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市场调查报告书
商品编码
1482377

中国汽车MCU产业（2024年）

Automotive Microcontroller Unit (MCU) Industry Report, 2024
出版日期: | 出版商: ResearchInChina | 英文 390 Pages | 商品交期: 最快1-2个工作天内

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简介目录

在政策支持下，汽车MCU国产化率将快速提升。

中国电动车製造商正在加大采购国产晶片的步伐，以减少对进口晶片的依赖，促进中国半导体产业体系的发展。根据非官方目标，2025年汽车国产晶片整体渗透率将提升至20%以上，鼓励国营和民营汽车企业优先采购国产晶片。虽然汽车MCU量产週期较长，国产化率仍极低，但这项政策支持将支撑国产汽车MCU的繁荣。

2024年1月，工信部公布了《国家汽车晶片标准体系建立指南》，目标是到2025年制定30项以上汽车晶片主要标准，重点对环境、可靠性、电磁相容、功能等方面进行明确。资讯安全等基本要求，制定控制、运算、储存、电源、通讯晶片等主要产品和应用的技术规范，确保汽车晶片产品安全可靠，满足使用和试点的基本需求。个汽车晶片标准。政策利好将促进中国汽车MCU厂商的发展。

主要国际公司在汽车 MCU 方面获得先发优势。中国厂商从安全要求相对较低的车身控制入手，一些主要厂商也在动力/底盘、座舱、自动驾驶领域进行布局。中国厂商正逐步完善汽车MCU产品线布局，缩小与国际巨头的产品性能差距。

1.中国汽车MCU厂商低阶、中阶、高阶产品全方位布局。

高端汽车MCU一直由国际大公司主导。例如，Infineon在自动驾驶领域占据主导地位，而NXP和Renesas在网关和电源/底盘领域占据主导地位。

近年来，中国厂商积极推出高阶汽车MCU产品，部分厂商如SemiDrive、AutoChips等已进入高阶市场。

SemiDrive将于2022年推出支援域控、车身、底盘、动力、ADAS、电池管理系统（BMS）等的E3系列汽车MCU，目前出货量已超过100万颗。Chery Tiggo 9、EXEED Stellar等车款搭载的悬吊控制器（CDC）采用的是SemiDrive E3系列产品。

2024年3月，SemiDrive进一步完善E3系列，发表E3119F8/E3118F4，针对车身域控、区域控制器、前视一体机、雷射雷达等应用。新品采用ARM Cortex R5F为CPU，配备多达两个独立的400MHz高效能应用内核，资讯安全内核主频高达200MHz。工具链方面，SemiDrive支援IAR和Greenhills，适合主流ARM调试器，并提供SDK/MCAL基础软体支援。目前，SemiDrive正在与多家中国和国际AutoSAR供应商合作，致力于BSW合规性工作。

目前，SemiDrive产品涵盖区域控制、底盘、智慧驾驶等高阶领域。

2023 年 10 月，AutoChips 发布了 AC7870x，这是首款满足 ASIL-D 功能安全等级、基于 Arm Cortex R52 核心的多核心高频 MCU。AC7870x主要应用于动力/底盘、新能源汽车 "三电" 、新EEA区域控制器等领域。至此，AC7870x正式进军汽车高阶MCU领域。

本报告针对中国汽车MCU产业进行调查分析，提供市场规模、应用领域、产业发展要点、国内外厂商等资讯。

目录

第一章 汽车MCU产业现状

  • 汽车MCU概述
  • 汽车MCU生产方式：代工主导
  • 汽车MCU市场规模
  • 汽车MCU竞争格局

第二章 汽车MCU的主要应用领域

  • 应用领域一：车身控制
  • 应用领域二：自动驾驶
  • 应用领域三：智慧座舱
  • 应用领域4：动力/底盘控制
  • 应用领域五：中央运算+区域控制器

第三章 汽车MCU主要技术

  • 生产流程
  • 核心技术
  • 新型储存技术的应用
  • 影像处理功能
  • 功能安全
  • 包装技术
  • 单晶片+方案
  • 高端MCU
  • MCU与MPU集成
  • OEM 选择 MCU 时的注意事项

第四章 国外汽车MCU供应商

  • Renesas
  • NXP
  • Infineon
  • ST
  • TI
  • Microchip

第五章 中国汽车MCU供应商

  • SemiDrive
  • ChipON
  • GigaDevice
  • BYD Semiconductor
  • AutoChips
  • CCore Technology
  • Sine Microelectronics
  • Huada Semiconductor
  • Hangshun Chip
  • Geehy Semiconductor
  • Yuntu Micro
  • MindMotion Microelectronics
  • CVA Chip
  • Chipsea
  • AMEC
  • Flagchip
  • Binary Semiconductor
  • HPMicro
  • ChipEXT
  • Automotive MCU Product Line of Linko Semiconductor
  • Automotive MCU Business of Chipways
  • Chipower Tech
  • OmniVision Launched Automotive MCUs
  • Spintrol's Automotive MCU: SPC1169
简介目录
Product Code: ZHP136

With policy support, the localization rate of automotive MCU will surge.

Chinese electric vehicle companies are quickening their pace of purchasing domestic chips to reduce their dependence on imported ones and expedite the development of China's semiconductor industry system. According to unofficial goals, the overall penetration rate of homegrown automotive chips will be increased to over 20% in 2025, and state-owned and private automakers are encouraged to buy homemade chips as priority. Amid the long mass production cycle of automotive MCUs and the extremely low localization rate for a long time, the policy support will help local automotive MCUs boom.

In January 2024, the Ministry of Industry and Information Technology released the Guidelines for the Construction of the National Automotive Chip Standard System, suggesting that: in 2025, more than 30 key automotive chip standards should be formulated to clarify the basic requirements concerning environment and reliability, electromagnetic compatibility, functional safety, information security and more, and the technical specifications for key products and applications including control, computing, storage, power and communication chips should be formulated to meet the basic needs for safe and reliable application and pilot demonstration of automotive chip products; in 2030, more than 70 automotive chip standards should be formulated. Favorable policies facilitate the development of Chinese automotive MCU vendors.

International giants gain first-mover advantages in automotive MCUs. Chinese vendors started with body control with relatively low safety requirements, and some leading companies also work to make layout in power/chassis, cockpit, and autonomous driving fields. Chinese vendors gradually improve their automotive MCU product line layout and narrow the gap with international tycoons in product performance.

1. Chinese automotive MCU vendors have made an all-round layout of low-, mid- and high-end products.

High-end automotive MCUs have always been monopolized by international giants. For example, Infineon has a monopoly in the autonomous driving field; NXP and Renesas prevail in the gateway and power/chassis fields.

In recent years, Chinese vendors have been vigorously laying out high-end automotive MCU products, and some of them such as SemiDrive, AutoChips have already made a foray into the high-end market.

SemiDrive: it launched the E3 series of automotive MCUs for domain control, body, chassis, power, ADAS, battery management system (BMS) and other applications in 2022, and has shipped more than a million pieces. Suspension controllers (CDC) mounted on models like Chery Tiggo 9 and EXEED Stellar are powered by SemiDrive E3 series products.

In March 2024, SemiDrive further improved the E3 series and released E3119F8/E3118F4, targeting such application fields as body domain control, zone controllers, front-view all-in-one, and LiDAR. The new product uses ARM Cortex R5F CPU, and packs at most two independent 400MHz high-performance application kernels, with the main frequency of the information security kernel up to 200MHz. In terms of tool chain, SemiDrive supports IAR and Greenhills, adapts to the mainstream ARM debugger, and provides SDK/MCAL basic software support. Currently, SemiDrive is partnering with multiple Chinese and foreign AutoSAR vendors and working on BSW adaptation.

In current stage, SemiDrive's products have covered high-end fields of zone control, chassis and intelligent driving.

AutoChips: In October 2023, it introduced AC7870x, its first multi-kernel high-frequency MCU that meets the ASIL-D functional safety level and is based on Arm Cortex R52 kernel. AC7870x is primarily applied in the fields of power chassis, "three electrics" for new energy vehicles, and zone controllers under new EEA. The company thus officially entered the high-end automotive MCU field.

2. Build an independent domestic chip supply chain.

From 2021 to 2022, automotive MCUs were difficult to buy, with soaring prices, which made Chinese automakers realize the importance of an independent supply chain system and also gave scope to China's local automotive MCUs.

Chinese MCU vendors are trying hard to build a local supply chain:

Yuntu Micro: More than half of upstream partners are domestic. The company has achieved full localization in multiple links from upstream wafer fabs to packaging and testing. The localized supply chain makes products more cost-effective.

OmniVision: OMX14xN in the OMX14x series is an automotive MCU with a fully localized supply chain from fab to packaging and testing.

AutoChips: AC7802x, an automotive MCU mass-produced in August 2023, is a fully localized chip.

Application of automotive MCU in functional domains

Conventional automobiles need about 40-50 MCUs. As EEA gets upgraded, the MCU requirements of autonomous driving, cockpit, body & zone control, power, chassis, central computing and so on have also changed. MCU products head in the direction of high performance.

For autonomous driving domain control, mainstream MCU products include Infineon TC297X/397X Series and the latest TC4X Series, ST Stellar Series, Renesas RH850 Series, TI Hercules, and SemiDrive E3 Series.

Central supercomputing platforms have higher requirements on chips' functional safety. For example, Leapmotor's Four Leaf Clover central supercomputing platform adopts NXP S32G. Wherein, the Standard Configuration version adopts Qualcomm 8155 (3rd Generation Snapdragon Cockpit Platform) + NXP S32G (3 cores); the Medium Configuration version adopts Qualcomm 8295 (4th Generation Snapdragon Cockpit Platform) + NXP S32G (7 cores).

NXP S32G Family utilizes three 400MHz Arm Cortex-M7 cores, and provides support for different products according to cost requirements and application scenarios.

MCU core design trends include GPU, new storages, built-in HSM security components, etc.

Conventional MCU products mainly integrate eight components such as CPU, memory, I/O port, serial port, timer, interrupt system and special function register. The development of domain control architecture brings new demand for high-performance and high-security MCUs.

Furthermore with the increasingly high MCU performance, the difference between MCU and MPU becomes ever smaller. From some moves of international giants in current stage, it can be seen that crossover MCU or crossover MPU is a layout direction they head in. Putting some hardware only available in MPU into MCU not only realizes low power consumption, low cost and simplicity of MCU, but also enables applications that were enabled only by MPU in the past.

MCU's graphics processing capabilities are being enhanced.

As vehicles pose ever higher requirements for image definition, zoomable maps, video play, etc., MCU vendors have begun to compete in graphics processing in recent year. International tycoons like ST, Infineon, Renesas and NXP have launched MCU products with GPU integrated. Chinese vendors such as GigaDevice and HPMicro have also been working to make layout.

For example, the new TRAVEO(TM) T2G Cluster family of automotive microcontrollers (MCU) with a new graphics engine enables cluster, infotainment and cockpit systems with MPU like performance at MCU cost.

In terms of memory, the graphics engine within the MCUs minimizes the memory required for graphics processing by a factor of 3 to 5, resulting in lower power consumption and lower costs.

The requirements for MCU security are higher.

MCU is an important node in vehicle networks and interacts with other ECUs (electronic control unit) via communication protocols such as CAN (controller area network) bus or Ethernet. These communication protocols, if not encrypted or authenticated, will easily intercepted and tampered by attackers, leading to malicious vehicle control or other safety incidents.

