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市场调查报告书
商品编码
1494824
2030 年密封包装市场预测:按产品、成分、应用、最终用户和地区分類的全球分析Hermetic Packaging Market Forecasts to 2030 - Global Analysis By Product, Configuration, Application, End User and By Geography |
根据 Stratistics MRC 的数据,2024 年全球气密包装市场规模为 41.3 亿美元,预计在预测期内将以 8.6% 的复合年增长率增长,到 2030 年达到 67.7 亿美元。
气密封装是一种用于在气密和防潮环境中密封电子元件、电子机械系统 (MEMS) 和其他敏感装置的方法。这种封装技术可防止气体、湿气和污染物的进入,确保封装组件的可靠性和使用寿命。这对于航太、医疗设备和通讯等恶劣环境中的应用至关重要。气密包装对于保护高价值组件免受环境暴露造成的劣化和故障至关重要。
根据电动车销售报告,2022年全球电动车年销量将比与前一年同期比较成长55%,达到1,020万辆,创下新高。根据国务院新闻办预计,2024年,主要项目中,我国行动电话产量将比与前一年同期比较15.7亿部,其中手机产量将比上年增长6.9 %。部。
半导体产业的成长
半导体产业的成长是密封封装市场的关键驱动因素。随着对先进电子和小型化设备的需求增加,对可靠和耐用的半导体元件的需求变得至关重要。气密包装提供气密密封,并保护敏感的半导体元件免受湿气、灰尘和温度波动等环境因素的影响。随着消费性电子、汽车、医疗保健和航太领域应用的激增,半导体产业的扩张直接推动了对密封封装解决方案的需求,以确保电子元件的最佳功能和可靠性。
有限的应用
气密包装市场面临几个阻碍其成长的因素。关键挑战之一是与气密密封材料和工艺相关的高成本,这对于中小型企业来说可能令人望而却步。此外,製造密封零件所需的复杂性和精度可能会限制生产的扩充性。法规遵从性和对专用设备的需求进一步增加了营运成本和复杂性。高品质气密密封所需的技术纯熟劳工和技术专业知识有限,也限制了市场的成长。
航太和国防需求不断成长
航太和国防领域不断增长的需求为气密密封市场创造了巨大的机会。气密密封包装以其气密密封的能力而闻名,对于在恶劣环境(例如航太和国防应用中的环境)中保护敏感电子元件至关重要。技术的进步推动了对更小、更强大的电子设备的需求,增加了对可靠密封封装解决方案的需求。航太和国防相关企业需要坚固的包装来确保关键系统的完整性和性能,这使得密封包装成为其供应链的重要组成部分。随着这些行业的不断扩张和创新,这一趋势预计将推动密封包装市场的成长。
消费者偏好的变化
消费者偏好的变化对密封包装市场构成了重大威胁。由于永续性、便利性和健康意识等因素,消费者需求不断变化,传统密封包装可能面临挑战。消费者对环保包装解决方案的要求越来越高,并且倾向于减少废弃物的简约设计。此外,对保证新鲜度和产品安全的包装的需求仍然很高。为了减轻这一威胁,密封包装领域的公司必须透过创新永续材料、融入智慧包装技术并改进产品美观来适应不断变化的消费者偏好。
最近的 COVID-19 疫情正在影响密封包装供应商的资源和财务状况。疫情引发的全球健康危机正对全球金融市场、国家经济和密封包装商品最终用途业务产生负面影响。预计这将引发经济衰退并对密封电气元件的需求产生负面影响。 COVID-19对密封包装市场的长期影响预计取决于许多变量,包括大流行的全球传播和持续时间、世界各国政府的反应以及疾病的严重程度。
预计铅玻璃产业在预测期内将是最大的
预计簧片玻璃产业将出现良好的成长。磁簧玻璃可在数百万次开关週期内为磁簧开关提供极为稳定的封装。当分立电子元件需要密封、绝缘和保护时,玻璃管经常用于电子应用。然而,这种玻璃的用途通常是用于被动元件的气密密封或电隔离。热水锅炉开关、皮带感应器和汽车中控锁系统均采用含铅玻璃。
军事和国防部门预计在预测期内复合年增长率最高
预计军事和国防部门在预测期内将以最快的复合年增长率成长。这是因为,由于安全问题的加剧、国防预算的扩大和政治动态的变化,预计在预测期内对密封包装的需求将会增加。由于公共和私人太空探勘支出的增加,密封包装预计将增长。
由于政府在航太和国防工业方面的支出增加,预计北美在预测期内将占据最大份额。航空业也依赖新飞机来推动气密包装的需求,使气密包装产业受益。在汽车产业,气密密封用于确保翻车和安全气囊系统中的感测器性能。因此,随着安全气囊装置变得越来越普遍,市场可能需要气密包装。
由于能源需求增加、新兴经济体和国防支出增加等因素,亚太地区预计在预测期内将维持最高的复合年增长率。随着中国、印度和韩国等新兴国家军事能力的增强,对敏感电子元件密封包装的需求不断增加。
According to Stratistics MRC, the Global Hermetic Packaging Market is accounted for $4.13 billion in 2024 and is expected to reach $6.77 billion by 2030 growing at a CAGR of 8.6% during the forecast period. Hermetic packaging is a method used to seal electronic components, microelectromechanical systems (MEMS), and other sensitive devices in an airtight and moisture-resistant environment. This packaging technique prevents the ingress of gases, moisture, and contaminants, ensuring the reliability and longevity of the enclosed components. It is crucial for applications in harsh environments, such as aerospace, medical devices, and telecommunications. Hermetic packaging is essential for protecting high-value components from degradation and failure due to environmental exposure.
