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封面
市场调查报告书
商品编码
1258806

到 2028 年的密封包装市场预测 - 按产品、成分、应用、最终用户和地区分列的全球分析

Hermetic Packaging Market Forecasts to 2028 - Global Analysis By Product, Configuration, Application, End User and By Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 175+ Pages | 商品交期: 2-3个工作天内

价格

根据 Stratistics MRC 的数据，2022 年全球密封包装市场规模将达到 39.5 亿美元，预计到 2028 年将达到 57 亿美元，预测期内復合年增长率为 6.3。 10%。

密封封装是一种高级封装技术，主要用于半导体和电子製造、有源和无源电子产品。 此外，密封封装可保护电子系统免受外部因素的影响，例如气压变化、水分、土壤和其他可能损害电气连接和敏感电子元件的危害。 通过延长电气元件的使用寿命，它们对许多医疗保健和技术设备的安全和可靠性能做出了重大贡献。

据 SIPRI 称，2020 年美国军费开支预计将超过 7780 亿美元，比 2019 年增长 4.4%。

市场动态:

驱动程序

更多地使用密封包装来保护敏感的电子元件

封装商品可抵御各种环境因素，例如污垢、污垢、湿气和大气压力变化，这些因素会损坏敏感的电子设备或干扰电气连接。 也有需要气密性的应用，例如在需要气密性的产品的情况下，功能的丧失可能会带来灾难性的后果。 因此，气密封装越来越多地用于保护高度敏感的电子元件，预计这一趋势将在整个预测期内持续下去。 这是影响密封包装市场的主要变数之一。

约束

严格的洩漏率要求

由于其恶劣的环境和关键应用，军事、航空航天和医疗系统中使用的微电子元件必须符合最严格的气密封装标准。 这些增加的法规迫使公司购买新的洩漏测试设备。 这是因为旧设备缺乏根据新标准进行测试所需的灵敏度。 密封包装供应商必须遵守这些标准，以便以更高的成本获得市场份额。 这种对密封包装的严格规定预计将限制市场增长。

机会

更多地使用密封包装来保护植入式医疗设备

虽然智能设备变得更加复杂和高度集成，但微技术的进步使它们变得更小。 因此，微电子封装必须高度可靠且体积小。 此外，植入式医疗设备等生命攸关物品的包装需要密封良好的环境，以保护设备不与身体接触。 下一代植入式医疗器械的小型化有望推动创新封装技术的发展。

威胁

半密封包装的出现

金属、陶瓷和玻璃以外的聚合物材料用于製造近乎气密的封装。 它也被称为半密封、非完全密封或接近密封的材料。 如果製造、製造和测试正确，这些封装技术有可能成为密封封装的可靠替代品。 在预测期内，密闭包装凭藉其低成本、轻量化和小型化等优势，以及产量增加和标准化程度提高，有望取代密封包装。

COVID-19 的影响:

当前爆发的 COVID-19 正在影响密封包装供应商的资源和财务状况。 大流行病引发的全球健康危机正在对全球金融市场、国民经济和密封包装商品的最终用途企业产生负面影响。 预计这将引发经济放缓并对密封电气元件的需求产生不利影响。 COVID-19 对密封包装市场的长期影响预计将取决于许多变量，包括大流行的全球传播和持续时间、全球政府的反应以及疾病的严重程度。

芦苇草段预计在预测期内最大

据估计，芦苇草行业将经历有利可图的增长。 簧片玻璃在数百万个开关週期内提供非常稳定的簧片开关封装。 当必须密封、绝缘和保护分立电子元件时，玻璃管经常用于电子应用中。 然而，这种玻璃的用途通常是无源元件的气密密封或电绝缘。 簧片玻璃用于热水锅炉开关、皮带传感器、汽车中控锁系统等。

在预测期内，预计军事和国防部门的复合年增长率最高。

军事和国防部门在预测期内将增长最快，因为由于安全问题加剧、国防预算扩大和政治动态变化，预计在预测期内对密封包装的需求将增加。预计将呈现复合年增长率. 由于太空探索中公共和私人支出的增加，密封封装可能会出现增长。

