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到 2028 年的耐辐射电子市场预测 - 按组件、技术、材料类型、产品类型、应用和地区进行的全球分析
市场调查报告书
商品编码
1273567

到 2028 年的耐辐射电子市场预测 - 按组件、技术、材料类型、产品类型、应用和地区进行的全球分析

Radiation Hardened Electronics Market Forecasts to 2028 - Global Analysis By Component, Technique, Material Type, Product Type, Application and By Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 175+ Pages | 商品交期: 2-3个工作天内

价格

根据 Stratistics MRC 的数据，全球耐辐射电子市场预计在 2022 年将达到 15 亿美元，并在 2028 年达到 21 亿美元，复合年增长率预计为 6.0% .

主要用于高空作业的各种电子元件、封装和商品称为抗辐射电子产品。 以硅、碳化硅、氮化镓、氢化非晶硅等为原料。 开关稳压器、微处理器和电源单元常用于卫星、飞机和核电站。 因此，它被频繁地应用于军事、航空航天和国防等各个行业。

根据忧思科学家联盟 (UCS) 的数据，截至 2020 年 4 月，大约有 2,666 颗人造卫星绕地球运行。 Euroconsult 估计每年发射约 990 颗卫星，预计到 2028 年将有 15,000 颗卫星进入轨道。

市场动态：

驱动程序

驱动力：增加太空任务

随着世界上越来越多的太空任务，对先进的抗辐射组件、创新的构造和设计方法以及软件模型的需求不断增长，以使电子组件更耐辐射。 然而，农业监测等各种应用对低成本卫星通信的需求不断增长，正在推动市场向前发展。

约束

设置合适的测试环境有问题

有一个方面是开发能够准确再现外太空、核战争和国防环境的测试环境是一个制约因素。 建立抗辐射电子测试实验室非常昂贵，并且需要高技能人员。 此外，根据应用需要，可以使用不同的方法来测试辐射效应和屏蔽。 因此，这些因素制约了市场的增长。

机会

对信息收集和监控的需求增加

情报、监视和侦察活动的扩展预计会影响市场增长。 用于军事和空间应用的现场可编程门阵列和多核处理器技术的快速发展，以及电子设备对第三代半导体材料的需求增加，因为它们的带隙比硅更宽，预计将推动市场增长。。

威胁

高端消费者的定制化需求

航天机构希望使用具有高度集成性、效率和紧凑性的专业辐射硬化器。 企业正在接受许多创新，这不仅需要在研发方面进行大量投资，而且需要时间和金钱方面的投资。 可用于认证抗辐射芯片组的实验室时间不足预计也会影响定制产品线的供应。

COVID-19 的影响：

由于 COVID-19 造成的封锁限制以及欧洲政府对製造流程和供应链的限制对整个行业的增长产生了负面影响。 然而，大约一年前，在冠状病毒大流行开始后，经济復苏的迹像开始出现。 症状迅速蔓延到多个行业和地区，促使经济復苏强于预期，全球芯片短缺前所未有。 由于自然灾害和当地 Covid 事件的增加，製造能力已成为一个限制性问题，并一直持续到今天。

电源管理领域预计在预测期内规模最大

由于对抗辐射电源转换的需求不断增加，预计电源管理领域将实现有利增长。 任何电子系统都必须包含电源设备，因为它们是其运行不可或缺的一部分。 随着技术的进步，功率器件正在向功能更多、损耗更少的方向发展。 氮化镓是製造商用来提高高辐射环境下功率器件性能的前沿材料之一。

在预测期内，辐射固化部分的设计预计将呈现最高的复合年增长率

由于低成本、易于改造以及大规模生产辐射固化产品的能力，预计辐射固化设计领域在预测期内将以最快的复合年增长率增长。 这种製造方法利用了各种想法，例如布局解决方案和零件设置。 通过这种製造方法，可以重新布置电路以防止电池在任务期间发生故障，从而有助于提高恶劣条件下的可靠性。

份额最大的地区

由于技术进步和大量终端用户的存在，预计在预测期内北美将占据最大的市场份额。 该地区拥有发达的研发和工业基础设施，因此我们可以期待目标市场的稳步扩张。 在预测期内，以网络为中心的战争技术的迅速采用有望推动市场的增长前景。

复合年增长率最高的地区：

由于对更高效和更具成本效益的辐射固化组件的需求不断增长，预计北美在预测期内的复合年增长率最高。 随着可辐射固化材料的使用频率增加和最新技术的快速进步，预计对可辐射固化电子设备的需求将会增加。 此外，使用纳米卫星的活跃学术研究和太空探索项目的扩展预计将支持市场需求。

