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封面
市场调查报告书
商品编码
1457004

密封包装市场－2024年至2029年预测

Hermetic Packaging Market - Forecasts from 2024 to 2029
出版日期: | 出版商: Knowledge Sourcing Intelligence | 英文 144 Pages | 商品交期: 最快1-2个工作天内

价格
简介目录

预计密封包装市场在整个预测期内的复合年增长率为 4.89%，到 2029 年市场规模将达到 58.57 亿美元。这比 2022 年的 41.93 亿美元大幅成长。

气密包装市场是更广泛的包装行业中的一个专业领域，专注于气密包装解决方案的创建和生产。密封包装为敏感电子和光电元件製造气密和完全密封的外壳。这种特殊的封装型态对于保护这些组件免受环境因素（例如湿气、气体和其他可能损害功能和可靠性的污染物）的影响至关重要。

市场驱动因素：

  • 对可靠耐用包装不断增长的需求推动了成长

有几个因素促进了密封包装市场的成长。关键驱动因素之一是电子产业对可靠耐用的包装解决方案的需求不断增长。随着电子设备变得越来越小、越来越复杂，越来越需要保护精密组件免受外部因素的影响。

即使在恶劣的环境下，密封封装也能确保电子和光电设备的长寿命和最佳性能，使其成为航太、汽车、医疗设备、IT 和通讯各种应用的重要解决方案。此外，汽车和航太等需要严格安全和可靠性标准的行业的成长正在推动对密封包装的需求。这些产业要求电子元件能够在高温、压力差和接触刺激性化学品等极端条件下成功运作。密封包装可针对这些恶劣条件提供可靠的屏蔽，有助于市场扩张。

此外，医疗领域对密封包装市场做出了重大贡献。植入式医疗设备、感测器和其他电子元件在医疗应用中的使用越来越多，需要封装解决方案来确保这些关键设备的使用寿命和可靠性。气密包装可以提供安全且受保护的环境，在医疗产业中变得越来越重要。

  • 电子业的成长带动市场

电子产业的成长已成为密封封装市场扩张的关键催化剂。随着电子产业不断发展和创新，对在多样化和充满挑战的环境中运行的小型高性能电子元件的需求不断增长。

气密包装在满足这些需求方面发挥关键作用，它提供了一个保护屏障，保护精密的电子元件免受外部因素的影响，并确保可靠性和长寿命。印度电子业国内生产的成长对电子产品出口的成长做出了重大贡献，并推动了密封包装市场的成长。随着印度成为电子製造的参与企业，对密封包装等可靠包装解决方案的需求对于确保优质电子产品的出口变得至关重要。随着印度电子产品出口的扩大，影响密封包装市场成长的关键因素之一是专注于生产符合国际品质标准的零件。

许多进口电子产品的国家都有严格的品质和可靠性要求。气密包装为敏感电子元件提供了气密的保护外壳，使这些元件在运输和使用过程中保持功能性和完整性。这种可靠性是增强海外买家信心、促进印度电子产品出口的关键因素。

此外，随着印度国内电子产品产能的增加，人们越来越关注复杂和先进电子产品的製造。据印度投资局称，印度国内生产目前正以 13% 的复合年增长率增长，从 2017 财年的 490 亿美元增至 2023 财年的 1,010 亿美元。到2026财年，该国的电子产品出口预计将达到1,200亿美元。

这些先进设备通常包含对环境因敏感的组件，因此密封封装成为保持其性能的重要元素。在製造过程中采用密封包装可以确保最终用户和全球市场的产品耐用性和可靠性，使印度在电子产品出口方面更具竞争力。

  • 北美市场预计将稳定成长。

密封包装提供的高性能特性，例如防止气体和湿气传输以及帮助组件形成系统，使得此类设备对于航太、汽车、军事和电子等关键领域至关重要。在美国，由于这些关键最终用户的加速成长以及保护敏感电气元件的努力，未来几年对密封包装的需求可能会成长。

