市场调查报告书
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1373824
全球电子黏剂市场(2023-2030):按类型(导电黏剂、导热黏剂)和应用(印刷基板、半导体、 IC封装)分類的规模、份额、成长分析和预测Global Electronic Adhesives Market Size, Share, Growth Analysis, By Type(Electrically Conductive Adhesives, Thermally Conductive Adhesives), By Application(Printed Circuit Boards, Semiconductor and IC Packaging) - Industry Forecast 2023-2030 |
全球电子黏剂市场规模将从2021年的77亿美元成长到2022年的82.9亿美元,预测期内年复合成长率为7.7%,预计到2030年将达到150.9亿美元。
近年来,全球电子黏剂市场经历了显着扩张,主要得益于电子设备需求的快速成长和技术进步。这一增长主要归因于消费性电子产品、汽车、航太和医疗保健等各行业的电子设备消费不断增长。随着智慧型手机、平板电脑、穿戴式装置和智慧家电的普及,对电子黏剂的需求大幅增加。此外,电子零件的小型化以及柔性和穿戴式电子产品的日益普及正在进一步加速市场成长。全球市场的一个重要趋势是转向环保和永续的黏剂解决方案。为了应对日益严格的环境法规和消费者意识的提高,製造商正在专注于开放式有机化合物 (VOC) 含量较低且对环境影响较小的黏剂。这种转变导致了黏剂和无溶剂黏剂的采用,不仅提高了安全性和永续性,而且保持了性能标准。
本报告调查了全球电子黏剂市场,并提供了市场概况、市场各种影响因素分析、技术和创新趋势、法律制度、市场规模趋势和预测,以及按不同细分市场和地区进行的细分。总结了主要企业的细分、竞争形势和概况。
Global Electronic Adhesives Market size was valued at USD 7.7 billion in 2021 and is poised to grow from USD 8.29 billion in 2022 to USD 15.09 billion by 2030, growing at a CAGR of 7.7% during the forecast period (2023-2030).
The global electronic adhesives market has experienced substantial expansion in recent years, primarily due to the surging demand for electronic devices and technological advancements. This growth is primarily attributed to the increased consumption of electronic devices in various industries such as consumer electronics, automotive, aerospace, and healthcare. The widespread adoption of smartphones, tablets, wearable devices, and smart home appliances has created a significant upswing in the need for electronic adhesives. Furthermore, the development of smaller electronic components and the growing popularity of flexible and wearable electronics have further accelerated the market's progress. An important trend in the worldwide market is the transition towards eco-friendly and sustainable adhesive solutions. Given the escalating environmental regulations and heightened consumer consciousness, manufacturers are placing a strong emphasis on creating adhesives with lower levels of volatile organic compounds (VOCs) and reduced environmental impact. This shift has led to the adoption of water-based and solvent-free adhesives, which not only enhance safety and sustainability but also maintain performance standards.
Top-down and bottom-up approaches were used to estimate and validate the size of the global electronic adhesives market and to estimate the size of various other dependent submarkets. The research methodology used to estimate the market size includes the following details: The key players in the market were identified through secondary research, and their market shares in the respective regions were determined through primary and secondary research. This entire procedure includes the study of the annual and financial reports of the top market players and extensive interviews for key insights from industry leaders such as CEOs, VPs, directors, and marketing executives. All percentage shares split, and breakdowns were determined by using secondary sources and verified through Primary sources. All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data.
Segments covered in this report
Global Electronic Adhesives Market is segmented by type, application, and region. Based on type, the market can be segmented into Electrically Conductive Adhesives, Thermally Conductive Adhesives, UV Curing Adhesives and Silicone Adhesives. Based on application, the market is segmented into Printed Circuit Boards, Semiconductor and IC Packaging, Display and Touch Panels, Potting and Encapsulation and Others. Based on region, the market is segmented into North America, Europe, Asia Pacific, Middle East and Africa, and Latin America.
Drivers:
Technological Advancements and Miniaturization
The ongoing progress in technology has led to the shrinking of electronic components and devices. This development underscores the importance of employing electronic adhesives that exhibit outstanding adhesive qualities, excellent thermal conductivity, and low viscosity. These attributes are essential for optimizing assembly procedures and upholding the dependability of small-scale electronic products. As technology continues its advancement, electronic adhesives become increasingly crucial in facilitating the growth and operation of compact electronic devices.
Restraints:
Limitations in High-Temperature Applications
It's crucial to take into account the constraints associated with electronic adhesives in high-temperature scenarios. Some adhesives have particular temperature limits beyond which they encounter difficulties. Elevated operational temperatures can result in problems such as deterioration, diminished adhesion strength, or disparities in thermal expansion. Consequently, the utilization of specific adhesives in situations involving high temperatures is restricted. To overcome this limitation in the market, manufacturers and researchers are continuously striving to create electronic adhesives capable of enduring higher temperatures, thus broadening their scope of applications.
Market Trends:
A notable development observed in the worldwide electronic adhesives market involves the increasing desire for miniaturization and cutting-edge packaging technologies within the electronics industry. As consumer electronics, automotive electronics, and various electronic devices progressively reduce in size, weight, and overall dimensions, the demand for effective and trustworthy bonding solutions has grown substantially. Electronic adhesives are essential in ensuring robust and enduring connections among diverse electronic components, guaranteeing their optimal performance and extended dependability.