整合微波组件市场规模、份额及成长分析(按频率、技术、应用、功率、封装和地区)- 产业预测(2025-2032)
市场调查报告书
商品编码
1796116

整合微波组件市场规模、份额及成长分析(按频率、技术、应用、功率、封装和地区)- 产业预测(2025-2032)

Integrated Microwave Assembly Market Size, Share, and Growth Analysis, By Frequency (S-Band, C-Band), By Technology (Silicon Germanium, Gallium Arsenide), By Application, By Power Output, By Packaging, By Region - Industry Forecast 2025-2032

出版日期: | 出版商: SkyQuest | 英文 176 Pages | 商品交期: 3-5个工作天内

价格
简介目录

全球整合微波组件市场规模预计将在 2023 年达到 16 亿美元,并从 2024 年的 17 亿美元增长到 2032 年的 28 亿美元,预测期内(2025-2032 年)的复合年增长率为 6.4%。

整合式微波组件市场正经历强劲成长,这得益于对高速、节能电子产品日益增长的需求,尤其是在汽车应用领域,例如用于自动驾驶和先进安全措施的雷达系统。此外,卫星通讯技术的扩展以及对宽频和行动通讯等卫星服务日益增长的需求也是对该市场产生重大影响的趋势。为了满足行动装置日益普及的需求,製造商正专注于开发紧凑、高效的组件。然而,他们面临着设计和整合复杂性、高开发成本以及熟练微波工程师短缺的挑战。此外,国防和航太等领域的严格法令遵循以及影响关键材料的供应链中断可能会阻碍市场发展。

目录

介绍

  • 分析目的
  • 市场覆盖
  • 定义

分析方法

  • 资讯收集
  • 二次资料和一次资料方法
  • 市场规模预测
  • 市场假设与约束

执行摘要

  • 市场概况与展望
  • 供需趋势分析
  • 按细分市场进行机会分析

市场动态与展望

  • 市场概览
  • 市场规模
  • 市场动态
    • 驱动因素和机会
    • 限制与挑战
  • 波特的分析

关键市场考量因素

  • 关键成功因素
  • 竞争程度
  • 关键投资机会
  • 市场生态系统
  • 市场魅力指数(2024年)
  • PESTEL分析
  • 总体经济指标
  • 价值链分析
  • 定价分析
  • 案例研究
  • 客户和购买标准分析

全球整合微波组件市场规模及复合年增长率(按频率)(2025-2032)

  • 市场概览
  • S波段
  • C波段
  • X波段
  • Ku波段
  • Ka波段
  • W波段
  • 毫米波

全球整合微波组件市场规模及复合年增长率(按技术划分)(2025-2032 年)

  • 市场概览
  • 硅锗
  • 砷化镓
  • 磷化铟
  • 氮化砷镓

全球整合微波组件市场规模及各应用复合年增长率(2025-2032)

  • 市场概览
  • 航太/国防
  • 通讯
  • 产业
  • 医疗保健
  • 家电

全球整合微波组件市场规模及复合年增长率(按功率输出)(2025-2032 年)

  • 市场概览
  • 低功率
  • 中功率
  • 高功率
  • 高功率

全球整合微波组件市场规模及复合年增长率(按封装划分)(2025-2032)

  • 市场概览
  • 表面黏着技术
  • 球栅阵列
  • 陶瓷四方扁平封装
  • 塑胶四方扁平封装

全球整合微波组件市场规模及复合年增长率(2025-2032)

  • 北美洲
    • 美国
    • 加拿大
  • 欧洲
    • 德国
    • 西班牙
    • 法国
    • 英国
    • 义大利
    • 其他欧洲国家
  • 亚太地区
    • 中国
    • 印度
    • 日本
    • 韩国
    • 其他亚太地区
  • 拉丁美洲
    • 巴西
    • 其他拉丁美洲
  • 中东和非洲
    • 海湾合作委员会国家
    • 南非
    • 其他中东和非洲地区

竞争格局

  • 前五大公司对比
  • 主要企业的市场定位(2024年)
  • 主要企业采取的策略
  • 近期市场趋势
  • 主要企业市场占有率(2024年)
  • 主要企业简介
    • 公司简介
    • 产品系列分析
    • 按细分市场分析市场份额
    • 收益同比对比(2022-2024 年)

