查看购物车
  • Traditional Chinese
  • English
  • Japanese
  • Korean
封面
市场调查报告书
商品编码
1625301

到 2030 年辐射固化电子和半导体市场预测：按组件、技术、应用、最终用户和地区进行分析

Radiation Hardened Electronics and Semiconductors Market Forecasts to 2030 - Global Analysis By Component (Semiconductors, Passive Components and Other Components), Technology, Application, End User and By Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 200+ Pages | 商品交期: 2-3个工作天内

价格

根据 Stratistics MRC 的数据，2024 年全球辐射固化电子和半导体市场规模为 18 亿美元，预计在预测期内复合年增长率为 7.7%，到 2030 年将达到 28 亿美元。

抗辐射电子产品和半导体旨在承受辐射的有害影响，例如宇宙射线和太阳辐射，这些影响可能会导致标准电子设备的物理损坏或故障。这些设备在太空探索、核能发电厂、军事行动和高空飞行等应用中至关重要。为了实现辐射耐受性，这些设备经过特定的设计技术、材料选择和製造过程。

根据卫星产业协会统计，绕地球运行的活跃卫星约7,316颗，与前一年同期比较增加51%，过去五年增加321%。

活性化太空探勘活动

随着太空探勘的进展，对能够承受高辐射水平的抗辐射组件的需求不断增加。 NASA 的 Artemis 计画、太空望远镜、火星探勘等重大任务以及 SpaceX 的 Starship 等私人企业都需要能够承受宇宙射线和其他太空现象的可靠电子设备。这种市场多元化导致了耐辐射电子产品的广泛应用，包括卫星通讯、地球观测、导航和科学探勘，推动了市场成长。

辐射硬化零件高成本

辐射固化半导体的高成本可能会阻止小型组织和新兴企业进入太空探勘和国防领域。虽然大型航太机构可以吸收成本，但较小的卫星和航太製造商可能难以购买必要的组件。此外，组件成本的增加可能会导致预算有限的政府和商业太空项目的任务减少、有效载荷减少以及计划延迟，从而减少科学研究和探勘预算，并阻碍市场发展。

技术进步和小型化

半导体材料、製造技术和电路设计的进步大大提高了抗辐射元件的性能。碳化硅和氮化镓等新材料正在取代传统的硅基材料，从而实现更高的性能、更低的消费量和改进的温度控管。小型化也有助于提高性能。较小的元件具有较短的讯号路径，减少了辐射引起的错误并增强了市场。

提高绩效的问题

提高抗辐射电子产品的性能通常需要权衡，例如增加功耗、更大的外形尺寸和增加的热量产生，这给太空应用带来了挑战。在高性能需求与辐射、极端温度和真空等恶劣条件之间取得平衡是一项复杂的挑战。製造商努力製造高性能的抗辐射组件，以满足太空任务的需求，同时保持 SWaP 限制。

COVID-19 的影响

太空和国防领域的供应链中断、生产延误和计划受挫。製造能力的下降和物流挑战影响了卫星、太空任务和国防系统的抗辐射部件的及时交付。然而，疫情加速了先进技术的采用，刺激了对太空探勘和国防的投资，并为市场创造了长期成长机会，因为对可靠耐用组件的需求仍然强劲。

预计半导体领域将在预测期内成为最大的领域

在预测期内，半导体领域由于其在高电离辐射环境（例如外层空间、核能发电厂和军事应用）中的功能可靠性，预计将创下最大的市场占有率。这些半导体对于太空任务、卫星和航太系统至关重要，由于辐射暴露而导致的故障可能会导致任务失败、资料遗失和系统劣化。硅等传统半导体材料对辐射敏感，需要特殊的材料、设计和製程来使辐射固化装置更具抵抗力。

预计总剂量辐射固化产业在预测期内复合年增长率最高。

由于暴露于电离辐射的太空任务、卫星运作和军事系统的增加，预计总剂量辐射硬化领域在预测期内将出现良好的成长。火星探勘和深空探勘等长期任务需要全剂量抗辐射组件，以防止因累积辐射而导致性能劣化。因此，太空探勘、科学任务和国防对辐射固化电子元件的需求不断增长，正在推动全剂量辐射固化半导体市场的发展。

占比最大的地区：

在预测期内，北美地区预计将占据最大的市场占有率，其中美国在太空探勘、卫星通讯和太空基础设施开发方面处于世界领先地位。主要航太机构需要可靠耐用的组件，能够承受太空恶劣的辐射环境。 NASA 的深空任务（例如火星和外行星）需要能够承受长期暴露的抗辐射组件。铱星通讯、Intelsat 和 SES Networks 等商业卫星通讯业者也依赖抗辐射电子设备来实现不间断的通讯和资料传输。

复合年增长率最高的地区：

亚太地区预计在预测期内将以最高复合年增长率成长，因为该地区是全球半导体製造的领导者，拥有台积电、三星电子和英特尔等先进代工厂。随着抗辐射电子产品在太空、国防和航太领域变得越来越重要，这些国家正在投资抗辐射组件的开发和製造。台湾是半导体製造领域的世界领导者，正在投资先进材料和製程技术，以提高耐辐射性，推动该地区的市场成长。

免费客製化服务：

订阅此报告的客户可以存取以下免费自订选项之一：

  • 公司简介
    • 其他市场公司的综合分析（最多 3 家公司）
    • 主要企业SWOT分析（最多3家企业）
  • 区域分割
    • 根据客户兴趣对主要国家的市场估计、预测和复合年增长率（註：基于可行性检查）
  • 竞争标基准化分析
    • 根据产品系列、地理分布和策略联盟对主要企业基准化分析

目录

第一章执行摘要

第二章 前言

  • 概述
  • 相关利益者
  • 调查范围
  • 调查方法
    • 资料探勘
    • 资料分析
    • 资料检验
    • 研究途径
  • 研究资讯来源
    • 主要研究资讯来源
    • 二次研究资讯来源
    • 先决条件

第三章市场趋势分析

  • 促进因素
  • 抑制因素
  • 机会
  • 威胁
  • 技术分析
  • 应用分析
  • 最终用户分析
  • 新兴市场
  • COVID-19 的影响

第4章波特五力分析

  • 供应商的议价能力
  • 买方议价能力
  • 替代品的威胁
  • 新进入者的威胁
  • 竞争公司之间的敌对关係

第五章全球辐射固化电子与半导体市场：依组成部分

  • 半导体
    • 电晶体
    • 二极体
    • 积体电路（IC）
    • 微处理器和微控制器
    • 光耦合器
  • 被动元件
    • 电阻器
    • 电容器
    • 电感器
  • 其他组件

第六章全球辐射固化电子与半导体市场：依技术分类

  • 总剂量辐射抗性
  • 单粒子效应 (SEE) 保护
  • 抗辐射设计（RHBD）
  • 包装解决方案
  • 其他技术

第七章全球辐射固化电子与半导体市场：依应用分类

  • 太空和卫星
  • 核能发电厂
  • 医疗设备
  • 高能物理
  • 其他用途

第八章全球辐射固化电子和半导体市场：依最终用户分类

  • 军事/国防
  • 汽车/交通
  • 政府/航太
  • 其他最终用户

第九章全球辐射固化电子和半导体市场：按地区

  • 北美洲
    • 美国
    • 加拿大
    • 墨西哥
  • 欧洲
    • 德国
    • 英国
    • 义大利
    • 法国
    • 西班牙
    • 其他欧洲国家
  • 亚太地区
    • 日本
    • 中国
    • 印度
    • 澳洲
    • 纽西兰
    • 韩国
    • 其他亚太地区
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 南美洲其他地区
  • 中东/非洲
    • 沙乌地阿拉伯
    • 阿拉伯聯合大公国
    • 卡达
    • 南非
    • 其他中东和非洲

