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全球柔性印刷电路市场:到 2028 年的预测——按类型、应用和地区分析Flexible Printed Circuit Boards Market Forecasts to 2028 - Global Analysis By Type, Application and Geography |
根据 Stratistics MRC 的数据,2022 年全球柔性印刷电路板市场规模将达到 231 亿美元,预计到 2028 年将达到 464 亿美元,预测期内復合年增长率为 12.3%。
柔性印刷电路板比刚性电路板更小更轻,重量和体积最多可减少 60%。通常,我们使用单面和/或双面电路的组合来製造这些电路板。此外,它还具有高密度贴装、柔性化、减少连接器和线束、小型化、实现阻抗控制等诸多优点。由于其在成本和耐用性方面的优势,它也被各种最终用户行业广泛采用。此外,汽车和医疗行业需要灵活紧凑的电子产品,预计这将对市场增长产生有利影响。
根据国际汽车製造商组织的数据,2019 年全球製造和生产了约 9200 万辆汽车。
市场动态
促进者
对汽车电子元件的需求增加
电气和电子元件都与汽车电子有关,具有非常复杂的结构。由于转向高科技元件,HDI 微孔和任意层板的需求量很大。从技术上讲,重点是电动汽车、低成本车辆、安全、信息和环境。此外,高密度、细线、激光微孔等高性能薄材料是HDI印製电路板的标誌。
约束
印刷电路板初始成本高
柔性印刷电路板由铜箔、电解溶剂和钴盐等材料製成,製造过程成本高。此外,由于柔性印刷电路板是根据其预期用途设计和製造的,因此初始电路设计、布局和照相製版的成本很高。这些因素限制了预测期内的市场增长。
机会
消费电子产品的快速普及
柔性印刷电路板与使用传统电连接器连接同一电路或其他电子设备的各种组件有很大不同。柔性电子元件以其适应性、紧凑性和创建高电气连接密度的能力而闻名。此外,用于消费电子产品的 PCB 必须价格低廉,以保持最终产品的低成本。製造商还需要高度可靠的基板,因为他们依靠其产品的功能来保持竞争力。收音机、平板电脑、智能手錶、智能手机和其他通信设备等消费电子产品的运行需要 PCB。
威胁
体积有限且易碎
当传统工艺不可用时,FPC 通常采用批量工艺生产。由于製造设备的尺寸限制,我们无法製造特别长和特别宽的尺寸。如果操作人员不当,FPC很容易损坏。FPC 必须由经过培训的人员进行焊接和返工。这些要点阻碍了预测期内的市场增长。
COVID-19 的影响
COVID-19 大流行预计将在中短期内影响半导体和电子行业,预计也会影响柔性 PCB 市场。此外,停工还扰乱了电子製造商的供应链。此外,预计消费电子产品将受到冠状病毒情况的影响,其次是汽车和工业部门。
预计预测期内多层FPCBS最大
多层 FPCB 占据最大的市场份额,并且由于其固有的高容量、高速和高密度封装的小尺寸电气参数,预计在预测期内将保持这一地位。如此昂贵和復杂的电路很难製造,但它们满足了客户、製造商和设计人员对不断增加的电路密度的需求。在国防和航空航天工业中,柔性多层电路也很有吸引力,因为它们可以提供动态和高密度的电路。
电信行业预计在预测期内復合年增长率最高
电信行业预计在预测期内将创下最高的复合年增长率,因为它被广泛用于移动通信系统、无线通信系统和移动电话基站系统等应用领域。它们还用于电子数据存储设备、手机发射器和塔式电子设备、视频协作系统、高速服务器和路由器。此外,在智能手机、笔记本电脑和可穿戴设备等现代电子设备中越来越多地使用这些电路,预计将在预测期内显着推动市场增长。
市场占有率最高的地区
由于ADAS和车辆安全功能在汽车中的集成度越来越高,以及消费电子设备和通信产品的渗透率越来越高,亚太地区占据全球柔性印刷电路板市场的最大份额,并将在2019年继续增长预测期内,预计将保持类似的份额。此外,由于环境问题、监管加强和电动汽车的普及,预计该地区对 FPC 的需求将会增加。
复合年增长率最高的地区
由于军事和航空航天业的高需求,北美预计在预测期内以最高的复合年增长率增长。此外,越来越多地使用技术正在显着推动该地区的市场扩张。经济、设计自由、重量轻和结构简单等优势推动了该行业在该地区的发展。
重大发展
2022 年 4 月,Cicor 集团宣布成功完成对位于德累斯顿(德国)的 SMT Elektronik GmbH 的收购。SMT Elektronik 拥有与 Cicor 的医疗和工业技术目标市场相关的有吸引力且忠诚的客户群。
2021年6月,AT&S将在吉打州居林高科技园区新建高端PCB和IC载板生产园区,总投资85亿令吉(17亿欧元),高科技就业岗位5000人,高影响力。建议生产该设施的建设计划于 2021 年底开始,目标是在 2024 年投入商业运营。
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根据产品组合、地域分布和战略联盟对主要参与者进行基准测试
According to Stratistics MRC, the Global Flexible Printed Circuit Boards Market is accounted for $23.1 billion in 2022 and is expected to reach $46.4 billion by 2028 growing at a CAGR of 12.3% during the forecast period. In comparison to rigid PCBs, flexible PCBs are smaller and lighter, saving up to 60% of the weight and volume. Generally, single and/or double-sided circuits are combined to produce these circuit boards. The product has many positive capabilities, such as higher assembly density, increased flexibility, less requirement for connector wiring harness, reduced size, and better incorporation of controlled impedance features. They have been adopted more widely across a variety of end-user industries as a result of the advantages offered in terms of cost and durability. Moreover, the desire for flexible, small, and compact electronics in the automotive and medical industries is also projected to have a beneficial impact on the market's growth.
