覆铜板市场规模、份额及成长分析(按应用、材料类型、製造工艺、铜涂层及地区)-2025-2032 年产业预测
市场调查报告书
商品编码
1758593

覆铜板市场规模、份额及成长分析(按应用、材料类型、製造工艺、铜涂层及地区)-2025-2032 年产业预测

Copper Clad Laminate Market Size, Share, and Growth Analysis, By Application (High-Speed Digital Circuit Boards, Power Circuit Boards), By Material Type (Fr-4, Cem-1), By Manufacturing Process, By Copper Coating, By Region - Industry Forecast 2025-2032

出版日期: | 出版商: SkyQuest | 英文 194 Pages | 商品交期: 3-5个工作天内

价格
简介目录

2023 年全球覆铜板市场规模为 175 亿美元,预计将从 2024 年的 187.1 亿美元成长到 2032 年的 319 亿美元,预测期内(2025-2032 年)的复合年增长率为 6.9%。

覆铜板 (CCL) 市场正经历强劲成长,主要得益于电子和通讯行业需求的不断增长。推动这项扩张的关键因素包括印刷基板(PCB) 製造和半导体生产的进步。预计到 2024 年,亚太地区将以最高的成长率引领市场,这得益于其作为通讯系统、汽车电子、医疗技术和国防应用中心的战略定位。随着全球电子格局的发展,尤其是消费性电子产品、汽车技术创新、5G 基础设施和物联网设备的兴起,对高性能和耐用层压板的需求持续激增。此外,汽车产业向电动车和 ADAS(高级驾驶辅助系统)的转变进一步推动了对可靠、耐热层压板的需求。

目录

介绍

  • 调查目的
  • 研究范围
  • 定义

调查方法

  • 资讯采购
  • 二次资料和一次资料方法
  • 市场规模预测
  • 市场假设与限制

执行摘要

  • 全球市场展望
  • 供需趋势分析
  • 细分机会分析

市场动态与展望

  • 市场概览
  • 市场规模
  • 市场动态
    • 驱动因素和机会
    • 限制与挑战
  • 波特的分析

关键市场考察

  • 关键成功因素
  • 竞争程度
  • 主要投资机会
  • 市场生态系统
  • 市场吸引力指数(2024年)
  • PESTEL分析
  • 总体经济指标
  • 价值链分析
  • 定价分析

覆铜板市场规模(依应用)

  • 市场概览
  • 高速数位电路基板
  • 电源电路基板
  • 汽车电路基板
  • 家用电子电器电路基板
  • 医疗电路基板
  • 工业电路基板

覆铜板市场规模(依材料类型划分)

  • 市场概览
  • Fr-4
  • Cem-1
  • Cem-3
  • Fr-2
  • Fr-5
  • 聚酰亚胺
  • 铂铁

按製造流程分類的覆铜板市场规模

  • 市场概览
  • 层压树脂压机
  • 高压层压机
  • 双面胶带层压板
  • 冷裱压机
  • 高频层压机

覆铜板市场规模(依铜涂层划分)

  • 市场概览
  • 电解
  • 轧延铜
  • 溅镀铜
  • 包覆铜
  • 蚀刻铜

覆铜板市场规模

  • 北美洲
    • 美国
    • 加拿大
  • 欧洲
    • 德国
    • 西班牙
    • 法国
    • 英国
    • 义大利
    • 其他欧洲国家地区
  • 亚太地区
    • 中国
    • 印度
    • 日本
    • 韩国
    • 其他亚太地区
  • 拉丁美洲
    • 巴西
    • 其他拉丁美洲
  • 中东和非洲
    • 海湾合作委员会国家
    • 南非
    • 其他中东和非洲地区

竞争资讯

  • 前五大公司对比
  • 主要企业市场定位(2024年)
  • 主要市场参与者所采取的策略
  • 近期市场趋势
  • 公司市场占有率分析(2024年)
  • 主要企业简介
    • 公司详情
    • 产品系列分析
    • 公司分部份额分析
    • 收益同比对比(2022-2024 年)

主要企业简介

  • Kingboard Laminates Holdings Ltd.(China)
  • Shengyi Technology Co., Ltd.(China)
  • Nan Ya Plastics Corporation(Taiwan)
  • Panasonic Holdings Corporation(Japan)
  • Taiwan Union Technology Corporation(Taiwan)
  • Hitachi Chemical Co., Ltd.(Japan)
  • Isola Group(USA)
  • Doosan Corporation Electro-Materials(South Korea)
  • Mitsubishi Gas Chemical Company, Inc.(Japan)
  • Rogers Corporation(USA)
  • Elite Material Co. Ltd.(EMC)(Taiwan)
  • ITEQ Corporation(Taiwan)
  • Resonac Corporation(Japan)
  • AGC Inc.(Japan)
  • Ventec International Group(China/UK)
  • Chang Chun Group(Taiwan)
  • Nanya New Material Technology Co., Ltd.(China)
  • Goldenmax International Group Ltd.(China)
  • Wazam New Materials(China)
  • Sumitomo Bakelite Co., Ltd.(Japan)

