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市场调查报告书
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1615139

光子积体电路市场:现状分析与未来预测 (2024年～2032年)

Photonic Integrated Circuit Market: Current Analysis and Forecast (2024-2032)
出版日期: | 出版商: UnivDatos Market Insights Pvt Ltd | 英文 149 Pages | 商品交期: 最快1-2个工作天内

价格
简介目录

由于需要高速资料传输和低延迟通讯的 5G 基础设施的快速扩张，预计光子积体电路市场在预测期内将以 12.9% 的复合年增长率强劲增长。这个市场有很多投资，近年来也有很多併购。例如，2024 年 8 月，Sivers Semiconductors 宣布计划将其光子子公司 Sivers Photonics Limited 与 Binordic Acquisition Corporation 合併，以增加市场准入和投资者兴趣。 2022 年 3 月，Luminar Technologies 收购 Freedom Photonics，专注于垂直整合，以提高雷射雷达和自动驾驶等高需求领域的性能。

在亚太地区，太平洋岛国预计将经历最高的成长，主要市场是中国、日本和印度。这是由于通讯系统的健康、政策支持以及对光子系统日益增长的兴趣。例如，光子学被列为 "中国製造2025" 的战略重要项目之一，以避免对外部半导体技术的严重依赖，促进国内生产。在北美，政府透过光子学资助计划（例如美国 DARPA（国防高级研究计划局）拨款）提供支持，支持国防和通讯领域高级用途的光子学研究。这些政策和举措，加上私人投资的增加，正在改善 PIC 市场，并将其定位为一项关键技术，将在多个高需求领域实现未来的创新。

光子积体电路市场依原料分为III-V族材料、铌酸锂、硅基二氧化硅等。在预测期内，III-V族材料领域可能在光子积体电路市场的成长中发挥重要作用。 III-V族材料用于光子积体电路的主要原因是它们表现出优异的光学特性，这使得复杂的主动元件（例如雷射和调製器）能够在大量资讯流的应用中实现高度整合。

光子积体电路市场依应用分为通讯、生物医学、资料中心等。预计电信业在预测期内将呈现显着成长。由于对高速资料传输、低延迟以及处理大量资料的方式的需求不断增长，电信业被认为是光子积体电路（PIC）市场的最大驱动力。随着现代社会人口密度的不断增加、5G网路的出现以及光纤化的进一步发展，PIC被用来提高网路效能并支援复杂的多媒体服务。随着视讯串流、线上游戏和云端运算服务等多媒体服务的客户流量不断增加，营运商正在加强其网络，提高处理这些大量流量数据的能力，同时需要优化能源消耗。数据、语音和视讯传输等不断发展的传输需要紧凑、低功耗的解决方案，能够长距离提供高数据速率，而这正是由 PIC 提供的。这项需求是由物联网和智慧城市专案推动的，这些专案将许多设备整合到必须可扩展、可靠和安全的网路中。

依照整合工艺，光子积体电路市场分为混合型和单片型。混合元件目前是光子积体电路市场中最大的部分。光子积体电路（PIC）市场混合部分的关键推动因素是能够在一个晶片上混合不同的材料系统。这种整合使得高性能材料的应用成为可能，包括用于主动结构（雷射和调製器）的 III-V 族化合物和用于被动元件的硅，其功能和效率难以透过单片结构实现。混合 PIC 可以帮助设计和实现 5G 扩展、大规模资料中心和其他不断发展的感测器应用所需的先进高速光通讯链路。混合 PIC 使用多种材料来满足通讯、医疗和航空航太产业对可客製化、高性能产品的市场需求。这种灵活性和卓越的效率使得混合部分在需要灵活且节能的光子基板的行业中最受欢迎。