主要企业简介

  • L3Harris Technologies
  • Qorvo
  • Wolfspeed
  • Mercury Systems
  • Broadcom
  • STMicroelectronics
  • NXP Semiconductors
  • Rockwell Automation
  • Infineon Technologies AG
  • Amphenol Corporation
  • Teledyne Technologies
  • Murata Manufacturing
  • Skyworks Solutions
  • Analog Devices

结论和建议

简介目录
Product Code: SQMIG20A2397

Global Integrated Microwave Assembly Market size was valued at USD 1.6 billion in 2023 and is poised to grow from USD 1.7 billion in 2024 to USD 2.8 billion by 2032, growing at a CAGR of 6.4% during the forecast period (2025-2032).

The integrated microwave assembly market is experiencing robust growth driven by the increasing demand for high-speed and energy-efficient electronics, particularly within automotive applications such as radar systems for autonomous driving and advanced safety measures. Additionally, the expansion of satellite communication technologies and the rising need for satellite-based services like broadband and mobile communications are significant trends influencing this market. Manufacturers are focusing on developing compact and high-efficiency components to cater to the growing prevalence of portable devices. Meanwhile, the complexity of design and integration, high development costs, and a shortage of skilled microwave engineers pose challenges. Additionally, stringent compliance regulations in sectors like defense and aerospace, along with supply chain disruptions affecting vital materials, may hinder market progression.

Top-down and bottom-up approaches were used to estimate and validate the size of the Global Integrated Microwave Assembly market and to estimate the size of various other dependent submarkets. The research methodology used to estimate the market size includes the following details: The key players in the market were identified through secondary research, and their market shares in the respective regions were determined through primary and secondary research. This entire procedure includes the study of the annual and financial reports of the top market players and extensive interviews for key insights from industry leaders such as CEOs, VPs, directors, and marketing executives. All percentage shares split, and breakdowns were determined using secondary sources and verified through Primary sources. All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data.

Global Integrated Microwave Assembly Market Segments Analysis

Global Integrated Microwave Assembly Market is segmented by Frequency, Technology, Application, Power Output, Packaging and region. Based on Frequency, the market is segmented into S-Band, C-Band, X-Band, Ku-Band, Ka-Band, W-Band and MM Wave. Based on Technology, the market is segmented into Silicon Germanium, Gallium Arsenide, Indium Phosphide and Nitride Gallium Arsenide. Based on Application, the market is segmented into Aerospace and Defence, Telecommunications, Automotive, Industrial, Medical and Consumer Electronics. Based on Power Output, the market is segmented into Low Power, Medium Power, High Power and Very High Power. Based on Packaging, the market is segmented into Surface Mount Technology, Ball Grid Array, Ceramic Quad Flat Pack and Plastic Quad Flat Pack. Based on region, the market is segmented into North America, Europe, Asia Pacific, Latin America and Middle East & Africa.

Driver of the Global Integrated Microwave Assembly Market

The demand for Integrated Microwave Assemblies (IMAs) is surging due to the growing prevalence of high-speed, low-power electronic devices like laptops, smartphones, and tablets. These advanced devices require ultra-compact and high-performance components to enable efficient high-frequency signal transmission. IMAs present an ideal solution by combining multiple wireless functions into a single module, streamlining design and enhancing functionality. As consumer electronics evolve rapidly, the importance of IMAs becomes increasingly significant, as they play a vital role in supporting the technological advancements and connectivity needs of modern devices, thereby positioning themselves as a cornerstone in the wireless communication landscape.

Restraints in the Global Integrated Microwave Assembly Market

The Global Integrated Microwave Assembly market faces several significant constraints due to the complex design and integration processes necessary for optimal high-frequency performance, thermal stability, and minimal signal interference. Adhering to stringent technical specifications for various applications, including defense, aerospace, and healthcare devices, poses further challenges. Any design flaws not only jeopardize the reliability and performance of these systems but can also lengthen the design timelines, potentially compromising mission assurance for critical applications. These factors collectively hinder the market's growth and innovation potential, making it imperative for stakeholders to navigate these intricate challenges adeptly.

