温度控管组件市场规模、份额和成长分析（按材料、装置、服务、最终用户产业和地区划分）—产业预测（2026-2033 年）

全球温度控管组件市场规模预计在 2024 年达到 137 亿美元，从 2025 年的 150.6 亿美元增长到 2033 年的 320.4 亿美元，在预测期（2026-2033 年）内复合年增长率为 9.9%。

由于智慧型手机、笔记型电脑和平板电脑等电子设备的需求不断增长，全球温度控管组件市场正在快速扩张。这些设备在运作过程中会产生大量热量，而散热管理组件对于调节温度和防止过热至关重要，从而推动了市场成长。此外，产业范围内的节能措施也促进了市场需求，因为温度控管解决方案有助于降低能耗、减少成本并减轻对环境的影响。然而，高成本和终端用户认知不足等挑战依然存在。儘管如此，在电动和混合动力汽车的普及（这些汽车需要有效的温度控管） 、设备小型化趋势以及人工智慧 (AI) 与温度控管系统的整合等趋势的推动下，预计该市场将显着增长。

全球温度控管组件市场驱动因素

智慧型手机、平板电脑、笔记型电脑、游戏机和汽车电子产品等电子设备的日益普及，推动了对温度控管组件的需求。随着这些设备功能越来越强大、体积越来越小，有效散热的挑战也日益严峻，因此，实施可靠的温度控管解决方案至关重要。这是因为需要防止过热，过热会对设备的性能和使用寿命产生负面影响。因此，製造商优先采用先进的温度控管技术，以增强设备的功能和可靠性，最终推动该领域的市场成长。设备创新与散热效率之间的协同作用凸显了这些组件的关键作用。

限制全球温度控管组件市场的因素

全球温度控管组件市场面临许多限制因素，其中高性能散热器和热电冷却器等先进温度控管解决方案高成本。这种经济负担可能会阻碍这些技术的广泛应用，尤其是在价格敏感型市场。因此，製造商面临着如何在性能和价格之间取得有效平衡的挑战，以满足不同市场的需求。在维持温度控管标准的同时优化成本效益，仍然是影响这些技术在产业内发展和普及的关键因素。

全球温度控管组件市场趋势

全球温度控管组件市场正呈现出显着的趋势，即液冷解决方案的采用率不断提高，这主要得益于高功率电子应用需求的日益增长。随着各行业寻求更有效率的温度控管策略，包括液冷热交换器和冷板在内的液冷技术因其优于传统风冷系统的散热能力而备受青睐。这一趋势在资料中心和电动车电池冷却领域尤其明显，因为更高的热效率能够支援高功率密度。随着技术的进步，预计该市场将持续扩张，并为应对热挑战提供创新解决方案。

目录

介绍

• 调查目标
• 调查范围
• 定义

调查方法

• 资讯收集
• 二手资料和一手资料方法
• 市场规模预测
• 市场假设与限制

执行摘要

• 全球市场展望
• 供需趋势分析
• 细分市场机会分析

市场动态与展望

• 市场规模
• 市场动态
  • 驱动因素和机会
  • 限制与挑战
• 波特分析

关键市场考察

• 关键成功因素
• 竞争程度
• 关键投资机会
• 市场生态系统
• 市场吸引力指数（2025）
• PESTEL 分析
• 总体经济指标
• 价值链分析
• 定价分析
• 专利分析
• 监管分析

全球温度控管组件市场规模（按材料类型和复合年增长率划分）（2026-2033 年）

• 黏合剂
  • 磁带
  • 电影
  • 导热膜
  • 导电膜
  • 黏合剂液体
  • 热固性液体
  • 室温固化液
  • 非黏性材料

全球温度控管组件市场规模（按元件类型和复合年增长率划分）（2026-2033 年）

• 传导冷却装置
  • 楔锁
  • 盆栽材料
• 对流冷却装置
  • 散热器
  • 散热片
  • 强制通风和自然冷却
  • 热泵
• 先进的冷却系统
  • 直接浸没式冷却
  • 微通道冷却
  • 冷板
  • 其他的
  • 低温冷却设备
  • 冷媒冷却装置
  • 喷淋冷却设备
• 混合冷却装置
  • 电动湿式冷却装置
  • 局部冷却器
  • 蒸气室
  • 紧凑型热交换器
  • 热电冷却器
  • 其他的
  • 喷射衝击冷却装置
  • 热超导性

