日本汽车一级先进技术与产品（2024-2025）

在汽车电动化、智慧化方面，中国主机厂和解决方案供应商正在引领潮流，尤其在智慧化应用的加速普及方面。但日本的汽车业和零件供应商正在加紧步伐追赶中国和西方汽车製造商。该公司在继续努力加强在某些电气化领域的技术领先地位的同时，也在扩大对人工智慧开发、软体定义汽车（SDV）和智慧（包括晶片）的投资。它也致力于推动与中国智慧汽车产业的联繫，以稳定全球销售成长为前提。

2024年5月，日本经济产业省和国土交通省发布了未来10年日本汽车产业数位转型策略计划，重点介绍软体定义汽车（SDV）、机器人计程车和车辆数据的价值。其中，SDV的研发被视为重中之重。日本政府预测2030年全球SDV市场规模将达到4,100万辆，其中日本厂商将占30%的占有率，约1,100万至1,200万辆。这是一个雄心勃勃的目标。

1、日本Tier1车企将加强对外合作，巩固电气化领域优势，并不遗余力地接受智慧化。

人工智慧电动车（AIEV）的开发除了需要内部在人工智慧开发支援、汽车SoC和OS（作业系统）等领域的研发和创新之外，自然也需要来自Tier 1的外部合作。

在AI开发方面，TURING、TIER IV、Sakana AI、Digital Realty、NTT、Denso、Alps Alpine等日本企业正致力于AI技术、世界模型、LLM记忆体管理技术等开发，加速与汽车产品的融合，推动L4自动驾驶在日本的大规模普及。例如，有以下几种：

2024年11月，Denso和Quadric宣布将共同开发专门用于AI计算处理的半导体NPU（神经处理单元）。根据该协议，Denso 将获得 Quadric 的 Chimera GPNPU IP 核的许可，两家公司将共同开发基于该核的高性能汽车半导体。

阿尔卑斯阿尔派 + 高通：2025年1月，两家公司宣布扩大技术合作，将高通科技公司最新一代的骁龙(R) Cockpit平台整合到阿尔卑斯阿尔派的汽车产品中。

自动驾驶开源软体供应商 TIER IV 和松尾研究所已着手开展针对 Autonomy 2.0 的生成式人工智慧项目，旨在大幅扩展 4 级自动驾驶的操作设计领域 (ODD)。

在晶片研发方面，日本厂商积极与台积电、Nvidia、英特尔、微软等大公司合作。

台积电：其在日本的第一座晶圆厂预计将于2024年底开始量产，第二座晶圆厂预计将于2027年投入营运。

微软：2024年11月，在东京开设了日本第一家研究中心。

英特尔：2024年9月，英特尔计画与AIST合作，兴建专门生产先进晶片的新研发中心。

NVIDIA：2024年4月，AIST与NVIDIA联手打造量子运算系统。

本报告对中国和日本的汽车产业进行调查和分析，并提供有关日本一级汽车研发、产品和与海外公司的关係的资讯。

目录

第1章：日本一级汽车企业与中国的关係

• 中国与日本汽车 Tier1/OEM 之间的产业关係（1）
• 中国与日本汽车一级供应商/OEM厂商的产业关係（2）
• 中日汽车 Tier1/OEM 之间的产业关係（3）
• 中国与日本汽车 Tier1/OEM 之间的产业关係（4）
• 中国与日本汽车 Tier1/OEM 之间的产业关係（5）
• 中日汽车 Tier1/OEM 之间的产业关係（6）
• 电装中国布局（1）
• 电装在华布局（2）
• 电装中国研发中心
• 电装在华生产布局
• 住友电工在华布局（1）
• 住友电工在华布局（2）
• 住友电工在华布局（3）
• 住友电工在华布局（4）
• JTEKT 中国生产基地布局
• NSK Steering & Control 公司中国生产基地布局
• 日立阿斯特莫中国生产基地布局
• KYB株式会社中国生产基地分布
• KEL Corporation 在中国的生产工厂
• 矢崎商事在中国的合资企业
• 丰田汽车计划在中国新建独资工厂
• 日本工具机订单：来自中国汽车市场的订单
• 典型日本工具机製造商的案例研究

