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全球抗辐射电子市场报告

Global Radiation Hardened Electronics Market Report

出版日期: 2023年10月01日 | 出版商:

Value Market Research | 英文 190 Pages | 商品交期: 最快1-2个工作天内

价格

简介目录图表

预计到 2030 年，全球抗辐射电子市场的市场规模将从 2022 年的 250 万美元达到近 369 万美元，2023 年至 2030 年研究期间的复合年增长率为 5%。

抗辐射电子产品是指电子元件。它由电路、电阻器、电晶体、电容器、二极体、单板电脑 CPU、封装和产品组成，主要用于工业中，以保护设备免受极高的辐射。抗辐射电子产品在保护电子设备免受外太空有害辐射造成的物理损坏和故障方面发挥着至关重要的作用。它们设计用于承受辐射和 -55°C 至 125°C 的极端温度。

市场动态：

对通讯卫星不断增长的需求和不断增加的监控推动了抗辐射电子产品市场的发展。商业太空计画数量的增加和电子辐射暴露系统的日益采用是促进市场成长的其他主要因素。此外，太空探索计画和长途通讯的不断增加也推动了卫星中使用的抗辐射电子产品的需求增加。推动市场成长的其他主要因素是各种技术进步，例如开发高可靠性积体电路和改进现场可程式闸阵列（FPGA）技术，这将推动市场成长。然而，抗辐射电子产品的高维护成本可能会在评估期间阻碍其市场成长。

研究报告涵盖波特五力模型、市场吸引力分析和价值链分析。这些工具有助于清晰地了解行业结构并评估全球范围内的竞争吸引力。此外，这些工具也对全球抗辐射电子产品市场的各个细分市场进行了包容性评估。抗辐射电子产业的成长和趋势为这项研究提供了整体方法。

区域分析：

本节涵盖区域前景，重点介绍北美、欧洲、亚太地区、拉丁美洲以及中东和非洲的抗辐射电子市场当前和未来的需求。此外，该报告重点关注所有主要地区各个应用领域的需求、估计和预测。

该研究报告还涵盖了市场主要参与者的全面概况以及对全球竞争格局的深入了解。抗辐射电子市场的主要参与者包括Microchip Technology Inc.（美国）、BAE Systems（英国）、瑞萨电子公司（日本）、英飞凌科技股份公司（德国）、义法半导体（瑞士）、赛灵思公司（美国）、德州仪器公司（美国）、霍尼韦尔国际公司（美国）、Teledyne Technologies Inc.（美国）和 TTM Technologies, Inc.（美国）。本节包含竞争格局的整体视图，包括各种策略发展，例如关键併购、未来产能、合作伙伴关係、财务概况、合作、新产品开发、新产品发布和其他发展。

如果您有任何客製化要求，请写信给我们。我们的研究团队可以根据您的需求提供客製化报告。

简介 - 市场动态
市场驱动因素
市场限制
机会
产业动态
波特五力分析
市场吸引力分析
- 按组件分類的市场吸引力分析
- 按製造技术进行的市场吸引力分析
- 市场吸引力分析：按产品类型
- 市场吸引力分析：依应用分类
- 市场吸引力分析：按地区

第 4 章：价值链分析

价值链分析
原料分析
- 原料清单
- 原料厂商清单
- 主要原物料价格走势
潜在买家名单
行销管道
- 直效行销
- 间接行销
- 行销通路发展趋势

第 5 章：COVID-19 爆发的影响分析

第 6 章：全球抗辐射电子市场分析：依组件分类

按组件概述
历史和预测数据
按成分分析
混合讯号 IC
处理器和控制器
记忆
能源管理

第 7 章：全球抗辐射电子市场分析：依製造技术分类

按製造技术概述
历史和预测数据
依製造技术分析
抗辐射设计 (RHBD)
辐射硬化製程 (RHBP)

