封面
市场调查报告书
商品编码
1610804

覆晶市场规模、份额、成长分析、按封装类型、按封装技术、按凸块技术、按最终用途、按地区 - 行业预测,2024-2031 年

Flip Chip Market Size, Share, Growth Analysis, By Packaging Type, By Packaging Technology, By Bumping Technology, By End Use, By Region -Industry Forecast 2024-2031

出版日期: | 出版商: SkyQuest | 英文 192 Pages | 商品交期: 3-5个工作天内

价格
简介目录

2022年全球覆晶市场规模为305亿美元,从2023年的324.3亿美元增长到2031年的497.4亿美元,在预测期内(2024-2031年)预计复合年增长率为6.3%。

全球快速的数位化趋势是创新半导体和晶片尤其是覆晶需求的主要驱动力。随着设备小型化和半导体技术进步的加速、物联网 (IoT) 设备的激增以及 5G 网路技术部署的加速,该市场有望成长。而且,汽车的电气化正在增加对汽车电子产品的需求,进一步增加了覆晶市场的潜力。对高效能运算的需求不断增长以及先进资料中心的建立预计将支持未来几年覆晶的销售。然而,温度控管复杂性、替代封装解决方案的可用性以及高昂的初始实施成本等挑战可能会阻碍市场开拓。

目录

介绍

  • 研究目的
  • 调查范围
  • 定义

调查方法

  • 资讯采购
  • 二手资料和主要资料方法
  • 市场规模预测
  • 市场假设与限制

执行摘要

  • 全球市场展望
  • 供需趋势分析
  • 按细分市场的机会分析

市场动态及展望

  • 市场概况
  • 市场规模
  • 市场动态
    • 驱动因素和机会
    • 抑制因素和挑战
  • 波特分析与影响
    • 竞争公司之间的敌对关係
    • 替代品的威胁
    • 买方议价能力
    • 新进入者的威胁
    • 供应商的议价能力

主要市场考察

  • 关键成功因素
  • 竞争程度
  • 主要投资机会
  • 市场生态系统
  • 市场吸引力指数(2023)
  • PESTEL分析
  • 总体经济指标
  • 价值链分析
  • 价格分析
  • 技术进步
  • 监管环境
  • 案例研究

覆晶市场规模:按类型和复合年增长率(2024-2031)

  • 球栅阵列
  • 四方扁平无引线
  • 晶片级封装
  • 封装中的晶片系统

覆晶市场规模:封装技术与复合年增长率(2024-2031)

  • 3D
  • 2.5D
  • 2.1D

覆晶市场规模:凸块技术与复合年增长率(2024-2031)

  • 铜柱
  • 焊料凸块
  • 金凸块
  • 其他的

覆晶市场规模:依最终用途及复合年增长率(2024-2031)

  • 航太和国防
  • 製造业
  • 汽车/交通
  • 家电
  • 资讯科技和通讯
  • 其他的

覆晶市场规模:依地区及复合年增长率(2024-2031)

  • 北美洲
    • 美国
    • 加拿大
  • 欧洲
    • 英国
    • 德国
    • 西班牙
    • 法国
    • 义大利
    • 其他欧洲国家地区
  • 亚太地区
    • 中国
    • 印度
    • 日本
    • 韩国
    • 其他亚太地区
  • 拉丁美洲
    • 巴西
    • 其他拉丁美洲地区
  • 中东/非洲
    • 海湾合作委员会国家
    • 南非
    • 其他中东/非洲

竞争资讯

  • 前5名企业对比
  • 主要企业市场定位(2023年)
  • 主要市场参与者所采取的策略
  • 近期市场趋势
  • 公司市场占有率分析(2023)
  • 主要企业简介
    • 公司简介
    • 产品系列分析
    • 按细分市场分類的份额分析
    • 收益与前一年同期比较(2021-2023)