市场份额最高的地区:

由于能源需求增加、新兴经济体和国防开支增加等因素，预计亚太地区在预测期内将占据最大的市场份额，从而推动该地区的市场增长。 随着中国、印度和韩国等新兴国家军事实力的增强，对敏感电子元器件气密封装的需求越来越大。

复合年增长率最高的地区:

由于政府在航空航天和国防工业上的支出增加，预计北美在预测期内的复合年增长率最高。 此外，航空业对新型飞机的依赖正在推动对密封包装的需求，从而使密封包装行业受益。 在汽车工业中，密封件用于确保防翻倒和安全气囊系统中的传感器性能。 因此，如果安全气囊装置变得司空见惯，市场可能需要密封包装。

市场主要参与者

密封包装市场的主要参与者包括:Legacy Technologies, Inc.、NGK Spark Plug Co., Ltd.、Schott AG、Ametek, Inc.、Mackin Technologies、SST International、Teledyne Microelectronic Technologies、Willow Technologies、Kyocera Corporation、Sinclair Manufacturing Company、Egide S.A.、Special Hermetic Products, Inc、Amkor Technology、Materion Corporation 和 SGA Technologies。

主要发展:

2019 年 8 月，京瓷公司在神奈川县横滨市启动了新的 Minato Mirai 研究中心。 该中心的成立旨在促进开放式创新，发展新业务和新技术。

2019 年 6 月，肖特推出了新的 SCHOTT HEATAN 馈通，扩展了其密封传感器封装产品组合。 SCHOTT HEATAN 馈通件可在超过 1000度C 的腐蚀性高温环境中提供可靠的性能。

2019 年 2 月，AMETEK 的电子元器件和封装部门 AMETEK Coining 推出了革命性的 Copper-Core Connect，这是高性能电子封装中使用的厚焊料预成型件的一种经济高效的替代品。确实如此。

2018 年 7 月，肖特签署了收购 Primoceler 的协议，通过玻璃微键合技术扩展其气密封装产品组合。 这种黏合技术提供了一种具有优异生物相容性的新型玻璃。 该技术为晶圆级芯片级封装 (WL-CSP) 开闢了新的可能性，适用于广泛的应用，例如 MEMS 设备、医疗植入物和其他对可靠性至关重要的电子和光学器件。

这份报告提供了什么

  • 区域和国家/地区细分市场份额评估
  • 向新进入者提出战略建议
  • 2020、2021、2022、2025 和 2028 年的综合市场数据
  • 市场驱动因素（市场趋势、制约因素、机遇、威胁、挑战、投资机会、建议等）
  • 根据市场预测在关键业务领域提出战略建议
  • 竞争格局和趋势
  • 公司简介，包括详细的战略、财务状况和近期发展
  • 供应链趋势反映了最新的技术进步。

提供免费定制

购买此报告的客户将免费获得以下定制之一。

  • 公司简介
    • 其他市场参与者的综合概况（最多 3 家公司）
    • 主要参与者的 SWOT 分析（最多 3 家公司）
  • 区域细分
    • 应客户要求提供主要国家/地区的市场估算、预测和復合年增长率（注意:基于可行性检查）
  • 竞争基准
    • 根据产品组合、地域分布和战略联盟对主要参与者进行基准测试

内容

第 1 章执行摘要

第2章前言

  • 概览
  • 利益相关者
  • 调查范围
  • 调查方法
    • 数据挖掘
    • 数据分析
    • 数据验证
    • 研究方法
  • 调查来源
    • 主要研究信息来源
    • 二手研究资源
    • 假设

第3章市场趋势分析

  • 司机
  • 约束因素
  • 机会
  • 威胁
  • 产品分析
  • 应用分析
  • 最终用户分析
  • 新兴市场
  • COVID-19 的影响

第 4 章波特五力分析

  • 供应商的议价能力
  • 买家的议价能力
  • 替代品的威胁
  • 新进入者的威胁
  • 竞争公司之间的敌对关係

第 5 章全球密封包装市场:按产品分类

  • 应答器玻璃
  • 钝化玻璃
  • 芦苇玻璃
  • 陶瓷金属密封 (CERTM)
  • 玻璃金属密封 (GTMS)
  • 其他产品

第 6 章全球密封包装市场:按成分分类

  • 压陶瓷封装
  • 多层陶瓷封装
  • 金属罐包装

第 7 章全球密封包装市场:按应用

  • 雷射
  • 微机电开关
  • 晶体管
  • 安全气囊点火器
  • 振动晶体
  • 光电二极管
  • 传感器
  • 其他应用

第 8 章全球气密包装市场:按最终用户分类

  • 能源与核安全
  • 家用电器
  • 军事与国防
  • 汽车
  • 航空航天
  • 医学
  • 沟通
  • 其他最终用户

第 9 章全球气密包装市场:按地区

  • 北美
    • 美国
    • 加拿大
    • 墨西哥
  • 欧洲
    • 德国
    • 英国
    • 意大利
    • 法国
    • 西班牙
    • 其他欧洲
  • 亚太地区
    • 日本
    • 中国
    • 印度
    • 澳大利亚
    • 新西兰
    • 韩国
    • 其他亚太地区
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 其他南美洲
  • 中东和非洲
    • 沙特阿拉伯
    • 阿拉伯联合酋长国
    • 卡塔尔
    • 南非
    • 其他中东和非洲地区

第10章主要发展

  • 合同、伙伴关係、协作和合资企业
  • 收购与合併
  • 新产品发布
  • 业务扩展
  • 其他关键策略

第11章公司简介

  • Legacy Technologies, Inc.
  • NGK Spark Plug Co., Ltd.
  • Schott AG
  • Ametek, Inc.
  • Mackin Technologies
  • SST International
  • Teledyne Microelectronic Technologies
  • Willow Technologies
  • Kyocera Corporation
  • Sinclair Manufacturing Company
  • Egide S.A.
  • Special Hermetic Products, Inc.
  • Amkor Technology
  • Materion Corporation
  • SGA Technologies
Product Code: SMRC22692

According to Stratistics MRC, the Global Hermetic Packaging Market is accounted for $3.95 billion in 2022 and is expected to reach $5.70 billion by 2028 growing at a CAGR of 6.3% during the forecast period. Hermetic packaging is a high-level packing technique that is primarily used in semiconductor and electronics manufacturing, as well as in active and passive electronic devices. Moreover, hermetic packaging shields the electronic systems from external factors that could harm electrical connections or delicate electronic components, such as changes in atmospheric pressure, moisture, soil, and other dangers. By increasing the service life of electrical components, it contributes significantly to the safe and reliable performance of many healthcare and technological equipment.

According to SIPRI Military spending in the United States is expected to exceed USD 778 billion in 2020, a 4.4% increase over 2019.

Market Dynamics:

Driver:

Increasing use of hermetic packaging for protecting highly sensitive electronic components

Hermetic goods offer protection from a range of environmental factors, including soil/grime, moisture/humidity, variations in atmospheric pressure, and other natural hazards that could harm delicate electronics or interfere with electrical connections. Applications for products that need to be hermetically sealed if their functionality is disrupted since doing so could have disastrous consequences. As a result, hermetic packaging is increasingly being used to protect extremely sensitive electronic components, and this trend is only projected to continue throughout the forecast period. This is one of the main variables influencing the market for hermetic packaging.

Restraint:

Stringent leak rate requirements

Due to their harsh surroundings and important uses, microelectronic components used in military, aerospace, and medical systems must adhere to the strictest criteria for hermetic packaging. The tightening of regulations forces businesses to purchase new leak test equipment since outdated equipment lacks the sensitivity needed to test in accordance with the new criteria. Providers of hermetic packaging must abide by these criteria in order to gain market share at the cost of higher costs. It is anticipated that the market growth will be constrained by these strict regulations for hermetic packaging.

Opportunity:

Increase in use of hermetic packing to safeguard implantable medical devices

Smart gadgets have significantly shrunk in size thanks to contemporary micro-technology, despite their complexity and integration growing. Microelectronics packaging needs to be dependable and small because of this. The packaging for life-critical items, such as implantable medical devices, must offer a superior hermetic environment to shield the device from contact with the body. The development of innovative packaging techniques is anticipated to be facilitated by the miniaturisation of implantable medical devices of the next generation.

Threat:

Emergence of quasi-hermetic packaging

Polymeric materials, as opposed to metals, ceramics, and glasses, are used to create the nearly hermetic packaging. They are also referred to as quasi-hermetic, not quite hermetic, or almost hermetic materials. These packaging techniques have the potential to be trustworthy alternatives to hermetic packaging if they are produced, created, and tested correctly. During the projection period, near-hermetic packaging is anticipated to be utilised instead of hermetic packaging because of its advantages, including lower cost, lighter weight, and smaller size, as well as anticipated growth in production and the development of standardisation.

COVID-19 Impact:

The latest COVID-19 epidemic has impacted the resources and financial situation of hermetic packaging suppliers. A worldwide health crisis brought on by the pandemic is having a negative impact on global financial markets, national economies, and end-use businesses for hermetic packaged goods. This is anticipated to trigger an economic slump and have a detrimental impact on the demand for electrical components that are hermetically sealed. The overall long-term impact of COVID-19 on the hermetic packaging market is anticipated to rely on a number of variables, including the pandemic's global spread and length, the response of different governments around the world, and the disease's severity.

The reed glasses segment is expected to be the largest during the forecast period

The reed glasses segment is estimated to have a lucrative growth. Through millions of switching cycles, Reed Glasses offer incredibly stable encapsulation of reed switches. Where discrete electronic components need to be sealed, isolated, or protected, glass tubes are frequently employed in electronic applications. Yet, the purpose of this glass is typically to hermetically seal or electrically insulate passive components. Hot water boiler switches, belt sensors, and centralised locking systems for automobiles have all utilised reed glass.

The military & defense segment is expected to have the highest CAGR during the forecast period

The military & defense segment is anticipated to witness the fastest CAGR growth during the forecast period, due to the demand for hermetic packaging is anticipated to increase over the course of the forecast period as a result of rising security concerns, expanding defence budgets, and shifting political dynamics. Hermetic packaging is likely to experience growth due to rising public and private expenditure in space exploration.

Region with highest share:

Asia Pacific is projected to hold the largest market share during the forecast period owing to factors like rising energy needs, developing economies, and rising defence spending, this market is expanding in the area. The demand for hermetic packaging for delicate electronic components is increasing as a result of the growing military prowess of emerging nations like China, India, and South Korea.

Region with highest CAGR:

North America is projected to have the highest CAGR over the forecast period, owing to the region's government's increased spending on the aerospace and defence industries. Also, the aviation sector boosts demand for hermetic packaging by relying on new aircraft, which benefits the hermetic packaging sector. In the automotive industry, hermetic is utilised to guarantee sensor performance in rollover devices and airbag apparatus. As a result, the market might require hermetic packaging if airbag equipment becomes more common.

Key players in the market:

Some of the key players profiled in the Hermetic Packaging Market include: Legacy Technologies, Inc., NGK Spark Plug Co., Ltd., Schott AG, Ametek, Inc., Mackin Technologies, SST International, Teledyne Microelectronic Technologies, Willow Technologies, Kyocera Corporation, Sinclair Manufacturing Company, Egide S.A., Special Hermetic Products, Inc., Amkor Technology, Materion Corporation and SGA Technologies.

Key Developments:

In August 2019, KYOCERA Corporation inaugurated its new Minato Mirai Research Center in Yokohama, Kanagawa Prefecture, Japan. The center was created with the aim of promoting open innovation and the development of new business and technologies.

In June 2019, SCHOTT launched new SCHOTT HEATAN feedthroughs to expand its hermetic sensor packaging portfolio. SCHOTT HEATAN feedthroughs can perform reliably in corrosive, high-heat environments beyond 1000°C.

In February 2019, AMETEK Coining-a unit of AMETEK's Electronic Components and Packaging division launched the Copper-Core Connect-a cost-effective, innovative alternative to thick solder preforms that are used in high-performance electronic packaging.