MCU thus plays a critical role in automotive cybersecurity. To cope with increasingly severe cybersecurity threats, effective measures need to be taken to strengthen automotive cybersecurity. Major automotive MCU vendors are also vigorously deploying high-security MCU products.

SemiDrive: SemiDrive E3 series meets the AEC-Q100 Grade 1 reliability certification. It is China's first MCU to pass German TUV ASIL D/SIL 3 functional safety level certification and China's national cryptographic product Level 2 certification, and has passed the TUV ASPICE CL2 evaluation. It is known that the new automotive MCU products E3119F8 and E3118F4 unveiled in March 2024 integrate hardware security modules (HSM), comply with the Full EVITA information security level, and cooperate with the industry's leading information security solution providers, and support ISO 21434-compliant information security firmware. This sub-series can support ISO 26262 ASIL-B functional safety level. SemiDrive will provide functional safety software library, FMEDA and various functional safety documents, and complete the ASIL-B level product functional safety certification.

Renesas: The RH850 series MCUs have a built-in intelligent cryptography unit (ICU), which stores the secret key in a separate storage area that cannot be directly accessed by the CPU. A dedicated mechanism is required to enhance the actual anti-tampering function and support high-end encryption operations such as RSA and ECC. They can provide security services such as software operation prevention, hardware and software connection, secure boot, and verification of ECUs in network nodes.

Automotive Microcontroller Unit (MCU) Industry Report, 2024 released by ResearchInChina highlights the following:

Automotive MCU market (status quo, size, pattern, supply and demand, etc.;)

Application, localization and main product cases of automotive MCU in different application fields (body control, autonomous driving, intelligent cockpit, power chassis, central computing domain control, etc.);

Key points in automotive MCU industry development (process, core technology, storage technology, image processing function, functional safety, etc.);

Chinese and foreign automotive MCU vendors (product layout, new product R&D dynamics, product applications, etc.).

Table of Contents

1 Status Quo of Automotive MCU Industry

  • 1.1 Overview of Automotive MCU
    • 1.1.1 Automotive MCU Development Status Quo and Trends
    • 1.1.2 Classification of Automotive MCU
    • 1.1.3 Structure of Automotive MCU
    • 1.1.4 Automotive MCU Application (1)
    • 1.1.5 Automotive MCU Application (2)
    • 1.1.6 Automotive MCU Technology Evolution Trends under Cross-Domain Integration Architecture
  • Production Modes of Automotive MCU: Foundry-dominated
  • 1.2 Automotive MCU Market Size
    • 1.2.1 Number of MCUs Per Vehicle
    • 1.2.2 Price of Automotive MCU (1)
    • 1.2.3 Price of Automotive MCU (2)
    • 1.2.4 Price of Automotive MCUs Stabilizes
    • 1.2.5 Global Automotive MCU Market Size (by 8-bit / 16-bit / 32-bit)
    • 1.2.6 Passenger Car MCU Market Size in China
    • 1.2.7 Passenger Car MCU Market Size in China - Appendix
  • 1.3 Competitive Pattern of Automotive MCU
    • 1.3.1 Competitive Pattern of Global MCU Market: Foreign Vendors Monopolize the Mid- and High-end Automotive MCU Markets
    • 1.3.2 Competitive Pattern of China's MCU Market
    • 1.3.3 Automotive MCU Market Players (1): Conventional Automotive Chip Suppliers (1)
    • 1.3.4 Automotive MCU Market Players (1): Conventional Automotive Chip Suppliers (2)
    • 1.3.5 Automotive MCU Market Players (1): Conventional Automotive Chip Suppliers (3)
    • 1.3.6 Automotive MCU Market Players (2): OEMs
    • 1.3.7 Automotive MCU Market Potential Players (1): Chip Design Companies
    • 1.3.8 Automotive MCU Market Potential Players (2): Tier 1 Suppliers
    • 1.3.9 Automotive MCU Product Lines from Major Vendors (1)
    • 1.3.10 Automotive MCU Product Lines from Major Vendors (2)
    • 1.3.11 Automotive MCU Product Lines from Major Vendors (3)
    • 1.3.12 Summary of Chinese Players' Automotive MCUs: Products Benchmarking Against Foreign Major Players (1)
    • 1.3.13 Summary of Chinese Players' Automotive MCUs: Products Benchmarking Against Foreign Major Players (2)
    • 1.3.14 Summary of Chinese Players' Automotive Specification MCUs: Product Performance Continues to Improve
    • 1.3.15 Typical 8-bit/16-bit/32-bit MCU Products