第 2 章：日本一级汽车製造商的 AI 开发、SDV 和晶片研究

• 摘要：日本的永续发展目标
• 摘要：日本正大力投资国内半导体产业。
• 摘要：日本八大企业扩大半导体产能
• 摘要：国内外汽车晶片製程比较（一）
• 摘要：国内外汽车晶片製程比较（二）
• 摘要：台积电、Nvidia、英特尔、微软与日本的合作（1）
• 摘要：台积电、Nvidia、英特尔、微软与日本的合作（2）
• 摘要：日本掌握的五项技术
• 摘要：日本的 Zetta 级超级计算机
• 摘要：汽车晶片联盟（1）
• 摘要：汽车晶片联盟（二）
• 摘要：日本企业AI发展对比
• AI开发案例1：TURING
• AI开发案例2：Digital Realty
• AI发展案例3：
• AI发展案例4：
• AI发展案例5：
• AI发展案例6：
• AI发展案例7：
• AI发展案例8：
• AI发展案例9：
• 摘要：日本企业的SDV案例对比
• SDV 案例 1：
• SDV 案例 2：
• SDV 案例 3：
• SDV 案例 4：本田 + 亚马逊
• SDV 案例 5：松下汽车系统 + Arm（1）
• SDV 案例 6：
• 总结：日系车用晶片案例对比
• 汽车晶片案例1
• 汽车晶片案例2
• 汽车晶片案例3
• 汽车晶片案例4
• 汽车晶片案例5

第 3 章：日本一级自动驾驶/ADAS 技术与产品

• 日本的自动驾驶政策（1）
• 日本的自动驾驶政策（2）
• 日本自动驾驶汽车计划
• 课题系统
• 自动驾驶/ADAS

第4章：日本汽车Tier1智慧座舱技术及产品

• 日本智慧座舱零件主要供应商（1）
• 日本智慧座舱零件主要供应商（2）
• 日本智慧座舱零件主要供应商（3）
• 日本智慧座舱零件主要供应商（4）
• 日本智慧座舱零件主要供应商（5家）
• 日本智慧座舱零件主要供应商（6家）
• 智慧座舱零件供应商供应关係（1） - 丰田
• 智慧座舱零件供应商供应关係（2） - 日产
• 智慧座舱零件供应商供应关係（3） - 本田
• 智慧座舱零件供应商供应关係（4）－马自达
• 智慧座舱零件供应商供应关係（5）—Subaru
• 智慧座舱零件供应商供应关係（6） - 铃木
• 智慧座舱零件供应商供应关係（7） - 三菱
• 智慧座舱零件供应商供应关係（8） - 大发
• 智慧座舱技术案例总结（一）
• 智慧座舱技术案例总结（二）
• 智慧座舱技术案例总结（三）

第5章：日本一级电气化技术与产品

• IGBT/SiC/GaN功率半导体概述（1）
• IGBT/SiC/GaN功率半导体概述（二）
• IGBT/SiC/GaN功率半导体总结（3）
• 电子轴
• 马达产品概要 (1)
• 马达产品概览 (2)
• 马达产品概览 (3)
• 电池/固态电池

第6章 日本一级供应商的供应关係

• 电装
• 爱信
• 日本电产
• 住友电工
• 日本电动辅助转向系统 (EPS) 供应商及其供应关係
• 日本市场主要 ADAS 雷达和 LiDAR 供应商及其与 OEM 的供应关係

第7章 日本整车厂的国内合作与国际关係

• 日本新车销售（2024 年 1 月至 11 月）
• 日本主机厂海外生产基地分布
• 日本OEM海外生产数据
• 日本汽车製造商之间的技术合作（1）
• 日本汽车製造商之间的技术合作（2）
• 日本国内汽车及零件生产厂分布
• 日中汽车产业关係
• 日美汽车产业关係
• 日本与欧洲汽车产业关係
• 日本汽车製造商的电气化/智慧化

Japanese Tier1s' advanced technologies research: accelerate external cooperation, intensify internal collaboration, and further upgrade "fine manufacturing"

In vehicle electrification and intelligence, Chinese OEMs and solution suppliers are leading the trend, especially at a time when intelligent application speeds up. Japan's automotive industry and parts suppliers are however quickening their pace to catch up with their Chinese, European and American counterparts. While making continuous efforts to reinforce their technical superiority in some electrification segments, they are also still investing more in intelligence, involving AI development, software-defined vehicles (SDV) and chips. On the basis of stabilizing global sales growth, they also work to expedite connection with China's intelligent vehicle industry.