主要企业简介

  • IBM Corporation
  • ASE Technology Holding Co., Ltd.
  • Advanced Micro Devices, Inc.
  • Intel Corporation
  • Fujitsu
  • Texas Instruments Incorporated
  • Fujitsu Ltd.
  • 3M
  • Powertech Technology Inc.
  • Samsung Electronics Co. Ltd.
  • TSMC Ltd.,
  • Apple Inc.
  • AMD Inc.
  • Amkor Technology
  • International business machines corporation

结论和建议

简介目录
Product Code: SQMIG45I2223

Global Flip chip Market size was valued at USD 30.5 Billion in 2022 and is poised to grow from USD 32.43 Billion in 2023 to USD 49.74 Billion by 2031, growing at a CAGR of 6.3% during the forecast period (2024-2031).

The rapid global digitization trend is significantly driving the demand for innovative semiconductors and chips, particularly flip chips. As device miniaturization and semiconductor technology advancements accelerate, the market is poised for growth, fueled by the increasing prevalence of Internet of Things (IoT) devices and the rollout of 5G network technologies. Additionally, the electrification of vehicles is boosting the need for automotive electronics, further enhancing flip chip market potential. The rising demand for high-performance computing and the establishment of advanced data centers are expected to support flip chip sales in the coming years. However, challenges such as thermal management complexities, the availability of alternative packaging solutions, and high initial deployment costs may hinder market development.

Top-down and bottom-up approaches were used to estimate and validate the size of the Global Flip Chip market and to estimate the size of various other dependent submarkets. The research methodology used to estimate the market size includes the following details: The key players in the market were identified through secondary research, and their market shares in the respective regions were determined through primary and secondary research. This entire procedure includes the study of the annual and financial reports of the top market players and extensive interviews for key insights from industry leaders such as CEOs, VPs, directors, and marketing executives. All percentage shares split, and breakdowns were determined using secondary sources and verified through Primary sources. All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data.

Global Flip Chip Market Segmental Analysis

Global Flip Chip Market is segmented by Type, by Packaging Technology, by Bumping Technology, by End Use and by Region. Based on Type, the market is segmented into Ball Grid Array, Quad Flat No-Lead, Chip Scale Packaging, Chip System in Packaging. Based on Packaging Technology, the market is segmented into 3D, 2.5D, 2.1D. Based on Bumping Technology, the market is segmented into Copper Pillar, Solder Bumping, Gold Bumping, Others. Based on End User, the market is segmented into Consumer Electronics, IT & Telecommunication, Automotive, Industrial, Medical and Healthcare, Military & Aerospace, Others. Based on region, the market is segmented into North America, Europe, Asia Pacific, Latin America and Middle East & and Africa.

Driver of the Global Flip Chip Market

One of the key drivers of the global flip chip market is the increasing utilization of automotive electronics. The automotive sector is experiencing significant transformation due to the growing incorporation of semiconductors and electronic components. The surge in popularity of electric vehicles, coupled with the demand for enhanced safety features and advanced infotainment systems, is driving the need for automotive semiconductors. This rising demand directly influences the flip chip market, as these technologies rely heavily on flip chip packaging for improved performance and efficiency. As a result, the evolution of the automotive landscape is favorably impacting the growth of the flip chip market.

Restraints in the Global Flip Chip Market

One of the significant restraints affecting the Global Flip Chip market is the complexity involved in its manufacturing process. Unlike traditional packaging methods, flip chip technology requires a series of intricate steps, including wafer bumping, underfill application, and die attachment. This multifaceted approach not only elevates the overall production complexity but also leads to increased manufacturing costs. Consequently, these heightened expenses can stifle market demand and hinder the growth prospects for flip chip technology moving forward. As manufacturers navigate these challenges, the intricate nature of flip chip production could continue to serve as a barrier to widespread adoption and utilization.