第10章 主要进展

  • 合约、伙伴关係、合作和合资企业
  • 收购和合併
  • 新产品发布
  • 业务拓展
  • 其他关键策略

第十一章 公司概况

  • 3D Plus
  • Analog Devices
  • Atmel Corporation
  • BAE Systems
  • Cobham Limited
  • Honeywell Aerospace
  • Infineon Technologies
  • Intersil Corporation
  • Linear Technology Corporation
  • Maxwell Technologies
  • Microchip Technology
  • Micropac Industries
  • Microsemi Corporation
  • PSemi Corporation
  • Renesas Electronics
  • ST Microelectronics
  • Teledyne E2V Semiconductors
  • Texas Instruments
  • The Boeing Company
  • Xilinx Incorporation
Product Code: SMRC28256

According to Stratistics MRC, the Global Radiation Hardened Electronics and Semiconductors Market is accounted for $1.8 billion in 2024 and is expected to reach $2.8 billion by 2030 growing at a CAGR of 7.7% during the forecast period. Radiation-hardened electronics and semiconductors are designed to withstand the harmful effects of radiation, such as cosmic rays and solar radiation, which can cause physical damage or malfunction in standard electronic devices. These devices are crucial in applications like space exploration, nuclear power plants, military operations, and high-altitude flights. To achieve radiation hardness, these devices undergo specific design techniques, material selections, and manufacturing processes.

According to the Satellite Industry Association approximately 7,316 active satellites were orbiting the Earth, marking a 51% increase from the previous year and a 321% increase over the past five years.

Market Dynamics:

Driver:

Increasing space exploration activities

As space exploration continues, there is a growing demand for rad-hard components that can withstand high radiation levels. Key missions like NASA's Artemis program, space telescopes, Mars rovers, and private ventures like SpaceX's Starship require reliable electronics that can withstand cosmic rays and other space phenomena. This diversification leads to a broader spectrum of applications for rad-hard electronics, including satellite communication, earth observation, navigation, and scientific exploration boosting the market growth.

Restraint:

High cost of radiation-hardened components

The high cost of radiation-hardened semiconductors can hinder smaller organizations and startups from entering the space exploration or defense sectors. Large space agencies can absorb the cost, but smaller satellite or aerospace players may struggle to afford the required components. Moreover increased component costs can lead to fewer missions, smaller payloads, or delayed projects for government and private space programs with limited budgets resulting in more limited budgets for scientific research and exploration hampering the market.

Opportunity:

Technological advancements and miniaturization

Advancements in semiconductor materials, fabrication techniques, and circuit designs have significantly improved the performance of radiation-hardened components. New materials like silicon carbide and gallium nitride are being used to replace traditional silicon-based materials, resulting in higher performance, reduced energy consumption, and better thermal management. Miniaturization also contributes to improved performance, as smaller components have shorter signal paths, reducing radiation-induced errors enhancing the market.

Threat:

Challenges in achieving high performance

High performance in rad-hard electronics often involves trade-offs like higher power consumption, larger form factors, or increased heat generation, which can be challenging for space applications. Balancing high-performance requirements with harsh conditions like radiation, temperature extremes, and vacuum becomes a complex challenge. Manufacturers struggle to create high-performance rad-hard components that meet space missions' demands while maintaining SWaP constraints.

Covid-19 Impact

Supply chain disruptions, delays in production, and project setbacks in the space and defense sectors. Reduced manufacturing capacity and logistical challenges affected the timely delivery of radiation-hardened components for satellites, space missions, and defense systems. However, the pandemic also accelerated the adoption of advanced technologies and spurred investment in space exploration and defense, creating long-term growth opportunities for the market as demand for reliable, durable components remained strong.