2 Major Application Fields of Automotive MCU

  • 2.1 Application Field 1: Body Control
    • 2.1.1 Application Trends of MCU in Body Control: Multiple Conventional Functions, Relatively Stable Demand for MCU
    • 2.1.2 Body Domain Control MCU Market Pattern
    • 2.1.3 Localization of MCU in Body Control Market
    • 2.1.4 Localization Layout of Body Control MCUs (1)
    • 2.1.5 Localization Layout of Body Control MCUs (2)
    • 2.1.6 Body Control MCU Product Selection (1)
    • 2.1.7 Body Control MCU Product Selection (2)
    • 2.1.8 Body Control MCU Product Selection (3)
    • 2.1.9 Body Control MCU Product Selection (4)
    • 2.1.10 Body Control MCU Product Selection (5)
    • 2.1.11 New Body Control MCU Product: Renesas RH850/F1KM-S2 Series (1)
    • 2.1.12 New Body Control MCU Product: Renesas RH850/F1KM-S2 Series (2)
    • 2.1.13 Body Domain Control MCU Case: NXP's S32K3-based Body Domain Control Solution (1)
    • 2.1.14 Body Domain Control MCU Case: NXP's S32K3-based Body Domain Control Solution (2)
    • 2.1.15 Body Domain Control MCU Case: ST's SPC5-based BCM solution
    • 2.1.16 Body Domain Control MCU Case: Infineon's BCM Solution based on Traveo II and AURIX(TM)
    • 2.1.17 Body Domain Control MCU Case: TI's BCM Solution Based on DRA714 or DRA710
    • 2.1.18 Body Domain Control MCU Case: Body Control Solution Built on MCU Chips from AutoChips
    • 2.1.19 Body Domain Control MCU Case: Freescale MCU-based Central Body Control Module (BCM) (1)
    • 2.1.20 Body Domain Control MCU Case: Freescale MCU-based Central Body Control Module (BCM) (2)
    • 2.1.21 Body (Domain) Control MCU for OEM: BMW BCP
  • 2.2 Application Field 2: Autonomous Driving
    • 2.2.1 Structure of ADAS Domain Controller
    • 2.2.2 Impacts of Autonomous Driving Evolution on MCU: ADAS Functional Domain Centralization, Narrower MCU Application Scope
    • 2.2.3 ADAS Domain Control Architecture Development Trend 1: SoCs Replace MCU Computing Power
    • 2.2.4 ADAS Domain Control Architecture Development Trend 2: Adoption of Enhanced Functional Safety MCUs (1)
    • 2.2.5 ADAS Domain Control Architecture Development Trend 2: Adoption of Enhanced Functional Safety MCUs (2)
    • 2.2.6 ADAS Domain Control Architecture Development Trend 2: Adoption of Enhanced Functional Safety MCUs (3)
    • 2.2.7 ADAS Domain Control MCU Market Pattern
    • 2.2.8 Localization of Autonomous Driving MCU
    • 2.2.9 Advantages for Localization of Autonomous Driving MCU: Reducing Supply Chain Risks
    • 2.2.10 Layout for Localization of Autonomous Driving MCU
    • 2.2.11 Autonomous Driving MCU Product Selection (1)
    • 2.2.12 Autonomous Driving MCU Product Selection (2)
    • 2.2.13 Autonomous Driving MCU Product Case: Infineon's Domain Control MCU
    • 2.2.14 Autonomous Driving MCU Product Case: J5-based Autonomous Driving Domain Controller
    • 2.2.15 Autonomous Driving MCU Application Case (1): Zhicong Technology's ADAS Domain Controller
    • 2.2.16 Autonomous Driving MCU Application Case (2): Nissan's ADAS Domain Controller
    • 2.2.17 Autonomous Driving MCU Application Case (3): Youkong Zhixing's AVCU
    • 2.2.18 Discussion on Whether ADAS Domain Control Would Eliminate MCUs (1)
    • 2.2.19 Discussion on Whether ADAS Domain Control Would Eliminate MCUs (2)
  • 2.3 Application Field 3: Intelligent Cockpit
    • 2.3.1 Application Trends of MCU in Intelligent Cockpit: Less Important Role of MCU (1)
    • 2.3.2 Application Trends of MCU in Intelligent Cockpit: Less Important Role of MCU (2)
    • 2.3.3 Localization of Intelligent Cockpit MCU
    • 2.3.4 Localization Layout of Intelligent Cockpit MCU
    • 2.3.5 Intelligent Cockpit MCU Product Selection (1)
    • 2.3.6 Intelligent Cockpit MCU Product Selection (2)
    • 2.3.7 Intelligent Cockpit MCU Product Selection (3)
    • 2.3.8 Intelligent Cockpit MCU Application Case (1): McLaren GT Cockpit
    • 2.3.9 Intelligent Cockpit MCU Application Case (2): Ford EVOS
    • 2.3.10 Intelligent Cockpit MCU Application Case (3): NIO ET7
  • 2.4 Application Field 4: Power & Chassis Control
    • 2.4.1 Application Trends of MCU in Power & Chassis Control: Electric Systems Push up Demand for MCU
    • 2.4.2 Localization of Power & Chassis Control MCU
    • 2.4.3 Localization Layout of Power & Chassis Control MCU
    • 2.4.4 Power & Chassis Control MCU Product Selection (1)
    • 2.4.5 Power & Chassis Control MCU Product Selection (2)
    • 2.4.6 Power & Chassis Control MCU Product Selection (3)
    • 2.4.7 Power & Chassis Control MCU Product Selection (4)
    • 2.4.8 Power & Chassis Control MCU Application Case: Volkswagen ID.3 Inverter
  • 2.5 Application Field 5: Central Computing + Zonal Controller
    • 2.5.1 MCU Demand from Central Computing + Zonal Controller
    • 2.5.2 Central Computing + Zonal Controller MCU Application Case (1): Infineon TC4xx (1)
    • 2.5.3 Central Computing + Zonal Controller MCU Application Case (1): Infineon TC4xx (2)
    • 2.5.4 Central Computing + Zonal Controller MCU Application Case (1): Infineon TC4xx (3)
    • 2.5.5 Central Computing + Zonal Controller MCU Application Case (1): Infineon TC4xx (4)
    • 2.5.6 Central Computing + Zonal Controller MCU Application Case (2): Semidrive Semiconductor E3 Series
    • 2.5.7 Central Computing + Zonal Controller MCU Application Case (3): Renesas RH850
    • 2.5.8 Application Trends of Auto Companies under E/E Architecture: Leapmotor Adopts SOC+MCU to Realize Multi-Domain Integration (1)
    • 2.5.9 Application Trends of Auto Companies under E/E Architecture: Leapmotor Adopts SOC+MCU to Realize Multi-Domain Integration (2)
    • 2.5.10 Application Trends of Auto Companies under E/E Architecture: Leapmotor Adopts SOC+MCU to Realize Multi-Domain Integration (3)

