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市场调查报告书
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全球化合物半导体市场:到 2028 年的预测 - 按类型、产品、应用和地区分析Compound Semiconductor Market Forecasts to 2028 - Global Analysis By Type, Product, Application, and Geography |
根据 Stratistics MRC 的数据,2022 年全球化合物半导体市场规模将达到 1122 亿美元,预计到 2028 年将达到 1674 亿美元,预测期内復合年增长率为 6.9%。成长。
化合物半导体是由至少两种不同的化学元素组成的半导体。 化合物半导体是使用各种沉积方法製造的,例如化学气相沉积和原子层沉积。
根据美国能源部 (DOE) 的数据,LED 照明的能耗比传统白炽灯泡低约 75-80%,比卤素灯泡低约 65%。
市场动态
驱动程序
IoT(物联网)在各种应用中的发展
随着 IoT(物联网)的普及,化合物半导体的业务正在扩大。 智能家居和智能建筑的出现加速了化合物半导体的结合,以提高许多组件的功能和可用性,从而推动了该行业的发展。 传感器越来越多地用于更智能的建筑和家庭,因为它们可以更有效地收集运营数据并实现自动化。 此外,作为嵌入式安全解决方案,它可以保护基础设施免受网络攻击,促进化合物半导体的发展。
抑製剂
原材料和製造成本高
由于高昂的原材料和製造成本,化合物半导体有可能抑制市场扩张。 由于对用于汽车、笔记本电脑和其他电子设备的芯片的需求不断增加,半导体的製造成本很高。 主要原因是缺乏製造芯片的工厂。
机会
技术进步
随着5G技术的引入和互联网的迅速扩张,氮化镓(GaN)和碳化硅(SiC)等化合物半导体的用途正在扩大(SiC)。 此外,由于世界上半导体的短缺,化合物半导体正在被用作硅基材料的替代品,并且该领域正在扩大。 化合物半导体已开始用于各种电子元件,因为它们可以承受高温高压并且效率很高。 因此,化合物半导体的应用正在扩大,这正在推动业务增长。
威胁
化合物半导体的复杂性
化合物半导体由于其复杂的製造工艺阻碍了市场扩张。 由于化合物半导体是通过复杂的工艺製造的,因此需要先进的机器和优秀的人力资源。 窄半导体层的指数演化、清洁和光刻、离子注入、金属导体沉积等是製造过程中的一些步骤。 由于一个过程会影响后续过程,因此必须仔细控制这些过程。 此外,在化合物半导体的製造过程中,为了在限制范围内製造零件,需要先进的知识。 这些困难阻碍了市场的扩张。
COVID-19 的影响
COVID-19 的爆发显着改变了全球市场。 这段时间,我们经历了更多的损失和困难。 该行业的业务受到供应链问题的阻碍。 很少有强者主导化合物半导体市场。 然而,COVID-19 流行期间市场扩张的主要原因之一是关键领域对包括功率半导体、晶体管和集成电路 (IC) 解决方案在内的化合物半导体的需求增加。 然而,COVID-19 大流行在市场上造成了各种问题,例如合格人员短缺以及由于世界完全或部分关闭而导致开发延迟或取消。
碳化硅 (SiC) 细分市场预计将成为预测期内最大的细分市场
由于碳化硅 (SiC) 在功率分立元件和器件(如 MOSFET、结型场效应晶体管 (JFET) 和肖特基势垒二极管)中的广泛应用,预计碳化硅 (SiC) 市场将实现有利可图的增长。. SiC 在更高的温度和电压下工作,并且具有比其他化合物半导体更大的带隙(高达 1,200 V)。 因此,有望用于大功率应用。 电动汽车、无线充电、电源等都使用了SiC。
在预测期内,预计电力行业的复合年增长率最高
在预测期内,电力供应行业预计将见证最快的复合年增长率。 在电力领域,化合物半导体正在彻底改变该行业。 化合物半导体因其对最终用户公司的好处而在许多部门和行业中无处不在。 GaN 和 SiC 器件可用于双转换方案,同时保持高效率。 这些组件可用于 UPS 以减小尺寸、改善电能质量并降低成本。 与硅和混合竞争对手相比,这些提供了各种优势。 使用化合物半导体的混合部件可将功率损耗降低高达 46%,全基于 GaN 的 UPS 设备可将功率损耗降低高达 100%,而传统的硅绝缘栅双极晶体管 (IGBT) 具有功率损耗优势。
份额最大的地区
在预测期内,亚太地区预计将占据最大的市场份额。 快速的城市化、越来越多的汽车製造商以及航空航天、电子和其他终端用户行业对半导体的需求不断增加,是该地区市场扩张的部分原因。 亚洲国家正在大力投资国防工业,并用尖端技术更新他们的机器。 此外,伴随工业自动化而来的是使用计算机和其他设备来有效且高效地控制流程。 化合物半导体器件非常重要,因为它们可以承受高温和电压。
复合年增长率最高的地区
由于原材料供应充足且劳动力成本低,预计亚太地区在预测期内的复合年增长率最高。 为满足高性能、高功率和长寿命的严格要求,氮化镓技术正迅速被引入国防工业的雷达、电子战和通信系统,取代横向 MOSFET 元件。 由于供应商集中在韩国、中国大陆和台湾,亚太地区是最有可能主导化合物半导体市场的地区。 能够承受高压和高温的化合物半导体器件对于小型应用中的高效功耗至关重要。
主要发展
2021 年 5 月,OSRAM和 ams 的一家子公司推出了OSRAM 24V TEC Flex 系列,该系列可为各种室内和室外应用提供均匀照明。 通过使用 TEC Flex Tunable White (TW),色温可以在 2700K 到 6500K 之间连续调节,同时保持高产色量。
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According to Stratistics MRC, the Global Compound Semiconductor Market is accounted for $112.2 billion in 2022 and is expected to reach $167.4 billion by 2028 growing at a CAGR of 6.9% during the forecast period. A compound semiconductor is a semiconductors made up of at least two different species of chemical elements. These are produced utilising a variety of deposition methods, including chemical vapour deposition, atomic layer deposition, and others.
According to the US Department of Energy (DOE), LED lights use about 75-80% less energy than traditional incandescent light bulbs and about 65% less energy than halogen bulbs.
Market Dynamics:
Driver:
Rising integration of the Internet of things (IoT) in various applications
The business for compound semiconductor is expanding as a result of the increasing adoption of the Internet of Things (IoT) in numerous applications. The emergence of smart homes and smart buildings is accelerating the combination of compound semiconductors to improve the functionality and operational effectiveness of many components, hence fueling industry growth. They also make sensors more effective at gathering operational data and enabling automation, which is why they are being used in smarter buildings and houses. By offering embedded security solutions, they also shield infrastructure from cyber attacks, fostering the development of the compound semiconductor sector.
Restraint:
High raw material and fabrication costs
Compound semiconductors have high raw material as well as fabrication costs, which can restrain market expansion. Due to the rising demand for chips in automobiles, laptops, and other electronic gadgets, semiconductor manufacture is expensive. The lack of factories to manufacture the chips is the primary cause of the scarcity.
Opportunity:
Technological advancement
The utilization of compound semiconductors like gallium nitride (GaN) as silicon carbide is growing as a result of the introduction of 5G technology and the rapid expansion of the internet (SiC). Additionally, the sector is expanding due to the usage of compound semiconductors as a replacement for silicon-based materials as a result of the worldwide semiconductor shortage. Compound semiconductors are utilised more frequently in a variety of electronic components because they offer high temperature, high pressure resistance, and high efficiency. This is stimulating the growth of the business by boosting the applications for compound semiconductor.
Threat:
Complexities of compound semiconductor
The expansion of the market would be hampered by the complexity of compound semiconductor manufacturing. Compound semiconductors are produced using intricate processes that call for sophisticated machinery and highly qualified staff. The exponential development of a narrow semiconductor layer, washing and lithography, ion implantation, and the deposition of metallic conductors are a few of the phases in the manufacturing process. These procedures need to be carefully managed because one step of the process can affect the ones that follow. Making compound semiconductor components in within limitations of the typical production process also calls for a high level of knowledge. These difficulties are limiting the market's expansion.