According to the International Organisation of Motor Vehicle Manufacturers, around 92 million vehicles were manufactured and produced in the year 2019, worldwide.
Market Dynamics:
Driver:
Rise in Demand for Automotive Electronics
Both electrical and electronic components have extremely complex structures as they pertain to automotive electronics. The demand for HDI microvia and any-layer boards is rising due to the shift toward high-tech components. Technology focuses on concerns including e-mobility, affordable cars, safety, information, and the environment. Furthermore, rising density elements such as laser microvias, narrow lines, and high-performance thin materials characterize HDI PCBs.
Restraint:
High initial PCB cost
Copper foil, electrolytic solvents, and cobalt salts are materials used to make flexible printed circuit boards, and their high cost is increased during the production process. The price of initial circuit design, layout, and photographic plates is costly since flexible PCBs are designed and manufactured for particular purposes. Such factor restrains the market growth during the projection period.
Opportunity:
Rapid Adoption of Consumer Electronic Devices
Due to the usage of traditional electrical connector methods to combine various components of the same circuit or other electronic devices has been transformed by the development of flexible PCBs. Flexible electronics are renowned for their adaptability, compactness, and ability to produce high electrical connection density. Consumer electronics PCBs must be inexpensive also in order to keep the cost of the final product low. Manufacturers also desire reliable boards since they depend on the functionality of their products to remain competitive. PCBs are required for the operation of consumer electronic products like radios, tablets, smartwatches, smartphones, and other communication devices.
Threat:
Limited size and easily damaged
If a conventional process is not available, FPC is typically produced in a batch process. Due to the size restrictions of the production equipment, particularly long and wide sizes cannot be produced. By using improper personnel, FPC is easily harmed. It needs to be soldered and reworked by trained personnel. These aspects hinder the market growth throughout the forecasted period.
COVID-19 Impact:
The COVID-19 pandemic is anticipated to have a short- and medium-term impact on the semiconductor and electronics sectors, which is expected to have an effect on the market for flexible PCBs. Additionally, because of the shutdown, the supply chain of electronic manufacturers has been hampered. Furthermore, consumer electronics are predicted to be impacted by the coronavirus scenario, followed by the automobile and industrial sectors.
The multilayer FPCBS segment is expected to be the largest during the forecast period
Owing to their innate electrical parameters, such as the ability to provide high capacity and high speed in a smaller footprint and higher assembly density, multi-layer FPCBs held the largest share of the market and is anticipated to hold this position throughout the forecast period. These costly and complex circuits are challenging to build, but they satisfy customer, producer, and designer demands for even more circuit density. Moreover, in the defence and aerospace industries, flexible multilayer circuits are attractive because they offer dynamic, high-density circuits.
The telecommunication segment is expected to have the highest CAGR during the forecast period
Due to the increased usage in a wide range of applications, such as mobile communication systems, wireless communication systems, and systems for mobile phone towers, the telecommunications segment is expected to register the highest CAGR during the forecast period. It is also used in electronic data storage devices, cell transmission and tower electronics, video collaboration systems, high-speed servers, and routers. Furthermore, increased use of these circuits in modern electronics such as smartphones, laptops, wearables, and other devices is expected to significantly drive market growth over the forecast period.
Region with largest share:
Because of the increasing integration of ADAS and vehicle safety features in automotive, as well as the increased penetration of consumer electronic devices and telecommunication products, Asia Pacific held the largest share of the global market for flexible printed circuit boards, and it is anticipated that it will hold the same during the projection period. Additionally, demand for FPC is anticipated to rise in the region as a result of rising environmental concerns and regulations, as well as the expanding use of electric vehicles.
Region with highest CAGR:
Because of the substantial demand from the military and aerospace industries, North America is predicted to grow at the highest CAGR over the projection period. Additionally, the expanding use of technology is significantly boosting regional market expansion. In this region, the benefits like economical nature, design freedom, lightweight, and simple structuring will drive the growth of this industry.
Key players in the market
Some of the key players in Flexible Printed Circuit Boards market include Sumitomo Electric Industries Ltd, Nitto Denko Corporation, Flexible Circuit, Interflex Co. Ltd, Career Technologies, MFS Technology, Cicor Management AG, Benchmark Electronics, Flex Ltd, AT&S, Flexcom Inc, IEC Electronics, Multi-Fineline Electronix, Inc, Interflex Co. Ltd and Nitto Denko Corporation.
Key Developments:
In April 2022, Cicor Group announced that the acquisition of SMT Elektronik GmbH located in Dresden (Germany) had been successfully completed. SMT Elektronik has an attractive and loyal customer base, which is predominantly related to Cicor's target markets of medical and industrial technology.
In June 2021, AT&S' new campus in Kulim Hi-Tech Park, Kedah, to produce high-end PCBs and IC substrates involves a proposed total investment of RM8.5 billion (€1.7 billion) and would create 5,000 high-tech and high impact jobs. The construction of the facility is scheduled to begin in the second half of 2021 with commercial operations targeted to come on stream in 2024.
Types Covered:
Applications Covered:
Regions Covered:
What our report offers:
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Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances