1 LiDAR Development Technology Route
    • 3.3.2 Development Directions of LiDAR Chips
    • 3.3.3 LiDAR Transmitter Chip Technology Trend 1: Develop from EEL to VCSEL Chip
    • 3.3.4 LiDAR Transmitter Chip Technology Trend 2: 905nm Is Favored again Due to Its Cost Advantage (1)
    • 3.3.5 LiDAR Transmitter Chip Technology Trend 2: 905nm Is Favored again Due to Its Cost Advantage (2)
    • 3.3.6 LiDAR Transmitter Chip Technology Trend 3: FMCW Ranging Method Rises Rapidly (1)
    • 3.3.7 LiDAR Transmitter Chip Technology Trend 3: FMCW Ranging Method Rises Rapidly (2)
    • 3.3.8 LiDAR Receiver Chip Technology Trends: SPAD/SiPM Can Replace APD in the Future (1)
    • 3.3.9 LiDAR Receiver Chip Technology Trends: SPAD/SiPM Can Replace APD in the Future (2)
    • 3.3.10 LiDAR Development Trend 1: Integration with Transceiver Chip Favors Cost Reduction (1)
    • 3.3.11 LiDAR Development Trend 1: Integration with Transceiver Chip Favors Cost Reduction (2)
    • 3.3.12 LiDAR Development Trend 1: Integration with Transceiver Chip Favors Cost Reduction (3)
    • 3.3.13 LiDAR Development Trend 2: Single-chip Silicon Photonics Integration (1)
    • 3.3.14 LiDAR Development Trend 2: Single-chip Silicon Photonics Integration (2)
    • 3.3.15 LiDAR Development Trend 2: Single-chip Silicon Photonics Integration (3)
    • 3.3.16 Single-chip LiDAR Layout Case 1 of Suppliers: Hesai Technology
    • 3.3.17 Single-chip LiDAR Layout Case 2 of Suppliers: Ouster
  • 3.4 LiDAR Chip Market Size and Pattern
    • 3.4.1 China's Demand for Passenger Car LiDARs, 2021-2026E
    • 3.4.2 China's Passenger Car LiDAR Chip Market Size, 2021-2026E
    • 3.4.3 China's Passenger Car LiDAR Chip Market Size, 2021-2026E - Attached Table (2)
    • 3.4.4 Competitive Pattern of LiDAR Chip Market
    • 3.4.5 Mainstream Automotive LiDAR Chip Suppliers (1)
    • 3.4.6 Mainstream Automotive LiDAR Chip Suppliers (2)
    • 3.4.7 Layout of Chinese Suppliers in Laser Sensor Chips: Stepping into the Upstream End of VCSEL Chips
    • 3.4.8 Layout of Chinese Suppliers in Laser Sensor Chips: Marching into SPAD and SiPM Chips

4 Vision Sensor Chip Industry

  • 4.1 Overview of Automotive Camera Industry
    • 4.1.1 Structure of Automotive Camera
    • 4.1.2 Implementation Mode of Cameras in Vehicles
    • 4.1.3 Major OEMs in Automotive Camera Industry Chain (1)
    • 4.1.4 Major OEMs in Automotive Camera Industry Chain (2)
    • 4.1.5 Autonomous Driving Sensor Chip Industry Chain: Types of
  • Vision Chips
    • 4.1.6 Cost Structure of Automotive Camera
    • 4.1.7 China's Demand for Passenger Car Cameras, 2021-2026E
    • 4.1.8 China's Passenger Car Camera Chipset Market Size, 2021-2026E
    • 4.1.9 China's Passenger Car Camera Chipset Market Size, 2021-2026E - Attached Table (1)
    • 4.1.10 China's Passenger Car Camera Chipset Market Size, 2021-2026E - Attached Table (2)
  • 4.2 Automotive Camera CIS Chip
    • 4.2.1 Demand for Automotive Camera CIS Keeps Increasing
    • 4.2.2 Automotive CIS Shipment Structure
    • 4.2.3 Automotive CIS Market Features High Entry Threshold and Oligarchic Competition
