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市场调查报告书
商品编码
1628941

半导体晶圆清洗设备市场规模、份额、成长分析,依设备类型、晶圆尺寸、技术、营运模式、地区 - 产业预测,2025-2032

Semiconductor Wafer Cleaning Equipment Market Size, Share, Growth Analysis, By Equipment Type, By Wafer Size, By Technology, By Operation Mode, By Region - Industry Forecast 2025-2032

出版日期: | 出版商: SkyQuest | 英文 221 Pages | 商品交期: 3-5个工作天内

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简介目录

2023年全球半导体晶圆清洗设备市场规模将为101亿美元,预测期内(2025-2032年)复合年增长率为10.4%,从2024年的111.5亿美元增长到2032年的246.1亿美元,预计将增长。

由于电子、汽车和其他领域对半导体的需求不断增加,全球半导体晶圆清洗设备市场预计将持续成长。由于技术的进步和生产率的提高,以及湿式清洗、干式清洗和等离子清洗等先进清洗技术的广泛采用,预计市场的有利轨迹将持续下去。然而,障碍包括高昂的初始投资成本、严格的法律规范以及需要持续创新以跟上快速发展的半导体技术的步伐。此外,COVID-19 的爆发扰乱了供应链和製造流程,暂时影响了市场成长。如果这些挑战得到解决,该行业将能够在未来几年发挥其成长潜力。

目录

介绍

  • 研究目的
  • 调查范围
  • 定义

调查方法

  • 资讯采购
  • 二手资料和主要资料方法
  • 市场规模预测
  • 市场假设与限制

执行摘要

  • 全球市场展望
  • 供需趋势分析
  • 按细分市场的机会分析

市场动态及展望

  • 市场概况
  • 市场规模
  • 市场动态
    • 驱动因素和机会
    • 抑制因素和挑战
  • 波特的分析

主要市场考察

  • 关键成功因素
  • 竞争程度
  • 主要投资机会
  • 市场生态系统
  • 市场吸引力指数(2024年)
  • PESTEL分析
  • 总体经济指标
  • 价值链分析
  • 价格分析
  • 案例研究
  • 技术进步
  • 监管环境
  • Start-Ups分析
  • 专利分析
  • 贸易分析

按设备类型分類的半导体晶圆清洗设备市场规模

  • 市场概况
  • 单晶圆喷涂系统
  • 单晶圆低温系统
  • 批量浸泡式清洗系统
  • 批量喷淋清洗系统
  • 洗涤器

半导体晶圆清洗设备市场规模:以晶圆尺寸划分

  • 市场概况
  • 150毫米
  • 200毫米
  • 300毫米
  • 450毫米

半导体晶圆清洗设备市场规模:依技术分类

  • 市场概况
  • 湿式化学清洗
  • 蚀刻清洗
  • 正面朝上清洁

半导体晶圆清洗设备市场规模:依营运模式划分

  • 市场概况
  • 自动的
  • 半自动
  • 手动的

半导体晶圆清洗设备市场规模:依应用分类

  • 市场概况
  • MEMS(微电子机械系统)
  • CIS(CMOS 影像感测器)
  • 记忆
  • 射频装置
  • LED
  • 内插器
  • 逻辑

半导体晶圆清洗设备市场规模

  • 北美洲
    • 美国
    • 加拿大
  • 欧洲
    • 德国
    • 西班牙
    • 法国
    • 英国
    • 义大利
    • 其他欧洲国家地区
  • 亚太地区
    • 中国
    • 印度
    • 日本
    • 韩国
    • 其他亚太地区
  • 拉丁美洲
    • 巴西
    • 其他拉丁美洲地区
  • 中东/非洲
    • 海湾合作委员会国家
    • 南非
    • 其他中东/非洲

竞争资讯

  • 前5名企业对比
  • 主要企业市场定位(2024年)
  • 主要市场参与者所采取的策略
  • 近期市场趋势
  • 公司市场占有率分析(2024年)
  • 主要企业简介
    • 公司简介
    • 产品系列分析
    • 按细分市场分類的份额分析
    • 收益与前一年同期比较(2022-2024)

主要企业简介

  • Tokyo Electron Limited(Japan)
  • Lam Research Corporation(US)
  • SCREEN Holdings Co., Ltd.(Japan)
  • KLA Corporation(US)
  • Hitachi High-Tech Corporation(Japan)
  • Semes Co., Ltd.(South Korea)
  • Shibaura Mechatronics Corporation(Japan)
  • Entegris, Inc.(US)
  • Modutek Corporation(US)
  • PVA TePla AG(Germany)
  • Veeco Instruments Inc.(US)
  • Ultratech, Inc.(US)
  • Axus Technology(US)
  • Meyer Burger Technology AG(Switzerland)
  • Rudolph Technologies, Inc.(US)
  • EV Group(Austria)
  • Mattson Technology, Inc.(US)
  • Akrion Systems LLC(US)
  • SUSS MicroTec SE(Germany)

结论和建议

简介目录
Product Code: SQMIG45N2103

Global Semiconductor Wafer Cleaning Equipment Market size was valued at USD 10.1 billion in 2023 and is poised to grow from USD 11.15 billion in 2024 to USD 24.61 billion by 2032, growing at a CAGR of 10.4% during the forecast period (2025-2032).

