SRAM 和 ROM 设计 IP 市场规模、份额和成长分析(按应用、产品、技术、最终用途和地区划分)—产业预测(2026-2033 年)
市场调查报告书
商品编码
1913991

SRAM 和 ROM 设计 IP 市场规模、份额和成长分析(按应用、产品、技术、最终用途和地区划分)—产业预测(2026-2033 年)

SRAM and ROM Design IP Market Size, Share, and Growth Analysis, By Application (Consumer Electronics, Automotive), By Product (Standard SRAM, Embedded SRAM), By Technology, By End use, By Region - Industry Forecast 2026-2033.

出版日期: | 出版商: SkyQuest | 英文 192 Pages | 商品交期: 3-5个工作天内

价格
简介目录

全球 SRAM 和 ROM 设计 IP 市场规模预计到 2024 年将达到 25.5 亿美元,到 2025 年将达到 27.1 亿美元,到 2033 年将达到 44.2 亿美元,预测期(2026-2033 年)的复合年增长率为 6.3%。

全球SRAM和ROM设计IP市场的发展动力源自于各领域对节能、高密度片上记忆体的需求,这些领域包括家用电子电器、汽车系统晶片(SoC)和边缘AI应用。随着设计人员专注于更小的晶片尺寸和更节能的架构,对嵌入式记忆体IP模组的需求正在飙升。这些IP模组使设计人员能够在支援多种代工厂製程的同时,实现更高的性能和更低的延迟。 SRAM IP在AI加速器中发挥关键作用,用于高效资料处理,而ROM IP则用于安全地储存韧体和设备资讯。随着SoC设计人员越来越需要针对汽车、穿戴式装置和工业自动化等特定应用进行客製化,各种节点尺寸的记忆体效能的提升正在为IP供应商和Start-Ups创造盈利的环境。

推动全球SRAM和ROM设计IP市场发展的因素

人工智慧驱动的应用在家用电子电器、汽车和工业等领域的广泛应用,显着提升了对片上储存解决方案的需求。嵌入式SRAM在边缘AI晶片中扮演关键角色,提供即时资料处理所需的低延迟、高速储存。同时,ROM IP在储存超小型物联网设备的韧体和静态配置方面发挥着至关重要的作用。这些IP在提升效能的同时还能有效控制功耗,其独特的优势正推动着它们在智慧穿戴装置、无人机、自主系统和先进神经网路处理器等多个市场中广泛应用。

限制全球SRAM和ROM设计IP市场的因素

全球SRAM和ROM设计IP市场面临严峻挑战,尤其是对于中小型晶片开发商和Start-Ups而言,高性能IP模组的授权成本高。除了授权本身的经济负担外,将这些IP元件整合到现有的系统晶片(SoC)框架中也需要付出巨大的努力。这个过程通常需要代工厂进行严格的检验、调优和确认,这会进一步增加开发成本和产品上市时间。因此,许多小规模企业无法获得这些高端IP产品,这限制了它们在市场上的创新和有效竞争力。

全球SRAM和ROM设计IP市场趋势

全球SRAM和ROM设计IP市场正经历着向可自订、专用记忆体IP解决方案的显着转变。随着半导体应用的不断发展,对能够根据特定需求量身定制的记忆体组件的需求日益增长,尤其是在人工智慧、汽车系统和穿戴式装置等领域。半导体製造商越来越倾向于寻求能够提高能源效率、性能和安全性,同时又能最大限度缩小物理尺寸的IP。这种不断变化的市场格局正促使IP供应商开发可配置的记忆体编译器和专用记忆体选项,以确保能够在竞争激烈的市场中满足客户提出的各种效能和技术标准。

目录

介绍

  • 调查目标
  • 调查范围
  • 定义

调查方法

  • 资讯收集
  • 二手资料和一手资料方法
  • 市场规模预测
  • 市场假设与限制

执行摘要

  • 全球市场展望
  • 供需趋势分析
  • 细分市场机会分析

市场动态与展望

  • 市场规模
  • 市场动态
    • 驱动因素和机会
    • 限制与挑战
  • 波特分析

关键市场考察

  • 关键成功因素
  • 竞争程度
  • 关键投资机会
  • 市场生态系统
  • 市场吸引力指数(2025)
  • PESTEL 分析
  • 总体经济指标
  • 价值链分析
  • 定价分析
  • 技术分析
  • 案例研究
  • 顾客购买行为分析

全球SRAM及ROM设计IP市场规模(依应用及复合年增长率划分)(2026-2033年)

  • 家用电子电器
  • 电讯
  • 工业自动化
  • 航太

全球SRAM和ROM设计IP市场规模(按产品和复合年增长率划分)(2026-2033年)

  • 标准SRAM
  • 嵌入式SRAM
  • 异步SRAM
  • 同步SRAM
  • ROM

全球SRAM及ROM设计IP市场规模(依技术及复合年增长率划分)(2026-2033年)

  • CMOS
  • BiCMOS
  • SOI
  • FinFET

全球SRAM和ROM设计IP市场规模(按最终用途和复合年增长率划分)(2026-2033年)

  • 行动装置
  • 电脑
  • 网路装置
  • 物联网设备

全球SRAM及ROM设计IP市场规模及复合年增长率(2026-2033年)

  • 北美洲
    • 美国
    • 加拿大
  • 欧洲
    • 德国
    • 西班牙
    • 法国
    • 英国
    • 义大利
    • 其他欧洲地区
  • 亚太地区
    • 中国
    • 印度
    • 日本
    • 韩国
    • 亚太其他地区
  • 拉丁美洲
    • 巴西
    • 其他拉丁美洲地区
  • 中东和非洲
    • 海湾合作委员会国家
    • 南非
    • 其他中东和非洲地区

竞争资讯

  • 前五大公司对比
  • 主要企业的市场定位(2025 年)
  • 主要市场参与者所采取的策略
  • 近期市场趋势
  • 公司市占率分析(2025 年)
  • 主要企业公司简介
    • 公司详情
    • 产品系列分析
    • 依业务板块进行公司股票分析
    • 2023-2025年营收年比比较

主要企业简介

  • Qualcomm
  • Cadence Design Systems
  • Broadcom
  • Analogue Devices
  • Texas Instruments
  • Infineon Technologies
  • Synopsys
  • ON Semiconductor
  • STMicroelectronics
  • Microchip Technology
  • Intel

结论与建议

简介目录
Product Code: SQMIG45N2129

Global SRAM and ROM Design IP Market size was valued at USD 2.55 Billion in 2024 and is poised to grow from USD 2.71 Billion in 2025 to USD 4.42 Billion by 2033, growing at a CAGR of 6.3% during the forecast period (2026-2033).

The global SRAM and ROM design IP market is propelled by the necessity for energy-efficient and high-density on-chip memory across various sectors, including consumer electronics, automotive systems-on-chip (SoCs), and edge AI applications. As designers focus on smaller footprints and power-efficient architectures, the demand for embedded memory IP blocks has surged. These IP blocks empower designers to achieve enhanced performance and reduced latency, compatible with multiple foundry processes. SRAM IP plays a crucial role in AI accelerators for efficient data handling, while ROM IP securely stores firmware and device information. The evolution of memory performance across diverse node sizes creates a profitable landscape for IP vendors and startups, driven by the increasing customization needs of SoC designers for specific applications in automotive, wearables, and industrial automation.

Top-down and bottom-up approaches were used to estimate and validate the size of the Global SRAM and ROM Design IP market and to estimate the size of various other dependent submarkets. The research methodology used to estimate the market size includes the following details: The key players in the market were identified through secondary research, and their market shares in the respective regions were determined through primary and secondary research. This entire procedure includes the study of the annual and financial reports of the top market players and extensive interviews for key insights from industry leaders such as CEOs, VPs, directors, and marketing executives. All percentage shares split, and breakdowns were determined using secondary sources and verified through Primary sources. All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data.

Global SRAM and ROM Design IP Market Segments Analysis

Global SRAM and ROM Design IP Market is segmented by Application, Product, Technology, End use and region. Based on Application, the market is segmented into Consumer Electronics, Automotive, Telecommunications, Industrial Automation and Aerospace. Based on Product, the market is segmented into Standard SRAM, Embedded SRAM, Asynchronous SRAM, Synchronous SRAM and ROM. Based on Technology, the market is segmented into CMOS, BiCMOS, SOI and FinFET. Based on End use, the market is segmented into Mobile Devices, Computers, Networking Equipment and IoT Devices. Based on region, the market is segmented into North America, Europe, Asia Pacific, Latin America and Middle East & Africa.

Driver of the Global SRAM and ROM Design IP Market

The expansion of AI-driven applications across consumer electronics, automotive sectors, and industrial use cases has resulted in a substantial increase in demand for on-chip memory solutions. Embedded SRAM plays a vital role in edge AI chips, providing the low-latency and high-speed memory necessary for real-time data processing. Meanwhile, ROM IP serves a critical purpose by storing firmware and static configurations for ultra-compact IoT devices. The distinct ability of these intellectual properties to enhance performance while managing power consumption significantly influences their acceptance in diverse markets, including smart wearables, drones, autonomous systems, and advanced neural processors.