结论和建议

简介目录
Product Code: SQMIG15K2005

Global Copper Clad Laminate Market size was valued at USD 17.5 billion in 2023 and is poised to grow from USD 18.71 billion in 2024 to USD 31.9 billion by 2032, growing at a CAGR of 6.9% during the forecast period (2025-2032).

The copper clad laminate (CCL) market is witnessing robust growth, primarily fueled by rising demand from the electronics and telecommunications sectors. Key factors driving this expansion include advancements in printed circuit board (PCB) fabrication and semiconductor production. The Asia Pacific region is expected to lead the market, exhibiting the highest growth rate in 2024 due to its strategic position as a hub for communication systems, automotive electronics, healthcare technology, and defense applications. As the global electronics landscape evolves, particularly with the proliferation of consumer electronics, automotive innovations, 5G infrastructure, and IoT devices, the demand for high-performance, durable laminates continues to surge. Additionally, the automotive industry's transition toward electric vehicles and advanced driver-assistance systems further intensifies the need for reliable heat-resistant laminates.

Top-down and bottom-up approaches were used to estimate and validate the size of the Global Copper Clad Laminate market and to estimate the size of various other dependent submarkets. The research methodology used to estimate the market size includes the following details: The key players in the market were identified through secondary research, and their market shares in the respective regions were determined through primary and secondary research. This entire procedure includes the study of the annual and financial reports of the top market players and extensive interviews for key insights from industry leaders such as CEOs, VPs, directors, and marketing executives. All percentage shares split, and breakdowns were determined using secondary sources and verified through Primary sources. All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data.

Global Copper Clad Laminate Market Segments Analysis

Global Copper Clad Laminate Market is segmented by Application, Material Type, Manufacturing Process, Copper Coating and region. Based on Application, the market is segmented into High-Speed Digital Circuit Boards, Power Circuit Boards, Automotive Circuit Boards, Consumer Electronics Circuit Boards, Medical Circuit Boards and Industrial Circuit Boards. Based on Material Type, the market is segmented into Fr-4, Cem-1, Cem-3, Fr-2, Fr-5, Polyimide and PtFe. Based on Manufacturing Process, the market is segmented into Laminating Resin Press, High-Pressure Laminating Press, Double-Sided Tape Lamination, Cold Lamination Press and High-Frequency Lamination Press. Based on Copper Coating, the market is segmented into Electrolytic Copper, Rolled Copper, Sputtered Copper, Clad Copper and Etched Copper. Based on region, the market is segmented into North America, Europe, Asia Pacific, Latin America and Middle East & Africa.

Driver of the Global Copper Clad Laminate Market

The global Copper Clad Laminate (CCL) market is primarily driven by the increasing demand for electronic devices such as smartphones, laptops, electric vehicles (EVs), and various industrial equipment. CCLs play a crucial role in the manufacturing of printed circuit boards (PCBs), which are vital components in these electronic products. The anticipated rollout of 5G infrastructure in 2024 and the rising production of EVs have further fueled the growth of the CCL market. For example, major companies like Apple and Samsung have heightened their procurement of high-frequency CCLs to support new device launches, prompting suppliers such as Kingboard Laminates and Nan Ya Plastics to expand their production capabilities.

Restraints in the Global Copper Clad Laminate Market

The global copper clad laminate market is facing notable constraints primarily linked to the availability and cost of essential raw materials like copper foil, epoxy resin, and fiberglass cloth. In 2024, significant fluctuations in global copper prices became a key challenge, largely due to political turbulence in major copper-producing countries such as Chile and Peru, which hindered mining operations and tightened the worldwide supply of copper. This disruption has led to increased prices, further compounded by a rising demand in sectors like renewable energy and electric vehicles, creating fierce competition for copper resources in the market.

Market Trends of the Global Copper Clad Laminate Market

The Global Copper Clad Laminate (CCL) market is witnessing a significant trend towards the adoption of halogen-free and eco-friendly materials, driven by heightened environmental awareness and stringent regulations. In 2024, leading electronics brands globally are insisting on halogen-free and low-VOC CCLs, influencing manufacturers to innovate sustainable solutions. Notably, companies like Elite Material Co. (EMC) are expanding their product portfolios to include eco-conscious laminate options, appealing to clients focused on meeting ESG objectives and adhering to global sustainability benchmarks. This shift reflects a broader commitment to responsible sourcing and environmental stewardship in the electronics supply chain, shaping the CCL market's future landscape.

Table of Contents

Introduction

  • Objectives of the Study
  • Scope of the Report
  • Definitions

Research Methodology

  • Information Procurement
  • Secondary & Primary Data Methods
  • Market Size Estimation
  • Market Assumptions & Limitations

Executive Summary

  • Global Market Outlook
  • Supply & Demand Trend Analysis
  • Segmental Opportunity Analysis

Market Dynamics & Outlook

  • Market Overview
  • Market Size
  • Market Dynamics
    • Drivers & Opportunities
    • Restraints & Challenges
  • Porters Analysis
    • Competitive rivalry
    • Threat of substitute
    • Bargaining power of buyers
    • Threat of new entrants
    • Bargaining power of suppliers

Key Market Insights

  • Key Success Factors
  • Degree of Competition
  • Top Investment Pockets
  • Market Ecosystem
  • Market Attractiveness Index, 2024
  • PESTEL Analysis
  • Macro-Economic Indicators
  • Value Chain Analysis
  • Pricing Analysis

Global Copper Clad Laminate Market Size by Application & CAGR (2025-2032)

  • Market Overview
  • High-Speed Digital Circuit Boards
  • Power Circuit Boards
  • Automotive Circuit Boards
  • Consumer Electronics Circuit Boards
  • Medical Circuit Boards
  • Industrial Circuit Boards

Global Copper Clad Laminate Market Size by Material Type & CAGR (2025-2032)

  • Market Overview
  • Fr-4
  • Cem-1
  • Cem-3
  • Fr-2
  • Fr-5
  • Polyimide
  • PtFe

Global Copper Clad Laminate Market Size by Manufacturing Process & CAGR (2025-2032)

  • Market Overview
  • Laminating Resin Press
  • High-Pressure Laminating Press
  • Double-Sided Tape Lamination
  • Cold Lamination Press
  • High-Frequency Lamination Press

Global Copper Clad Laminate Market Size by Copper Coating & CAGR (2025-2032)

  • Market Overview
  • Electrolytic Copper
  • Rolled Copper
  • Sputtered Copper
  • Clad Copper
  • Etched Copper

Global Copper Clad Laminate Market Size & CAGR (2025-2032)

  • North America (Application, Material Type, Manufacturing Process, Copper Coating)
    • US
    • Canada
  • Europe (Application, Material Type, Manufacturing Process, Copper Coating)
    • Germany
    • Spain
    • France
    • UK
    • Italy
    • Rest of Europe
  • Asia Pacific (Application, Material Type, Manufacturing Process, Copper Coating)
    • China
    • India
    • Japan
    • South Korea
    • Rest of Asia-Pacific
  • Latin America (Application, Material Type, Manufacturing Process, Copper Coating)
    • Brazil
    • Rest of Latin America
  • Middle East & Africa (Application, Material Type, Manufacturing Process, Copper Coating)
    • GCC Countries
    • South Africa
    • Rest of Middle East & Africa

Competitive Intelligence

  • Top 5 Player Comparison
  • Market Positioning of Key Players, 2024
  • Strategies Adopted by Key Market Players
  • Recent Developments in the Market
  • Company Market Share Analysis, 2024
  • Company Profiles of All Key Players
    • Company Details
    • Product Portfolio Analysis
    • Company's Segmental Share Analysis
    • Revenue Y-O-Y Comparison (2022-2024)

Key Company Profiles

  • Kingboard Laminates Holdings Ltd. (China)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Shengyi Technology Co., Ltd. (China)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Nan Ya Plastics Corporation (Taiwan)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Panasonic Holdings Corporation (Japan)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Taiwan Union Technology Corporation (Taiwan)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Hitachi Chemical Co., Ltd. (Japan)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Isola Group (USA)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Doosan Corporation Electro-Materials (South Korea)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Mitsubishi Gas Chemical Company, Inc. (Japan)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Rogers Corporation (USA)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Elite Material Co. Ltd. (EMC) (Taiwan)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • ITEQ Corporation (Taiwan)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Resonac Corporation (Japan)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • AGC Inc. (Japan)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Ventec International Group (China/UK)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Chang Chun Group (Taiwan)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Nanya New Material Technology Co., Ltd. (China)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Goldenmax International Group Ltd. (China)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Wazam New Materials (China)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Sumitomo Bakelite Co., Ltd. (Japan)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments

Conclusion & Recommendations