    • 4.2.4 Automotive CIS Market Pattern (1)
    • 4.2.5 Automotive CIS Market Pattern (2)
    • 4.2.6 Automotive CIS Market Pattern (3)
    • 4.2.7 Automotive CIS Market Pattern: Chinese Manufacturers Accelerate Product Layout
    • 4.2.8 Comparison between Main Automotive CIS Products
    • 4.2.9 Development Directions of Automotive CIS Technology
    • 4.2.10 Development Direction 1 of Automotive CIS Technology: Higher Resolution (1)
    • 4.2.11 Development Direction 1 of Automotive CIS Technology: Higher Resolution (2)
    • 4.2.12 Development Direction 2 of Automotive CIS Technology: Higher Dynamic Range
  • 4.3 Automotive Camera ISP
    • 4.3.1 Automotive ISP Fusion Modes
    • 4.3.2 Competition Pattern of Automotive ISP Market
    • 4.3.3 Development Directions of Automotive ISP
    • 4.3.4 Development Direction 1 of Automotive ISP: Introduction of AI Algorithms
    • 4.3.5 Development Direction 2 of Automotive ISP: Integration of ISP into SoC
    • 4.3.6 Case 1 of Automotive ISP Integrated into Autonomous Driving SOC: TI
    • 4.3.7 Case 2 of Automotive ISP Integrated into Autonomous Driving SOC: Mobileye
    • 4.3.8 Case 3 of Automotive ISP Integrated into Autonomous Driving SOC: Black Sesame Technologies
    • 4.3.9 Case 4 of Automotive ISP Integrated into Autonomous Driving SOC: Horizon Robotics
    • 4.3.10 Case 5 of Automotive ISP Integrated into Autonomous Driving SOC: Ambarella

5 Radar Chip Suppliers

  • 5.1 Infineon
    • 5.1.1 Autonomous Driving Sensor Chip Product Line
    • 5.1.2 Radar Chips
    • 5.1.3 24GHz Radar Chips: BGT24XX Series (1)
    • 5.1.4 24GHz Radar Chips: BGT24XX Series (2)
    • 5.1.5 77GHz Radar Chips
    • 5.1.6 77GHz Radar Microcontroller
  • 5.2 NXP
    • 5.2.1 Autonomous Driving Sensor Chip Product Line
    • 5.2.2 Radar Chip Business
    • 5.2.3 4D Imaging Radar Chip: S32R45
    • 5.2.4 77GHz Radar Transceiver Chips: TEF82xx
    • 5.2.5 77GHz Radar Transceiver Chips: TEF810X
    • 5.2.6 77GHz Radar Transceiver Chips: MR3003
    • 5.2.7 Radar Solutions
    • 5.2.8 Application of Autonomous Driving Sensor Chips: Continental's 4-cascade Radar
  • 5.3 STMicroelectronics
    • 5.3.1 Autonomous Driving Sensor Chip Product Line
    • 5.3.2 24GHz Radar Chips
    • 5.3.3 77GHz Radar Chip: STRADA770M
  • 5.4 TI
    • 5.4.1 Autonomous Driving Sensor Chip Product Line (1)
    • 5.4.2 Autonomous Driving Sensor Chip Product Line (2)
    • 5.4.3 Radar Chip System
    • 5.4.4 Parameters of Radar Chips
    • 5.4.5 77GHz Radar Chips: AWR1243
    • 4.5.6 77GHz Radar Chips: AWR2243
    • 5.4.7 77GHz Radar Chips: AWR2944
    • 5.4.8 Integrated Radar Chip: AWR1843AoP
  • 5.5 ADI
    • 5.5.1 Autonomous Driving Sensor Chip Product Line
    • 5.5.2 24GHz Radar Chips
    • 5.5.3 Intelligent Transportation Solution Based on 24GHz Radar Demonstration Platform
  • 5.6 Vayyar
    • 5.6.1 Autonomous Driving Sensor Chip Product Line
    • 5.6.2 Comparison between Radar Products and Alternative Products
    • 5.6.3 Radar SOC
    • 5.6.4 4D Radars and Chips