COVID-19 Impact
Global markets are seeing extraordinary shifts as a result of the COVID-19 outbreak. During this time, there are more losses and difficulties. Operations in the sector are being hampered by supply chain problems. Few strong significant firms dominate the market for compound semiconductors. However, one of the key reasons driving the market expansion during the COVID-19 pandemic is the increase in the demand for compound semiconductors also including power semiconductors, transistors, and integrated circuits (ICs) solutions across key sectors. Instead, the COVID-19 epidemic caused a number of challenges for the market, including a shortage of competent workers and delays or cancellations of development due to complete or partial lockdowns around the world.
The Silicon Carbide (SiC) segment is expected to be the largest during the forecast period
The Silicon Carbide (SiC) segment is estimated to have a lucrative growth, due to its widespread application in power discrete components and devices including MOSFETs, junction field effect transistors (JFETs), and Schottky barrier diodes. SiC can function at greater temperatures and voltages and has a larger bandgap than other compound semiconductors (up to 1,200 V). SiC is so anticipated to be utilised in high-power applications. Electric vehicles, wireless charging, and power supplies all employ SiC.
The Power Supply segment is expected to have the highest CAGR during the forecast period
The Power Supply segment is anticipated to witness the fastest CAGR growth during the forecast period. In the field of power supplies, compound semiconductors are revolutionising the industry. Compound semiconductors have proliferated across many sectors and industries as a result of the advantages they provide to end-user organisations. GaN and SiC devices can be used in the double-conversion manner while maintaining strong efficiency. These components can be used in UPSs to reduce size, enhance power quality, and save money. These have various benefits over silicon and hybrid competition. Although hybrid components based on compound semiconductors can minimise power loss by up to 46% and full GaN-based UPS devices can minimise power loss by up to 100%, conventional silicon insulated-gate bipolar transistors (IGBTs) offer no advantage over power loss.
Region with largest share:
Asia Pacific is projected to hold the largest market share during the forecast period. Rapid urbanisation, the presence of more automakers, and the rising demand for semiconductors from the aerospace, electronics, and other end-user industries are some of the reasons contributing to the regional market's expansion. Asian nations are making significant investments in the defence industry to update their machinery with cutting-edge technologies. As industrial automation has increased, so has the use of computers and other devices for the effective and efficient control of processes. Compound semiconductor devices are crucial because they can withstand high temperatures and voltages.
Region with highest CAGR:
Asia Pacific is projected to have the highest CAGR over the forecast period, owing to the area boasts a wide range of providers of raw materials in addition to low labour prices. In order to meet stringent high-performance, high-power, and long-life cycle requirements, gallium nitride technology is swiftly being deployed in radar, electronic warfare, and communication systems in the defence industry, thus replacing lateral MOSFET components. The Asia Pacific region is most likely to dominate the compound semiconductor market because the bulk of industry vendors are situated in South Korea, China, and Taiwan. Compound semiconductor devices, which can withstand high voltages and temperatures, are essential for ensuring effective power consumption in smaller applications.
Key players in the market
Some of the key players profiled in the Compound Semiconductor Market include Toshiba Corporation, Broadcom Inc., NXP Semiconductors N.V., Texas Instruments Inc., International Quantum Epitaxy Plc., Taiwan Semiconductor Manufacturing Company Ltd., International Quantum Epitaxy PLC, Qorvo Inc., Mitsubishi Electric Corporation, Samsung Electronics Co. Ltd., Skyworks Solutions, Inc., OSRAM, Qualcomm Inc. and Sony Group Corp.
Key Developments:
In May 2021, OSRAM, and ams subsidiary, introduced the OSRAM 24V TEC Flex family, which provides homogeneous illumination for a variety of indoor and outdoor applications. TEC Flex Tunable White (TW) can be utilized to maintain a high color yield while continually adjusting the color temperature from 2700 K to 6500 K.
Types Covered:
Products Covered:
Applications Covered:
Regions Covered:
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Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.