The semiconductors segment is expected to be the largest during the forecast period

During the forecast period, the semiconductors segment is anticipated to register the largest market share owing to their function reliability in environments with high levels of ionizing radiation, such as outer space, nuclear power plants, and military applications. These semiconductors are crucial for space missions, satellites, and aerospace systems, where failure due to radiation exposure can lead to mission failure, data loss, or system degradation. Traditional semiconductor materials like silicon are more vulnerable to radiation-induced effects, requiring specialized materials, designs, and processes to enhance the resilience of rad-hard devices.

The total dose radiation hardening segment is expected to have the highest CAGR during the forecast period

The total dose radiation hardening segment is expected to register lucrative growth during the estimation period due to the increasing number of space missions, satellite operations, and military systems exposed to ionizing radiation. For extended missions, such as Mars missions or deep-space probes, total dose radiation -hardened components are needed to prevent performance degradation from accumulated radiation. This growing demand for radiation-hardened electronics in space exploration, scientific missions, and national defense drives the market for total dose radiation -hardened semiconductors.

Region with largest share:

During the estimation period, the North America region is expected to capture the largest market share owing to the United States, which is a global leader in space exploration, satellite communications, and space infrastructure development. Major space agencies require reliable and durable components to withstand harsh radiation environments in space. NASA's deep-space missions, such as Mars and outer planets, require radiation-hardened components for prolonged exposure. Commercial satellite operators like Iridium Communications, Intelsat, and SES Networks also rely on radiation-hardened electronics for uninterrupted communications and data transmission.

Region with highest CAGR:

The Asia Pacific region is expected to grow at the highest CAGR over the forecast period owing to leading global semiconductor manufacturing, with advanced foundries like TSMC, Samsung Electronics, and Intel. As radiation-hardened electronics become crucial for space, defense, and aerospace sectors, these countries are investing in developing and manufacturing rad-hard components. Taiwan, a global leader in semiconductor manufacturing, is investing in advanced materials and process technologies to enhance radiation resistance encouraging the regions market growth.

Key players in the market

Some of the key players in Radiation Hardened Electronics and Semiconductors market include 3D Plus, Analog Devices, Atmel Corporation, BAE Systems, Cobham Limited, Honeywell Aerospace, Infineon Technologies, Intersil Corporation, Linear Technology Corporation, Maxwell Technologies, Microchip Technology, Micropac Industries, Microsemi Corporation, PSemi Corporation, Renesas Electronics, ST Microelectronics, Teledyne E2V Semiconductors, Texas Instruments, The Boeing Company and Xilinx Incorporation

Key Developments:

In December 2024, Australian and UK Governments have announced a significant milestone between the Australian Submarine Agency (ASA) and industry partners that will support the delivery of the SSN AUKUS fleet of conventionally armed, nuclear-powered submarines for the Royal Australian Navy.

In December 2024, BAE Systems, Leonardo, and Japan Aircraft Industrial Enhancement Co Ltd (JAIEC), have reached an agreement to form a new company under a business joint venture for the Global Combat Air Programme (GCAP), subject to regulatory approvals.

In December 2024, Honeywell announced that it has signed a memorandum of understanding (MoU) with Sino Jet at the Middle East and North Africa Business Aviation Association (MEBAA) show.

Components Covered:

  • Semiconductors
  • Passive Components
  • Other Components

Technologies Covered:

  • Total Dose Radiation Hardening
  • Single Event Effects (SEE) Protection
  • Radiation Hardened by Design (RHBD)
  • Packaging Solutions
  • Other Technologies

Applications Covered:

  • Space & Satellite
  • Nuclear Power Plants
  • Medical Equipment
  • High-Energy Physics
  • Other Applications

End Users Covered:

  • Military & Defense
  • Automotive & Transportation
  • Government & Aerospace
  • Other End Users

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2022, 2023, 2024, 2026, and 2030
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Technology Analysis
  • 3.7 Application Analysis
  • 3.8 End User Analysis
  • 3.9 Emerging Markets
  • 3.10 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global Radiation Hardened Electronics and Semiconductors Market, By Component