第 8 章：全球抗辐射电子市场分析：依产品类型

概述：按产品类型
历史和预测数据
分析：依产品类型
商业现货 (COTS)
客製化

第 9 章：全球抗辐射电子市场分析：依应用分类

概述：按应用
历史和预测数据
分析：按应用
空间
航太与国防
核电厂
医疗的
其他的

第 10 章：全球抗辐射电子市场分析：依地理位置

区域展望
介绍
北美销售分析
- 概述、历史和预测销售分析
- 北美按细分市场销售分析
- 北美按国家销售分析
- 美国销售分析
- 加拿大销售分析
- 墨西哥销售分析
欧洲销售分析
- 概述、历史和预测销售分析
- 欧洲按细分市场销售分析
- 欧洲按国家销售分析
- 英国销售分析
- 法国销售分析
- 德国销售分析
- 义大利销售分析
- 俄罗斯销售分析
- 欧洲其他地区销售分析
亚太地区销售分析
- 概述、历史和预测销售分析
- 亚太地区按细分市场销售分析
- 亚太地区国家/地区销售分析
- 中国销售分析
- 印度销售分析
- 日本销售分析
- 韩国销售分析
- 澳洲销售分析
- 亚太地区其他地区销售分析
拉丁美洲销售分析
- 概述、历史和预测销售分析
- 拉丁美洲按细分市场销售分析
- 拉丁美洲按国家销售分析
- 巴西销售分析
- 阿根廷销售分析
- 秘鲁销售分析
- 智利销售分析
- 拉丁美洲其他地区销售分析
中东和非洲销售分析
- 概述、历史和预测销售分析
- 中东和非洲按细分市场销售分析
- 中东和非洲国家销售分析
- 沙乌地阿拉伯销售分析
- 阿联酋销售分析
- 以色列销售分析
- 南非销售分析
- 中东其他地区和非洲销售分析

第 11 章：抗辐射电子公司的竞争格局

抗辐射电子市场竞争
伙伴关係/协作/协议
併购
新产品发布
其他发展

第 12 章：公司简介

顶尖公司股票分析
市场集中度
Microchip Technology Inc. (US)

公司简介
公司收入
产品
最近的发展

BAE Systems (UK)

公司简介
公司收入
产品
最近的发展

Renesas Electronics Corporation (Japan)

公司简介
公司收入
产品
最近的发展

Infineon Technologies AG (Germany)

公司简介
公司收入
产品
最近的发展

STMicroelectronics (Switzerland)

公司简介
公司收入
产品
最近的发展

Xilinx Inc. (US)

公司简介
公司收入
产品
最近的发展

Texas Instruments Incorporated (US)

公司简介
公司收入
产品
最近的发展

Honeywell International Inc. (US)

公司简介
公司收入
产品
最近的发展

Teledyne Technologies Inc. (US)

公司简介
公司收入
产品
最近的发展

TTM Technologies Inc. (US).

公司简介
公司收入
产品
最近的发展

注意 - 在公司概况中，财务详细资讯和近期发展视情况而定，或者如果是私人公司，则可能不包括在内

简介目录图表

Product Code: VMR11218590

The global demand for Radiation Hardened Electronics Market is presumed to reach the market size of nearly USD 3.69 MN by 2030 from USD 2.5 MN in 2022 with a CAGR of 5% under the study period 2023 - 2030.

Radiation hardened electronics refers to electronic components. It consists of circuits, resistors, transistors, capacitors, diodes, single-board computer CPUs, packages, and products primarily used in industries to protect devices from extremely high radiation exposure. The radiation hardened electronics play a crucial role in protecting electronic equipment from physical damage and failure caused by harmful radiation in outer space. They are designed to withstand radiation and extreme temperatures ranging from -55°C to 125°C.

MARKET DYNAMICS:

The market for radiation hardened electronics is driven by growing demand for communication satellites and increasing surveillance. The increasing number of commercial space programs and growing adoption of electronics radiation exposure systems are other major factors contributing to market growth. Moreover, increased demand for radiation-hardened electronics used in satellites has been driven by rising space exploration programmes and long-distance communication. Other major factors fuelling market growth are various technological advancements, such as developing highly reliable integrated circuits and improving field-programmable gate array (FPGA) technology, which will boost the market. However, the high maintenance cost of radiation hardened electronics may hamper its market growth during the assessment period.

The research report covers Porter's Five Forces Model, Market Attractiveness Analysis, and Value Chain analysis. These tools help to get a clear picture of the industry's structure and evaluate the competition attractiveness at a global level. Additionally, these tools also give an inclusive assessment of each segment in the global market of radiation hardened electronics. The growth and trends of radiation hardened electronics industry provide a holistic approach to this study.

MARKET SEGMENTATION:

This section of the radiation hardened electronics market report provides detailed data on the segments at country and regional level, thereby assisting the strategist in identifying the target demographics for the respective product or services with the upcoming opportunities.

By Component

Mixed Signal ICs
Processors & Controllers
Memory
Power Management

By Manufacturing Technique

Radiation-Hardening by Design (RHBD)
Radiation-Hardening by Process (RHBP)

By Product Type

Commercial-off-the-Shelf (COTS)
Custom Made

By Application

Space
Aerospace & Defense
Nuclear Power Plant
Medical
Others

REGIONAL ANALYSIS:

This section covers the regional outlook, which accentuates current and future demand for the Radiation Hardened Electronics market across North America, Europe, Asia-Pacific, Latin America, and Middle East & Africa. Further, the report focuses on demand, estimation, and forecast for individual application segments across all the prominent regions.