3 Key Technologies of Automotive MCU

  • 3.1 Production Process
    • 3.1.1 Process Technology Evolution Toward Advanced Processes
    • 3.1.2 Gap between Chinese and Foreign Automotive MCU Processes
    • 3.1.3 MCU Process Layout in Different Vendors
    • 3.1.4 Process Layout of Mainstream Automotive MCU Vendors
  • 3.2 Core Technologies
    • 3.2.1 Major Core Architectures for Automotive MCUs (1)
    • 3.2.2 Major Core Architectures for Automotive MCUs (2)
    • 3.2.3 Major Kernel Statistics Adopted by Chinese and Foreign MCU Vendors (1)
    • 3.2.4 Major Kernel Statistics Adopted by Chinese and Foreign MCU Vendors (2)
    • 3.2.5 Automotive MCU Kernel Development Trends 1: Adoption of RISC-V
    • 3.2.6 Automotive MCU Kernel Development Trends 1: Advantages and Disadvantages of RISC-V Chips for Vehicles
    • 3.2.7 Automotive MCU Kernel Development Trends 1: Partial RISC-V Automotive IPs
    • 3.2.8 Automotive MCU Kernel Development Trends 1: Layout of RISC-V Chip Vendors (1)
    • 3.2.9 Automotive MCU Kernel Development Trends 1: Layout of RISC-V Chip Vendors (2)
    • 3.2.10 Automotive MCU Kernel Development Trends 1: RISC-V Chip Applications for OEMs
    • 3.2.11 Automotive MCU Kernel Development Trends 1: RISC-V Vendor Cases
    • 3.2.12 Layout of Vendor's Automotive MCU Kernel Technology 1: Using PowerPC
    • 3.2.13 Automotive MCU Development Trend 2: Multi-core Heterogeneity
    • 3.2.14 Automotive MCU Development Trend 2: Multi-core Heterogeneity Improves Communication Quality (1)
    • 3.2.15 Automotive MCU Development Trend 2: Multi-core Heterogeneity Improves Communication Quality (2)
    • 3.2.16 Automotive MCU Development Trend 3: Evolution to High-Frequency
    • 3.2.17 Automotive MCU Development Trend 3: High-Frequency Case (SemiDrive)
  • 3.3 Application of New Storage Technologies
    • 3.3.1 Application Advantages of SRAM for Automotive MCU
    • 3.3.2 Automotive MCUs Start Embedding New Types of Storages
    • 3.3.3 MCU Vendors' New Storage Technology Layout
    • 3.3.4 MCU Vendors' New Storage Technology Case: ST's PCM (1)
    • 3.3.5 MCU Vendors' New Storage Technology Case: ST's PCM (2)
    • 3.3.6 MCU Vendors' New Storage Technology Case: ST's PCM (3)
    • 3.3.7 MCU Vendors' New Storage Technology Case: Infineon's RRAM NVM (Non-Volatile Memory) (1)
    • 3.3.8 MCU Vendors' New Storage Technology Case: Infineon's RRAM NVM (Non-Volatile Memory) (2)
    • 3.3.9 MCU Vendors' New Storage Technology Case: NXP's MRAM
    • 3.3.10 MCU Vendors' New Storage Technology Case: Renesas Self-developed STT-MRAM
  • 3.4 Image Processing Capabilities
    • 3.4.1 Image Processing Capabilities of MCUs
    • 3.4.2 Layout of Major MCU Vendors on Graphics Processing Capabilities
    • 3.4.3 Case of MCU with Graphics Processing Capability: HPMicro
    • 3.4.4 Case of MCU with Graphics Processing Capability: Infineon
  • 3.5 Functional Safety
    • 3.5.1 Automotive MCU Testing and Certification
    • 3.5.2 Certification of Automotive MCUs is Difficult and Takes a Long Time
    • 3.5.3 Certification Standards for Automotive MCUs (1)
    • 3.5.4 Certification Standards for Automotive MCUs (2)
    • 3.5.5 Automotive MCU's Requirements for ASIL Functional Safety
    • 3.5.6 Summary of MCU Products Meeting ASIL-B Functional Safety: Foreign (1)
    • 3.5.7 Summary of MCU Products Meeting ASIL-B Functional Safety: Foreign (2)
    • 3.5.8 Summary of MCU Products Meeting ASIL-B Functional Safety: Domestic (1)
    • 3.5.9 Summary of MCU Products Meeting ASIL-B Functional Safety: Domestic (2)
    • 3.5.10 Summary of MCU Products Meeting ASIL-C Functional Safety: Foreign
    • 3.5.11 Summary of MCU Products Meeting ASIL-D Functional Safety: Foreign (1)
    • 3.5.12 Summary of MCU Products Meeting ASIL-D Functional Safety: Foreign (2)
    • 3.5.13 Summary of MCU Products Meeting ASIL-D Functional Safety: Chinese (1)
    • 3.5.14 Summary of MCU Products Meeting ASIL-D Functional Safety: Chinese (2)
    • 3.5.15 New MCU Products Meeting Automotive Functional Safety Requirements (1): Semidrive E3 Microcontroller Series
    • 3.5.16 New MCU Products Meeting Automotive Functional Safety Requirements (2): Blue Whale CVM0144
  • 3.6 Packaging Technology
    • 3.6.1 Packaging Technology Evolution
    • 3.6.2 Advanced Packaging Technology Platform
    • 3.6.3 Automotive MCU Packaging Technology
    • 3.6.4 Some MCU Packaging Vendors
  • 3.7 MCU + Solutions
    • 3.7.1 Integrate MCU and Other Chips as MCU+ Solution
    • 3.7.2 Integrate MCU and Other Chips as MCU+ Solution: MCU + SoC (1)
    • 3.7.3 Integrate MCU and Other Chips as MCU+ Solution: MCU + SoC (2)
    • 3.7.4 Integrate MCU and Other Chips as MCU+ Solution: MCU + Other Chips
  • 3.8 High-end MCUs
    • 3.8.1 High-end MCUs Integrate More Functions
    • 3.8.2 High-end Automotive MCU: Foreign Vendors Layout Domain Control Field (1)
    • 3.8.3 High-end Automotive MCU: Foreign Vendors Layout Domain Control Field (2)
    • 3.8.4 High-end Automotive MCU: Chinese Vendors Entering the High-end Field
    • 3.8.5 High-Performance MCU Case: NXP S32K Series
    • 3.8.6 High-Performance MCU Case: NXP S32G Series
  • 3.9 Integration of MCU and MPU
    • 3.9.1 Layout of Crossover MCUs for Major Vendors
    • 3.9.2 Crossover MCU Case: ST's STM32H7Rx and STM32H7Sx
    • 3.9.3 Crossover MCU Case: TI's Sitara AM2x
    • 3.9.4 Crossover MPU Case: ST Multiplexes STM32 MCU Eco and IP
  • 3.10 Considerations for OEMs in Selecting MCUs
    • 3.10.1 Consideration 1: Application Development
    • 3.10.2 Consideration 2: Technical Support (1)
    • 3.10.3 Consideration 2: Technical Support (2)

4 Foreign Automotive MCU Suppliers

  • 4.1 Renesas
    • 4.1.1 Next Generation of Automotive SoC and MCU Processors Product Roadmap
    • 4.1.2 MCU Product Line
    • 4.1.3 Automotive MCU Product: RH850 Series
    • 4.1.4 Automotive MCU Product: RH850 F-Series Wiring Diagram
    • 4.1.5 Automotive MCU Product: Expanding the RH850 F-Series Product Line
    • 4.1.6 Automotive MCU Product: Low Power Consumption Performance of RH850 Series
    • 4.1.7 Automotive MCU Product: RH850 Series Functional Safety
    • 4.1.8 Automotive MCU Product: RH850 Series Features
    • 4.1.9 Automotive MCU Product: RL78/F24 and RL78/F23
    • 4.1.10 MCU Cybersecurity Management Certified to ISO/SAE 21434:2021
    • 4.1.11 MCU Application: Low Cost Cockpit Instrument Cluster
    • 4.1.12 MCU Application: Domain Control Unit
    • 4.1.13 MCU Application: Automotive Gateway
  • 4.2 NXP
    • 4.2.1 Automotive Chip Delivery Cycle
    • 4.2.2 Automotive MCU Product Line
    • 4.2.3 Automotive MCU Product: S32G Series (1)
    • 4.2.4 Automotive MCU Product: S32G Series (2)
    • 4.2.5 Automotive MCU Product: S32K Series
    • 4.2.6 Automotive MCU Product: Naming Rules for S32K Series
    • 4.2.7 Automotive MCU Product: S32Z/S32E (1)
    • 4.2.8 Automotive MCU Product: S32Z/S32E (2)
    • 4.2.9 Automotive MCU Product: S32K39
    • 4.2.10 MCU Price
    • 4.2.11 MCU Production Base
  • 4.3 Infineon
    • 4.3.1 Automotive MCU Product Line (1)
    • 4.3.2 Automotive MCU Product Line (2)
    • 4.3.3 Automotive MCU Product: Traveo(TM) II Series
    • 4.3.4 Automotive MCU Product: TRAVEO(TM) T2G Cluster Series
    • 4.3.5 Automotive MCU Product: AURIX(TM) Series (1)
    • 4.3.6 Automotive MCU Product: AURIX(TM) Series (2)
    • 4.3.7 Automotive MCU Product: AURIX(TM) TC 3 Series
    • 4.3.8 Automotive MCU Product: AURIX(TM) TC4x
    • 4.3.9 Automotive MCU Product: Performance of AURIX(TM) TC4x
    • 4.3.10 Automotive MCU Product: Architecture of AURIX(TM) TC4x
    • 4.3.11 Automotive MCU Product: AURIX(TM) TC4x Introduces PPU (1)
    • 4.3.12 Automotive MCU Product: AURIX(TM) TC4x Introduces PPU (2)
    • 4.3.13 Automotive MCU Product: AI Performance of AURIX(TM) TC4x
    • 4.3.14 Automotive MCU Product: AURIX(TM) TC4x Security
    • 4.3.15 Automotive MCU Product: AURIX(TM) TC4x Virtualization Performance
    • 4.3.16 Automotive MCU Product: AURIX(TM) TC4x Application Areas
    • 4.3.17 Automotive MCU Product: AURIX(TM) TC4x Ecosystem
    • 4.3.18 Automotive MCU Product: AURIX(TM) TC4x Supports AUTOSAR
    • 4.3.19 Automotive MCU Production
  • 4.4 ST
    • 4.4.1 Automotive MCU Product Line
    • 4.4.2 Automotive MCU Product: Stellar Series (1)
    • 4.4.3 Automotive MCU Product: Stellar Series (2)
    • 4.4.4 Automotive MCU Product: Stellar G Architecture
    • 4.4.5 Automotive MCU Product: SPC5 Series (1)
    • 4.4.6 Automotive MCU Product: SPC5 Series (2)
    • 4.4.7 Automotive MCU Product: SPC5 Series (3)
    • 4.4.8 Automotive MCU Product: Process Evolution of SPC5 Series
    • 4.4.9 New Automotive MCU Product: Stellar P
    • 4.4.10 New Automotive MCU Product: Stellar E
    • 4.4.11 Automotive MCU Eco-Partners
    • 4.4.12 Development Toolchain
  • 4.5 TI
    • 4.5.1 MCU Business
    • 4.5.2 Low Consumption Automotive MCU Product: MSPM0 Safety Series (1)
    • 4.5.3 Low Consumption Automotive MCU Product: MSPM0 Safety Series (2)
    • 4.5.4 Low Consumption Automotive MCU Product: MSPM0 Safety Series (3)
    • 4.5.5 Automotive MCU Product: C2000 Series
    • 4.5.6 Automotive MCU Product: Jacinto Series (1)
    • 4.5.7 Automotive MCU Product: Jacinto Series (2)
    • 4.5.8 Automotive MCU Product: Sitara(TM) AM2x Series
    • 4.5.9 Production Base
    • 4.5.10 Automotive MCU Application: BYD All-in-One Controller
  • 4.6 Microchip
    • 4.6.1 Automotive MCU Product Line
    • 4.6.2 Automotive MCU Product: 8-bit MCU
    • 4.6.3 Automotive MCU Product: 16-bit MCU
    • 4.6.4 Automotive MCU Product: dsPIC33 DSC
    • 4.6.5 Automotive MCU Product: 32-bit MCU (1)
    • 4.6.6 Automotive MCU Product: 32-bit MCU (2)
    • 4.6.7 Automotive MCU Product: 32-bit MCU (3)
    • 4.6.8 Automotive MCU Product: 32-bit MCU (4)