In May 2024, the Ministry of Economy, Trade and Industry (METI) and the Ministry of Land, Infrastructure, Transport and Tourism (MLIT) of Japan announced a strategic plan for digital transformation of the Japanese automotive industry in the next decade, highlighting software-defined vehicles (SDV), robotaxi, and vehicle data value. Wherein, the development of SDVs is considered a top priority. The Japanese government predicts that the scale of the global SDV market will reach 41 million vehicles in 2030, and hopes that Japanese OEM can take a 30% share, or 11 million to 12 million vehicles. It can be seen that the goal is ambitious.

1. Japanese automotive Tier1s rev up external cooperation, and consolidate their superiority in electrification segments, sparing no effort to embrace intelligence.

To develop artificial intelligence electric vehicles (AIEV), in addition to internal R&D and innovations, for example, support for AI development, automotive SoC, and operating system (OS), Tier1s need external cooperation as a matter of course.

In AI development, Japanese companies including TURING, TIER IV, Sakana AI, Digital Realty, NTT, Denso and Alps Alpine are working hard on development of AI technology, world models, LLM memory management technology, and more, in a bid to accelerate integration into automotive products and enable mass adoption of L4 autonomous driving in Japan. Examples include:

In November 2024, Denso and Quadric announced that they would work together to develop an NPU (neural processing unit), a semiconductor specialized for the arithmetic processing of AI. Through the agreement, DENSO will acquire the IP core license for Quadric's Chimera GPNPU, and the two companies will co-develop high-performance automotive semiconductors on this basis.

Alps Alpine + Qualcomm: In January 2025, the two parties announced their expanded technology collaboration to integrate Qualcomm Technologies' latest generation Snapdragon(R) Cockpit platform into Alps Alpine's automotive products.

TIER IV, a supplier of open source software for autonomous driving, and the Matsuo Institute embarked on a generative AI project for Autonomy 2.0, aiming to significantly expand the operational design domains (ODDs) of Level 4 autonomous driving.

In chip R&D, Japanese manufacturers are vigorously advancing cooperation with giants like TSMC, Nvidia, Intel, and Microsoft.

TSMC: its first Japanese wafer fab is scheduled to start mass production by the end of 2024, and the second fab will come into operation in 2027;

Microsoft: In November 2024, Microsoft opened its first research base in Japan in Tokyo;

Intel: In September 2024, Intel planned to partner with AIST to establish a new research and development center focused on advanced chip production;

NVIDIA: In April 2024, AIST and NVIDIA teamed up to build a quantum computing system.

In addition, the METI plans to provide a total of 2 trillion yen (about 13 billion US dollars) in subsidies to boost investment in the domestic chip industry. Japan's eight major chip vendors, including Sony Group, Mitsubishi Electric, Rohm, Toshiba, Kioxia Holdings, Renesas Electronics, Rapidus, and Fuji Electric, have planned to invest about 5 trillion yen (equivalent to 31 billion US dollars) by 2029 to increase the production capacity of power devices and image sensors, and increase investment in power semiconductors, sensors and logic chips. These technologies are considered the key to growth areas such as artificial intelligence, decarbonization and electric vehicles. Among them, Mitsubishi Electric, Rohm, Toshiba, Kioxia, and Renesas have taken a significant market share in SiC MOSFET, IGBT, automotive storage, high-end automotive MCU and other fields.

Not only that, the Japan Advanced SoC Research for Automotive, an alliance established at the end of 2023, is also committed to the research and development of "chiplet" technology to enable SoCs to be integrated into production vehicles. The members include Japanese OEMs like Toyota, Nissan, Honda, Mazda and Subaru, and automotive electronic system components suppliers such as Denso and Panasonic, as well as automotive chip vendor Renesas Electronics, design tool software provider Synopsys, chip developer MIRISE Technologies (a joint venture between Toyota and Denso), and chip designer Socionext.

In electrification, Japanese companies have technological advantages in some segments and keep improving competitive edges of products (see table below), such as motors and power semiconductors (IGBT/SiC/GaN).

As concerns motors, Japan has multiple superior suppliers like Fukuta Electric & Machinery (flat wire hairpin motor), JFE Precision (cold forged hollow shaft, e-Axle motor hollow shaft), Tokai Rika (5th generation hub motor), Toshiba (TB9084FTG, a MOSFET gate driver IC for motors), THK (variable flux in-wheel motor), ELEMEC (XPEAC internal direct cooling motor), Nitto (hairpin stator winding, EESM rotor winding), and Nidec (motor). Take automotive Tier1 Nidec as an example to see its external supply cases.

As for intelligence, in the case of intelligent cockpits, Honda now has ASIMO OS (debuted at CES 2025), its core vehicle operating system which will be gradually installed in Honda 0 series models including Honda 0 SUV and Honda 0 SALOON production cars. Moreover, Toyota's operating system "Arene OS" is scheduled to be launched in 2026. In terms of cockpit innovation, Japanese Tier 1 suppliers provide a variety of new in-cabin technologies and products, including in-cabin integration, integration of HMI and interiors, vehicle assistant HMI, cockpit design, new input/output devices, occupant monitoring, multi-screen interaction, new interior lighting and sound field presentation, and interior electronic rearview mirror technologies. Major players include Toyota Boshoku, AGC, TOPPAN, TORAY, Nippon Seiki, TOKAI RIKA, Yazaki Corporation, Toyoda Gosei, Ichikoh Industries, Kyocera, Murata Manufacturing, ROHM, KAGA FEI, Oshino Lamps, Asahi Kasei, and Stanley Electric.

2. Japanese Tier1s work together and collaborate to help Japanese OEMs with rapider global development.

In May 2024, the Ministry of Economy, Trade and Industry announced implementation of stricter regulatory measures in five key industrial sectors, namely, semiconductors, advanced electronic components, batteries, machine tools and industrial robots, and aircraft components, to curb the risk of technology leakage. Japan requires that these technologies should be "developed locally", and the most advanced factories also should "remain at home", and even sales and exports will be regulated.

The Japanese machine tool order data (final value) for November 2024, released by the Japan Machine Tool Builders' Association (JMA) on December 25, 2024, show that the total value of machine tool orders in November was 119.327 billion yen, an increase of 3.0% compared with the same period of the previous year, sustaining growth for two consecutive months. By region, the value of orders from the Chinese market jumped by 33.0% from the prior-year period to 29.319 billion yen, achieving eight consecutive months of growth. Especially in the automotive industry, the value of orders surged by 56.3% to 11.6 billion yen. This is mainly thanks to China's domestic competitiveness enhancement measures around electric vehicles and aggressive investments in overseas factories. The great investment willingness in the Chinese market has become an important source of income for Japanese machine tool manufacturers.

Examples of fine manufacturing process include:

DMG MORI: it has developed a solution based on a five-axis machining center. This solution enables a mode of "one machine, multiple functions" from gear roughing to precision grinding. This system covers the entire process from workpiece turning, milling, and gear roughing (e.g., gear shaping) to final precision grinding, even deburring. At the grinding stage, the grinding modules will be automatically loaded onto the spindle and ground precisely one by one by detecting the gear phase. The system is suitable for internal/external gear machining, with the machining accuracy up to ISO 4.

Nachi-Fujikoshi: it has launched "GSGT260", a gear grinder that enables high-precision and high-efficiency grinding. It is mainly suitable for production of external gears, with the machining accuracy up to Grade 1 of the new JIS. Through form grinding on multiple tooth surfaces at the same time, this equipment is particularly fit to meet the needs of mass-producing reducers for electric vehicle drive modules (e-Axle).

The close internal and external supply relationships of Japanese auto parts Tier1s, and the innovative upgrades in manufacturing process are helping Japanese companies to go steady and far in the global market.

Table of Contents

1 Relevance between Japanese Automotive Tier1s and China

• 1.1 China-Japan Automotive Tier1/OEM Industrial Connections (1)
• 1.1 China-Japan Automotive Tier1/OEM Industrial Connections (2)
• 1.1 China-Japan Automotive Tier1/OEM Industrial Connections (3)
• 1.1 China-Japan Automotive Tier1/OEM Industrial Connections (4)
• 1.1 China-Japan Automotive Tier1/OEM Industrial Connections (5)
• 1.1 China-Japan Automotive Tier1/OEM Industrial Connections (6)
• 1.2 Denso's Layout in China (1)
• 1.2 Denso's Layout in China (2)
• 1.2 Denso's R&D Centers in China
• 1.2 Denso's Production Layout in China
• 1.3 Sumitomo Electric's Layout in China (1)
• 1.3 Sumitomo Electric's Layout in China (2)
• 1.3 Sumitomo Electric's Layout in China (3)
• 1.3 Sumitomo Electric's Layout in China (4)
• 1.4 JTEKT's Production Base Layout in China
• 1.5 NSK Steering & Control's Production Base Layout in China
• 1.6 Hitachi Astemo's Production Base Layout in China
• 1.7 KYB Corporation's Production Base Layout in China
• 1.8 KEL Corporation's Production Plants in China
• 1.9 Yazaki Corporation's Joint Ventures in China
• 1.10 Toyota Motor's Plan for New Wholly-Owned Plants in China
• 1.11 Japan's Machine Tool Orders: Orders from the Chinese Automotive Market
• 1.12 Cases of Typical Japanese Machine Tool Manufacturers