主要发展：

2022 年 3 月，STMicroelectronics（瑞士）推出了一系列采用低成本塑料封装的耐辐射功率、模拟和逻辑 IC。 新系列预计将包括稳压器、数据转换器、逻辑门、LVDS 收发器和其他用于各种空间应用（例如遥测启动跟踪器和机载计算机）的抗辐射组件。

2021 年 9 月，Microchip Technology Inc.（美国）宣布有意加入国防高级研究计划局 (DARPA) 的工具箱计划，该计划有望为该组织的研究人员提供开放许可机会。 参与 Microchip 的国防和航空航天发展计划有助于加速创新。

本报告内容

  • 区域和国家/地区细分市场份额评估
  • 向新进入者提出战略建议
  • 2020、2021、2022、2025 和 2028 年的综合市场数据
  • 市场驱动因素（市场趋势、制约因素、机遇、威胁、挑战、投资机会、建议）。
  • 根据市场预测在关键业务领域提出战略建议
  • 竞争格局映射关键共同趋势。
  • 公司简介，包括详细的战略、财务状况和近期发展
  • 映射最新技术进步的供应链趋势

免费定制优惠：

购买此报告的客户将获得以下免费定制选项之一：

  • 公司简介
    • 其他市场参与者的综合概况（最多 3 家公司）
    • 主要参与者的 SWOT 分析（最多 3 家公司）
  • 区域细分
    • 根据客户的要求对主要国家/地区的市场估计/预测/复合年增长率（注意：基于可行性检查）。
  • 竞争基准
    • 根据产品组合、区域影响力和战略联盟对主要参与者进行基准测试

内容

第 1 章执行摘要

第二章前言

  • 概览
  • 利益相关者
  • 调查范围
  • 调查方法
    • 数据挖掘
    • 数据分析
    • 数据验证
    • 研究方法
  • 调查来源
    • 主要研究来源
    • 二级研究来源
    • 假设

第三章市场趋势分析

  • 司机
  • 约束因素
  • 机会
  • 威胁
  • 产品分析
  • 应用分析
  • 新兴市场
  • COVID-19 的影响

第 4 章波特五力分析

  • 供应商的议价能力
  • 买家的议价能力
  • 替代品的威胁
  • 新进入者的威胁
  • 竞争公司之间的敌对关係

第 5 章全球耐辐射电子市场：按组件分类

  • 逻辑
  • 现场可编程门阵列
  • 内存
  • 电源管理
  • 专用集成电路
  • 传感器
  • 模拟和数字混合信号服务
  • 其他组件

第 6 章全球抗辐射电子市场：按技术分类

  • 按工艺进行辐射固化
  • 辐射固化设计
  • 通过软件增强辐射
  • 其他技巧

第 7 章。全球耐辐射电子市场：按材料类型分类

  • 氮化镓
  • 硅
  • 碳化硅
  • 其他材料类型

第 8 章全球耐辐射电子市场：按产品类型分类

  • 商业现货
  • 定制
  • 其他产品类型

第 9 章。全球耐辐射电子市场：按应用

  • 航空航天与国防
  • 军队
  • 核电站
  • 太空卫星
  • 商业卫星
  • 其他用途

第 10 章全球耐辐射电子市场：按地区

  • 北美
    • 美国
    • 加拿大
    • 墨西哥
  • 欧洲
    • 德国
    • 英国
    • 意大利
    • 法国
    • 西班牙
    • 其他欧洲
  • 亚太地区
    • 日本
    • 中国
    • 印度
    • 澳大利亚
    • 新西兰
    • 韩国
    • 其他亚太地区
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 其他南美洲
  • 中东和非洲
    • 沙特阿拉伯
    • 阿拉伯联合酋长国
    • 卡塔尔
    • 南非
    • 其他中东和非洲地区

第11章主要发展

  • 合同、伙伴关係、协作和合资企业
  • 收购与合併
  • 新产品发布
  • 业务扩展
  • 其他关键策略

第12章公司简介

  • Renesas Electronics Corporation
  • IBM Corporation
  • Microchip Technology Inc.
  • Cobham Limited
  • Analog Devices Inc.
  • BAE Systems
  • Infineon Technologies AG
  • GSI Technology Inc
  • Ai Tech
  • STMicroelectronics
  • Honeywell International
  • Texas Instruments Incorporated
  • Mercury Systems Inc.
  • Teledyne Technologies Inc.
  • Data Devices Corporation
  • TTM Technologies Inc.
Product Code: SMRC22864

According to Stratistics MRC, the Global Radiation Hardened Electronics Market is accounted for $1.5 billion in 2022 and is expected to reach $2.1 billion by 2028 growing at a CAGR of 6.0% during the forecast period. Various electronic parts, packages, and goods that are primarily used for high-altitude applications are referred to as radiation-hardened electronics. Silicon, silicon carbide, gallium nitride, and hydrogenated amorphous silicon are employed as raw materials in the fabrication of such components. Satellites, aeroplanes, and nuclear power plants all make substantial use of switching regulators, microprocessors, and power supply devices. As a result, they are frequently used in a variety of industries, such as the military, aerospace, and defence.