  • 5.1 Introduction
  • 5.2 Semiconductors
    • 5.2.1 Transistors
    • 5.2.2 Diodes
    • 5.2.3 Integrated Circuits (ICs)
    • 5.2.4 Microprocessors & Microcontrollers
    • 5.2.5 Optocouplers
  • 5.3 Passive Components
    • 5.3.1 Resistors
    • 5.3.2 Capacitors
    • 5.3.3 Inductors
  • 5.4 Other Components

6 Global Radiation Hardened Electronics and Semiconductors Market, By Technology

  • 6.1 Introduction
  • 6.2 Total Dose Radiation Hardening
  • 6.3 Single Event Effects (SEE) Protection
  • 6.4 Radiation Hardened by Design (RHBD)
  • 6.5 Packaging Solutions
  • 6.6 Other Technologies

7 Global Radiation Hardened Electronics and Semiconductors Market, By Application

  • 7.1 Introduction
  • 7.2 Space & Satellite
  • 7.3 Nuclear Power Plants
  • 7.4 Medical Equipment
  • 7.5 High-Energy Physics
  • 7.6 Other Applications

8 Global Radiation Hardened Electronics and Semiconductors Market, By End User

  • 8.1 Introduction
  • 8.2 Military & Defense
  • 8.3 Automotive & Transportation
  • 8.4 Government & Aerospace
  • 8.5 Other End Users

9 Global Radiation Hardened Electronics and Semiconductors Market, By Geography

  • 9.1 Introduction
  • 9.2 North America
    • 9.2.1 US
    • 9.2.2 Canada
    • 9.2.3 Mexico
  • 9.3 Europe
    • 9.3.1 Germany
    • 9.3.2 UK
    • 9.3.3 Italy
    • 9.3.4 France
    • 9.3.5 Spain
    • 9.3.6 Rest of Europe
  • 9.4 Asia Pacific
    • 9.4.1 Japan
    • 9.4.2 China
    • 9.4.3 India
    • 9.4.4 Australia
    • 9.4.5 New Zealand
    • 9.4.6 South Korea
    • 9.4.7 Rest of Asia Pacific
  • 9.5 South America
    • 9.5.1 Argentina
    • 9.5.2 Brazil
    • 9.5.3 Chile
    • 9.5.4 Rest of South America
  • 9.6 Middle East & Africa
    • 9.6.1 Saudi Arabia
    • 9.6.2 UAE
    • 9.6.3 Qatar
    • 9.6.4 South Africa
    • 9.6.5 Rest of Middle East & Africa

10 Key Developments

  • 10.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 10.2 Acquisitions & Mergers
  • 10.3 New Product Launch
  • 10.4 Expansions
  • 10.5 Other Key Strategies

11 Company Profiling

  • 11.1 3D Plus
  • 11.2 Analog Devices
  • 11.3 Atmel Corporation
  • 11.4 BAE Systems
  • 11.5 Cobham Limited
  • 11.6 Honeywell Aerospace
  • 11.7 Infineon Technologies
  • 11.8 Intersil Corporation
  • 11.9 Linear Technology Corporation
  • 11.10 Maxwell Technologies
  • 11.11 Microchip Technology
  • 11.12 Micropac Industries
  • 11.13 Microsemi Corporation
  • 11.14 PSemi Corporation
  • 11.15 Renesas Electronics
  • 11.16 ST Microelectronics
  • 11.17 Teledyne E2V Semiconductors
  • 11.18 Texas Instruments
  • 11.19 The Boeing Company
  • 11.20 Xilinx Incorporation