Restraints in the Global SRAM and ROM Design IP Market

The Global SRAM and ROM Design IP market faces significant challenges due to the prohibitively high costs associated with licensing high-performance IP blocks, particularly for smaller chip developers and start-ups. In addition to the financial burden of licensing itself, integrating these IP components into existing System-on-Chip (SoC) frameworks requires extensive effort. This process often entails rigorous verification, tuning, and validation by foundries, which can further escalate both development costs and timelines. As a result, many smaller organizations find themselves unable to access these premium IP offerings, thereby limiting their ability to innovate and compete effectively in the market.

Market Trends of the Global SRAM and ROM Design IP Market

The Global SRAM and ROM Design IP market is witnessing a pronounced shift towards customizable and application-specific memory IP solutions. As semiconductor applications evolve, particularly in fields such as artificial intelligence, automotive systems, and wearable devices, there is a growing demand for memory components that can be tailored to specific requirements. Chipmakers are increasingly seeking IP that enhances power efficiency, performance, security, and minimizes physical footprint. This evolving landscape is encouraging IP providers to develop configurable memory compilers and specialized memory options, ensuring that they meet the diverse performance criteria and technology standards set by their clients in this competitive market.

Table of Contents

Introduction

  • Objectives of the Study
  • Scope of the Report
  • Definitions

Research Methodology

  • Information Procurement
  • Secondary & Primary Data Methods
  • Market Size Estimation
  • Market Assumptions & Limitations

Executive Summary

  • Global Market Outlook
  • Supply & Demand Trend Analysis
  • Segmental Opportunity Analysis

Market Dynamics & Outlook

  • Market Overview
  • Market Size
  • Market Dynamics
    • Drivers & Opportunities
    • Restraints & Challenges
  • Porters Analysis
    • Competitive rivalry
    • Threat of substitute
    • Bargaining power of buyers
    • Threat of new entrants
    • Bargaining power of suppliers

Key Market Insights

  • Key Success Factors
  • Degree of Competition
  • Top Investment Pockets
  • Market Ecosystem
  • Market Attractiveness Index, 2025
  • PESTEL Analysis
  • Macro-Economic Indicators
  • Value Chain Analysis
  • Pricing Analysis
  • Technology Analysis
  • Case Studies
  • Customer Buying Behavior Analysis

Global SRAM and ROM Design IP Market Size by Application & CAGR (2026-2033)

  • Market Overview
  • Consumer Electronics
  • Automotive
  • Telecommunications
  • Industrial Automation
  • Aerospace

Global SRAM and ROM Design IP Market Size by Product & CAGR (2026-2033)

  • Market Overview
  • Standard SRAM
  • Embedded SRAM
  • Asynchronous SRAM
  • Synchronous SRAM
  • ROM

Global SRAM and ROM Design IP Market Size by Technology & CAGR (2026-2033)

  • Market Overview
  • CMOS
  • BiCMOS
  • SOI
  • FinFET

Global SRAM and ROM Design IP Market Size by End use & CAGR (2026-2033)

  • Market Overview
  • Mobile Devices
  • Computers
  • Networking Equipment
  • IoT Devices

Global SRAM and ROM Design IP Market Size & CAGR (2026-2033)

  • North America (Application, Product, Technology, End use)
    • US
    • Canada
  • Europe (Application, Product, Technology, End use)
    • Germany
    • Spain
    • France
    • UK
    • Italy
    • Rest of Europe
  • Asia Pacific (Application, Product, Technology, End use)
    • China
    • India
    • Japan
    • South Korea
    • Rest of Asia-Pacific
  • Latin America (Application, Product, Technology, End use)
    • Brazil
    • Rest of Latin America
  • Middle East & Africa (Application, Product, Technology, End use)
    • GCC Countries
    • South Africa
    • Rest of Middle East & Africa

Competitive Intelligence

  • Top 5 Player Comparison
  • Market Positioning of Key Players, 2025
  • Strategies Adopted by Key Market Players
  • Recent Developments in the Market
  • Company Market Share Analysis, 2025
  • Company Profiles of All Key Players
    • Company Details
    • Product Portfolio Analysis
    • Company's Segmental Share Analysis
    • Revenue Y-O-Y Comparison (2023-2025)

Key Company Profiles

  • Qualcomm
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Cadence Design Systems
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Broadcom
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Analogue Devices
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Texas Instruments
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Infineon Technologies
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Synopsys
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • ON Semiconductor
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • STMicroelectronics
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Microchip Technology
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Intel
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments

Conclusion & Recommendations