Market Trends of the Global Flip Chip Market

The Global Flip Chip market is increasingly driven by an emphasis on sustainability, prompting companies to innovate with lead-free solder technologies to align with stringent environmental standards. As regulations tighten with bans on hazardous materials and chemicals, manufacturers are compelled to explore new, eco-friendly materials for packaging solutions. This trend not only enhances the sustainability credentials of flip chip products but also positions companies favorably in a market that is progressively valuing environmentally responsible practices. Consequently, firms that prioritize sustainable development are likely to gain a competitive edge, thus shaping the future landscape of the Global Flip Chip market.

Table of Contents

Introduction

  • Objectives of the Study
  • Scope of the Report
  • Definitions

Research Methodology

  • Information Procurement
  • Secondary & Primary Data Methods
  • Market Size Estimation
  • Market Assumptions & Limitations

Executive Summary

  • Global Market Outlook
  • Supply & Demand Trend Analysis
  • Segmental Opportunity Analysis

Market Dynamics & Outlook

  • Market Overview
  • Market Size
  • Market Dynamics
    • Driver & Opportunities
    • Restraints & Challenges
  • Porters Analysis & Impact
    • Competitive rivalry
    • Threat of substitute
    • Bargaining power of buyers
    • Threat of new entrants
    • Bargaining power of suppliers

Key Market Insights

  • Key Success Factors
  • Degree of Competition
  • Top Investment Pockets
  • Market Ecosystem
  • Market Attractiveness Index, 2023
  • PESTEL Analysis
  • Macro-Economic Indicators
  • Value Chain Analysis
  • Pricing Analysis
  • Technological Advancement
  • Regulatory Landscape
  • Case Studies

Global Flip Chip Market Size by Type & CAGR (2024-2031)

  • Ball Grid Array
  • Quad Flat No-Lead
  • Chip Scale Packaging
  • Chip System in Packaging

Global Flip Chip Market Size by Packaging Technology & CAGR (2024-2031)

  • 3D
  • 2.5D
  • 2.1D

Global Flip Chip Market Size by Bumping Technology & CAGR (2024-2031)

  • Copper Pillar
  • Solder Bumping
  • Gold Bumping
  • Others

Global Flip Chip Market Size by End Use & CAGR (2024-2031)

  • Aerospace and Defense
  • Manufacturing
  • Automotive & Transportation
  • Consumer Electronics
  • IT & Telecommunications
  • Others

Global Flip Chip Market Size by Region & CAGR (2024-2031)

  • North America, (by Type, by Packaging Technology, by Bumping Technology, by End User)
    • US
    • Canada
  • Europe, (by Type, by Packaging Technology, by Bumping Technology, by End User)
    • UK
    • Germany
    • Spain
    • France
    • Italy
    • Rest of Europe
  • Asia-Pacific, (by Type, by Packaging Technology, by Bumping Technology, by End User)
    • China
    • India
    • Japan
    • South Korea
    • Rest of Asia Pacific
  • Latin America, (by Type, by Packaging Technology, by Bumping Technology, by End User)
    • Brazil
    • Rest of Latin America
  • Middle East & Africa, (by Type, by Packaging Technology, by Bumping Technology, by End User)
    • GCC Countries
    • South Africa
    • Rest of Middle East & Africa

Competitive Intelligence

  • Top 5 Player Comparison
  • Market Positioning of Key Players, 2023
  • Strategies Adopted by Key Market Players
  • Recent Developments in the Market
  • Company Market Share Analysis, 2023
  • Company Profiles of All Key Players
    • Company Details
    • Product Portfolio Analysis
    • Company's Segmental Share Analysis
    • Revenue Y-O-Y Comparison (2021-2023)

Key Company Profiles

  • IBM Corporation
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • ASE Technology Holding Co., Ltd.
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Advanced Micro Devices, Inc.
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Intel Corporation
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Fujitsu
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Texas Instruments Incorporated
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Fujitsu Ltd.
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • 3M
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Powertech Technology Inc.
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Samsung Electronics Co. Ltd.
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • TSMC Ltd.,
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Apple Inc.
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • AMD Inc.
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Amkor Technology
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • International business machines corporation
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments

Conclusion & Recommendation