全球温度控管组件市场规模（按服务类型和复合年增长率划分）（2026-2033 年）

• 安装和校准
• 优化和售后服务支持

全球温度控管组件市场规模（依终端用户产业划分）及复合年增长率（2026-2033 年）

• 家用电子电器
  • 笔记型电脑和桌上型电脑
  • 音频放大器部件
  • 电源单元
  • 游戏机
  • 智慧型手机
  • 家用电器（电视机、冷藏库、洗衣机等）
• 伺服器和资料中心
  • 单架
  • 多机架
• 车
  • 电池温度控管系统
  • 引擎控制温度控管系统
  • 废热回收和排放系统
  • 煞车和悬吊冷却系统
  • 座椅加热/冷却系统
  • 汽车照明系统
• 航太/国防
• 公司
• 卫生保健
  • 大型基础设施
  • 行动装置
• 其他终端用户产业
  • 製造业
  • 零售
  • 交通运输终端用户产业

全球温度控管组件市场规模及复合年增长率（2026-2033）

• 北美洲
  • 美国
  • 加拿大
• 欧洲
  • 德国
  • 西班牙
  • 法国
  • 英国
  • 义大利
  • 其他欧洲地区
• 亚太地区
  • 中国
  • 印度
  • 日本
  • 韩国
  • 亚太其他地区
• 拉丁美洲
  • 巴西
  • 其他拉丁美洲地区
• 中东和非洲
  • 海湾合作委员会国家
  • 南非
  • 其他中东和非洲地区

竞争资讯

• 前五大公司对比
• 主要企业的市场定位（2025 年）
• 主要市场参与者所采取的策略
• 近期市场趋势
• 公司市占率分析（2025 年）
• 主要企业公司简介
  • 公司详情
  • 产品系列分析
  • 依业务板块进行公司股票分析
  • 2023-2025年营收年比比较

主要企业简介

• Vertiv（United States）
• Johnson Controls（Ireland）
• BELIMO Holding AG（Switzerland）
• Daikin Industries, Ltd.（Japan）
• Spirax Group plc（United Kingdom）
• MAHLE GmbH（Germany）
• Honeywell International Inc.（United States）
• Schneider Electric SE（France）
• Eaton Corporation plc（Ireland）
• Parker-Hannifin Corporation（United States）
• NIBE Industrier AB（Sweden）
• Modine Manufacturing Company（United States）
• Laird Thermal Systems（United States）
• DENSO Corporation（Japan）
• Mitsubishi Electric Corporation（Japan）
• Sanhua Holding Group Co., Ltd.（China）
• Boyd Corporation（United States）
• Advanced Cooling Technologies, Inc.（United States）
• Aavid Thermalloy LLC（United States）
• Lytron Inc.（United States）

结论与建议

Global Thermal Management Components Market size was valued at USD 13.7 Billion in 2024 and is poised to grow from USD 15.06 Billion in 2025 to USD 32.04 Billion by 2033, growing at a CAGR of 9.9% during the forecast period (2026-2033).

The market for global thermal management components is expanding rapidly due to heightened demand for electronic devices, including smartphones, laptops, and tablets, which generate significant heat during operation. These components are essential for temperature regulation and overheating prevention, thus driving market growth. Additionally, the focus on energy efficiency across industries bolsters this demand, as thermal management solutions help reduce energy consumption, lower costs, and lessen environmental impact. However, challenges such as high costs and limited awareness among end users exist. Despite this, the market is poised for substantial growth, fueled by trends like the adoption of electric and hybrid vehicles requiring effective thermal management, as well as opportunities for miniaturization and the incorporation of artificial intelligence in thermal management systems.