In July 2018, SCHOTT signed an agreement to acquire Primoceler to expand the company's hermetic packaging portfolio with glass micro bonding technology. This bonding technology offers excellent biocompatibility with new glass types. This technology creates new possibilities for wafer level chip scale packaging (WL-CSP) in a wide range of applications such as MEMS devices, medical implants, and other reliability-critical electronic and optical devices.

Products Covered:

  • Transponder Glass
  • Passivation Glass
  • Reed Glass
  • Ceramic-Metal Sealing (CERTM)
  • Glass-Metal Sealing (GTMS)
  • Other Products

Configurations Covered:

  • Pressed Ceramic Packages
  • Multilayer Ceramic Packages
  • Metal Can Packages

Applications Covered:

  • Lasers
  • MEMS Switch
  • Transistors
  • Airbag Ignitors
  • Oscillating Crystals
  • Photo Diodes
  • Sensors
  • Other Applications

End Users Covered:

  • Energy & Nuclear Safety
  • Consumer Electronics
  • Military & Defense
  • Automotive
  • Aeronautics & Space
  • Medical
  • Telecommunication
  • Other End Users

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2020, 2021, 2022, 2025, and 2028
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Product Analysis
  • 3.7 Application Analysis
  • 3.8 End User Analysis
  • 3.9 Emerging Markets
  • 3.10 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global Hermetic Packaging Market, By Product

  • 5.1 Introduction
  • 5.2 Transponder Glass
  • 5.3 Passivation Glass
  • 5.4 Reed Glass
  • 5.5 Ceramic-Metal Sealing (CERTM)
  • 5.6 Glass-Metal Sealing (GTMS)
  • 5.7 Other Products

6 Global Hermetic Packaging Market, By Configuration

  • 6.1 Introduction
  • 6.2 Pressed Ceramic Packages
  • 6.3 Multilayer Ceramic Packages
  • 6.4 Metal Can Packages

7 Global Hermetic Packaging Market, By Application

  • 7.1 Introduction
  • 7.2 Lasers
  • 7.3 MEMS Switch
  • 7.4 Transistors
  • 7.5 Airbag Ignitors
  • 7.6 Oscillating Crystals
  • 7.7 Photo Diodes
  • 7.8 Sensors
  • 7.9 Other Applications

8 Global Hermetic Packaging Market, By End User

  • 8.1 Introduction
  • 8.2 Energy & Nuclear Safety
  • 8.3 Consumer Electronics
  • 8.4 Military & Defense
  • 8.5 Automotive
  • 8.6 Aeronautics & Space
  • 8.7 Medical
  • 8.8 Telecommunication
  • 8.9 Other End Users

9 Global Hermetic Packaging Market, By Geography

  • 9.1 Introduction
  • 9.2 North America
    • 9.2.1 US
    • 9.2.2 Canada
    • 9.2.3 Mexico
  • 9.3 Europe
    • 9.3.1 Germany
    • 9.3.2 UK
    • 9.3.3 Italy
    • 9.3.4 France
    • 9.3.5 Spain
    • 9.3.6 Rest of Europe
  • 9.4 Asia Pacific
    • 9.4.1 Japan
    • 9.4.2 China
    • 9.4.3 India
    • 9.4.4 Australia
    • 9.4.5 New Zealand
    • 9.4.6 South Korea
    • 9.4.7 Rest of Asia Pacific
  • 9.5 South America
    • 9.5.1 Argentina
    • 9.5.2 Brazil
    • 9.5.3 Chile
    • 9.5.4 Rest of South America
  • 9.6 Middle East & Africa
    • 9.6.1 Saudi Arabia
    • 9.6.2 UAE
    • 9.6.3 Qatar
    • 9.6.4 South Africa
    • 9.6.5 Rest of Middle East & Africa

10 Key Developments

  • 10.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 10.2 Acquisitions & Mergers
  • 10.3 New Product Launch
  • 10.4 Expansions
  • 10.5 Other Key Strategies

11 Company Profiling

  • 11.1 Legacy Technologies, Inc.
  • 11.2 NGK Spark Plug Co., Ltd.
  • 11.3 Schott AG
  • 11.4 Ametek, Inc.
  • 11.5 Mackin Technologies
  • 11.6 SST International
  • 11.7 Teledyne Microelectronic Technologies
  • 11.8 Willow Technologies
  • 11.9 Kyocera Corporation
  • 11.10 Sinclair Manufacturing Company
  • 11.11 Egide S.A.
  • 11.12 Special Hermetic Products, Inc.
  • 11.13 Amkor Technology
  • 11.14 Materion Corporation
  • 11.15 SGA Technologies

List of Tables

  • Table 1 Global Hermetic Packaging Market Outlook, By Region (2020-2028) ($MN)
  • Table 2 Global Hermetic Packaging Market Outlook, By Product (2020-2028) ($MN)
  • Table 3 Global Hermetic Packaging Market Outlook, By Transponder Glass (2020-2028) ($MN)
  • Table 4 Global Hermetic Packaging Market Outlook, By Passivation Glass (2020-2028) ($MN)
  • Table 5 Global Hermetic Packaging Market Outlook, By Reed Glass (2020-2028) ($MN)
  • Table 6 Global Hermetic Packaging Market Outlook, By Ceramic-Metal Sealing (CERTM) (2020-2028) ($MN)
  • Table 7 Global Hermetic Packaging Market Outlook, By Glass-Metal Sealing (GTMS) (2020-2028) ($MN)
  • Table 8 Global Hermetic Packaging Market Outlook, By Other Products (2020-2028) ($MN)
  • Table 9 Global Hermetic Packaging Market Outlook, By Configuration (2020-2028) ($MN)
  • Table 10 Global Hermetic Packaging Market Outlook, By Pressed Ceramic Packages (2020-2028) ($MN)
  • Table 11 Global Hermetic Packaging Market Outlook, By Multilayer Ceramic Packages (2020-2028) ($MN)
  • Table 12 Global Hermetic Packaging Market Outlook, By Metal Can Packages (2020-2028) ($MN)
  • Table 13 Global Hermetic Packaging Market Outlook, By Application (2020-2028) ($MN)
  • Table 14 Global Hermetic Packaging Market Outlook, By Lasers (2020-2028) ($MN)
  • Table 15 Global Hermetic Packaging Market Outlook, By MEMS Switch (2020-2028) ($MN)
  • Table 16 Global Hermetic Packaging Market Outlook, By Transistors (2020-2028) ($MN)
  • Table 17 Global Hermetic Packaging Market Outlook, By Airbag Ignitors (2020-2028) ($MN)
  • Table 18 Global Hermetic Packaging Market Outlook, By Oscillating Crystals (2020-2028) ($MN)
  • Table 19 Global Hermetic Packaging Market Outlook, By Photo Diodes (2020-2028) ($MN)
  • Table 20 Global Hermetic Packaging Market Outlook, By Sensors (2020-2028) ($MN)
  • Table 21 Global Hermetic Packaging Market Outlook, By Other Applications (2020-2028) ($MN)
  • Table 22 Global Hermetic Packaging Market Outlook, By End User (2020-2028) ($MN)
  • Table 23 Global Hermetic Packaging Market Outlook, By Energy & Nuclear Safety (2020-2028) ($MN)
  • Table 24 Global Hermetic Packaging Market Outlook, By Consumer Electronics (2020-2028) ($MN)
  • Table 25 Global Hermetic Packaging Market Outlook, By Military & Defense (2020-2028) ($MN)
  • Table 26 Global Hermetic Packaging Market Outlook, By Automotive (2020-2028) ($MN)
  • Table 27 Global Hermetic Packaging Market Outlook, By Aeronautics & Space (2020-2028) ($MN)
  • Table 28 Global Hermetic Packaging Market Outlook, By Medical (2020-2028) ($MN)
  • Table 29 Global Hermetic Packaging Market Outlook, By Telecommunication (2020-2028) ($MN)
  • Table 30 Global Hermetic Packaging Market Outlook, By Other End Users (2020-2028) ($MN)

Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.