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1544180

TIM（热感界面材料）市场规模、份额、成长分析：按材料、按应用、按化学物质、按地区 - 产业预测，2024-2031 年

Thermal Interface Materials Market Size, Share, Growth Analysis, By Material, By Application, By Chemistry, By Region - Industry Forecast 2024-2031

出版日期: 2024年08月23日 | 出版商:

SkyQuest | 英文 184 Pages | 商品交期: 3-5个工作天内

价格

简介目录

2022年TIM（热感界面材料）的全球市场规模将为37.5亿美元，从2023年的41.3亿美元增加至2031年的89.9亿美元，在预测期内（2024-2031）预计复合年增长率为10.2亿美元，在预测期内（2024-2031）预计复合年增长率为10.2 %。

由于 TIM 在管理电子设备产生的热量方面发挥着重要作用，其全球市场正在迅速扩大。随着对更小、更强大、更节能的电子元件的需求不断增加，对有效温度控管的需求也不断增长。 TIM 透过弥合发热组件和散热器之间的间隙并降低接触电阻，对于确保高效传热和防止过热至关重要。汽车、消费性电子、航太和通讯等各个领域越来越多地采用电子产品，推动了市场的成长，所有这些领域都需要高效的温度控管解决方案。电子设备小型化和电路复杂性的趋势进一步增加了对先进温度控管的需求，以保持最佳性能和寿命。此外，注重能源效率和环境永续性的严格法规正在推动製造商采用可增强散热、减少能源消耗和碳排放的 TIM。儘管存在这些成长机会，市场也面临挑战。先进 TIM 的高成本及其应用和安装的复杂性可能会阻碍市场扩张。此外，电子产品的不断发展需要 TIM 的持续创新，以确保与新材料和技术的兼容性。 TIM 市场的主要趋势包括转向先进材料，例如相变材料、基于石墨的解决方案和提供卓越导热性和可靠性的液态金属 TIM。将 TIM 整合到 5G、物联网和电动车等新兴技术中也带来了巨大的成长机会。汽车产业的电气化、对再生能源来源的重视以及奈米技术的进步进一步增加了市场潜力，使其成为一个充满活力且前景广阔的领域。

市场概况
北美洲
- 美国
- 加拿大
欧洲
- 德国
- 英国
- 法国
- 义大利
- 西班牙
- 其他欧洲国家地区
亚太地区
- 中国
- 印度
- 日本
- 韩国
- 其他亚太地区
拉丁美洲
- 巴西
- 其他拉丁美洲地区
中东和非洲 (MEA)
- 海湾合作委员会国家
- 南非
- 其他中东/非洲地区

竞争格局

前5名企业对比
主要企业市场定位（2023年）
主要市场参与者所采取的策略
近期市集活动
主要企业市场占有率（2023年）

主要企业简介

Henkel AG & Co. KGaA（Germany）
Dow Inc.（US）
3M Company（US）
Parker-Hannifin Corporation（US）
Honeywell International Inc.（US）
Momentive Performance Materials Inc.（US）
Fujipoly（Japan）
Shin-Etsu Chemical Co., Ltd.（Japan）
Indium Corporation（US）
Zalman Tech Co., Ltd.（South Korea）
SEMIKRON International GmbH（Germany）
Avery Dennison Corporation（US）
AOS Thermal Compounds LLC（US）
Enerdyne Solutions（US）
Electrolube（UK）
Polytec PT GmbH（Germany）
Arctic Cooling（Switzerland）
Thermal Grizzly（Germany）
Gelid Solutions Ltd.（Hong Kong）
Nanografi（Turkey）
ProTek Devices（US）
Silicone Solutions（US）

简介目录

Product Code: SQMIG15E2273

Global Thermal Interface Materials Market size was valued at USD 3.75 Billion in 2022 and is poised to grow from USD 4.13 Billion in 2023 to USD 8.99 Billion by 2031, at a CAGR of 10.2% during the forecast period (2024-2031).

The Global Thermal Interface Materials (TIM) Market is rapidly expanding, driven by its critical role in managing the heat generated by electronic devices. As the demand for smaller, more powerful, and energy-efficient electronic components grows, the need for effective thermal management becomes increasingly important. TIMs are essential in filling gaps and reducing contact resistance between heat-generating components and heat sinks, ensuring efficient heat transfer and preventing overheating. The market's growth is fueled by the rising adoption of electronic devices across various sectors such as automotive, consumer electronics, aerospace, and telecommunications, all of which require efficient heat management solutions. The trend toward miniaturization and increased circuit complexity in electronics further heightens the need for advanced thermal management to maintain optimal performance and longevity. Additionally, stringent regulations focused on energy efficiency and environmental sustainability are pushing manufacturers to adopt TIMs that enhance heat dissipation, thereby reducing energy consumption and carbon emissions. Despite these growth opportunities, the market faces challenges. The high cost of advanced thermal interface materials and the complexities involved in their application and installation can hinder market expansion. Furthermore, the continuous evolution of electronic devices necessitates ongoing innovation in TIMs to ensure compatibility with new materials and technologies. Key trends in the TIM market include the shift towards advanced materials such as phase change materials, graphite-based solutions, and liquid metal TIMs, which offer superior thermal conductivity and reliability. The integration of TIMs into emerging technologies like 5G, IoT, and electric vehicles also presents significant growth opportunities. The electrification of the automotive industry, the focus on renewable energy sources, and advancements in nanotechnology further contribute to the market's potential, making it a dynamic and promising sector.

Top-down and bottom-up approaches were used to estimate and validate the size of the Global Thermal Interface Materials market and to estimate the size of various other dependent submarkets. The research methodology used to estimate the market size includes the following details: The key players in the market were identified through secondary research, and their market shares in the respective regions were determined through primary and secondary research. This entire procedure includes the study of the annual and financial reports of the top market players and extensive interviews for key insights from industry leaders such as CEOs, VPs, directors, and marketing executives. All percentage shares split, and breakdowns were determined using secondary sources and verified through Primary sources. All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data.

Global Thermal Interface Materials Market Segmental Analysis

Global Thermal Interface Materials Market is segmented on the basis of chemistry, material, application, and region. Based on Chemistry, the market is segmented into silicone, epoxy, polyamide, others. Based on Material, the market is segmented into greases and adhesive, tapes and films, gap fillers, metal-based thermal interface material, phase change material, and others. Based on application, the market is segmented into computer, telecom, medical devices, industrial machinery, consumer durables, automotive electronics, others. Based on region, the market is segmented into North America, Europe, Asia Pacific, Middle East and Africa, and Latin America.

Drivers of the Global Thermal Interface Materials Market

The increasing popularity of smartphones, laptops, gaming consoles, and other electronic devices is creating a heightened need for effective thermal management solutions. Thermal Interface Materials (TIMs) play a crucial role in dissipating the heat produced by these devices, preventing overheating, and maintaining optimal performance. For instance, the surge in gaming enthusiasts has significantly boosted the demand for high-performance computers, which rely on advanced thermal management to ensure they operate efficiently and safely.

Restraints in the Global Thermal Interface Materials Market

Although there are numerous types of Thermal Interface Materials (TIMs) with varying thermal conductivity properties, some may fall short in delivering optimal heat transfer. Certain TIMs may not provide high enough thermal conductivity, which can limit their effectiveness in applications with demanding heat dissipation requirements. Ongoing research and development are concentrated on creating new TIM formulations that offer enhanced thermal conductivity to address these limitations and improve performance in critical applications.

Market Trends of the Global Thermal Interface Materials Market

Phase Change Materials (PCMs) are a category of Thermal Interface Materials (TIMs) that undergo phase transitions-such as from solid to liquid or vice versa-when exposed to temperature fluctuations. These materials exhibit high thermal conductivity during these transitions, which makes them highly effective for managing heat. PCMs are increasingly being utilized in applications where efficient heat dissipation is crucial, such as in data centers and electric vehicle batteries. Their ability to absorb and release heat during phase changes enhances their performance in maintaining optimal temperatures in high-demand environments.

Introduction

Objectives of the Study
Definitions
Market Scope

Research Methodology

Information Procurement
Secondary & Primary Data Sources
Market Size Estimation
Market Assumptions & Limitations

Executive Summary

Market Overview Outlook
Supply Demand Trend Analysis
Segmental Opportunity Analysis

Market Dynamics & Outlook

Market Dynamics
- Drivers
- Opportunities
- Restraints
- Challenges
Porters Analysis
- Competitive rivalry
- Threat of Substitute Products
- Bargaining Power of Buyers
- Threat of New Entrants
- Bargaining Power of Suppliers

Key Market Insights

Key Success Factors of The Market
Degree Of Competition
Top Investment Pockets
Market Attractive Index
Ecosystem Mapping
Market demand analysis
Material and Technology Analysis
Cost Benefit Analysis
Competitive Landscape Analysis
Future Outlook Analysis
Market Segmentation and Targeting Analysis

Global Thermal Interface Materials Market by Material

Market Overview
Greases and Adhesive
Tapes and Films
Gap Fillers
Metal-Based Thermal Interface Material
Phase Change Material
Others

Global Thermal Interface Materials Market by Application

Market Overview
Computer
Telecom
Medical Devices
Industrial Machinery
Consumer Durables
Automotive Electronics
Others

Global Thermal Interface Materials Market by Chemistry

Market Overview
Silicone
Epoxy
Polyamide
Others

Global Thermal Interface Materials Market Size by Region

Market Overview
North America
- USA
- Canada
Europe
- Germany
- UK
- France
- Italy
- Spain
- Rest of Europe
Asia Pacific
- China
- India
- Japan
- South Korea
- Rest of Asia-Pacific
Latin America
- Brazil
- Rest of Latin America
Middle East & Africa (MEA)
- GCC Countries
- South Africa
- Rest of MEA

Competitive Landscape

Top 5 Player Comparison
Market Positioning of Key Players, 2023
Strategies Adopted by Key Market Players
Recent Activities in the Market
Key Companies Market Share (%), 2023

Key Company Profiles

Henkel AG & Co. KGaA (Germany)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Dow Inc. (US)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
3M Company (US)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Parker-Hannifin Corporation (US)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Honeywell International Inc. (US)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Momentive Performance Materials Inc. (US)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Fujipoly (Japan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Shin-Etsu Chemical Co., Ltd. (Japan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Indium Corporation (US)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Zalman Tech Co., Ltd. (South Korea)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
SEMIKRON International GmbH (Germany)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Avery Dennison Corporation (US)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
AOS Thermal Compounds LLC (US)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Enerdyne Solutions (US)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Electrolube (UK)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Polytec PT GmbH (Germany)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Arctic Cooling (Switzerland)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Thermal Grizzly (Germany)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Gelid Solutions Ltd. (Hong Kong)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Nanografi (Turkey)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
ProTek Devices (US)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Silicone Solutions (US)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments