Wi-Fi晶片组市场规模、份额和成长分析(按MIMI配置、频段、IEEE标准、应用、最终用途、垂直产业和地区划分)-产业预测,2026-2033年
市场调查报告书
商品编码
1902796

Wi-Fi晶片组市场规模、份额和成长分析(按MIMI配置、频段、IEEE标准、应用、最终用途、垂直产业和地区划分)-产业预测,2026-2033年

Wi-Fi Chipset Market Size, Share, and Growth Analysis, By MIMI Configuration (SU-MIMO, MU-MIMO), By Band, By IEEE Standard, By Application, By End Use, By Vertical, By Region - Industry Forecast 2026-2033

出版日期: | 出版商: SkyQuest | 英文 187 Pages | 商品交期: 3-5个工作天内

价格
简介目录

预计到 2024 年,全球 Wi-Fi 晶片组市场规模将达到 290.8 亿美元,到 2025 年将成长至 310.8 亿美元,到 2033 年将成长至 530.1 亿美元,在预测期(2026-2033 年)内成长至 530.1 亿美元,在预测期(2026-2033 年)内成长至 6.9%。

物联网 (IoT) 在商业、工业和住宅等各个领域的日益普及,正推动全球对 Wi-Fi 晶片组的需求快速成长。自动化整合提高了生产力、柔软性、安全性和成本效益,随着连网设备数量的增加,无线晶片组的需求也随之成长。物联网连接数量的显着增长,尤其是在智慧建筑领域,正是这一趋势的鲜明例证。此外,对安全威胁日益增长的担忧促使各国政府投资于先进的监控技术,进一步推动了 Wi-Fi 晶片组市场的发展。为多用户提供稳定频宽的高效能网路连线至关重要,因为更广的覆盖范围、稳定的通讯和更低的延迟相结合,能够显着提升各种应用场景下的整体用户体验。

全球Wi-Fi晶片组市场驱动因素

全球Wi-Fi晶片组市场持续成长,主要受高速网路需求不断增长的驱动,而4K串流媒体、线上游戏和远端办公等应用的需求更是推动了这一趋势。消费者和企业对更强大、更可靠的网路连线的需求日益增长,从而促进了采用先进技术的创新Wi-Fi晶片组的研发和应用。这一趋势在人们对Wi-Fi 6日益增长的兴趣中尤其明显,Wi-Fi 6提供了更高的性能和容量。随着对无缝连接的需求不断增长,Wi-Fi晶片组市场有望持续成长和创新,以满足全球用户不断变化的需求。

限制全球Wi-Fi晶片组市场的因素

由于Wi-Fi 6和Wi-Fi 6E等先进技术的出现,全球Wi-Fi晶片组市场面临一些限制因素。这些新技术可能与许多旧设备不相容。这种不相容性带来了挑战,因为许多用户仍然依赖不支援这些新功能的传统设备。因此,用户不愿升级或面临连接问题,阻碍了最新晶片组的广泛应用。这种犹豫最终限制了新型Wi-Fi解决方案的市场成长潜力,并影响了整体普及率。

全球Wi-Fi晶片组市场趋势

全球Wi-Fi晶片组市场正呈现出显着的趋势,即Wi-Fi 6和Wi-Fi 6E技术的普及应用日益广泛,这主要得益于市场对速度更快、延迟更低、容量更大的先进连接解决方案的需求不断增长。随着越来越多的设备需要无缝互联网接入,製造商正在开发先进的晶片组以支援不断发展的标准。这一转变反映了从消费性电子产品到企业解决方案等各个领域向互联环境的更广泛转变。对更智慧、更快速、更可靠的无线体验的追求将继续推动Wi-Fi晶片组市场的成长和技术进步。

目录

介绍

  • 调查目标
  • 调查范围
  • 定义

调查方法

  • 资讯收集
  • 二手资料和一手资料方法
  • 市场规模预测
  • 市场假设与限制

执行摘要

  • 全球市场展望
  • 供需趋势分析
  • 细分市场机会分析

市场动态与展望

  • 市场规模
  • 市场动态
    • 驱动因素和机会
    • 限制与挑战
  • 波特分析

关键市场考察

  • 关键成功因素
  • 竞争程度
  • 关键投资机会
  • 市场生态系统
  • 市场吸引力指数(2025)
  • PESTEL 分析
  • 总体经济指标
  • 价值链分析
  • 定价分析

全球 Wi-Fi 晶片组市场规模(按 MIMI 配置和复合年增长率划分)(2026-2033 年)

  • SU-MIMO
  • MU-MIMO

全球Wi-Fi晶片组市场规模(依频段及复合年增长率划分)(2026-2033年)

  • 单频段/双频
  • 三频

全球Wi-Fi晶片组市场规模(依IEEE标准及复合年增长率划分)(2026-2033年)

  • 802.11be(Wi-Fi 7)
  • 802.11ax(Wi-Fi 6/6E)
  • 802.11ac(Wi-Fi 5)
  • 802.11ad
  • 802.11b/g/n

全球Wi-Fi晶片组市场规模(按应用和复合年增长率划分)(2026-2033年)

  • 消费性电子产品
  • 对于企业
  • 工业的
  • 零售
  • BFSI
  • 卫生保健
  • 其他(政府/公共部门)

全球Wi-Fi晶片组市场规模(按最终用途和复合年增长率划分)(2026-2033年)

  • 消费性电子产品
    • 智慧型手机
    • 笔记型电脑/个人电脑(PC)
    • 药片
  • 相机
  • 智慧家庭设备
    • 家用电器
    • 智慧音箱
  • 游戏机
  • AR/VR设备
  • 移动机器人
  • 无人机
  • 网路装置
    • 路由器/网关
    • 网路基地台
  • mPOS
  • 车载资讯娱乐系统
  • 其他(医疗设备、行动设备、国防设备、教育设备)

全球Wi-Fi晶片组市场规模(依产业垂直领域划分)及复合年增长率(2026-2033年)

  • 介绍
  • 消费者
  • 汽车与运输
  • 卫生保健
  • 教育
  • 为视觉障碍者和身心障碍者提供的辅助工具(适合阅读障碍人士的阅读器)
  • BFSI
  • 零售
  • 对于企业
  • 旅游与饭店
  • 其他(政府/法律相关)

全球Wi-Fi晶片组市场规模及复合年增长率(2026-2033年)

  • 北美洲
    • 美国
    • 加拿大
  • 欧洲
    • 德国
    • 西班牙
    • 法国
    • 英国
    • 义大利
    • 其他欧洲地区
  • 亚太地区
    • 中国
    • 印度
    • 日本
    • 韩国
    • 亚太其他地区
  • 拉丁美洲
    • 巴西
    • 其他拉丁美洲地区
  • 中东和非洲
    • 海湾合作委员会国家
    • 南非
    • 其他中东和非洲地区

竞争资讯

  • 前五大公司对比
  • 主要企业的市场定位(2025 年)
  • 主要市场参与者所采取的策略
  • 近期市场趋势
  • 公司市占率分析(2025 年)
  • 主要企业公司简介
    • 公司详情
    • 产品系列分析
    • 依业务板块进行公司股票分析
    • 2023-2025年营收年比比较

主要企业简介

  • Qualcomm Technologies Inc.(USA)
  • MediaTek Inc.(Taiwan)
  • Intel Corporation(USA)
  • Texas Instruments Incorporated(USA)
  • STMicroelectronics NV(Switzerland)
  • On Semiconductor Co.(USA)
  • Cypress Semiconductor Corporation(USA)
  • Samsung Electronics Co., Ltd.(South Korea)
  • ASUS(Taiwan)
  • D-Link Systems Inc.(Taiwan)
  • Fibocom Wireless Inc.(China)
  • Hewlett Packard Enterprise Company(USA)
  • Cisco Systems Inc.(USA)
  • Infineon Technologies AG(Germany)
  • Espressif Systems(China)
  • Montage Technology Co. Ltd.(China)
  • Netgear Inc.(USA)

结论与建议

简介目录
Product Code: SQMIG50B2031

Global Wi-Fi Chipset Market size was valued at USD 29.08 Billion in 2024 and is poised to grow from USD 31.08 Billion in 2025 to USD 53.01 Billion by 2033, growing at a CAGR of 6.9% during the forecast period (2026-2033).

The global demand for Wi-Fi chipsets is surging, driven by the pervasive adoption of the Internet of Things (IoT) across various sectors, including commercial, industrial, and residential markets. Automation integration enhances productivity, flexibility, security, and cost-effectiveness, fueling the growth of wireless chipsets due to the expanding number of connected devices. Significant increases in IoT connections, particularly in smart buildings, are indicative of this trend. Moreover, heightened concerns over security threats are prompting governments to invest in advanced surveillance technologies, further propelling the market for Wi-Fi chipsets. The need for high-performance network connectivity that accommodates multiple users with consistent bandwidth is critical, as enhanced range, stable communication, and minimal latency collectively improve overall user experience in diverse applications.

Top-down and bottom-up approaches were used to estimate and validate the size of the Global Wi-Fi Chipset market and to estimate the size of various other dependent submarkets. The research methodology used to estimate the market size includes the following details: The key players in the market were identified through secondary research, and their market shares in the respective regions were determined through primary and secondary research. This entire procedure includes the study of the annual and financial reports of the top market players and extensive interviews for key insights from industry leaders such as CEOs, VPs, directors, and marketing executives. All percentage shares split, and breakdowns were determined using secondary sources and verified through Primary sources. All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data.

Global Wi-Fi Chipset Market Segments Analysis

Global Wi-Fi Chipset Market is segmented by MIMI Configuration, Band, IEEE Standard, Application, End Use, Vertical and region. Based on MIMI Configuration, the market is segmented into SU-MIMO and MU-MIMO. Based on Band, the market is segmented into Single & dual band and Tri band. Based on IEEE Standard, the market is segmented into 802.11be (Wi-Fi 7), 802.11ax (Wi-Fi 6 and 6E), 802.11 ac (Wi-Fi 5), 802.11ad and 802.11b/g/n.. Based on Application, the market is segmented into Consumer Electronics, Enterprise, Industrial, Retail, BFSI, Healthcare, Automotive and Others (government & public sector).. Based on End Use, the market is segmented into Consumer devices, Cameras, Smart home devices, Gaming devices, AR/VR devices, Mobile robots, Drones, Networking devices, mPOS, In-vehicle infotainment and Others (medical devices, portable devices, defense equipment, and educational devices). Based on Vertical, the market is segmented into Introduction, Consumer, Automotive & Transportation, Healthcare, Education, Assistant tool for visually impaired or disabilities (Dyslexic Reader), BFSI, Retail, Enterprise, Travel and Hospitality and Others (government and legal). Based on region, the market is segmented into North America, Europe, Asia Pacific, Latin America and Middle East & Africa.

Driver of the Global Wi-Fi Chipset Market

The expanding global Wi-Fi chipset market is significantly driven by the rising demand for high-speed internet, fueled by applications such as 4K streaming, online gaming, and remote work. Both consumers and businesses are increasingly seeking enhanced and dependable internet connectivity, prompting the development and adoption of innovative Wi-Fi chipsets featuring advanced technologies. This trend is particularly evident with the growing interest in Wi-Fi 6, which offers improved performance and capacity. As the need for seamless connectivity continues to escalate, the Wi-Fi chipset market is poised to experience continued growth and innovation, catering to the ever-evolving requirements of users worldwide.

Restraints in the Global Wi-Fi Chipset Market

The Global Wi-Fi Chipset market faces certain constraints due to the emergence of advanced technologies like Wi-Fi 6 and Wi-Fi 6E, which may not be compatible with many older devices in use. This incompatibility poses a challenge, as a significant portion of users still rely on legacy devices that do not support these new features. Consequently, this situation hinders the widespread deployment of the latest chipsets, as users are either reluctant to upgrade or face difficulties in connecting. This reluctance ultimately limits the potential growth of the market for newer Wi-Fi solutions, affecting overall adoption rates.

Market Trends of the Global Wi-Fi Chipset Market

The Global Wi-Fi Chipset market is experiencing a pronounced trend towards the adoption of Wi-Fi 6 and Wi-Fi 6E technologies, fueled by the growing demand for enhanced connectivity solutions that deliver higher speeds, reduced latency, and increased capacity. As more devices seek seamless Internet access, manufacturers are responding by innovating advanced chipsets to meet these evolving standards. This transition reflects a broader shift towards a more interconnected environment, encompassing various sectors from consumer electronics to enterprise solutions. The push for smarter, faster, and more reliable wireless experiences will continue to drive market growth and technological advancements in Wi-Fi chipset development.

Table of Contents

Introduction

  • Objectives of the Study
  • Scope of the Report
  • Definitions

Research Methodology

  • Information Procurement
  • Secondary & Primary Data Methods
  • Market Size Estimation
  • Market Assumptions & Limitations

Executive Summary

  • Global Market Outlook
  • Supply & Demand Trend Analysis
  • Segmental Opportunity Analysis

Market Dynamics & Outlook

  • Market Overview
  • Market Size
  • Market Dynamics
    • Drivers & Opportunities
    • Restraints & Challenges
  • Porters Analysis
    • Competitive rivalry
    • Threat of substitute
    • Bargaining power of buyers
    • Threat of new entrants
    • Bargaining power of suppliers

Key Market Insights

  • Key Success Factors
  • Degree of Competition
  • Top Investment Pockets
  • Market Ecosystem
  • Market Attractiveness Index, 2025
  • PESTEL Analysis
  • Macro-Economic Indicators
  • Value Chain Analysis
  • Pricing Analysis

Global Wi-Fi Chipset Market Size by MIMI Configuration & CAGR (2026-2033)

  • Market Overview
  • SU-MIMO
  • MU-MIMO

Global Wi-Fi Chipset Market Size by Band & CAGR (2026-2033)

  • Market Overview
  • Single & dual band
  • Tri band

Global Wi-Fi Chipset Market Size by IEEE Standard & CAGR (2026-2033)

  • Market Overview
  • 802.11be (Wi-Fi 7)
  • 802.11ax (Wi-Fi 6 and 6E)
  • 802.11 ac (Wi-Fi 5)
  • 802.11ad
  • 802.11b/g/n.

Global Wi-Fi Chipset Market Size by Application & CAGR (2026-2033)

  • Market Overview
  • Consumer Electronics
  • Enterprise
  • Industrial
  • Retail
  • BFSI
  • Healthcare
  • Automotive
  • Others (government & public sector).

Global Wi-Fi Chipset Market Size by End Use & CAGR (2026-2033)

  • Market Overview
  • Consumer devices
    • Smartphones
    • Laptops & Personal Computers (PCs)
    • Tablets
  • Cameras
  • Smart home devices
    • Appliances
    • Smart speakers
  • Gaming devices
  • AR/VR devices
  • Mobile robots
  • Drones
  • Networking devices
    • Routers & gateways
    • Access points
  • mPOS
  • In-vehicle infotainment
  • Others (medical devices, portable devices, defense equipment, and educational devices)

Global Wi-Fi Chipset Market Size by Vertical & CAGR (2026-2033)

  • Market Overview
  • Introduction
  • Consumer
  • Automotive & Transportation
  • Healthcare
  • Education
  • Assistant tool for visually impaired or disabilities (Dyslexic Reader)
  • BFSI
  • Retail
  • Enterprise
  • Travel and Hospitality
  • Others (government and legal)

Global Wi-Fi Chipset Market Size & CAGR (2026-2033)

  • North America (MIMI Configuration, Band, IEEE Standard, Application, End Use, Vertical)
    • US
    • Canada
  • Europe (MIMI Configuration, Band, IEEE Standard, Application, End Use, Vertical)
    • Germany
    • Spain
    • France
    • UK
    • Italy
    • Rest of Europe
  • Asia Pacific (MIMI Configuration, Band, IEEE Standard, Application, End Use, Vertical)
    • China
    • India
    • Japan
    • South Korea
    • Rest of Asia-Pacific
  • Latin America (MIMI Configuration, Band, IEEE Standard, Application, End Use, Vertical)
    • Brazil
    • Rest of Latin America
  • Middle East & Africa (MIMI Configuration, Band, IEEE Standard, Application, End Use, Vertical)
    • GCC Countries
    • South Africa
    • Rest of Middle East & Africa

Competitive Intelligence

  • Top 5 Player Comparison
  • Market Positioning of Key Players, 2025
  • Strategies Adopted by Key Market Players
  • Recent Developments in the Market
  • Company Market Share Analysis, 2025
  • Company Profiles of All Key Players
    • Company Details
    • Product Portfolio Analysis
    • Company's Segmental Share Analysis
    • Revenue Y-O-Y Comparison (2023-2025)

Key Company Profiles

  • Qualcomm Technologies Inc. (USA)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • MediaTek Inc. (Taiwan)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Intel Corporation (USA)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Texas Instruments Incorporated (USA)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • STMicroelectronics NV (Switzerland)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • On Semiconductor Co. (USA)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Cypress Semiconductor Corporation (USA)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Samsung Electronics Co., Ltd. (South Korea)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • ASUS (Taiwan)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • D-Link Systems Inc. (Taiwan)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Fibocom Wireless Inc. (China)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Hewlett Packard Enterprise Company (USA)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Cisco Systems Inc. (USA)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Infineon Technologies AG (Germany)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Espressif Systems (China)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Montage Technology Co. Ltd. (China)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Netgear Inc. (USA)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments

Conclusion & Recommendations