5 Chinese Automotive MCU Suppliers

  • 5.1 SemiDrive
    • 5.1.1 Improve Automotive MCU Product Line
    • 5.1.2 Improve E3 Series Automotive MCU Market Coverage
    • 5.1.3 Released New E3 Series Products
    • 5.1.4 Automotive MCU Products: E3 Series (1)
    • 5.1.5 Automotive MCU Products: E3 Series (2)
    • 5.1.6 E3 MCU-based Domain Controller Gateway Solution
    • 5.1.7 MCU Application: CDC
  • 5.2 ChipON
    • 5.2.1 Profile
    • 5.2.2 Revenue Structure
    • 5.2.3 Revenue Structure of MCU Products
    • 5.2.4 Sales and Price of MCU Products
    • 5.2.5 Core Competitiveness of Automotive MCU: Self-developed KungFu Core
    • 5.2.6 Automotive MCU Business
    • 5.2.7 Automotive MCU Product Line
    • 5.2.8 Automotive MCU Anti-War Plan
    • 5.2.9 MCU Benchmark Products
    • 5.2.10 32-bit Automotive MCU Localization Advantages
    • 5.2.11 Automotive MCU Product: KF32A158
    • 5.2.12 Automotive MCU Product: KF32A136/KF32A146
    • 5.2.13 Automotive MCU Application Scenarios
    • 5.2.14 Main Customers of Automotive MCU
  • 5.3 GigaDevice
    • 5.3.1 Operation
    • 5.3.2 Revenue Structure
    • 5.3.3 Gross Margin
    • 5.3.4 MCU Business
    • 5.3.5 Automotive MCU Product Planning
    • 5.3.6 New Automotive MCU Product: GD32A490 Series (1)
    • 5.3.7 New Automotive MCU Product: GD32A490 Series (2)
    • 5.3.8 Automotive MCU: GD32A503 (1)
    • 5.3.9 Automotive MCU: GD32A503 (2)
    • 5.3.10 Accelerating Localization
  • 5.4 BYD Semiconductor
    • 5.4.1 Profile
    • 5.4.2 Automotive MCU Product Line
    • 5.4.3 Automotive MCU Product Planning
    • 5.4.4 New Automotive MCU Product: BS9000AMXX Series
    • 5.4.5 New Automotive MCU Product: BS9000AMXX Series Competitor Comparison
  • 5.5 AutoChips
    • 5.5.1 Automotive MCU Product Line
    • 5.5.2 Shipments of Automotive MCU
    • 5.5.3 Automotive MCU: AC781x Series
    • 5.5.4 Automotive MCU: AC7801x Series
    • 5.5.5 Automotive MCU Product: AC7840x
    • 5.5.6 New Automotive MCU Product: AC7802x
    • 5.5.7 New Automotive MCU Product: AC7870x
    • 5.5.8 Automotive MCU Product Application: BMS
  • 5.6 CCore Technology
    • 5.6.1 Automotive MCU Application Scenarios
    • 5.6.2 Automotive MCU Product Line
    • 5.6.3 Automotive MCU Technology Roadmap
    • 5.6.4 Automotive MCU Core Advantages
    • 5.6.5 New Automotive MCU Product: CCFC3007PT
    • 5.6.6 New Automotive MCU Product: CCFC3008PT (1)
    • 5.6.7 New Automotive MCU Product: CCFC3008PT (1)
    • 5.6.8 Automotive MCU Product: CCFC2012BC
    • 5.6.9 Automotive MCU Product: CCFC2007PT
    • 5.6.10 Automotive MCU Product: CCFC2016BC
  • 5.7 Sine Microelectronics
    • 5.7.1 MCU Product Line
    • 5.7.2 New MCU Product: ASM31AM830
    • 5.7.3 New MCU Product: ASM8130X
    • 5.7.4 MCU+ Power Layout
    • 5.7.5 MCU Application Dynamics
  • 5.8 Huada Semiconductor
    • 5.8.1 MCU Business
    • 5.8.2 Automotive MCU Layout of Xiaohua Semiconductor
  • 5.9 Hangshun Chip
    • 5.9.1 Acquired Chengdu Rongxin Micro
    • 5.9.2 Obtained Automotive Functional Safety Certification
    • 5.9.3 Automotive MCU Planning
    • 5.9.4 Automotive MCU Product Series
    • 5.9.5 Automotive MCU: HK32AUTO39A
    • 5.9.6 Automotive MCU Application: Skoda Center Console Entertainment System
    • 5.9.7 Main Customers
  • 5.10 Geehy Semiconductor
    • 5.10.1 MCU Business
    • 5.10.2 Automotive MCU Layout
    • 5.10.3 Automotive MCU Product: APM32F103RCT7
    • 5.10.4 Automotive MCU Product: APM32A407 Series
    • 5.10.5 Automotive MCU Product: APM32A091 Series
    • 5.10.6 Automotive MCU Product: G32A1445
    • 5.10.7 Automotive MCU Application- LED Lights
  • 5.11 Yuntu Micro
    • 5.11.1 Profile
    • 5.11.2 Product Matrix
    • 5.11.3 Automotive MCU Product Line
    • 5.11.4 New Automotive MCU Product: YTM32B1H
    • 5.11.5 Automotive MCU Product: YTM32B1L
    • 5.11.6 Automotive MCU Product: YTM32B1ME (1)
    • 5.11.7 Automotive MCU Product: YTM32B1ME (2)
    • 5.11.8 Automotive MCUs Benchmarked Against NXP Products
  • 5.12 MindMotion Microelectronics
    • 5.12.1 MCU Business
    • 5.12.2 Automotive MCU Layout
    • 5.12.3 Automotive MCU Product: MM32A0140 (1)
    • 5.12.4 Automotive MCU Product: MM32A0140 (2)
    • 5.12.5 MCU: MM32F5 Series
    • 5.12.6 Automotive Chip Test and Verification Laboratory Passes National CNAS Certification
  • 5.13 CVA Chip
    • 5.13.1 Profile
    • 5.13.2 MCU Product Line
    • 5.13.3 New Automotive MCU Product: CVM011x Series
    • 5.13.4 Automotive MCU Product: CVM014x Series (1)
    • 5.13.5 Automotive MCU Product: CVM014x Series (2)
    • 5.13.6 Automotive MCU Product: CVM014x Series (3)
    • 5.13.7 Automotive MCU Product: CVM014x Series (4)
    • 5.13.8 Automotive MCU Application: Interior Ambient Lighting
    • 5.13.9 Automotive MCU Application: Power Tailgate
    • 5.13.10 Automotive MCU Application: Small Motor Control
  • 5.14 Chipsea
    • 5.14.1 Automotive Product Layout
    • 5.14.2 Automotive MCU
    • 5.14.3 Automotive MCU: CS32F116Q
    • 5.14.4 Automotive MCU: CS32F116Q Evaluation Kit
  • 5.15 AMEC
    • 5.15.1 Automotive MCU Product Line
    • 5.15.2 New Automotive MCU Product: BAT32A239/ BAT32A279
    • 5.15.3 Automotive MCU: BAT32A337
    • 5.15.4 Automotive MCU: BAT32A237
  • 5.16 Flagchip
    • 5.16.1 Automotive MCU Product Line
    • 5.16.2 Automotive MCU Product: FC4150 Family (1)
    • 5.16.3 Automotive MCU Product: FC4150 Family (2)
    • 5.16.4 Automotive MCU Product: FC4150F2M
    • 5.16.5 Automotive MCU Product: FC4150F512
    • 5.16.6 Automotive HPU Product: FC7300 Series (1)
    • 5.16.7 Automotive HPU Product: FC7300 Series (2)
    • 5.16.8 Automotive HPU Product: FC7300 Series (3)
    • 5.16.9 Ecosystem
  • 5.17 Binary Semiconductor
    • 5.17.1 Profile
    • 5.17.2 Automotive MCU Product Planning
    • 5.17.3 New Automotive MCU Product: Fuxi 2360
    • 5.17.4 Automotive MCU Kernel: Fuxi 2360
    • 5.17.5 Construction of Automotive Chip Ecosystem
  • 5.18 HPMicro
    • 5.18.1 Automotive MCU Layout
    • 5.18.2 New Automotive MCU Product: HPM5300
    • 5.18.3 New Automotive MCU Product: HPM5300 Architecture
    • 5.18.4 New Automotive MCU Product: HPM6200
    • 5.18.5 Automotive MCU Application: Automotive Cluster
  • 5.19 ChipEXT
    • 5.19.1 Profile
    • 5.19.2 First RISC-V Automotive MCU - CX3288
    • 5.19.3 First RISC-V Automotive MCU-CX3288 Product Features
    • 5.19.4 First RISC-V Automotive MCU-CX3288 for Information and Network Security
    • 5.19.5 First RISC-V Automotive MCU-CX3288 Utilizing AUTOSAR Architecture
    • 5.19.6 Profile of ThinkTech
    • 5.19.7 Automotive MCU Business of ThinkTech
  • 5.20 Profile of Fudan Microelectronics
    • 5.20.1 Automotive MCU Product: FM33LG0xxA
    • 5.20.2 New Automotive MCU Product: FM33FG0xxA Series
  • 5.21 Automotive MCU Product Line of Linko Semiconductor
    • 5.21.1 Automotive MCU Models
    • 5.21.2 Product-Level Control Algorithms and Platforms
    • 5.21.3 Automotive Chip Application: Automotive Electronic Expansion Valve
    • 5.21.4 Automotive Chip Application: Automotive Air Conditioning Compressor
    • 5.21.5 Automotive Chip Application: Automotive Water Pump, Oil Pump, Ventilation Fan
  • 5.22 Automotive MCU Business of Chipways
    • 5.22.1 Automotive MCU Product: XL660x
  • 5.23 Chipower Tech
    • 5.23.1 Automotive MCU Layout
    • 5.23.2 Automotive MCUs Passed the Highest Functional Safety Level Certification
  • 5.24 OmniVision Launched Automotive MCUs
    • 5.24.1 Automotive MCU Architecture: OMX14xN
    • 5.24.2 Automotive MCU Architecture: OMX14xB
    • 5.24.3 Automotive MCU Advantages
  • 5.25 Spintrol's Automotive MCU: SPC1169
    • 5.25.1 Automotive MCU: SPC1169 Architecture
    • 5.25.2 Automotive SOC Integrated with MCU