    • 5.6.5 60GHz Radar Chips
  • 5.7 Uhnder
    • 5.7.1 Imaging Radar Chips
    • 5.7.2 Application of Radar Chips
  • 5.8 Arbe
    • 5.8.1 Imaging Radar Chipset Solutions (1)
    • 5.8.2 Imaging Radar Chipset Solutions (2)
    • 5.8.3 Imaging Radar Chipset Application 1: In-house Phoenix Perception Radar
    • 5.8.4 Imaging Radar Chipset Application 2: In-house Lynx Surround Imaging Radar
    • 5.8.5 Imaging Radar Chipset Application 3: In-house 360° Surround Radar
    • 5.8.6 Imaging Radar Chipset Application 4: Cooperation (1)
    • 5.8.7 Imaging Radar Chipset Application 4: Cooperation (2)
  • 5.9 Calterah Semiconductor
    • 5.9.1 Profile
    • 5.9.2 Platformization and Serialization of Radar Chips Have Been Realized
    • 5.9.3 Automotive Radar Chip Product Line
    • 5.9.4 Radar Chip Products: Alps-Pro Series
    • 5.9.5 Radar Chip Products: Andes Series
    • 5.9.6 Radar Chip Products: ALPS Series
    • 5.9.7 Radar Chip Products: Alps-Mini Series
    • 5.9.8 Application Scenarios of Radar Chips
  • 5.10 Andar Technologies
    • 5.10.1 Profile
    • 5.10.2 77/79GHz Radar Chips: ADT2011
    • 5.10.3 77/79GHz Radar Chips: ADT2001
    • 5.10.4 77/79GHz Radar Chips: ADT3102
    • 5.10.5 77/79GHz Radar Chips: ADT3101
  • 5.11 SGR Semiconductors
    • 5.11.1 Profile
    • 5.11.2 24GHz Automotive Radar Chip Products
    • 5.11.3 Application of Radar Chips
  • 5.12 Runchip
    • 5.12.1 77GHz Radar Chips
    • 5.12.2 Domestic Radar Chip Localization Capability
  • 5.13 Others
    • 5.13.1 76-81GHz Radar Chips of Radaric (Beijing) Technology
    • 5.13.2 77GHz Radar Chips of Citta Microelectronics

6 LiDAR Chip Suppliers

  • 6.1 LeddarTech
    • 6.1.1 Profile
    • 6.1.2 Global Network
    • 6.1.3 Automotive LiDAR Technology (1)
    • 6.1.4 Automotive LiDAR Technology (2)
    • 6.1.5 LeddarCore SoCs: LCA2 & LCA3
    • 6.1.6 Products (1): Vu8 Solid State LiDAR Module
    • 6.1.7 Products (2): M16 Solid State LiDAR Module
    • 6.1.8 Products (3): LeddarVision & LeddarSteer
    • 6.1.9 Cooperation Mode
    • 6.1.10 Partners
    • 6.1.11 Partners
  • 6.2 Ouster
    • 6.2.1 Profile
    • 6.2.2 LiDAR Chip Products (1)
    • 6.2.3 LiDAR Chip Products (2)
  • 6.3 Lumentum
    • 6.3.1 Automotive Business Layout
    • 6.3.2 LiDAR Chips
  • 6.4 Mobileye
    • 6.4.1 LiDAR Chip Layout
    • 6.4.2 Benefit from Intel's Silicon Photonics Manufacturing Technology
  • 6.5 Lumotive
    • 6.5.1 Profile
    • 6.5.2 LiDAR Chip Technology
  • 6.6 LuminWave
    • 6.6.1 LiDAR Chip Technology
    • 6.6.2 LiDAR Chip Technology Upgrade
  • 6.7 visionICs
    • 6.7.1 Profile
    • 6.7.2 Autonomous Driving Sensor Chip Product Line
    • 6.7.3 Main LiDAR Chip Products (1)
    • 6.7.4 Main LiDAR Chip Products (2)
  • 6.8 Xilight
    • 6.8.1 Profile
    • 6.8.2 Autonomous Driving Sensor Chip Product Line
    • 6.8.3 Main LiDAR Chip Products (1): Detection Chip
    • 6.8.4 Main LiDAR Chip Products (2): Signal Receiving SiPM Chip
    • 6.8.5 Main LiDAR Chip Products (3): Digital Conversion Chip - XTD50
    • 6.8.6 Product R&D Dynamics
