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光子积体电路市场规模、份额和成长分析（按整合类型、组件、原材料、应用和地区划分）－2026-2033年产业预测

市场调查报告书

商品编码

1899761

光子积体电路市场规模、份额和成长分析（按整合类型、组件、原材料、应用和地区划分）－2026-2033年产业预测

Photonic Integrated Circuit Market Size, Share, and Growth Analysis, By Type of Integration (Hybrid, Monolithic), By Components (Lasers, Modulators), By Raw Materials, By Applications, By Region - Industry Forecast 2026-2033

出版日期: 2025年12月24日 | 出版商:

SkyQuest | 英文 193 Pages | 商品交期: 3-5个工作天内

价格

简介目录

预计到 2024 年，全球光子积体电路 (PIC) 市场规模将达到 151.1 亿美元，到 2025 年将达到 167.3 亿美元，到 2033 年将达到 377.2 亿美元，在预测期（2026-2033 年）内，复合成长率为 10.7%。

全球光子积体电路（PIC）市场正经历强劲成长，这主要得益于通讯技术的进步、光电技术在各个领域的广泛应用以及对高速资料传输需求的激增。 PIC 将多个光学元件整合到单一晶片上，具有性能提升、尺寸缩小和功耗降低等显着优势。资料中心和通讯网路的快速扩张，以及诸如用于自动驾驶汽车的雷射雷达（LiDAR）和 5G 网路等技术创新，进一步推动了对 PIC 的需求。然而，PIC 也面临着许多挑战，例如需要专业知识、初始成本高昂以及设计和製造流程复杂。儘管如此，活性化的研发活动、策略合作以及对量子运算等新兴技术的投资，都为创新和市场成长带来了巨大的机会。

全球光子积体电路市场驱动因素

全球光子积体电路 (PIC) 市场的主要驱动力是日益增长的高速资料传输需求和频宽应用需求。随着电信、资料中心和云端运算等各领域数位转型的推进，对先进光纤通讯解决方案的需求变得愈发迫切。 PIC 提供了一种紧凑、扩充性且节能的方式来处理大量资料并实现超高速传输。这项技术进步对于建构下一代网路、5G 无线通讯和光连接模组至关重要。因此，对更高传输速率和更高网路效率的需求不断增长，极大地推动了市场扩张。

限制全球光子积体电路市场的因素

全球光子积体电路（PIC）市场面临的主要挑战是其设计和製造过程的复杂性和高成本。 PIC製造需要先进的製造技术、整合各种光学元件以及精确对准，这些都需要专业技能和高科技设备。此外，推出製造工厂和维持品质标准所需的大量初始投资会导致生产成本增加、前置作业时间延长和可扩展性受限。这些障碍可能会阻碍市场扩张，而严格的监管要求和智慧财产权问题也阻碍了PIC技术的广泛应用。

全球光子积体电路（PIC）市场趋势

全球光子积体电路 (PIC) 市场正经历显着成长，这主要得益于高速光纤通讯的需求又源于资料密集型应用和 5G 等先进技术的普及。此外，为支援包括资料中心和云端运算服务在内的不断扩展的数位基础设施，对高效数据传输解决方案的需求也进一步推动了这一趋势。随着各行业追求更高的性能和更低的能耗，将光技术整合到通讯、家用电子电器和汽车等领域正成为策略重点。因此，PIC 设计和製造方面的创新有望推动市场扩张并增强竞争优势。

北美洲
- 美国
- 加拿大
欧洲
- 德国
- 西班牙
- 法国
- 英国
- 义大利
- 其他欧洲地区
亚太地区
- 中国
- 印度
- 日本
- 韩国
- 亚太其他地区
拉丁美洲
- 巴西
- 其他拉丁美洲地区
中东和非洲
- 海湾合作委员会国家
- 南非
- 其他中东和非洲地区

竞争资讯

前五大公司对比
主要企业的市场定位（2025 年）
主要市场参与者所采取的策略
近期市场趋势
公司市占率分析（2025 年）
主要企业公司简介
- 公司详情
- 产品系列分析
- 依业务板块进行公司股票分析
- 2023-2025年营收年比比较