According to The Union of Concerned Scientists (UCS), there are about 2,666 operational satellites revolving around the earth as of April 2020. According to the estimation of Euroconsult, there will be about 990 satellites to be launched every year, which can lead to 15,000 satellites in orbit by 2028.

Market Dynamics:

Driver:

Rising number of space missions

The demand for sophisticated radiation-hardened components, innovative configuration and design methodologies, and software models to increase the radiation tolerance of electronic components is growing as a result of the increasing number of space missions globally. However, rising demand for low-cost satellite communication for a variety of applications such as agriculture surveillance is propelling the market forward.

Restraint:

Challenges in developing a proper testing environment

The limiting aspect is the development of a testing environment that can accurately replicate space, a nuclear war, or the environment of defence. Building a radiation-hardened electronics test lab is quite expensive and requires highly skilled personnel. Depending on the needs of the application, a variety of methods can be used to test radiation effect and shielding. Hence, these factors are restraining the growth of the market.

Opportunity:

Increasing demand for intelligence and surveillance

The expansion of intelligence, surveillance, and reconnaissance operations will likely have an effect on the market's expansion. Rapid advances in field-programmable gate array and multicore processor technologies for military and space applications, as well as increased demand for third generation semiconductor materials in electronic devices due to a wider band gap than silicon, are expected to drive market growth.

Threat:

Customized requirements from high-end consumers

Space agencies want to use specialised radiation-hardened goods that have high levels of integration, efficiency, and compactness. The businesses are embracing a number of innovations, which involves a major investment in terms of time and money as well as R&D. The supply of customised product lines is also anticipated to be impacted by a lack of lab time available for the certification of radiation-hardened chipset.

COVID-19 Impact:

The COVID-19 lockdown constraints and restrictions on manufacturing processes and supply chains by the governments of European countries had a negative effect on the overall industry growth. But after the start of the coronavirus pandemic, signs of economic recovery started to appear about a year ago. These indications quickly spread to several industries and areas, prompting a stronger-than-anticipated economic rebound and previously unheard-of global chip shortage. When natural disasters and the rise in local Covid cases wreaked havoc, manufacturing capacity became and remains a limiting concern.

The power management segment is expected to be the largest during the forecast period

The power management segment is estimated to have a lucrative growth, due increased demand for radiation hardened power conversion. Any electronics system must include power devices because they are essential to its operation. Power devices are evolving as a result of technological improvements, with fewer losses and more functionality. Gallium nitride is one of the cutting-edge materials that producers are incorporating to enhance the performance of power devices in high radiation settings.

The radiation hardening by design segment is expected to have the highest CAGR during the forecast period

The radiation hardening by design segment is anticipated to witness the fastest CAGR growth during the forecast period, due to its low cost, ease of modification, and its ability to allow the production of radiation-hardened products in a large volume. This makes use of a number of ideas, including layout solutions and component setup. This manufacturing method enables circuit reconfiguration to prevent cells from failing during the mission and contributes to increased reliability in harsh situations.

Region with Largest share:

North America is projected to hold the largest market share during the forecast period owing to technological advancements and the presence of a large number of end-users. The region's steady expansion in the target market has also been facilitated by the region's strong R&D and industrial infrastructure. During the forecast period, the market's growth prospects are anticipated to be boosted by the rapid adoption of network-centric warfare techniques.

Region with highest CAGR:

North America is projected to have the highest CAGR over the forecast period, owing to increasing demand for more efficient and cost-effective radiation hardened by design components. The need for radiation-hardening electronics is anticipated to rise as radiation-hardening materials are used more frequently and as the newest technologies improve quickly. It is anticipated that rising academic research using nano satellites and expanding space exploration programmes will support market demand.