例如，根据通用航空製造商协会的数据，2023年第二季度美国製造的由活塞、涡轮螺旋桨和涡轮飞机组成的飞机总数为538架，比2022年第三季度增长18.5% ，以及2023年。比今年第一季成长了55.5%。

此外，除了航太领域外，汽车领域还依赖气密包装和密封来确保感测器、安全气囊和防翻滚装置的功能。根据国际汽车工业组织预测，2022年美国汽车产量将达到1,006万辆，较2021年增加10%。

同样，消费性电子产品需求的蓬勃发展以及能源领域的投资正在推动市场呈上升趋势。此外，大气压力和环境条件的变化正在加速提高电子元件生产率并防止其损坏的需求，进一步刺激了气密包装和密封产品的整体市场需求。

主要进展

  • 2023 年 3 月，CPS Technologies Corporation 宣布已收到一家着名航太电子製造商的 500 万美元密封封装订单。这些订单旨在支援美国的各种太空任务和大规模生产战术计划。 CPS 专门提供 H 级和 K 级密封包装，专为承受低地球轨道、中地球轨道、地球静止赤道轨道卫星和其他深空探勘环境中遇到的恶劣条件而设计。
  • 2022 年 1 月，肖特利用其在玻璃和金属密封方面的丰富专业知识，推出专为扩增实境 (AR) 应用设计的气密封装组件。这些创新解决方案满足了 RGB 雷射晶片和 MEMS 镜子等 AR 技术的需求。肖特首次在 SPIE AR/VR/MR 展会上展示 SCHOTT(R) LightView 封装元件。这些尖端封装解决方案的主要目标是小型化和提高扩增实境光引擎系统的光电性能。

目录

第一章 简介

  • 市场概况
  • 市场定义
  • 调查范围
  • 市场区隔
  • 货币
  • 先决条件
  • 基准年和预测年时间表
  • 相关人员的主要利益

第二章调查方法

  • 研究设计
  • 调查过程

第三章执行摘要

  • 主要发现
  • 分析师观点

第四章市场动态

  • 市场驱动因素
  • 市场限制因素
  • 波特五力分析
  • 产业价值链分析
  • 分析师观点

第五章密封包装市场：依构成

  • 介绍
  • 多层陶瓷封装
  • 金属罐包装
  • 压製陶瓷包装

第六章密封包装市场：依类型

  • 介绍
  • 陶瓷金属密封
  • 玻璃材质的封装
  • 钝化玻璃
  • 应答器玻璃
  • 簧片玻璃

第七章密封包装市场：依应用分类

  • 介绍
  • 电晶体
  • 雷射
  • 光电二极体
  • 气囊点火器
  • 其他的

第八章密封包装市场：按最终用户行业

  • 介绍
  • 军事和国防
  • 航太
  • 车
  • 活力
  • 其他的

第九章密封包装市场：按地区

  • 介绍
  • 北美洲
  • 南美洲
  • 欧洲
  • 中东/非洲
  • 亚太地区

第十章竞争环境及分析

  • 主要企业及策略分析
  • 市场占有率分析
  • 合併、收购、协议和合作
  • 竞争对手仪表板

第十一章 公司简介

  • Vertiv Group Corporation
  • SCHOTT AG
  • AMETEK
  • Amkor Technology
  • Texas Instruments
  • Teledyne Microelectronics
  • Kyocera Corporation
  • Materion Corporation
  • Egide
  • Micross Components
  • Legacy Technologies
  • Hermetic Solutions Group
简介目录
Product Code: KSI061612330

The hermetic packaging market is expected to experience a CAGR of 4.89% throughout the forecast period, reaching a market size of US$5.857 billion by 2029. This represents a substantial increase from US$4.193 billion recorded in 2022.

The Hermetic packaging market is a specialized sector within the broader packaging industry, focusing on the creation and production of hermetically sealed packaging solutions. Hermetic packaging involves creating airtight and completely sealed enclosures for sensitive electronic and optoelectronic components. This specialized form of packaging is crucial in protecting these components from environmental factors such as moisture, gases, and other contaminants that could compromise their functionality and reliability.

Market Drivers:

  • Rise in demand for reliable and durable packaging fuels the growth

Several factors are contributing to the Hermetic packaging market growth. One significant driver is the increasing demand for reliable and durable packaging solutions in the electronics industry. As electronic devices become more compact and sophisticated, the need to protect sensitive components from external elements becomes paramount.

Hermetic packaging ensures the longevity and optimal performance of electronic and optoelectronic devices in challenging environments, making it an indispensable solution for various applications, including aerospace, automotive, medical devices, and telecommunications. Furthermore, the growth of industries like automotive and aerospace, where stringent safety and reliability standards are essential, is propelling the demand for Hermetic packaging. These industries often require electronic components to function flawlessly under extreme conditions, such as high temperatures, pressure differentials, and exposure to harsh chemicals. Hermetic packaging provides a reliable shield against these challenging conditions, contributing to the market's expansion.

In addition, the healthcare sector is emerging as a significant contributor to the Hermetic packaging market. The increasing use of implantable medical devices, sensors, and other electronic components in medical applications necessitates packaging solutions that ensure the longevity and reliability of these critical devices. Hermetic packaging, with its ability to provide a secure and protective environment, is becoming increasingly integral in the healthcare industry.

  • Growth in the electronics industry propels the market.

The growth in the electronic industry has emerged as a significant catalyst for the Hermetic packaging market expansion. As the electronic industry continues to evolve and innovate, there is an increasing demand for compact, high-performance electronic components that can operate in diverse and challenging environments.

Hermetic packaging plays a crucial role in meeting these demands by providing a protective barrier that shields sensitive electronic elements from external factors, ensuring their reliability and longevity. The growth of India's domestic production in the electronics sector has significantly contributed to an increase in electronics exports, consequently driving the Hermetic packaging market growth. As India establishes itself as a prominent player in electronics manufacturing, the need for reliable packaging solutions, such as Hermetic packaging, becomes crucial to ensure the export of high-quality electronic products. One of the key factors influencing the Hermetic packaging market growth in tandem with India's electronics export expansion is the emphasis on producing components that meet international quality standards.

Many countries that import electronic goods have stringent quality and reliability requirements. Hermetic packaging, with its ability to provide airtight and protective enclosures for sensitive electronic components, ensures that these components maintain their functionality and integrity during transportation and use. This reliability is a significant factor in boosting the confidence of international buyers and promoting the export of Indian electronic products.

Furthermore, as India's domestic electronics production capabilities grow, there is an increased focus on manufacturing complex and advanced electronic devices. According to Invest India, at present, India's domestic production has increased at a CAGR of 13% from $49 Bn in FY17 to $101 Bn in FY23. The country's electronics exports are expected to reach $120 Bn by FY26.

These sophisticated devices often contain components that are sensitive to environmental factors, making Hermetic packaging an essential element in preserving their performance. The adoption of Hermetic packaging in the manufacturing process enhances the export competitiveness of Indian electronics by assuring end-users and global markets of the durability and reliability of the products.

  • It is projected that the market in North America will grow steadily.

High-performance features provided by hermetic packages such as preventing gas & moisture permeation and helping components form systems have made such instruments an integral part of major sectors such as aerospace, automotive, military, and electronics. With the bolstering growth of such major end-users in the United States coupled with the favourable efforts to protect sensitive electrical components, the demand for hermetic packages is expected to experience a growing trend in the coming years.

For instance, according to the General Aviation Manufacturers Association, in Q2 of 2023, the total number of aircraft consisting of piston, turboprop, and turbine planes manufactured in the United States stood at 538 units which signified an increase of 18.5% over Q3 2022 and 55.5% over Q1 2023.

Moreover, besides aerospace, the automotive sector relies upon hermetic packages & seals to ensure the functionality of sensors, airbags, and rollover devices. According to the International Organization of Motor Vehicle Manufacturers, in 2022, the USA's automotive production witnessed a 10% increase over 2021's production with volume reaching up to 10.06 million units.

Likewise, booming consumer electronic demand coupled with investments in the energy sector has resulted in an upward market trajectory. Additionally, the changes in atmospheric pressure and environmental conditions have accelerated the need for providing better production to electronics components and preventing their damage which has further stimulated the overall market demand for hermetic packages and seal products.

Key Developments:

  • In March 2023, CPS Technologies Corporation revealed that it had received $5.0M worth of purchase orders for hermetic packages from a prominent aerospace electronics manufacturer. These orders are intended to support various U.S. space missions and large-scale production tactical programs. CPS specializes in providing hermetic packages classified as Class-H and Class-K, which are designed to withstand extreme conditions encountered in environments like Low Earth Orbit, Medium Earth Orbit, and Geosynchronous Equatorial Orbit satellites, as well as other deep space initiatives.
  • In January 2022, SCHOTT introduced hermetic packaging components designed specifically for augmented reality (AR) applications, leveraging its extensive expertise in glass-to-metal sealing. These innovative solutions cater to the needs of AR technologies, including RGB laser chips and MEMS mirrors. SCHOTT, for the first time, will be unveiling its SCHOTT(R) LightView packaging components at SPIE AR/VR/MR. The primary goal of these cutting-edge packaging solutions is to downsize and improve the optoelectronic performance of augmented reality light engine systems.

Segmentation:

By Configuration:

  • Multilayer Ceramic Packages
  • Metal Can Packages
  • Pressed Ceramic Packages

By Type:

  • Ceramic Metal Sealing
  • Glass Material Sealing
  • Passivation Glass
  • Transponder Glass
  • Reed Glass

By Application:

  • Transistors
  • Lasers
  • Photo Diodes
  • Airbag Ignitors
  • Others

By End-User Industry:

  • Military and Defence
  • Aerospace
  • Automotive
  • Energy
  • Others

By Geography

  • North America
  • United States
  • Canada
  • Mexico
  • South America
  • Brazil
  • Argentina
  • Others
  • Europe
  • Germany
  • France
  • UK
  • Spain
  • Others
  • Middle East and Africa
  • Saudi Arabia
  • Israel
  • Others
  • Asia Pacific
  • China
  • Japan
  • South Korea
  • India
  • Indonesia
  • Taiwan
  • Others

TABLE OF CONTENTS

1. INTRODUCTION

  • 1.1. Market Overview
  • 1.2. Market Definition
  • 1.3. Scope of the Study
  • 1.4. Market Segmentation
  • 1.5. Currency
  • 1.6. Assumptions
  • 1.7. Base, and Forecast Years Timeline
  • 1.8. Key benefits to the stakeholder

2. RESEARCH METHODOLOGY

  • 2.1. Research Design
  • 2.2. Research Process

3. EXECUTIVE SUMMARY

  • 3.1. Key Findings
  • 3.2. Analyst View

4. MARKET DYNAMICS

  • 4.1. Market Drivers
  • 4.2. Market Restraints
  • 4.3. Porter's Five Forces Analysis
    • 4.3.1. Bargaining Power of Suppliers
    • 4.3.2. Bargaining Power of Buyers
    • 4.3.3. Threat of New Entrants
    • 4.3.4. Threat of Substitutes
    • 4.3.5. Competitive Rivalry in the Industry
  • 4.4. Industry Value Chain Analysis
  • 4.5. Analyst View

5. HERMETIC PACKAGING MARKET, BY CONFIGURATION

  • 5.1. Introduction
  • 5.2. Multilayer Ceramic Packages
    • 5.2.1. Market Opportunities and Trends
    • 5.2.2. Growth Prospects
    • 5.2.3. Geographic Lucrativeness
  • 5.3. Metal Can Packages
    • 5.3.1. Market Opportunities and Trends
    • 5.3.2. Growth Prospects
    • 5.3.3. Geographic Lucrativeness
  • 5.4. Pressed Ceramic Packages
    • 5.4.1. Market Opportunities and Trends
    • 5.4.2. Growth Prospects
    • 5.4.3. Geographic Lucrativeness