Market Trends of the Global Integrated Microwave Assembly Market

The Global Integrated Microwave Assembly market is experiencing notable growth driven by escalating defense budgets amid rising geopolitical tensions and security concerns. Nations are increasingly prioritizing national defense, resulting in substantial investments in advanced defense technologies, particularly in the communications and radar systems that utilize integrated microwave assemblies. This heightened focus on military preparedness is prompting regulatory bodies to endorse increased funding for sophisticated defense systems. The demand for efficient, high-performance microwave components is projected to expand as military forces seek to enhance operational capabilities and maintain technological superiority, positioning the integrated microwave assembly market as a key player in the defense sector's evolution.

Table of Contents

Introduction

  • Objectives of the Study
  • Scope of the Report
  • Definitions

Research Methodology

  • Information Procurement
  • Secondary & Primary Data Methods
  • Market Size Estimation
  • Market Assumptions & Limitations

Executive Summary

  • Global Market Outlook
  • Supply & Demand Trend Analysis
  • Segmental Opportunity Analysis

Market Dynamics & Outlook

  • Market Overview
  • Market Size
  • Market Dynamics
    • Drivers & Opportunities
    • Restraints & Challenges
  • Porters Analysis
    • Competitive rivalry
    • Threat of substitute
    • Bargaining power of buyers
    • Threat of new entrants
    • Bargaining power of suppliers

Key Market Insights

  • Key Success Factors
  • Degree of Competition
  • Top Investment Pockets
  • Market Ecosystem
  • Market Attractiveness Index, 2024
  • PESTEL Analysis
  • Macro-Economic Indicators
  • Value Chain Analysis
  • Pricing Analysis
  • Case Studies
  • Customer Buying Behavior Analysis

Global Integrated Microwave Assembly Market Size by Frequency & CAGR (2025-2032)

  • Market Overview
  • S-Band
  • C-Band
  • X-Band
  • Ku-Band
  • Ka-Band
  • W-Band
  • MM Wave

Global Integrated Microwave Assembly Market Size by Technology & CAGR (2025-2032)

  • Market Overview
  • Silicon Germanium
  • Gallium Arsenide
  • Indium Phosphide
  • Nitride Gallium Arsenide

Global Integrated Microwave Assembly Market Size by Application & CAGR (2025-2032)

  • Market Overview
  • Aerospace and Defence
  • Telecommunications
  • Automotive
  • Industrial
  • Medical
  • Consumer Electronics

Global Integrated Microwave Assembly Market Size by Power Output & CAGR (2025-2032)

  • Market Overview
  • Low Power
  • Medium Power
  • High Power
  • Very High Power

Global Integrated Microwave Assembly Market Size by Packaging & CAGR (2025-2032)

  • Market Overview
  • Surface Mount Technology
  • Ball Grid Array
  • Ceramic Quad Flat Pack
  • Plastic Quad Flat Pack

Global Integrated Microwave Assembly Market Size & CAGR (2025-2032)

  • North America (Frequency, Technology, Application, Power Output, Packaging)
    • US
    • Canada
  • Europe (Frequency, Technology, Application, Power Output, Packaging)
    • Germany
    • Spain
    • France
    • UK
    • Italy
    • Rest of Europe
  • Asia Pacific (Frequency, Technology, Application, Power Output, Packaging)
    • China
    • India
    • Japan
    • South Korea
    • Rest of Asia-Pacific
  • Latin America (Frequency, Technology, Application, Power Output, Packaging)
    • Brazil
    • Rest of Latin America
  • Middle East & Africa (Frequency, Technology, Application, Power Output, Packaging)
    • GCC Countries
    • South Africa
    • Rest of Middle East & Africa

Competitive Intelligence

  • Top 5 Player Comparison
  • Market Positioning of Key Players, 2024
  • Strategies Adopted by Key Market Players
  • Recent Developments in the Market
  • Company Market Share Analysis, 2024
  • Company Profiles of All Key Players
    • Company Details
    • Product Portfolio Analysis
    • Company's Segmental Share Analysis
    • Revenue Y-O-Y Comparison (2022-2024)

Key Company Profiles

  • L3Harris Technologies
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Qorvo
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Wolfspeed
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Mercury Systems
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Broadcom
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • STMicroelectronics
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • NXP Semiconductors
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Rockwell Automation
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Infineon Technologies AG
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Amphenol Corporation
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Teledyne Technologies
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Murata Manufacturing
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Skyworks Solutions
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Analog Devices
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments

Conclusion & Recommendations