2 Japanese Automotive Tier1s' AI Development, SDV and Chip Research

• Summary: Japan's SDV Goals
• Summary: Japan Lavishes on the Domestic Chip Industry
• Summary: Japan's Eight Giants Expand Chip Production Capacity
• Summary: Comparison between Domestic and Foreign Automotive Chip Processes (1)
• Summary: Comparison between Domestic and Foreign Automotive Chip Processes (2)
• Summary: Japan's Cooperation with TSMC, Nvidia, Intel, and Microsoft (1)
• Summary: Japan's Cooperation with TSMC, Nvidia, Intel, and Microsoft (2)
• Summary: Five Technologies Controlled by Japan
• Summary: Japan's Zetta-class Supercomputer
• Summary: Automotive Chip Alliances (1)
• Summary: Automotive Chip Alliances (2)
• Summary: Comparison of AI Development between Japanese Companies
• 2.1 AI Development Case 1: TURING
• 2.2 AI Development Case 2: Digital Realty
• 2.3 AI Development Case 3:
• 2.4 AI Development Case 4:
• 2.5 AI Development Case 5:
• 2.6 AI Development Case 6:
• 2.7 AI Development Case 7:
• 2.8 AI Development Case 8:
• 2.9 AI Development Case 9:
• Summary: Comparison of SDV Cases between Japanese Companies
• 2.10 SDV Case 1:
• 2.11 SDV Case 2:
• 2.12 SDV Case 3:
• 2.13 SDV Case 4: Honda + Amazon
• 2.14 SDV Case 5: Panasonic Automotive Systems + Arm (1)
• 2.15 SDV Case 6:
• Summary: Comparison of Automotive Chip Cases between Japanese Companies
• 2.16 Automotive Chip Case 1
• 2.17 Automotive Chip Case 2
• 2.18 Automotive Chip Case 3
• 2.19 Automotive Chip Case 4
• 2.20 Automotive Chip Case 5

3 Japanese Automotive Tier1s' Autonomous Driving/ADAS Technologies and Products

• 3.1 Japan's Policies Concerning Autonomous Driving (1)
• 3.1 Japan's Policies Concerning Autonomous Driving (2)
• 3.2 Japan's Autonomous Driving Schedule
• 3.3 Operating System
• Case 1:
• Case 2:
• 3.4 Autonomous Driving/ADAS
• Case 1: Hitachi Astemo
• Case 2: Ricoh
• Case 3: Panasonic Automotive
• Case 4: TDK
• Case 5: Murata
• Case 6: KOITO LiDAR
• Case 7: Sony Semiconductor + Lumotive
• Case 8: Sony Semiconductor (CIS)
• Case 9: Sony Semiconductor + Ansys
• Case 10: Kyocera Corporation
• Case 11: Toyota, Nissan and Momenta Cooperate on ADAS
• Case 12: Honda's Joint Ventures and ADAS for Global Use
• Case 13: Independent + Joint Venture Brands Cooperating with Huawei Intelligent Driving Solutions

4 Japanese Automotive Tier1s' Intelligent Cockpit Technologies and Products

• 4.1 Major Intelligent Cockpit Components Suppliers in Japan (1)
• 4.1 Major Intelligent Cockpit Components Suppliers in Japan (2)
• 4.1 Major Intelligent Cockpit Components Suppliers in Japan (3)
• 4.1 Major Intelligent Cockpit Components Suppliers in Japan (4)
• 4.1 Major Intelligent Cockpit Components Suppliers in Japan (5)
• 4.1 Major Intelligent Cockpit Components Suppliers in Japan (6)
• 4.2 Supply Relationship of Intelligent Cockpit Components Suppliers (1) - Toyota
• 4.2 Supply Relationship of Intelligent Cockpit Components Suppliers (1) - Toyota
• 4.2 Supply Relationship of Intelligent Cockpit Components Suppliers (2) - Nissan
• 4.2 Supply Relationship of Intelligent Cockpit Components Suppliers (3) - Honda
• 4.2 Supply Relationship of Intelligent Cockpit Components Suppliers (4) - Mazda
• 4.2 Supply Relationship of Intelligent Cockpit Components Suppliers (5) - Subaru
• 4.2 Supply Relationship of Intelligent Cockpit Components Suppliers (6) - Suzuki
• 4.2 Supply Relationship of Intelligent Cockpit Components Suppliers (7) - Mitsubishi
• 4.2 Supply Relationship of Intelligent Cockpit Components Suppliers (8) - Daihatsu
• 4.3 Summary of Intelligent Cockpit Technology Cases (1)
• 4.3 Summary of Intelligent Cockpit Technology Cases (2)
• 4.3 Summary of Intelligent Cockpit Technology Cases (3)
• Case 1: Toyota Boshoku (China) + Didi
• Case 2: Asahi Glass Co., Ltd. (AGC)
• Case 3: Toppan
• Case 4: Toray
• Case 5: Nippon Seiki
• Case 6: Tokai Rika
• Case 7: Yazaki
• Case 8: Tokai Rika
• Case 9: Toyota Gosei
• Case 10: Ichikoh Industries
• Case 11: Kyocera Corporation
• Case 12: Murata Manufacturing Co., Ltd.
• Case 13: Rohm
• Case 14: Kaga FEI Co., Ltd.
• Case 15: Oshino Electric Mfg. Co., Ltd.
• Case 16: Asahi Kasei
• Case 17: Stanley Electric Co., Ltd.
• Case 18: Nidec

5 Japanese Tier1s' Electrification Technologies and Products

• 5.1 Summary of IGBT/SiC/GaN Power Semiconductors (1)
• 5.1 Summary of IGBT/SiC/GaN Power Semiconductors (2)
• 5.1 Summary of IGBT/SiC/GaN Power Semiconductors (3)
• Case 1: Fuji Electric IGBT
• Case 2: Fuji Electric + Denso SiC
• Case 3: Mitsubishi Electric SiC
• Case 4: Rohm SiC
• Case 5: Rohm + Valeo SiC
• Case 6: Rohm IGBT
• Case 7: Rohm GaN
• Case 8: Japanese Material Manufacturers Work on Mass Production of GaN Substrates
• 5.2 e-Axle
• Case 1: Nidec
• Case 2: INAC
• Case 3: Aisin
• 5.3 Summary of Motor Products (1)
• 5.3 Summary of Motor Products (2)
• 5.3 Summary of Motor Products (3)
• Case 1: Tomita Electric
• Case 2: JFE Precision
• Case 3: Tokai Rika & Toshiba
• Case 4: THK
• Case 5: ELEMEC
• Case 6: Nidec
• Case 7: Odawara Mechanical Engineering
• Case 8: Nitto
• Case 9: Kuroda Seiko
• Case 10: Shin-Etsu Chemical
• Case 11: Sumitomo Electric Industries
• Case 12: Toshiba + MIKROE
• 5.4 Battery/Solid State Battery
• Supply Assurance Plan for Batteries Approved by the Ministry of Economy, Trade and Industry
• Battery Association for Supply Chain (BASC)
• Japan Vigorously Develops All-solid-state Batteries
• Honda's All-solid-state Battery Production Line
• Toyota's All-solid-state Battery Production
• Case 1: TDK
• Case 2: Panasonic
• Case 3: Shibaura Machine
• Case 4: PXP
• Case 5: Toshiba
• Case 6: Yazaki
• Case 7: AM Batteries