The global semiconductor wafer cleaning equipment market is poised for continued growth, fueled by increasing semiconductor demand across electronics, automotive, and other sectors. With technological advancements and rising production rates, the market's positive trajectory is expected to persist as advanced cleaning techniques, including wet cleaning, dry cleaning, and plasma cleaning, become more widely adopted. However, challenges such as high initial investment costs, stringent regulatory frameworks, and the ongoing need for innovation to align with rapidly evolving semiconductor technologies present hurdles. Additionally, the COVID-19 pandemic has created disruptions in supply chains and manufacturing processes, temporarily affecting market growth. As these challenges are addressed, the sector is likely to capitalize on its growth potential in the coming years.

Top-down and bottom-up approaches were used to estimate and validate the size of the Global Semiconductor Wafer Cleaning Equipment market and to estimate the size of various other dependent submarkets. The research methodology used to estimate the market size includes the following details: The key players in the market were identified through secondary research, and their market shares in the respective regions were determined through primary and secondary research. This entire procedure includes the study of the annual and financial reports of the top market players and extensive interviews for key insights from industry leaders such as CEOs, VPs, directors, and marketing executives. All percentage shares split, and breakdowns were determined using secondary sources and verified through Primary sources. All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data.

Global Semiconductor Wafer Cleaning Equipment Market Segmental Analysis

Global Semiconductor Wafer Cleaning Equipment Market is segmented by Equipment Type, Wafer Size, Technology, Operation Mode, Application and region. Based on Equipment Type, the market is segmented into Single Wafer Spray System, Single Wafer Cryogenic System, Batch Immersion Cleaning System, Batch Spray Cleaning System and Scrubber. Based on Wafer Size, the market is segmented into 150 mm, 200 mm, 300 mm and 450 mm. Based on Technology, the market is segmented into Wet Chemistry-Based Cleaning, Etch Cleaning and Front Side Up Cleaning. Based on Operation Mode, the market is segmented into Automatic, Semi-Automatic and Manual. Based on Application, the market is segmented into MEMS (Micro-Electro-Mechanical Systems), CIS (CMOS Image Sensors), Memory, RF Device, LED, Interposer and Logic. Based on region, the market is segmented into North America, Europe, Asia Pacific, Latin America and Middle East & Africa.

Driver of the Global Semiconductor Wafer Cleaning Equipment Market

The Global Semiconductor Wafer Cleaning Equipment market is significantly influenced by the increasing adoption of advanced packaging technologies. Innovations like 3D IC integration, wafer-level packaging, and fan-out wafer-level packaging (FOWLP) create a heightened demand for specialized cleaning equipment tailored to these processes. These state-of-the-art packaging techniques necessitate meticulous cleaning of wafer surfaces and interfaces to guarantee optimal adhesion, bonding, and reliability of stacked dies and interconnect structures. Consequently, wafer-cleaning equipment must effectively address the distinctive challenges posed by these advanced packaging methodologies, ultimately driving growth and development within the semiconductor wafer cleaning equipment market.

Restraints in the Global Semiconductor Wafer Cleaning Equipment Market

The Global Semiconductor Wafer Cleaning Equipment market faces notable constraints, primarily due to the substantial costs associated with installation and upkeep. Advanced wafer cleaning systems, designed to meet the rigorous cleanliness standards essential in contemporary semiconductor manufacturing, necessitate a hefty capital investment. These elevated initial expenses can deter semiconductor manufacturers from adopting such technologies, particularly affecting small and medium-sized enterprises that often operate within limited financial parameters. Consequently, the financial burden imposed by the acquisition, installation, and ongoing maintenance of these essential cleaning systems can hinder their ability to compete effectively in an increasingly demanding market landscape.

Market Trends of the Global Semiconductor Wafer Cleaning Equipment Market

The Global Semiconductor Wafer Cleaning Equipment market is experiencing a robust growth trajectory, fueled by the accelerated miniaturization of semiconductor devices. As consumer preferences shift towards compact, powerful electronics, the demand for impeccable wafer cleanliness intensifies. Miniaturization leads to decreased feature sizes and heightened device densities, where even minute contaminants can significantly affect performance and yield. Consequently, the reliance on advanced wafer-cleaning solutions is paramount for preserving the integrity and functionality of these high-density devices. This rising necessity among manufacturers to enhance production efficiency and product reliability signals a promising outlook for the semiconductor wafer cleaning equipment sector.