Top-down and bottom-up approaches were used to estimate and validate the size of the Global Thermal Management Components market and to estimate the size of various other dependent submarkets. The research methodology used to estimate the market size includes the following details: The key players in the market were identified through secondary research, and their market shares in the respective regions were determined through primary and secondary research. This entire procedure includes the study of the annual and financial reports of the top market players and extensive interviews for key insights from industry leaders such as CEOs, VPs, directors, and marketing executives. All percentage shares split, and breakdowns were determined using secondary sources and verified through Primary sources. All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data.

Global Thermal Management Components Market Segments Analysis

Global Thermal Management Components Market is segmented by Material Type, Device, Service, End-User Industry and region. Based on Material Type, the market is segmented into Adhesive Materials. Based on Device, the market is segmented into Conduction Cooling Devices, Convection Cooling Devices, Advanced Cooling Devices and Hybrid Cooling Devices. Based on Service, the market is segmented into Installation & Calibration and Optimization & Post-Sales Support. Based on End-User Industry, the market is segmented into Consumer Electronics, Servers & Data Centers, Automotive, Aerospace & Defense, Enterprises, Healthcare and Other End-User Industries. Based on region, the market is segmented into North America, Europe, Asia Pacific, Latin America and Middle East & Africa.

Driver of the Global Thermal Management Components Market

The increasing prevalence of electronic devices such as smartphones, tablets, laptops, gaming consoles, and automotive electronics is significantly fueling the demand for thermal management components. As these devices evolve to become more powerful and compact, the challenge of effective heat dissipation intensifies, making the implementation of reliable thermal management solutions essential. This need arises to prevent overheating, which can adversely affect performance and longevity. Consequently, manufacturers are prioritizing advanced thermal management technologies to enhance device functionality and reliability, ultimately propelling market growth in this sector. The synergy between device innovation and thermal efficiency underlines the critical role of these components.

Restraints in the Global Thermal Management Components Market

The Global Thermal Management Components market faces a constraint due to the high costs associated with advanced thermal management solutions, including high-performance heat sinks and thermoelectric coolers. This financial burden can hinder their widespread adoption, particularly in markets that are sensitive to pricing. Consequently, manufacturers are challenged to strike an effective balance between the performance and affordability of these thermal management components to satisfy diverse market needs. The necessity to optimize cost-efficiency while maintaining high standards of performance remains a critical factor influencing the growth and acceptance of these technologies within the industry.

Market Trends of the Global Thermal Management Components Market

The Global Thermal Management Components market is witnessing a significant trend towards the increased adoption of liquid cooling solutions, driven by the rising demands of high-power electronic applications. As industries seek more efficient thermal management strategies, liquid cooling technologies, including liquid heat exchangers and cold plates, are becoming prevalent due to their superior heat dissipation capabilities compared to traditional air-cooling methods. This trend is particularly prominent in data centers and electric vehicle battery cooling, where the need for enhanced thermal efficiency supports higher power densities. As technology continues to advance, the market is expected to expand, offering innovative solutions for thermal challenges.

Table of Contents

Introduction

• Objectives of the Study
• Scope of the Report
• Definitions

Research Methodology

• Information Procurement
• Secondary & Primary Data Methods
• Market Size Estimation
• Market Assumptions & Limitations

Executive Summary

• Global Market Outlook
• Supply & Demand Trend Analysis
• Segmental Opportunity Analysis

Market Dynamics & Outlook

• Market Overview
• Market Size
• Market Dynamics
  • Drivers & Opportunities
  • Restraints & Challenges
• Porters Analysis
  • Competitive rivalry
  • Threat of substitute
  • Bargaining power of buyers
  • Threat of new entrants
  • Bargaining power of suppliers

Key Market Insights

• Key Success Factors
• Degree of Competition
• Top Investment Pockets
• Market Ecosystem
• Market Attractiveness Index, 2025
• PESTEL Analysis
• Macro-Economic Indicators
• Value Chain Analysis
• Pricing Analysis
• Patent Analysis
• Regulatory Analysis

Global Thermal Management Components Market Size by Material Type & CAGR (2026-2033)