Key players in the market:

Some of the key players profiled in the Radiation Hardened Electronics Market include: Renesas Electronics Corporation, IBM Corporation, Microchip Technology Inc., Cobham Limited, Analog Devices Inc., BAE Systems, Infineon Technologies AG, GSI Technology Inc, Ai Tech, STMicroelectronics, Honeywell International, Texas Instruments Incorporated, Mercury Systems Inc., Teledyne Technologies Inc., Data Devices Corporation and TTM Technologies Inc.

Key Developments:

In March 2022, STMicroelectronics (Switzerland) announced the release of a new series of radiation-resistant power, analogue, and logic ICs housed in a low-cost plastic package. The new series is anticipated to include radiation-resistant components such as voltage regulators, data converters, logic gates, and LVDS transceivers, which are utilised in a variety of space applications, including telemetry start trackers and onboard computers.

In September 2021, Microchip Technology Inc. (US) announced that it would join the Defense Advanced Research Projects Agency (DARPA) Toolbox initiative, which is anticipated to provide open licencing opportunities for organisation researchers. Microchip's participation in defence and aerospace development programmes helps to accelerate innovation.

Components Covered:

  • Logic
  • Field-Programmable Gate Array
  • Memory
  • Power Management
  • Application Specific Integrated Circuit
  • Sensors
  • Analog & Digital Mixed Signal Services
  • Other Components

Techniques Covered:

  • Radiation Hardening by Process
  • Radiation Hardening by Design
  • Radiation Hardening by Software
  • Other Techniques

Material Types Covered:

  • Gallium Nitride
  • Silicon
  • Silicon Carbide
  • Other Material Types

Product Types Covered:

  • Commercial-Off-the-Shelf
  • Custom Made
  • Other Product Types

Applications Covered:

  • Aerospace and Defense
  • Military
  • Nuclear Power Plants
  • Space Satellites
  • Commercial Satellites
  • Other Applications

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2020, 2021, 2022, 2025, and 2028
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Product Analysis
  • 3.7 Application Analysis
  • 3.8 Emerging Markets
  • 3.9 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global Radiation Hardened Electronics Market, By Component

  • 5.1 Introduction
  • 5.2 Logic
  • 5.3 Field-Programmable Gate Array
  • 5.4 Memory
  • 5.5 Power Management
  • 5.6 Application Specific Integrated Circuit
  • 5.7 Sensors
  • 5.8 Analog & Digital Mixed Signal Services
  • 5.9 Other Components

6 Global Radiation Hardened Electronics Market, By Technique

  • 6.1 Introduction
  • 6.2 Radiation Hardening by Process
  • 6.3 Radiation Hardening by Design
  • 6.4 Radiation Hardening by Software
  • 6.5 Other Techniques

7 Global Radiation Hardened Electronics Market, By Material Type

  • 7.1 Introduction
  • 7.2 Gallium Nitride
  • 7.3 Silicon
  • 7.4 Silicon Carbide
  • 7.5 Other Material Types

8 Global Radiation Hardened Electronics Market, By Product Type

  • 8.1 Introduction
  • 8.2 Commercial-Off-the-Shelf
  • 8.3 Custom Made
  • 8.4 Other Product Types

9 Global Radiation Hardened Electronics Market, By Application

  • 9.1 Introduction
  • 9.2 Aerospace and Defense
  • 9.3 Military
  • 9.4 Nuclear Power Plants
  • 9.5 Space Satellites
  • 9.6 Commercial Satellites
  • 9.7 Other Applications

10 Global Radiation Hardened Electronics Market, By Geography

  • 10.1 Introduction
  • 10.2 North America
    • 10.2.1 US
    • 10.2.2 Canada
    • 10.2.3 Mexico
  • 10.3 Europe
    • 10.3.1 Germany
    • 10.3.2 UK
    • 10.3.3 Italy
    • 10.3.4 France
    • 10.3.5 Spain
    • 10.3.6 Rest of Europe
  • 10.4 Asia Pacific
    • 10.4.1 Japan
    • 10.4.2 China
    • 10.4.3 India
    • 10.4.4 Australia
    • 10.4.5 New Zealand
    • 10.4.6 South Korea
    • 10.4.7 Rest of Asia Pacific
  • 10.5 South America
    • 10.5.1 Argentina
    • 10.5.2 Brazil
    • 10.5.3 Chile
    • 10.5.4 Rest of South America
  • 10.6 Middle East & Africa
    • 10.6.1 Saudi Arabia
    • 10.6.2 UAE
    • 10.6.3 Qatar
    • 10.6.4 South Africa
    • 10.6.5 Rest of Middle East & Africa

11 Key Developments

  • 11.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 11.2 Acquisitions & Mergers
  • 11.3 New Product Launch
  • 11.4 Expansions
  • 11.5 Other Key Strategies