为了更了解光子积体电路产业的市场实施情况，市场有北美（美国、加拿大、北美其他地区）、欧洲（德国、英国、法国、西班牙、义大利、欧洲其他地区）、亚洲太平洋地区。由于通讯网路的增加、5G 普及率以及光整合系统的技术进步，亚太地区是一个持续成长的光子积体电路 (PIC) 市场。中国、日本、韩国和印度在这一扩张中处于领先地位，正在建立前所未有的能力，以满足对数据通讯和高速网路服务不断增长的需求。政府正在透过 "中国製造2025" 等计画推动创新能力的发展，该计画将帮助中国製造商推动通讯和数据中心技术等领域的光子技术进步。 .程式.此外，该地区消费性电子产业的成长和物联网解决方案的投资要求 PIC 优化电路和资料传输速度。放眼亚太市场，由于该地区的技术进步不断进步，且PIC的市场开发一直受到鼓励，因此该公司肯定会成功进入该市场。

在进入到市场的主要企业里(上)，有玛维尔·科技，富士通，IBM，界内fineela·团体，英特尔·团体，rumentamu·opereshonzuLLC，Siena·团体，Cisco，EMCORE团体，ST微电子等。

目录

第1章 市场概要

  • 市场定义
  • 主要目的
  • 相关利益者
  • 限制事项

第2章 分析方法或前提条件

  • 分析流程
  • 分析方法
  • 受访者简介

第3章 摘要整理

  • 产业摘要
  • 各市场区隔预测
    • 市场成长的强度
  • 地区展望

第4章 市场动态

  • 促进因素
  • 机会
  • 阻碍因素
  • 趋势
  • PESTEL分析
  • 需求面分析
  • 供给面分析
    • 企业合併·收购 (M&A)
    • 投资Scenario
    • 产业考察:主要Start-Ups企业与其独自的策略

第5章 价格分析

  • 价格分析:各地区
  • 价格的影响因素

第6章 全球光子积体电路的市场收益 (2022～2032年)

第7章 市场分析:各原料

  • III-V族材料
  • 铌酸锂
  • 二氧化硅开硅
  • 其他

第8章 市场分析:各用途

  • 通讯
  • 生物医学
  • 资料中心
  • 其他

第9章 市场分析:整合各流程

  • 混合型
  • 单片型

第10章 市场分析:各地区

  • 北美
    • 美国
    • 加拿大
    • 其他北美地区
  • 欧洲
    • 德国
    • 英国
    • 西班牙
    • 法国
    • 义大利
    • 其他欧洲地区
  • 亚太地区
    • 中国
    • 印度
    • 日本
    • 澳洲
    • 其他亚太地区
  • 全球其他地区

第10章 价值链分析

  • 限制分析
  • 市场参与企业的一览

第11章 竞争情形

  • 竞争仪表板
  • 企业的市场定位分析
  • 波特的五力分析

第13章 企业简介

  • Marvell Technology
    • 企业概要
    • 主要的财务指标
    • SWOT分析
    • 产品系列
    • 近几年趋势
  • Fujitsu
  • IBM
  • Infinera Corporation
  • Intel Corporation
  • Lumentum Operations LLC
  • Ciena Corporation
  • Cisco Systems, Inc.
  • EMCORE Corporation
  • STMicroelectronics

第14章 缩写与前提条件

第15章 附录

简介目录
Product Code: UMSE213105

The market of Photonic Integrated Circuit (PIC) is rapidly growing as the demand for high-speed data transmission, low power consumption, and high-performance optical components is increasing rapidly. PICs enable multiple photonic functions, with the result that these systems are used in telecommunications, data, center health care, and defense. Such devices open up opportunities that are superior to what can be achieved in traditional electronic circuits, they are faster and consume less energy. These are integral in managing the incoming demands that come along with the advanced digitized world. Big market forces include improvements in telecommunication technologies, 5G, IoT networks, and cloud computing among others. Also, the move to submicron scale as well as the configuration of different material types for better performance is fueling further adoption of PIC applications.

The Photonic Integrated Circuit Market is expected to grow at a robust CAGR of 12.9% during the forecast period, owing to the rapid expansion of 5G infrastructure, which demands high-speed data transfer and low-latency communication. There has been tremendous investment in this market and mergers and acquisitions in the last couple of years have been quite frequent. For instance, In August 2024, Sivers Semiconductors announced a merger plan for its photonics subsidiary, Sivers Photonics Ltd., with byNordic Acquisition Corporation to enhance market accessibility and investor interest. In March 2022, Luminar Technologies acquired Freedom Photonics, focusing on vertical integration to improve performance in high-demand sectors like lidar and autonomous driving.

The Pacific Island Countries are expected to experience the highest growth in Asia-Pacific, and their key markets will be China, Japan, and India due to sound telecommunication systems, policy support, and escalating interest in photonic systems. For example, photonics has been listed as one of the keys strategically important projects in 'Made in China 2025' to avoid heavily relying on external semiconductor technologies and advance domestic production. In North America, the government support of photonics funding programs like DARPA grants within the United States supports photonics research for advanced purposes within defense and telecommunication. These policies and initiatives coupled with rising private investments are improving the PIC market along with positioning it as an essential technology that will enable future innovations in several high demand sectors.

Based on Raw Material, the Photonic Integrated Circuit market is segmented into III-V Material, Lithium Niobate, Silica-on-silicon, and Others. The III-V Material segment seems to be a key player in the growth of Photonic Integrated Circuit market during the forecast period. The main incentive for III-V material in photonic integrated circuits is because it exhibits excellent optical characteristics allowing high integration of complex active elements such as lasers and modulators in applications with a large flow of information.

Based on Application, the Photonic Integrated Circuit market is divided into Telecommunications, Biomedical, Data Centers, and Others. The Telecommunications segment is expected to showcase a substantial growth rate during the forecast period. The telecommunications sector is considered to be the most significant driver of the Photonic Integrated Circuit (PIC) market, based on the increasing demand for high-speed data transfer, low latency and methods for dealing with enormous amounts of data. Denser population in modern society, the emergence of 5G networks, and further fiberization have led to the use of PICs for enhancing network performance and supporting complex multimedia services. With the growth of customer traffic loading multimedia services such as video streaming, online gaming, cloud computing services and others, the telecom operators are compelled to enhance the networks with improved capabilities to handle these high traffic data volumes while at the same time optimizing energy consumption. These evolving telecommunications such as data, voice and video transmission require a compact low power solution with high data rate over long distances and this is provided by PICs. This demand is fostered by the IoT and smart city projects that have integration of many devices into networks that have to be scalable, reliable and secure.

Based on Integration Process, the Photonic Integrated Circuit market is divided into Hybrid and Monolithic. The Hybrid is currently the largest segment in the Photonic Integrated Circuit Market. The key enabler for the hybrid segment of the Photonic Integrated Circuit (PIC) market is the capability of mixing different material systems on a single chip. This integration allows the application of high-performance materials, including III-V compounds for active structures (lasers and modulators) and Si for passive components with functionality and efficiency that are difficult to achieve with monolithic structures. Hybrid-PICs may be useful in designing and implementing sophisticated, high-speed optical communication links that are necessary for extension of 5G, large-scale data centers and other developing sensor applications. Hybrid PICs use multiple materials that fulfill the market's need for customizable, high-performance products use in telecommunication, healthcare and aerospace industries. This flexibility and better efficiency make the hybrid segment the most sought-after for industries demanding flexible and energy-efficient photonic substrates.

For a better understanding of the market adoption of the Photonic Integrated Circuit industry, the market is analyzed based on its worldwide presence in countries such as North America (U.S.A., Canada, and Rest of North America), Europe (Germany, United Kingdom, France, Spain, Italy, and Rest of Europe), Asia-Pacific (China, Japan, India, Australia, and Rest of Asia-Pacific), Rest of World. APAC is a continuously growing market for Photonic Integrated Circuits (PICs) due to the rising telecommunication networks, popular implementation of 5G, and technological advancement in photonic integrated systems. China, Japan, South Korea, and India are some of the leaders in this expansion as they progress in constructing ever-high capacities for growing demands in data and high-speed Internet services. Government drives towards innovative capabilities is promoted through programs such as the 'Made in China 2025' where Chinese manufacturing will drive photonics technology advances in sectors like telecommunications and Data center technologies; similarly, Japan, through the advanced manufacturing program is improving the photonics manufacturing industry. Furthermore, the region's growing consumer electronics industry and investments in IoT solutions require PICs to optimize circuits and data transmission rates. Looking at the APAC market, one is assured that the firm will succeed in leveraging in this market since the region has taken a step in technological advancement, and there is always encouragement for the development of PICs.

Some of the major players operating in the market include Marvell Technology, Fujitsu, IBM, Infinera Corporation, Intel Corporation, Lumentum Operations LLC, Ciena Corporation, Cisco Systems, Inc., EMCORE Corporation, and STMicroelectronics.

TABLE OF CONTENTS

1.MARKET INTRODUCTION

  • 1.1. Market Definitions
  • 1.2. Main Objective
  • 1.3. Stakeholders
  • 1.4. Limitation

2.RESEARCH METHODOLOGY OR ASSUMPTION

  • 2.1. Research Process of the Photonic Integrated Circuit Market
  • 2.2. Research Methodology of the Photonic Integrated Circuit Market
  • 2.3. Respondent Profile

3.EXECUTIVE SUMMARY

  • 3.1. Industry Synopsis
  • 3.2. Segmental Outlook
    • 3.2.1. Market Growth Intensity
  • 3.3. Regional Outlook

4.MARKET DYNAMICS

  • 4.1. Drivers
  • 4.2. Opportunity
  • 4.3. Restraints
  • 4.4. Trends
  • 4.5. PESTEL Analysis
  • 4.6. Demand Side Analysis
  • 4.7. Supply Side Analysis
    • 4.7.1. Analysis Merger & Acquisition
    • 4.7.2. Investment Scenario
    • 4.7.3. Industry Insights: Leading Startups and Their Unique Strategies

5.Pricing Analysis

  • 5.1. Regional Pricing Analysis
  • 5.2. Price Influencing Factors

6.GLOBAL PHOTONIC INTEGRATED CIRCUIT MARKET REVENUE (USD MN), 2022-2032F

7.MARKET INSIGHTS BY RAW MATERIAL

  • 7.1. III-V Material
  • 7.2. Lithium Niobate
  • 7.3. Silica-on-silicon
  • 7.4. Others

8.MARKET INSIGHTS BY APPLICATION

  • 8.1. Telecommunications
  • 8.2. Biomedical
  • 8.3. Data Centers
  • 8.4. Others

9.MARKET INSIGHTS BY INTEGRATION PROCESS

  • 9.1. Hybrid
  • 9.2. Monolithic

10.MARKET INSIGHTS BY REGION

  • 10.1. North America
    • 10.1.1. USA
    • 10.1.2. Canada
    • 10.1.3. Rest of NA
  • 10.2. Europe
    • 10.2.1. Germany
    • 10.2.2. United Kingdom
    • 10.2.3. Spain
    • 10.2.4. France
    • 10.2.5. Italy
    • 10.2.6. Rest of Europe
  • 10.3. Asia Pacific
    • 10.3.1. China
    • 10.3.2. India
    • 10.3.3. Japan
    • 10.3.4. Australia
    • 10.3.5. Rest of APAC
  • 10.4. Rest of World

11.VALUE CHAIN ANALYSIS

  • 11.1. Marginal Analysis
  • 11.2. List of Market Participants

12.COMPETITIVE LANDSCAPE

  • 12.1. Competition Dashboard
  • 12.2. Competitor Market Positioning Analysis
  • 12.3. Porter Five Forces Analysis

13.COMPANY PROFILED

  • 13.1. Marvell Technology
    • 13.1.1. Company Overview
    • 13.1.2. Key Financials
    • 13.1.3. SWOT Analysis
    • 13.1.4. Product Portfolio
    • 13.1.5. Recent Developments
  • 13.2. Fujitsu
  • 13.3. IBM
  • 13.4. Infinera Corporation
  • 13.5. Intel Corporation
  • 13.6. Lumentum Operations LLC
  • 13.7. Ciena Corporation
  • 13.8. Cisco Systems, Inc.
  • 13.9. EMCORE Corporation
  • 13.10. STMicroelectronics

14.ACRONYMS & ASSUMPTION

15.ANNEXURE