• Market Overview
• Adhesive Materials
  • Tapes
  • Films
  • Thermally Conductive Films
  • Electrically Conductive Films
  • Adhesive Liquids
  • Heat Cure Liquids
  • Room Temperature Cure Liquids
  • Non-adhesive Materials

Global Thermal Management Components Market Size by Device & CAGR (2026-2033)

• Market Overview
• Conduction Cooling Devices
  • Wedge Locks
  • Potting Materials
• Convection Cooling Devices
  • Heat Sinks
  • Hat Spreaders
  • Forced Air and Natural Cooling Devices
  • Heat Pumps
• Advanced Cooling Devices
  • Direct Immersion Cooling
  • Microchannel Cooling
  • Cold Plates
  • Others
  • Cryogenic Cooling Devices
  • Refrigerant Cooling Devices
  • Spray Coolers
• Hybrid Cooling Devices
  • Electrowetting Devices
  • Spot Coolers
  • Vapor Chambers
  • Compact Heat Exchangers
  • Thermoelectric Cooling Devices
  • Others
  • Jet Impingement Coolers
  • Heat Supercon

Global Thermal Management Components Market Size by Service & CAGR (2026-2033)

• Market Overview
• Installation & Calibration
• Optimization & Post-Sales Support

Global Thermal Management Components Market Size by End-User Industry & CAGR (2026-2033)

• Market Overview
• Consumer Electronics
  • Laptops and Computers
  • Audio Amplifier Components
  • Power Supply Units
  • Gaming Devices
  • Smartphones
  • Home Appliances (TV Sets, Fridges, Washing Machines, Etc.)
• Servers & Data Centers
  • Single Racks
  • Multi Racks
• Automotive
  • Battery Thermal Management Systems
  • Engine Control Thermal Management Systems
  • Waste Heat Recovery and Emission Reduction Systems
  • Brake and Suspension Cooling Systems
  • Seat Heating and Cooling Systems
  • Automotive Lighting Systems
• Aerospace & Defense
• Enterprises
• Healthcare
  • Large Infrastructure Equipment
  • Portable Equipment
• Other End-User Industries
  • Manufacturing
  • Retail
  • Transportation End-Use Industries

Global Thermal Management Components Market Size & CAGR (2026-2033)

• North America (Material Type, Device, Service, End-User Industry)
  • US
  • Canada
• Europe (Material Type, Device, Service, End-User Industry)
  • Germany
  • Spain
  • France
  • UK
  • Italy
  • Rest of Europe
• Asia Pacific (Material Type, Device, Service, End-User Industry)
  • China
  • India
  • Japan
  • South Korea
  • Rest of Asia-Pacific
• Latin America (Material Type, Device, Service, End-User Industry)
  • Brazil
  • Rest of Latin America
• Middle East & Africa (Material Type, Device, Service, End-User Industry)
  • GCC Countries
  • South Africa
  • Rest of Middle East & Africa

Competitive Intelligence

• Top 5 Player Comparison
• Market Positioning of Key Players, 2025
• Strategies Adopted by Key Market Players
• Recent Developments in the Market
• Company Market Share Analysis, 2025
• Company Profiles of All Key Players
  • Company Details
  • Product Portfolio Analysis
  • Company's Segmental Share Analysis
  • Revenue Y-O-Y Comparison (2023-2025)

Key Company Profiles

• Vertiv (United States)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Johnson Controls (Ireland)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• BELIMO Holding AG (Switzerland)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Daikin Industries, Ltd. (Japan)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Spirax Group plc (United Kingdom)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• MAHLE GmbH (Germany)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Honeywell International Inc. (United States)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Schneider Electric SE (France)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Eaton Corporation plc (Ireland)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Parker-Hannifin Corporation (United States)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• NIBE Industrier AB (Sweden)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Modine Manufacturing Company (United States)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Laird Thermal Systems (United States)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• DENSO Corporation (Japan)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Mitsubishi Electric Corporation (Japan)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Sanhua Holding Group Co., Ltd. (China)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Boyd Corporation (United States)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Advanced Cooling Technologies, Inc. (United States)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Aavid Thermalloy LLC (United States)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Lytron Inc. (United States)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments

Conclusion & Recommendations