12 Company Profiling

  • 12.1 Renesas Electronics Corporation
  • 12.2 IBM Corporation
  • 12.3 Microchip Technology Inc.
  • 12.4 Cobham Limited
  • 12.5 Analog Devices Inc.
  • 12.6 BAE Systems
  • 12.7 Infineon Technologies AG
  • 12.8 GSI Technology Inc
  • 12.9 Ai Tech
  • 12.10 STMicroelectronics
  • 12.11 Honeywell International
  • 12.12 Texas Instruments Incorporated
  • 12.13 Mercury Systems Inc.
  • 12.14 Teledyne Technologies Inc.
  • 12.15 Data Devices Corporation
  • 12.16 TTM Technologies Inc.

List of Tables

  • Table 1 Global Radiation Hardened Electronics Market Outlook, By Region (2020-2028) ($MN)
  • Table 2 Global Radiation Hardened Electronics Market Outlook, By Component (2020-2028) ($MN)
  • Table 3 Global Radiation Hardened Electronics Market Outlook, By Logic (2020-2028) ($MN)
  • Table 4 Global Radiation Hardened Electronics Market Outlook, By Field-Programmable Gate Array (2020-2028) ($MN)
  • Table 5 Global Radiation Hardened Electronics Market Outlook, By Memory (2020-2028) ($MN)
  • Table 6 Global Radiation Hardened Electronics Market Outlook, By Power Management (2020-2028) ($MN)
  • Table 7 Global Radiation Hardened Electronics Market Outlook, By Application Specific Integrated Circuit (2020-2028) ($MN)
  • Table 8 Global Radiation Hardened Electronics Market Outlook, By Sensors (2020-2028) ($MN)
  • Table 9 Global Radiation Hardened Electronics Market Outlook, By Analog & Digital Mixed Signal Services (2020-2028) ($MN)
  • Table 10 Global Radiation Hardened Electronics Market Outlook, By Other Components (2020-2028) ($MN)
  • Table 11 Global Radiation Hardened Electronics Market Outlook, By Technique (2020-2028) ($MN)
  • Table 12 Global Radiation Hardened Electronics Market Outlook, By Radiation Hardening by Process (2020-2028) ($MN)
  • Table 13 Global Radiation Hardened Electronics Market Outlook, By Radiation Hardening by Design (2020-2028) ($MN)
  • Table 14 Global Radiation Hardened Electronics Market Outlook, By Radiation Hardening by Software (2020-2028) ($MN)
  • Table 15 Global Radiation Hardened Electronics Market Outlook, By Other Techniques (2020-2028) ($MN)
  • Table 16 Global Radiation Hardened Electronics Market Outlook, By Material Type (2020-2028) ($MN)
  • Table 17 Global Radiation Hardened Electronics Market Outlook, By Gallium Nitride (2020-2028) ($MN)
  • Table 18 Global Radiation Hardened Electronics Market Outlook, By Silicon (2020-2028) ($MN)
  • Table 19 Global Radiation Hardened Electronics Market Outlook, By Silicon Carbide (2020-2028) ($MN)
  • Table 20 Global Radiation Hardened Electronics Market Outlook, By Other Material Types (2020-2028) ($MN)
  • Table 21 Global Radiation Hardened Electronics Market Outlook, By Product Type (2020-2028) ($MN)
  • Table 22 Global Radiation Hardened Electronics Market Outlook, By Commercial-Off-the-Shelf (2020-2028) ($MN)
  • Table 23 Global Radiation Hardened Electronics Market Outlook, By Custom Made (2020-2028) ($MN)
  • Table 24 Global Radiation Hardened Electronics Market Outlook, By Other Product Types (2020-2028) ($MN)
  • Table 25 Global Radiation Hardened Electronics Market Outlook, By Application (2020-2028) ($MN)
  • Table 26 Global Radiation Hardened Electronics Market Outlook, By Aerospace and Defense (2020-2028) ($MN)
  • Table 27 Global Radiation Hardened Electronics Market Outlook, By Military (2020-2028) ($MN)
  • Table 28 Global Radiation Hardened Electronics Market Outlook, By Nuclear Power Plants (2020-2028) ($MN)
  • Table 29 Global Radiation Hardened Electronics Market Outlook, By Space Satellites (2020-2028) ($MN)
  • Table 30 Global Radiation Hardened Electronics Market Outlook, By Commercial Satellites (2020-2028) ($MN)
  • Table 31 Global Radiation Hardened Electronics Market Outlook, By Other Applications (2020-2028) ($MN)

Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.