List of Tables

  • Table 1 Global Radiation Hardened Electronics and Semiconductors Market Outlook, By Region (2022-2030) ($MN)
  • Table 2 Global Radiation Hardened Electronics and Semiconductors Market Outlook, By Component (2022-2030) ($MN)
  • Table 3 Global Radiation Hardened Electronics and Semiconductors Market Outlook, By Semiconductors (2022-2030) ($MN)
  • Table 4 Global Radiation Hardened Electronics and Semiconductors Market Outlook, By Transistors (2022-2030) ($MN)
  • Table 5 Global Radiation Hardened Electronics and Semiconductors Market Outlook, By Diodes (2022-2030) ($MN)
  • Table 6 Global Radiation Hardened Electronics and Semiconductors Market Outlook, By Integrated Circuits (ICs) (2022-2030) ($MN)
  • Table 7 Global Radiation Hardened Electronics and Semiconductors Market Outlook, By Microprocessors & Microcontrollers (2022-2030) ($MN)
  • Table 8 Global Radiation Hardened Electronics and Semiconductors Market Outlook, By Optocouplers (2022-2030) ($MN)
  • Table 9 Global Radiation Hardened Electronics and Semiconductors Market Outlook, By Passive Components (2022-2030) ($MN)
  • Table 10 Global Radiation Hardened Electronics and Semiconductors Market Outlook, By Resistors (2022-2030) ($MN)
  • Table 11 Global Radiation Hardened Electronics and Semiconductors Market Outlook, By Capacitors (2022-2030) ($MN)
  • Table 12 Global Radiation Hardened Electronics and Semiconductors Market Outlook, By Inductors (2022-2030) ($MN)
  • Table 13 Global Radiation Hardened Electronics and Semiconductors Market Outlook, By Other Components (2022-2030) ($MN)
  • Table 14 Global Radiation Hardened Electronics and Semiconductors Market Outlook, By Technology (2022-2030) ($MN)
  • Table 15 Global Radiation Hardened Electronics and Semiconductors Market Outlook, By Total Dose Radiation Hardening (2022-2030) ($MN)
  • Table 16 Global Radiation Hardened Electronics and Semiconductors Market Outlook, By Single Event Effects (SEE) Protection (2022-2030) ($MN)
  • Table 17 Global Radiation Hardened Electronics and Semiconductors Market Outlook, By Radiation Hardened by Design (RHBD) (2022-2030) ($MN)
  • Table 18 Global Radiation Hardened Electronics and Semiconductors Market Outlook, By Packaging Solutions (2022-2030) ($MN)
  • Table 19 Global Radiation Hardened Electronics and Semiconductors Market Outlook, By Other Technologies (2022-2030) ($MN)
  • Table 20 Global Radiation Hardened Electronics and Semiconductors Market Outlook, By Application (2022-2030) ($MN)
  • Table 21 Global Radiation Hardened Electronics and Semiconductors Market Outlook, By Space & Satellite (2022-2030) ($MN)
  • Table 22 Global Radiation Hardened Electronics and Semiconductors Market Outlook, By Nuclear Power Plants (2022-2030) ($MN)
  • Table 23 Global Radiation Hardened Electronics and Semiconductors Market Outlook, By Medical Equipment (2022-2030) ($MN)
  • Table 24 Global Radiation Hardened Electronics and Semiconductors Market Outlook, By High-Energy Physics (2022-2030) ($MN)
  • Table 25 Global Radiation Hardened Electronics and Semiconductors Market Outlook, By Other Applications (2022-2030) ($MN)
  • Table 26 Global Radiation Hardened Electronics and Semiconductors Market Outlook, By End User (2022-2030) ($MN)
  • Table 27 Global Radiation Hardened Electronics and Semiconductors Market Outlook, By Military & Defense (2022-2030) ($MN)
  • Table 28 Global Radiation Hardened Electronics and Semiconductors Market Outlook, By Automotive & Transportation (2022-2030) ($MN)
  • Table 29 Global Radiation Hardened Electronics and Semiconductors Market Outlook, By Government & Aerospace (2022-2030) ($MN)
  • Table 30 Global Radiation Hardened Electronics and Semiconductors Market Outlook, By Other End Users (2022-2030) ($MN)

Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.