6 Supply Relationship of Japanese Tier1s

• 6.1 Denso
  • 6.1.1 Supply Relationship with OEMs (1)
  • 6.1.1 Supply Relationship with OEMs (2)
  • 6.1.1 Supply Relationship with OEMs (3)
  • 6.1.1 Supply Relationship with OEMs (4)
  • 6.1.1 Supply Relationship with OEMs (5)
  • 6.1.1 Supply Relationship with OEMs (6)
  • 6.1.1 Supply Relationship with OEMs (7)
  • 6.1.1 Supply Relationship with OEMs (8)
  • 6.1.2 Main Customers
• 6.2 Aisin
  • 6.2.1 Supply Relationship with OEMs (1)
  • 6.2.1 Supply Relationship with OEMs (2)
  • 6.2.1 Supply Relationship with OEMs (3)
  • 6.2.2 Main Customers
  • 6.2.3 Aisin Group's Revenue Structure (by Customer), FY2023-FY2025
• 6.3 Nidec
  • 6.3.1 Supply Relationship with OEMs
  • 6.3.2 Main Customers
  • 6.3.3 Main Subsidiaries and Businesses
  • 6.3.4 Sales by Product
  • 6.3.4 Sales by Region
• 6.4 Sumitomo Electric
  • 6.4.1 Supply Relationship with OEMs (1)
  • 6.4.1 Supply Relationship with OEMs (2)
  • 6.4.1 Supply Relationship with OEMs (3)
  • 6.4.1 Supply Relationship with OEMs (4)
  • 6.4.2 Sales by Division
  • 6.4.2 Sales by Region
  • 6.4.2 Sales by Product
• 6.5 Japanese Electric Power Steering (EPS) Suppliers and Their Supply Relationship
  • 6.5.1 Major Japanese EPS Parts Suppliers and Their Customers (Japan-made Models)
  • 6.5.2 OEM Customers of Japanese EPS Suppliers
  • 6.5.3 Supply Relationship of Major Japanese EPS Parts Suppliers (1) - Toyota
  • 6.5.3 Supply Relationship of Major Japanese EPS Parts Suppliers (1) - Toyota
  • 6.5.3 Supply Relationship of Major Japanese EPS Parts Suppliers (1) - Toyota
  • 6.5.3 Supply Relationship of Major Japanese EPS Parts Suppliers (2) - Nissan
  • 6.5.3 Supply Relationship of Major Japanese EPS Parts Suppliers (3) - Honda
  • 6.5.3 Supply Relationship of Major Japanese EPS Parts Suppliers (4) - Subaru
  • 6.5.3 Supply Relationship of Major Japanese EPS Parts Suppliers (5) - Mazda
  • 6.5.3 Supply Relationship of Major Japanese EPS Parts Suppliers (6) - Mitsubishi
  • 6.5.3 Supply Relationship of Major Japanese EPS Parts Suppliers (7) - Suzuki
  • 6.5.3 Supply Relationship of Major Japanese EPS Parts Suppliers (7) - Suzuki
  • 6.5.3 Supply Relationship of Major Japanese EPS Parts Suppliers (8) - Daihatsu
• 6.6 Major ADAS Radar & LiDAR Suppliers and Their Supply Relationship with OEMs in the Japanese Market
  • 6.6.1 Major ADAS Radar & LiDAR Suppliers and Their Supply Relationship with OEMs in the Japanese Market (1) - Toyota
  • 6.6.2 Major ADAS Radar & LiDAR Suppliers and Their Supply Relationship with OEMs in the Japanese Market (2) - Nissan/Honda/Subaru/Mazda/Mitsubishi
  • 6.6.3 Major ADAS Radar & LiDAR Suppliers and Their Supply Relationship with OEMs in the Japanese Market (2) - Suzuki/Daihatsu

7 Internal Cooperation and International Connections of Japanese OEMs

• 7.1 Japan's New Vehicle Sales, Jan-Nov 2024
• 7.2 Layout of Overseas Production Bases of Japanese OEMs
• 7.3 Overseas Production Data of Japanese OEMs
• 7.4 Technical Cooperation between Japanese OEMs (1)
• 7.4 Technical Cooperation between Japanese OEMs (2)
• 7.5 Distribution of Vehicle/Parts Manufacturing Plants in Japan
• 7.6 Japan - Connection with China's Automotive Industry
• 7.7 Japan - Connection with US Automotive Industry
• 7.8 Japan - Connection with Europe's Automotive Industry
• 7.9 Electrification/Intelligence of Japanese OEMs
• Toyota's Electrification Plan
• Toyota's Battery R&D Plan (1)
• Toyota's Battery R&D Plan (2)
• Toyota's Intelligent Electric Vehicle R&D in China
• GAC Toyota's Intelligence
• FAW Toyota's Intelligence
• Honda's Electric Transformation Plan
• Honda's Battery and Production Capacity Layout
• Honda's All-solid-state Battery Production Line
• Nissan's Electric Vehicle Model Launch Plan
• Nissan Accelerates Its Electrification Transformation
• Nissan Accelerates Its Intelligence Layout
• Dongfeng Nissan's Intelligence