According to the EV volumes report, annual sales of EVs reached a new high of 10.2 million units globally in 2022, up 55% from the previous year. According to the State of Council Information Office of The People's Republic of China, in 2024, in China among main items, mobile phone output increased 6.9 percent year on year to 1.57 billion units, with smartphone production up 1.9 percent year on year to 1.14 billion.
Growth in the semiconductor industry
The growth in the semiconductor industry is a significant driver of the hermetic packaging market. As demand for advanced electronics and miniaturized devices increases, the need for reliable and durable semiconductor components becomes critical. Hermetic packaging provides an airtight seal, protecting sensitive semiconductor components from environmental factors such as moisture, dust, and temperature fluctuations, which can compromise their performance and longevity. With the proliferation of applications in consumer electronics, automotive, healthcare, and aerospace sectors, the semiconductor industry's expansion directly boosts the demand for hermetic packaging solutions to ensure optimal functionality and reliability of electronic components.
Limited applications
The hermetic packaging market faces several restraints that could hinder its growth. One significant challenge is the high cost associated with hermetic packaging materials and processes, which can be prohibitive for smaller companies. Additionally, the complexity and precision required in manufacturing hermetically sealed components can limit production scalability. Regulatory compliance and the need for specialized equipment further add to operational costs and complexity. Market growth is also tempered by the limited availability of skilled labor and technical expertise necessary for high-quality hermetic sealing.
Increasing demand in aerospace and defense
The increasing demand in the aerospace and defense sectors presents a significant opportunity for the hermetic packaging market. Hermetic packaging, known for its ability to provide airtight seals, is crucial for protecting sensitive electronic components in harsh environments like those found in aerospace and defense applications. With advancements in technology driving the need for smaller and more powerful electronics, the demand for reliable hermetic packaging solutions is on the rise. Aerospace and defense companies require robust packaging to ensure the integrity and performance of critical systems, making hermetic packaging a vital component in their supply chain. This trend is expected to drive growth in the hermetic packaging market as these industries continue to expand and innovate.
Shifts in consumer preferences
Shifts in consumer preferences pose a significant threat to the hermetic packaging market. As consumer demands evolve, driven by factors such as sustainability, convenience, and health consciousness, traditional hermetic packaging may face challenges. Consumers increasingly seek eco-friendly packaging solutions and are inclined towards minimalist designs that reduce waste. Moreover, the demand for packaging that ensures freshness and product safety remains high. To mitigate this threat, companies in the hermetic packaging sector must adapt by innovating sustainable materials, incorporating smart packaging technologies, and enhancing product aesthetics to align with changing consumer preferences.
The latest COVID-19 epidemic has impacted the resources and financial situation of hermetic packaging suppliers. A worldwide health crisis brought on by the pandemic is having a negative impact on global financial markets, national economies, and end-use businesses for hermetic packaged goods. This is anticipated to trigger an economic slump and have a detrimental impact on the demand for electrical components that are hermetically sealed. The overall long-term impact of COVID-19 on the hermetic packaging market is anticipated to rely on a number of variables, including the pandemic's global spread and length, the response of different governments around the world, and the disease's severity.
The reed glass segment is expected to be the largest during the forecast period
The reed glasses segment is estimated to have a lucrative growth. Through millions of switching cycles, Reed Glasses offer incredibly stable encapsulation of reed switches. Where discrete electronic components need to be sealed, isolated, or protected, glass tubes are frequently employed in electronic applications. Yet, the purpose of this glass is typically to hermetically seal or electrically insulate passive components. Hot water boiler switches, belt sensors, and centralised locking systems for automobiles have all utilised reed glass.
The military & defense segment is expected to have the highest CAGR during the forecast period
The military & defense segment is anticipated to witness the fastest CAGR growth during the forecast period, due to the demand for hermetic packaging is anticipated to increase over the course of the forecast period as a result of rising security concerns, expanding defence budgets, and shifting political dynamics. Hermetic packaging is likely to experience growth due to rising public and private expenditure in space exploration.
North America is projected to have the highest largest share over the forecast period, owing to the region's government's increased spending on the aerospace and defence industries. Also, the aviation sector boosts demand for hermetic packaging by relying on new aircraft, which benefits the hermetic packaging sector. In the automotive industry, hermetic is utilised to guarantee sensor performance in rollover devices and airbag apparatus. As a result, the market might require hermetic packaging if airbag equipment becomes more common.
Asia Pacific is projected to hold the highest market CAGR during the forecast period owing to factors like rising energy needs, developing economies, and rising defence spending, this market is expanding in the area. The demand for hermetic packaging for delicate electronic components is increasing as a result of the growing military prowess of emerging nations like China, India, and South Korea.
Key players in the market
Some of the key players in Hermetic Packaging market include Ametek, Inc., Amkor Technology, Egide S.A., Kyocera Corporation, Mackin Technologies, Materion Corporation, NGK Spark Plug Co., Ltd., Schott AG, SGA Technologies, Sinclair Manufacturing Company, Special Hermetic Products, Inc., SST International, Teledyne Microelectronic Technologies and Willow Technologies
In May 2024, AMETEK Level Measurement Solutions (LMS) has launched BrightTEK, a state-of-the-art wireless Industrial Internet of Things (IIoT) solution designed to redefine operational efficiency and cost-effectiveness in various industries. Initially available for the North American market, BrightTEK leverages wireless technology to facilitate seamless data transmission from AMETEK LMS branded transmitters - including Magnetrol, Orion Instruments, Drexelbrook, SWI and B/W Controls, offering visibility to key variables to help optimise on-site operations.
In January 2024, Lumus Ltd., a developer of reflective waveguide technology for augmented reality (AR) eyewear, is expanding its five-year long partnership with international technology group Schott AG. To support this partnership, Schott is adding a new production facility to its site in Penang, Malaysia.
Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.