The research report also covers the comprehensive profiles of the key players in the market and an in-depth view of the competitive landscape worldwide. The major players in the radiation hardened electronics market include Microchip Technology Inc. (US), BAE Systems (UK), Renesas Electronics Corporation (Japan), Infineon Technologies AG (Germany), STMicroelectronics (Switzerland), Xilinx, Inc. (US), Texas Instruments Incorporated (US), Honeywell International Inc. (US), Teledyne Technologies Inc. (US), and TTM Technologies, Inc. (US). This section consists of a holistic view of the competitive landscape that includes various strategic developments such as key mergers & acquisitions, future capacities, partnerships, financial overviews, collaborations, new product developments, new product launches, and other developments.

In case you have any custom requirements, do write to us. Our research team can offer a customized report as per your need.

1 . PREFACE

1.1. Report Description
- 1.1.1. Objective
- 1.1.2. Target Audience
- 1.1.3. Unique Selling Proposition (USP) & offerings
1.2. Research Scope
1.3. Research Methodology
- 1.3.1. Market Research Process
- 1.3.2. Market Research Methodology

2 . EXECUTIVE SUMMARY

2.1. Highlights of Market
2.2. Global Market Snapshot

3 . RADIATION HARDENED ELECTRONICS - INDUSTRY ANALYSIS

3.1. Introduction - Market Dynamics
3.2. Market Drivers
3.3. Market Restraints
3.4. Opportunities
3.5. Industry Trends
3.6. Porter's Five Force Analysis
3.7. Market Attractiveness Analysis
- 3.7.1 Market Attractiveness Analysis By Component
- 3.7.2 Market Attractiveness Analysis By Manufacturing Technique
- 3.7.3 Market Attractiveness Analysis By Product Type
- 3.7.4 Market Attractiveness Analysis By Application
- 3.7.5 Market Attractiveness Analysis By Region

4 . VALUE CHAIN ANALYSIS

4.1. Value Chain Analysis
4.2. Raw Material Analysis
- 4.2.1. List of Raw Materials
- 4.2.2. Raw Material Manufactures List
- 4.2.3. Price Trend of Key Raw Materials
4.3. List of Potential Buyers
4.4. Marketing Channel
- 4.4.1. Direct Marketing
- 4.4.2. Indirect Marketing
- 4.4.3. Marketing Channel Development Trend

5 . IMPACT ANALYSIS OF COVID-19 OUTBREAK

6 . GLOBAL RADIATION HARDENED ELECTRONICS MARKET ANALYSIS BY COMPONENT

6.1 Overview by Component
6.2 Historical and Forecast Data
6.3 Analysis by Component
6.4 Mixed Signal ICs Historic and Forecast Sales by Regions
6.5 Processors & Controllers Historic and Forecast Sales by Regions
6.6 Memory Historic and Forecast Sales by Regions
6.7 Power Management Historic and Forecast Sales by Regions

7 . GLOBAL RADIATION HARDENED ELECTRONICS MARKET ANALYSIS BY MANUFACTURING TECHNIQUE

7.1 Overview by Manufacturing Technique
7.2 Historical and Forecast Data
7.3 Analysis by Manufacturing Technique
7.4 Radiation-Hardening Design (RHBD) Historic and Forecast Sales by Regions
7.5 Radiation-Hardening Process (RHBP) Historic and Forecast Sales by Regions

8 . GLOBAL RADIATION HARDENED ELECTRONICS MARKET ANALYSIS BY PRODUCT TYPE

8.1 Overview by Product Type
8.2 Historical and Forecast Data
8.3 Analysis by Product Type
8.4 Commercial-off-the-Shelf (COTS) Historic and Forecast Sales by Regions
8.5 Custom Made Historic and Forecast Sales by Regions

9 . GLOBAL RADIATION HARDENED ELECTRONICS MARKET ANALYSIS BY APPLICATION

9.1 Overview by Application
9.2 Historical and Forecast Data
9.3 Analysis by Application
9.4 Space Historic and Forecast Sales by Regions
9.5 Aerospace & Defense Historic and Forecast Sales by Regions
9.6 Nuclear Power Plant Historic and Forecast Sales by Regions
9.7 Medical Historic and Forecast Sales by Regions
9.8 Others Historic and Forecast Sales by Regions

10 . GLOBAL RADIATION HARDENED ELECTRONICS MARKET ANALYSIS BY GEOGRAPHY

10.1. Regional Outlook
10.2. Introduction
10.3. North America Sales Analysis
- 10.3.1. Overview, Historic and Forecast Sales Analysis
- 10.3.2. North America By Segment Sales Analysis
- 10.3.3. North America By Country Sales Analysis
- 10.3.4. United State Sales Analysis
- 10.3.5. Canada Sales Analysis
- 10.3.6. Mexico Sales Analysis
10.4. Europe Sales Analysis
- 10.4.1. Overview, Historic and Forecast Sales Analysis
- 10.4.2. Europe by Segment Sales Analysis
- 10.4.3. Europe by Country Sales Analysis
- 10.4.4. United Kingdom Sales Analysis
- 10.4.5. France Sales Analysis
- 10.4.6. Germany Sales Analysis
- 10.4.7. Italy Sales Analysis
- 10.4.8. Russia Sales Analysis
- 10.4.9. Rest Of Europe Sales Analysis
10.5. Asia Pacific Sales Analysis
- 10.5.1. Overview, Historic and Forecast Sales Analysis
- 10.5.2. Asia Pacific by Segment Sales Analysis
- 10.5.3. Asia Pacific by Country Sales Analysis
- 10.5.4. China Sales Analysis
- 10.5.5. India Sales Analysis
- 10.5.6. Japan Sales Analysis
- 10.5.7. South Korea Sales Analysis
- 10.5.8. Australia Sales Analysis
- 10.5.9. Rest Of Asia Pacific Sales Analysis
10.6. Latin America Sales Analysis
- 10.6.1. Overview, Historic and Forecast Sales Analysis
- 10.6.2. Latin America by Segment Sales Analysis
- 10.6.3. Latin America by Country Sales Analysis
- 10.6.4. Brazil Sales Analysis
- 10.6.5. Argentina Sales Analysis
- 10.6.6. Peru Sales Analysis
- 10.6.7. Chile Sales Analysis
- 10.6.8. Rest of Latin America Sales Analysis
10.7. Middle East & Africa Sales Analysis
- 10.7.1. Overview, Historic and Forecast Sales Analysis
- 10.7.2. Middle East & Africa by Segment Sales Analysis
- 10.7.3. Middle East & Africa by Country Sales Analysis
- 10.7.4. Saudi Arabia Sales Analysis
- 10.7.5. UAE Sales Analysis
- 10.7.6. Israel Sales Analysis
- 10.7.7. South Africa Sales Analysis
- 10.7.8. Rest Of Middle East And Africa Sales Analysis

11 . COMPETITIVE LANDSCAPE OF THE RADIATION HARDENED ELECTRONICS COMPANIES

11.1. Radiation Hardened Electronics Market Competition
11.2. Partnership/Collaboration/Agreement
11.3. Merger And Acquisitions
11.4. New Product Launch
11.5. Other Developments

12 . COMPANY PROFILES OF RADIATION HARDENED ELECTRONICS INDUSTRY

12.1. Top Company Share Analysis
12.2. Market Concentration Rate
12.3. Microchip Technology Inc. (US)
- 12.3.1. Company Overview
- 12.3.2. Company Revenue
- 12.3.3. Products
- 12.3.4. Recent Developments
12.4. BAE Systems (UK)
- 12.4.1. Company Overview
- 12.4.2. Company Revenue
- 12.4.3. Products
- 12.4.4. Recent Developments
12.5. Renesas Electronics Corporation (Japan)
- 12.5.1. Company Overview
- 12.5.2. Company Revenue
- 12.5.3. Products
- 12.5.4. Recent Developments
12.6. Infineon Technologies AG (Germany)
- 12.6.1. Company Overview
- 12.6.2. Company Revenue
- 12.6.3. Products
- 12.6.4. Recent Developments
12.7. STMicroelectronics (Switzerland)
- 12.7.1. Company Overview
- 12.7.2. Company Revenue
- 12.7.3. Products
- 12.7.4. Recent Developments
12.8. Xilinx Inc. (US)
- 12.8.1. Company Overview
- 12.8.2. Company Revenue
- 12.8.3. Products
- 12.8.4. Recent Developments
12.9. Texas Instruments Incorporated (US)
- 12.9.1. Company Overview
- 12.9.2. Company Revenue
- 12.9.3. Products
- 12.9.4. Recent Developments
12.10. Honeywell International Inc. (US)
- 12.10.1. Company Overview
- 12.10.2. Company Revenue
- 12.10.3. Products
- 12.10.4. Recent Developments
12.11. Teledyne Technologies Inc. (US)
- 12.11.1. Company Overview
- 12.11.2. Company Revenue
- 12.11.3. Products
- 12.11.4. Recent Developments
12.12. TTM Technologies Inc. (US).
- 12.12.1. Company Overview
- 12.12.2. Company Revenue
- 12.12.3. Products
- 12.12.4. Recent Developments