Table of Contents

Introduction

  • Objectives of the Study
  • Scope of the Report
  • Definitions

Research Methodology

  • Information Procurement
  • Secondary & Primary Data Methods
  • Market Size Estimation
  • Market Assumptions & Limitations

Executive Summary

  • Global Market Outlook
  • Supply & Demand Trend Analysis
  • Segmental Opportunity Analysis

Market Dynamics & Outlook

  • Market Overview
  • Market Size
  • Market Dynamics
    • Drivers & Opportunities
    • Restraints & Challenges
  • Porters Analysis
    • Competitive rivalry
    • Threat of substitute
    • Bargaining power of buyers
    • Threat of new entrants
    • Bargaining power of suppliers

Key Market Insights

  • Key Success Factors
  • Degree of Competition
  • Top Investment Pockets
  • Market Ecosystem
  • Market Attractiveness Index, 2024
  • PESTEL Analysis
  • Macro-Economic Indicators
  • Value Chain Analysis
  • Pricing Analysis
  • Case Studies
  • Technology Advancement
  • Regulatory Landscape
  • Startup Analysis
  • Patent Analysis
  • Trade Analysis

Global Semiconductor Wafer Cleaning Equipment Market Size by Equipment Type & CAGR (2025-2032)

  • Market Overview
  • Single Wafer Spray System
  • Single Wafer Cryogenic System
  • Batch Immersion Cleaning System
  • Batch Spray Cleaning System
  • Scrubber

Global Semiconductor Wafer Cleaning Equipment Market Size by Wafer Size & CAGR (2025-2032)

  • Market Overview
  • 150 mm
  • 200 mm
  • 300 mm
  • 450 mm

Global Semiconductor Wafer Cleaning Equipment Market Size by Technology & CAGR (2025-2032)

  • Market Overview
  • Wet Chemistry-Based Cleaning
  • Etch Cleaning
  • Front Side Up Cleaning

Global Semiconductor Wafer Cleaning Equipment Market Size by Operation Mode & CAGR (2025-2032)

  • Market Overview
  • Automatic
  • Semi-Automatic
  • Manual

Global Semiconductor Wafer Cleaning Equipment Market Size by Application & CAGR (2025-2032)

  • Market Overview
  • MEMS (Micro-Electro-Mechanical Systems)
  • CIS (CMOS Image Sensors)
  • Memory
  • RF Device
  • LED
  • Interposer
  • Logic

Global Semiconductor Wafer Cleaning Equipment Market Size & CAGR (2025-2032)

  • North America (Equipment Type, Wafer Size, Technology, Operation Mode, Application)
    • US
    • Canada
  • Europe (Equipment Type, Wafer Size, Technology, Operation Mode, Application)
    • Germany
    • Spain
    • France
    • UK
    • Italy
    • Rest of Europe
  • Asia Pacific (Equipment Type, Wafer Size, Technology, Operation Mode, Application)
    • China
    • India
    • Japan
    • South Korea
    • Rest of Asia-Pacific
  • Latin America (Equipment Type, Wafer Size, Technology, Operation Mode, Application)
    • Brazil
    • Rest of Latin America
  • Middle East & Africa (Equipment Type, Wafer Size, Technology, Operation Mode, Application)
    • GCC Countries
    • South Africa
    • Rest of Middle East & Africa

Competitive Intelligence

  • Top 5 Player Comparison
  • Market Positioning of Key Players, 2024
  • Strategies Adopted by Key Market Players
  • Recent Developments in the Market
  • Company Market Share Analysis, 2024
  • Company Profiles of All Key Players
    • Company Details
    • Product Portfolio Analysis
    • Company's Segmental Share Analysis
    • Revenue Y-O-Y Comparison (2022-2024)

Key Company Profiles

  • Tokyo Electron Limited (Japan)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Lam Research Corporation (US)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • SCREEN Holdings Co., Ltd. (Japan)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • KLA Corporation (US)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Hitachi High-Tech Corporation (Japan)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Semes Co., Ltd. (South Korea)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Shibaura Mechatronics Corporation (Japan)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Entegris, Inc. (US)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Modutek Corporation (US)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • PVA TePla AG (Germany)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Veeco Instruments Inc. (US)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Ultratech, Inc. (US)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Axus Technology (US)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Meyer Burger Technology AG (Switzerland)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Rudolph Technologies, Inc. (US)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • EV Group (Austria)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Mattson Technology, Inc. (US)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Akrion Systems LLC (US)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • SUSS MicroTec SE (Germany)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments

Conclusion & Recommendations