6. HERMETIC PACKAGING MARKET, BY TYPE

  • 6.1. Introduction
  • 6.2. Ceramic Metal Sealing
    • 6.2.1. Market Opportunities and Trends
    • 6.2.2. Growth Prospects
    • 6.2.3. Geographic Lucrativeness
  • 6.3. Glass Material Sealing
    • 6.3.1. Market Opportunities and Trends
    • 6.3.2. Growth Prospects
    • 6.3.3. Geographic Lucrativeness
  • 6.4. Passivation Glass
    • 6.4.1. Market Opportunities and Trends
    • 6.4.2. Growth Prospects
    • 6.4.3. Geographic Lucrativeness
  • 6.5. Transponder Glass
    • 6.5.1. Market Opportunities and Trends
    • 6.5.2. Growth Prospects
    • 6.5.3. Geographic Lucrativeness
  • 6.6. Reed Glass
    • 6.6.1. Market Opportunities and Trends
    • 6.6.2. Growth Prospects
    • 6.6.3. Geographic Lucrativeness

7. HERMETIC PACKAGING MARKET, BY APPLICATION

  • 7.1. Introduction
  • 7.2. Transistors
    • 7.2.1. Market Opportunities and Trends
    • 7.2.2. Growth Prospects
    • 7.2.3. Geographic Lucrativeness
  • 7.3. Lasers
    • 7.3.1. Market Opportunities and Trends
    • 7.3.2. Growth Prospects
    • 7.3.3. Geographic Lucrativeness
  • 7.4. Photo Diodes
    • 7.4.1. Market Opportunities and Trends
    • 7.4.2. Growth Prospects
    • 7.4.3. Geographic Lucrativeness
  • 7.5. Airbag Ignitors
    • 7.5.1. Market Opportunities and Trends
    • 7.5.2. Growth Prospects
    • 7.5.3. Geographic Lucrativeness
  • 7.6. Others
    • 7.6.1. Market Opportunities and Trends
    • 7.6.2. Growth Prospects
    • 7.6.3. Geographic Lucrativeness

8. HERMETIC PACKAGING MARKET, BY END-USER INDUSTRY

  • 8.1. Introduction
  • 8.2. Military and Defence
    • 8.2.1. Market Opportunities and Trends
    • 8.2.2. Growth Prospects
    • 8.2.3. Geographic Lucrativeness
  • 8.3. Aerospace
    • 8.3.1. Market Opportunities and Trends
    • 8.3.2. Growth Prospects
    • 8.3.3. Geographic Lucrativeness
  • 8.4. Automotive
    • 8.4.1. Market Opportunities and Trends
    • 8.4.2. Growth Prospects
    • 8.4.3. Geographic Lucrativeness
  • 8.5. Energy
    • 8.5.1. Market Opportunities and Trends
    • 8.5.2. Growth Prospects
    • 8.5.3. Geographic Lucrativeness
  • 8.6. Others
    • 8.6.1. Market Opportunities and Trends
    • 8.6.2. Growth Prospects
    • 8.6.3. Geographic Lucrativeness

9. HERMETIC PACKAGING MARKET, BY GEOGRAPHY

  • 9.1. Introduction
  • 9.2. North America
    • 9.2.1. By Configuration
    • 9.2.2. By Type
    • 9.2.3. By Application
    • 9.2.4. By End User
    • 9.2.5. By Country
      • 9.2.5.1. United States
        • 9.2.5.1.1. Market Opportunities and Trends
        • 9.2.5.1.2. Growth Prospects
      • 9.2.5.2. Canada
        • 9.2.5.2.1. Market Opportunities and Trends
        • 9.2.5.2.2. Growth Prospects
      • 9.2.5.3. Mexico
        • 9.2.5.3.1. Market Opportunities and Trends
        • 9.2.5.3.2. Growth Prospects
  • 9.3. South America
    • 9.3.1. By Configuration
    • 9.3.2. By Type
    • 9.3.3. By Application
    • 9.3.4. By End User
    • 9.3.5. By Country
      • 9.3.5.1. Brazil
        • 9.3.5.1.1. Market Opportunities and Trends
        • 9.3.5.1.2. Growth Prospects
      • 9.3.5.2. Argentina
        • 9.3.5.2.1. Market Opportunities and Trends
        • 9.3.5.2.2. Growth Prospects
      • 9.3.5.3. Others
        • 9.3.5.3.1. Market Opportunities and Trends
        • 9.3.5.3.2. Growth Prospects
  • 9.4. Europe
    • 9.4.1. By Configuration
    • 9.4.2. By Type
    • 9.4.3. By Application
    • 9.4.4. By End User
    • 9.4.5. By Country
      • 9.4.5.1. Germany
        • 9.4.5.1.1. Market Opportunities and Trends
        • 9.4.5.1.2. Growth Prospects
      • 9.4.5.2. France
        • 9.4.5.2.1. Market Opportunities and Trends
        • 9.4.5.2.2. Growth Prospects
      • 9.4.5.3. United Kingdom
        • 9.4.5.3.1. Market Opportunities and Trends
        • 9.4.5.3.2. Growth Prospects
      • 9.4.5.4. Spain
        • 9.4.5.4.1. Market Opportunities and Trends
        • 9.4.5.4.2. Growth Prospects
      • 9.4.5.5. Others
        • 9.4.5.5.1. Market Opportunities and Trends
        • 9.4.5.5.2. Growth Prospects
  • 9.5. Middle East and Africa
    • 9.5.1. By Configuration
    • 9.5.2. By Type
    • 9.5.3. By Application
    • 9.5.4. By End User
    • 9.5.5. By Country
      • 9.5.5.1. Saudi Arabia
        • 9.5.5.1.1. Market Opportunities and Trends
        • 9.5.5.1.2. Growth Prospects
      • 9.5.5.2. Israel
        • 9.5.5.2.1. Market Opportunities and Trends
        • 9.5.5.2.2. Growth Prospects
      • 9.5.5.3. Others
        • 9.5.5.3.1. Market Opportunities and Trends
        • 9.5.5.3.2. Growth Prospects
  • 9.6. Asia Pacific
    • 9.6.1. By Configuration
    • 9.6.2. By Type
    • 9.6.3. By Application
    • 9.6.4. By End User
    • 9.6.5. By Country
      • 9.6.5.1. China
        • 9.6.5.1.1. Market Opportunities and Trends
        • 9.6.5.1.2. Growth Prospects
      • 9.6.5.2. Japan
        • 9.6.5.2.1. Market Opportunities and Trends
        • 9.6.5.2.2. Growth Prospects
      • 9.6.5.3. South Korea
        • 9.6.5.3.1. Market Opportunities and Trends
        • 9.6.5.3.2. Growth Prospects
      • 9.6.5.4. India
        • 9.6.5.4.1. Market Opportunities and Trends
        • 9.6.5.4.2. Growth Prospects
      • 9.6.5.5. Indonesia
        • 9.6.5.5.1. Market Opportunities and Trends
        • 9.6.5.5.2. Growth Prospects
      • 9.6.5.6. Taiwan
        • 9.6.5.6.1. Market Opportunities and Trends
        • 9.6.5.6.2. Growth Prospects
      • 9.6.5.7. Others
        • 9.6.5.7.1. Market Opportunities and Trends
        • 9.6.5.7.2. Growth Prospects

10. COMPETITIVE ENVIRONMENT AND ANALYSIS

  • 10.1. Major Players and Strategy Analysis
  • 10.2. Market Share Analysis
  • 10.3. Mergers, Acquisitions, Agreements, and Collaborations
  • 10.4. Competitive Dashboard

11. COMPANY PROFILES

  • 11.1. Vertiv Group Corporation
  • 11.2. SCHOTT AG
  • 11.3. AMETEK
  • 11.4. Amkor Technology
  • 11.5. Texas Instruments
  • 11.6. Teledyne Microelectronics
  • 11.7. Kyocera Corporation
  • 11.8. Materion Corporation
  • 11.9. Egide
  • 11.10. Micross Components
  • 11.11. Legacy Technologies
  • 11.12. Hermetic Solutions Group