  • 6.9 ABAX Sensing
    • 6.9.1 Profile
    • 6.9.2 LiDAR Chips
    • 6.9.3 Parameters of LiDAR Products
    • 6.9.4 Development Dynamics
  • 6.10 Vertilite
    • 6.10.1 Profile
    • 6.10.2 LiDAR Chips: CAC940K010
    • 6.10.3 LiDAR Chips: CAC940F005
  • 6.11 Hesai Technology
    • 6.11.1 Self-developed Chip Planning
    • 6.11.2 Self-developed Chip Planning: Work to Lay out Single-chip Solutions
    • 6.11.3 Scope of Self-developed Chips
    • 6.11.4 Scope of Self-developed Chips
    • 6.11.5 Application of Self-developed Chips
  • 6.12 China Science Photon Chip
    • 6.12.1 Profile
    • 6.12.2 LiDAR Chip Layout
  • 6.13 Fortsense
    • 6.13.1 Profile
    • 6.13.2 LiDAR Chip Business
  • 6.14 DAO Sensing
    • 6.14.1 LiDAR Chip Planning (1)
    • 6.14.2 LiDAR Chip Planning (1)
  • 6.15 Others
    • 6.15.1 LiDAR Chip Business of Sophoton
    • 6.15.2 LiDAR Chip Layout of Huawei
    • 6.15.3 LiDAR Chip Business of Luminar
    • 6.15.4 Automotive LiDAR Chip Business of Berxel Photonics
    • 6.15.5 LiDAR Business of Dibotics

7 Vision Sensor Chip Suppliers

  • 7.1 ON Semiconductor
    • 7.1.1 Profile
    • 7.1.2 Market & Product Layout (1)
    • 7.1.3 Market & Product Layout (2)
    • 7.1.4 Classification of Products
    • 7.1.5 Automotive CIS Products
    • 7.1.6 Automotive ISP Products
    • 7.1.7 CIS Products - Front View CIS (1)
    • 7.1.8 CIS Products - Front View CIS (2)
    • 7.1.9 CIS Products - Cockpit CIS (1)
    • 7.1.10 CIS Products - Cockpit CIS (2)
    • 7.1.11 CIS Products - Cockpit CIS (3)
    • 7.1.12 CIS Products - Cockpit CIS (4)
    • 7.1.13 CIS Products - Surround/Back View CIS
    • 7.1.14 ISP Products - ISP (1)
    • 7.1.15 ISP Products - ISP (2)
    • 7.1.16 CIS Technology
    • 7.1.17 LiDAR Chip Technology
    • 7.1.18 Market Share and Customers of ON Semiconductor's Automotive Image Sensors
    • 7.1.19 Autonomous Driving Ecosystem Partners (1)
    • 7.1.20 Autonomous Driving Ecosystem Partners (2)
  • 7.2 Samsung Electronics
    • 7.2.1 Automotive Image Sensors: ISOCELL Auto
    • 7.2.2 Automotive Image Sensors: ISOCELL Auto 4AC
    • 7.2.3 Features of Automotive Image Sensors
  • 7.3 Sony
    • 7.3.1 Profile
    • 7.3.2 CIS Market Layout
    • 7.3.3 Development History of CIS
    • 7.3.4 Classification of Semiconductor Products
    • 7.3.5 Autonomous Driving Sensor Chip Product Line
    • 7.3.6 CIS Technology
    • 7.3.7 Automotive CIS Products (1)
    • 7.3.8 Automotive CIS Products (2)
    • 7.3.9 Automotive CIS Products (3)
    • 7.3.10 Application of Autonomous Driving Sensor Chips (1)
    • 7.3.11 Application of Autonomous Driving Sensor Chips (2)
  • 7.4 NXP
    • 7.4.1 Profile
    • 7.4.2 Classification of Products
    • 7.4.3 Automotive ISP Products - ISP-integrated Vision Processing Unit (1)
    • 7.4.4 Automotive ISP Products - ISP-integrated Vision Processing Unit (2)
    • 7.4.5 Automotive ISP Products - ISP-integrated Vision Processing Unit (3)
    • 7.4.6 Automotive ISP Products - ISP-integrated Autonomous Driving SoC (1)
    • 7.4.7 Automotive ISP Products - ISP-integrated Autonomous Driving SoC (2)
    • 7.4.8 Automotive ISP Products - ISP-integrated Autonomous Driving SoC (3)
    • 7.4.9 Automotive ISP Products - ISP-integrated Autonomous Driving SoC (4)
    • 7.4.10 Summary of Automotive ISP Products
    • 7.4.11 ISP Software Training Partners
  • 7.5 Nextchip
    • 7.5.1 Profile & Classification of Products
    • 7.5.2 Development History and Market Layout
    • 7.5.3 Core Technologies
    • 7.5.4 Products - ISP (1)
    • 7.5.5 Products - ISP (2)
    • 7.5.6 Products - ISP (3)
    • 7.5.7 Products - ISP (4)
    • 7.5.8 Products - ISP-integrated Autonomous Driving SoC (1)
    • 7.5.9 Products - ISP-integrated Autonomous Driving SoC (2)
    • 7.5.10 Products - ISP-integrated Autonomous Driving SoC (3)
    • 7.5.11 Summary of Products (1)
    • 7.5.12 Summary of Products (2)
    • 7.5.13 Customers and Partners
  • 7.6 OmniVision Technology
    • 7.6.1 Profile
    • 7.6.2 Market Layout (1)
    • 7.6.3 Market layout (2)
    • 7.6.4 Technologies (1)
    • 7.6.5 Technologies (2)
    • 7.6.6 Classification of Products
    • 7.6.7 Products - ISP-integrated Video Processing Unit (1)
    • 7.6.8 Products - ISP-integrated Video Processing Unit (2)
    • 7.6.9 Products - ISP-integrated Video Processing Unit (3)
    • 7.6.10 Products - ISP-integrated Video Processing Unit (4)
    • 7.6.11 Products - ISP
    • 7.6.12 Products - ISP-integrated CIS (1)
    • 7.6.13 Products - ISP-integrated CIS (2)
    • 7.6.14 Products - ISP-integrated CIS (3)
    • 7.6.15 Products - ISP-integrated CIS (4)
    • 7.6.16 Products - Non-ISP CIS
    • 7.6.17 Summary of Products (1)
    • 7.6.18 Summary of Products (2)
    • 7.6.19 Comparison of Some CIS Products between OmniVision and ON Semiconductor
  • 7.7 SmartSens
    • 7.7.1 Profile
    • 7.7.2 Classification of Products
    • 7.7.3 Automotive CIS Business
    • 7.7.4 Products - ISP-integrated CIS (1)
    • 7.7.5 Products - ISP-integrated CIS (2)
    • 7.7.6 Products - ISP-integrated CIS (3)
    • 7.7.7 Products - ISP-integrated CIS (4)
    • 7.7.8 Products - ISP-integrated CIS (5)
    • 7.7.9 Products - ISP-integrated CIS (6)
    • 7.7.10 Summary of ISP-integrated CIS Products
    • 7.7.11 Automotive CIS Product Layout (1)
    • 7.7.12 Automotive CIS Product Layout (2)
    • 7.7.13 Market Layout (1)
    • 7.7.14 Market Layout (2)
    • 7.7.15 Product R&D Layout
  • 7.8 GalaxyCore
    • 7.8.1 Profile
    • 7.8.2 CMOS Image Sensor Business
  • 7.9 Metoak
    • 7.9.1 Profile
    • 7.9.2 Product Lines
    • 7.9.3 Stereo Vision Chips
  • 7.10 Rockchip
    • 7.10.1 Panoramic View Chip - RK3588M
    • 7.10.2 Architecture of RK3588M SoC
  • 7.11 Fullhan Microelectronics
    • 7.11.1 Profile
    • 7.11.2 Classification of Products
    • 7.11.3 Products - ISP (1)
    • 7.11.4 Products - ISP (2)
    • 7.11.5 Products & Summary of Products
    • 7.11.6 ISP Tuning & Image Tuning Lab
    • 7.11.7 ISP Product Layout & Market Layout
    • 7.11.8 Customers & Partners
  • 7.12 Others
    • 7.12.1 GPU Products of ARM
    • 7.12.2 Vision Chip Products of NST Technology