主要企业简介

Avago Technologies（US）
Ciena Corporation（US）
EMCORE Corporation（US）
Enablence Technologies（Canada）
Finisar Corporation（US）
Hewlett-Packard（US）
Infinera Corporation（US）
Intel Corporation（US）
JDS Uniphase Corporation（US）
Kaiam Corporation（US）
OneChip Photonics（Canada）
TE Connectivity（Switzerland）

结论与建议

简介目录

Product Code: SQMIG45N2097

Global Photonic Integrated Circuit Market size was valued at USD 15.11 Billion in 2024 and is poised to grow from USD 16.73 Billion in 2025 to USD 37.72 Billion by 2033, growing at a CAGR of 10.7% during the forecast period (2026-2033).

The global photonic integrated circuit (PIC) market is experiencing robust growth driven by advancements in telecommunications, the increasing application of photonics across various sectors, and the surging demand for high-speed data transmission. PICs offer significant advantages such as enhanced performance, reduced size, and lower power consumption by integrating multiple optical components on a single chip. The rapid expansion of data centers, telecommunication networks, and innovations in technologies like LiDAR for autonomous vehicles and 5G networks further fuel the demand for PICs. Challenges such as the need for specialized expertise, high initial costs, and complex design and manufacturing processes pose hurdles. Nevertheless, heightened research and development initiatives, strategic partnerships, and investments in emerging technologies like quantum computing present promising opportunities for innovation and market growth.

Top-down and bottom-up approaches were used to estimate and validate the size of the Global Photonic Integrated Circuit market and to estimate the size of various other dependent submarkets. The research methodology used to estimate the market size includes the following details: The key players in the market were identified through secondary research, and their market shares in the respective regions were determined through primary and secondary research. This entire procedure includes the study of the annual and financial reports of the top market players and extensive interviews for key insights from industry leaders such as CEOs, VPs, directors, and marketing executives. All percentage shares split, and breakdowns were determined using secondary sources and verified through Primary sources. All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data.

Global Photonic Integrated Circuit Market Segments Analysis

Global Photonic Integrated Circuit Market is segmented by Type of Integration, Components, Raw Materials, Applications and region. Based on Type of Integration, the market is segmented into Hybrid, Monolithic and Module. Based on Components, the market is segmented into Lasers, Modulators, Photo Detectors, Attenuators and Optical Amplifiers. Based on Raw Materials, the market is segmented into Lithium Niobate, Silica-on-Silicon, Silicon-on-Insulator, Gallium Arsenide and Indium Phosphide. Based on Applications, the market is segmented into Optical Fiber Communications, Optical Fiber Sensor, Biomedical, Quantum Computing and Others. Based on region, the market is segmented into North America, Europe, Asia Pacific, Latin America and Middle East & Africa.

Driver of the Global Photonic Integrated Circuit Market

The global Photonic Integrated Circuit (PIC) market is primarily propelled by the rising need for high-speed data transmission and bandwidth-demanding applications. As digital transformation expands across diverse sectors such as telecommunications, data centers, and cloud computing, the requirement for advanced optical communication solutions becomes increasingly critical. PICs provide a compact, scalable, and energy-efficient means to manage vast data volumes at ultra-fast speeds. This technological advancement is essential for facilitating next-generation networks, 5G wireless communications, and optical interconnects. Consequently, the escalating demand for enhanced data rates and superior network efficiency is significantly contributing to the market's expansion.

Restraints in the Global Photonic Integrated Circuit Market

A key challenge facing the global Photonic Integrated Circuit (PIC) market is the intricate complexity and high expenses linked to the design and manufacturing processes. Creating PICs necessitates advanced fabrication methods, the integration of various optical components, and meticulous alignment, which demand specialized skills and high-tech equipment. Furthermore, the considerable initial investment needed to set up fabrication facilities and uphold quality standards adds to production costs, extends lead times, and restricts scalability. These hurdles can impede market expansion, while stringent regulatory demands and intellectual property issues also serve as obstacles to the broader adoption of PIC technology.

Market Trends of the Global Photonic Integrated Circuit Market

The Global Photonic Integrated Circuit (PIC) market is witnessing significant growth driven by the increasing demand for high-speed optical communication, fueled by the proliferation of data-intensive applications and advanced technologies like 5G. This trend is further accelerated by the need for efficient data transmission solutions to support expanding digital infrastructures, including data centers and cloud computing services. As industries seek to enhance performance and reduce energy consumption, the integration of photonic technologies into telecommunications, consumer electronics, and automotive sectors is becoming a strategic focus. Consequently, innovations in PIC design and manufacturing are expected to propel market expansion and foster competitive advantages.

Introduction

Objectives of the Study
Scope of the Report
Definitions

Research Methodology

Information Procurement
Secondary & Primary Data Methods
Market Size Estimation
Market Assumptions & Limitations

Executive Summary

Global Market Outlook
Supply & Demand Trend Analysis
Segmental Opportunity Analysis

Market Dynamics & Outlook

Market Overview
Market Size
Market Dynamics
- Drivers & Opportunities
- Restraints & Challenges
Porters Analysis
- Competitive rivalry
- Threat of substitute
- Bargaining power of buyers
- Threat of new entrants
- Bargaining power of suppliers

Key Market Insights

Key Success Factors
Degree of Competition
Top Investment Pockets
Market Ecosystem
Market Attractiveness Index, 2025
PESTEL Analysis
Macro-Economic Indicators
Value Chain Analysis
Pricing Analysis
Technology Analysis
Regulatory Analysis
Patent Analysis
Case Study Analysis

Global Photonic Integrated Circuit Market Size by Type of Integration & CAGR (2026-2033)

Market Overview
Hybrid
Monolithic
Module

Global Photonic Integrated Circuit Market Size by Components & CAGR (2026-2033)

Market Overview
Lasers
Modulators
Photo Detectors
Attenuators
Optical Amplifiers

Global Photonic Integrated Circuit Market Size by Raw Materials & CAGR (2026-2033)

Market Overview
Lithium Niobate
Silica-on-Silicon
Silicon-on-Insulator
Gallium Arsenide
Indium Phosphide

Global Photonic Integrated Circuit Market Size by Applications & CAGR (2026-2033)

Market Overview
Optical Fiber Communications
Optical Fiber Sensor
Biomedical
Quantum Computing
Others

Global Photonic Integrated Circuit Market Size & CAGR (2026-2033)

North America (Type of Integration, Components, Raw Materials, Applications)
- US
- Canada
Europe (Type of Integration, Components, Raw Materials, Applications)
- Germany
- Spain
- France
- UK
- Italy
- Rest of Europe
Asia Pacific (Type of Integration, Components, Raw Materials, Applications)
- China
- India
- Japan
- South Korea
- Rest of Asia-Pacific
Latin America (Type of Integration, Components, Raw Materials, Applications)
- Brazil
- Rest of Latin America
Middle East & Africa (Type of Integration, Components, Raw Materials, Applications)
- GCC Countries
- South Africa
- Rest of Middle East & Africa

Competitive Intelligence

Top 5 Player Comparison
Market Positioning of Key Players, 2025
Strategies Adopted by Key Market Players
Recent Developments in the Market
Company Market Share Analysis, 2025
Company Profiles of All Key Players
- Company Details
- Product Portfolio Analysis
- Company's Segmental Share Analysis
- Revenue Y-O-Y Comparison (2023-2025)

Key Company Profiles

Avago Technologies (US)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Ciena Corporation (US)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
EMCORE Corporation (US)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Enablence Technologies (Canada)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Finisar Corporation (US)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Hewlett-Packard (US)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Infinera Corporation (US)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Intel Corporation (US)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
JDS Uniphase Corporation (US)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Kaiam Corporation (US)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
OneChip Photonics (Canada)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
TE Connectivity (Switzerland)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments