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市场调查报告书
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1530859

2030 年积体电路 (IC) 市场预测：按产品类型、封装类型、设计方法、技术、最终用户和地区进行的全球分析

Integrated Circuits Market Forecasts to 2030 - Global Analysis By Product Type, Packaging Type, Design Approach, Technology, End User and By Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 200+ Pages | 商品交期: 2-3个工作天内

价格

根据 Stratistics MRC 的数据，2024 年全球积体电路 (IC) 市场规模为 7,426 亿美元，预计到 2030 年将达到 17,087 亿美元，预测期内复合年增长率为 14.9%。

积体电路 (IC) 是一种小型电子电路，它将许多元件（例如电晶体、电阻器和电容器）整合到单一半导体晶片上。这种紧凑且多功能的设备构成了现代电子产品的基础，为从智慧型手机到工业设备的一切设备提供动力。 IC 市场涵盖各种应用的晶片设计、製造和销售，包括家用电子电器、汽车、通讯和其他各个领域。

根据半导体产业协会（SIA）的资料，2022年汽车IC销售额达341亿美元，与前一年同期比较增29.2%。

电子设备需求增加

智慧型手机、平板电脑、穿戴式装置和其他消费性电子产品的激增正在推动对 IC 的巨大需求。此外，物联网、人工智慧和 5G 等新兴技术正在创造需要先进 IC 解决方案的新应用。汽车产业向电动和自动驾驶汽车的转变也推动了积体电路的使用。多个最终用途行业不断增长的需求是推动市场成长的主要因素。

研发成本高

开发新的 IC 设计和製造流程需要大量的研发投资。随着 IC 技术的进步，与晶片设计和製造相关的复杂性和成本不断增加。这种高进入障碍限制了创新和市场准入，特别是对于中小企业而言。此外，对专用设备和设备的需求增加了总体成本，并可能限制市场成长。

新兴国家市场拓展

亚洲、非洲和拉丁美洲的新兴国家为IC市场提供了巨大的成长机会。在这些地区，可支配收入的增加、都市化的加快以及技术采用的扩大正在推动对家用电子电器和其他 IC 产品的需求。此外，印度和越南等国政府提高国内製造能力的努力可能为积体电路公司创造新的市场机会。

智慧财产权盗窃

IC 产业竞争激烈，智慧财产权 (IP) 成为重要资产。然而，智慧财产权盗窃的风险，特别是企业间谍活动和国家主导的活动，对公司的竞争优势和创新努力构成了重大威胁。这可能会限制研发投资并减缓产业的技术进步。

COVID-19 的影响：

疫情最初扰乱了全球供应链和製造业务，导致生产延误和短缺。然而，对支援远端工作和数位服务的电子设备的需求增加部分抵消了这些挑战。这场危机也可能加速数位转型趋势，为市场创造长期成长机会。

专用积体电路（ASIC）领域预计将在预测期内成为最大的领域

ASIC 领域预计将主导市场。 ASIC 专为特定应用而设计，与通用 IC 相比，可提供最佳化的效能、效能和成本效率。人工智慧、加密货币挖矿和物联网等领域对客製化解决方案的需求不断增长，推动了 ASIC 的采用。此外，ASIC 增强安全性和 IP 保护的能力使其对各个行业都具有吸引力，并有助于其市场主导地位。

硅锗 (SiGe) 领域预计在预测期内复合年增长率最高

预计 SiGe 领域的复合年增长率最高。与传统硅相比，SiGe 技术在高频和高速应用中具有卓越的性能。这使得它特别适合 5G 基础设施、汽车雷达系统和卫星通讯。对这些应用不断增长的需求，加上 SiGe 能够实现更小、更节能的设备，正在推动市场快速成长。

占比最大的地区：

预计亚太地区将主导积体电路（IC）市场。这一优势得益于台湾、韩国和中国等国家的主要半导体製造地。该地区强大的消费电子市场，加上政府促进国内积体电路生产的倡议，为该地区带来了巨大的市场占有率。此外，主要参与者的存在和成熟的供应链进一步巩固了亚太地区的主导地位。

复合年增长率最高的地区：

预计亚太地区积体电路（IC）市场将出现良好成长。高成长率是由半导体製造能力投资增加所推动的，特别是在印度和越南等国家。该地区的家用电子电器市场正在迅速扩张，再加上 5G 和物联网等新兴技术的采用，正在推动对 IC 的需求。政府对国内晶片生产的支持以及全球供应链向亚洲的转移也促进了该地区的加速成长。

免费客製化服务

订阅此报告的客户可以存取以下免费自订选项之一：

  • 公司简介
    • 其他市场参与者的综合分析（最多 3 家公司）
    • 主要企业SWOT分析（最多3家企业）
  • 区域分割
    • 根据客户兴趣对主要国家的市场估计、预测和复合年增长率（註：基于可行性检查）
  • 竞争基准化分析
    • 根据产品系列、地理分布和策略联盟对主要企业基准化分析

目录

第一章执行摘要

第二章 前言

  • 概述
  • 相关利益者
  • 调查范围
  • 调查方法
    • 资料探勘
    • 资料分析
    • 资料检验
    • 研究途径
  • 研究资讯来源
    • 主要研究资讯来源
    • 二次研究资讯来源
    • 先决条件

第三章市场趋势分析

  • 促进因素
  • 抑制因素
  • 机会
  • 威胁
  • 产品分析
  • 技术分析
  • 最终用户分析
  • 新兴市场
  • COVID-19 的影响

第4章波特五力分析

  • 供应商的议价能力
  • 买方议价能力
  • 替代品的威胁
  • 新进入者的威胁
  • 竞争公司之间的敌对关係

第五章全球积体电路（IC）市场：依产品类型

  • 数位IC
    • 微处理器
    • 微控制器
    • 数位讯号处理器（DSP）
    • 逻辑积体电路
  • 类比IC
    • 线性积体电路
    • 电源管理IC
  • 记忆体IC
    • 记忆
    • 贫民窟
    • 快闪记忆体
    • 唯读记忆体
  • 混合讯号IC
  • 其他IC

第六章全球积体电路（IC）市场：依封装类型

  • 表面黏着型元件(SMD)
    • 四方扁平封装 (QFP)
    • 球栅阵列 (BGA)
    • 晶片级封装 (CSP)
    • 板载晶片(COB)
    • 其他SMD封装
  • 通孔装置
    • 双列直插式封装 (DIP)
    • 针栅阵列 (PGA)
    • 其他通孔元件封装
  • 积体电路模组
    • 系统级封装(SiP)
    • 多晶片模组（MCM）
    • 2.5D 和 3D IC封装
  • 先进封装
    • 扇出层压板封装 (FOPL)
    • 整合扇出 (IFO)
    • 晶圆上晶片 (CoW)
    • 其他先进封装

第七章 全球积体电路 (IC) 市场：依设计方法论

  • 通用IC
  • 专用积体电路 (ASIC)
  • 现场可程式闸阵列(FPGA)
  • 系统晶片(SoC)
  • 特定应用标准产品 (ASSP)
  • 自订IC

第八章全球积体电路 (IC) 市场：依技术分类

  • 互补型金属氧化物半导体 (CMOS)
  • 双极互补型金属氧化物半导体（BiCMOS）
  • 双极性
  • 砷化镓 (GaAs)
  • 硅锗 (SiGe)
  • 其他技术

第九章 全球积体电路 (IC) 市场：依最终使用者分类

  • 家电
  • 车
  • 资讯科技和通讯
  • 製造与自动化
  • 卫生保健
  • 航太和国防
  • 其他最终用户

第10章全球积体电路（IC）市场：按地区

  • 北美洲
    • 美国
    • 加拿大
    • 墨西哥
  • 欧洲
    • 德国
    • 英国
    • 义大利
    • 法国
    • 西班牙
    • 其他欧洲国家
  • 亚太地区
    • 日本
    • 中国
    • 印度
    • 澳洲
    • 纽西兰
    • 韩国
    • 其他亚太地区
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 南美洲其他地区
  • 中东/非洲
    • 沙乌地阿拉伯
    • 阿拉伯聯合大公国
    • 卡达
    • 南非
    • 其他中东和非洲

第十一章 主要进展

  • 合约、伙伴关係、协作和合资企业
  • 收购和合併
  • 新产品发布
  • 业务拓展
  • 其他关键策略

第十二章 公司概况

  • AMD
  • Analog Devices
  • Broadcom Inc.
  • Infineon Technologies AG
  • Intel Corporation
  • Marvell Technology, Inc.
  • MediaTek Inc.
  • Micron Technology, Inc.
  • Nvidia Corporation
  • NXP Semiconductors NV
  • ON Semiconductor Corporation
  • Qualcomm Technologies, Inc.
  • Renesas Electronics Corporation
  • Samsung Electronics
  • SK Hynix
  • STMicroelectronics NV
  • Taiwan Semiconductor Manufacturing Company（TSMC）
  • Texas Instruments
Product Code: SMRC26971

According to Stratistics MRC, the Global Integrated Circuits (ICs) Market is accounted for $742.6 billion in 2024 and is expected to reach $1,708.7 billion by 2030, growing at a CAGR of 14.9% during the forecast period. Integrated circuits (ICs) are miniaturized electronic circuits containing numerous components, such as transistors, resistors, and capacitors, fabricated on a single semiconductor chip. These compact, versatile devices form the foundation of modern electronics, powering everything from smartphones to industrial equipment. The IC market encompasses the design, manufacturing, and sale of these chips across various applications, including consumer electronics, automotive, telecommunications, and other various sectors.

According to data from the Semiconductor Industry Association (SIA), sales of automotive ICs increased by 29.2% year-over-year in 2022, reaching $34.1 billion.

Market Dynamics:

Driver:

Increasing demand for electronics

The growing adoption of smartphones, tablets, wearables, and other consumer electronics is driving significant demand for ICs. Additionally, emerging technologies like IoT, AI, and 5G are creating new applications that require advanced IC solutions. The automotive sector's shift towards electric and autonomous vehicles is also boosting IC usage. This rising demand across multiple end-use industries is a major factor propelling market growth.

Restraint:

High R&D costs

Developing new IC designs and manufacturing processes requires substantial investments in research and development. As IC technology advances, the complexity and costs associated with designing and fabricating chips continue to increase. This high barrier to entry can limit innovation and market participation, especially for smaller companies. The need for specialized equipment and facilities also adds to the overall costs, potentially restraining market growth.

Opportunity:

Market expansion in developing countries

Emerging economies in Asia, Africa, and Latin America present significant growth opportunities for the IC market. Rising disposable incomes, increasing urbanization, and growing technology adoption in these regions are driving demand for consumer electronics and other IC-enabled products. Additionally, government initiatives to boost domestic manufacturing capabilities in countries like India and Vietnam could create new market opportunities for IC companies.

Threat:

Intellectual property theft

The highly competitive nature of the IC industry makes intellectual property (IP) a critical asset. However, the risk of IP theft, especially through corporate espionage or state-sponsored activities, poses a significant threat to companies' competitive advantages and innovation efforts. This can discourage investments in R&D and potentially slow down technological advancements in the industry.

Covid-19 Impact:

The pandemic initially disrupted global supply chains and manufacturing operations, causing production delays and shortages. However, increased demand for electronics supporting remote work and digital services partially offsets these challenges. The crisis also accelerated digital transformation trends, potentially creating long-term growth opportunities for the market.

The application-specific integrated circuits (ASICs) segment is expected to be the largest during the forecast period

The ASICs segment is expected to dominate the market. ASICs are designed for specific applications, offering optimized performance, power efficiency, and cost-effectiveness compared to general-purpose ICs. The growing demand for customized solutions in areas like AI, cryptocurrency mining, and IoT is driving ASIC adoption. Additionally, ASICs' ability to provide enhanced security and IP protection makes them attractive for various industries, contributing to their market dominance.

The silicon-germanium (SiGe) segment is expected to have the highest CAGR during the forecast period

The SiGe segment is projected to experience the highest CAGR. SiGe technology offers superior performance in high-frequency and high-speed applications compared to traditional silicon. This makes it particularly suitable for 5G infrastructure, automotive radar systems, and satellite communications. The growing demand for these applications, coupled with SiGe's ability to enable smaller, more energy-efficient devices, is driving its rapid market growth.

Region with largest share:

Asia Pacific is expected to dominate the integrated circuits (ICs) market. The dominance is driven by the presence of major semiconductor manufacturing hubs in countries like Taiwan, South Korea, and China. The region's strong consumer electronics market, coupled with government initiatives to boost domestic IC production, contributes to its large market share. Additionally, the presence of key players and a well-established supply chain further solidify Asia Pacific's leading position.

Region with highest CAGR:

Asia Pacific is anticipated to witness lucrative growth in the integrated circuits (ICs) market. The high growth rate is fueled by increasing investments in semiconductor manufacturing capabilities, particularly in countries like India and Vietnam. The region's rapidly expanding consumer electronics market, coupled with the adoption of emerging technologies like 5G and IoT, is driving demand for ICs. Government support for domestic chip production and the shift of global supply chains towards Asia are also contributing to the region's accelerated growth.

Key players in the market

Some of the key players in Integrated Circuits (ICs) market include AMD, Analog Devices, Broadcom Inc., Infineon Technologies AG, Intel Corporation, Marvell Technology, Inc., MediaTek Inc., Micron Technology, Inc., Nvidia Corporation, NXP Semiconductors N.V., ON Semiconductor Corporation, Qualcomm Technologies, Inc., Renesas Electronics Corporation, Samsung Electronics, SK Hynix, STMicroelectronics N.V., Taiwan Semiconductor Manufacturing Company (TSMC), and Texas Instruments.

Key Developments:

In June 2024, Intel Corporation has achieved a revolutionary milestone in integrated photonics technology for high-speed data transmission. At the Optical Fiber Communication Conference (OFC) 2024, Intel's Integrated Photonics Solutions (IPS) Group demonstrated the industry's most advanced and first-ever fully integrated optical compute interconnect (OCI) chiplet co-packaged with an Intel CPU and running live data. Intel's OCI chiplet represents a leap forward in high-bandwidth interconnect by enabling co-packaged optical input/output (I/O) in emerging AI infrastructure for data centers and high performance computing (HPC) applications.

In May 2024, MediaTek held the MediaTek Dimensity Developer Conference (MDDC) 2024 in Shenzhen, where the Taiwan-based semiconductor company unveiled its latest flagship 5G chipset, the Dimensity 9300+. With a theme of "AI Empowers Everything," MDDC 2024 delved into the applications and advances in artificial intelligence technology across various domains, and the possibilities it brings to terminal devices. The Dimensity 9300+ has adopted TSMC's third-generation 4nm process technology, according to MediaTek. The new chip boasts big-core CPU architecture, housing an octa-core CPU comprising four Cortex-X4 ultra-large cores clocked at up to 3.4 GHz, and four Cortex-A720 large cores operating at 2.0 GHz.

Product Types Covered:

  • Digital ICs
  • Analog ICs
  • Memory ICs
  • Mixed-Signal ICs
  • Other ICs

Packaging Types Covered:

  • Surface-Mount Devices (SMD)
  • Through-Hole Devices
  • Integrated Circuit Modules
  • Advanced Packaging

Design Approaches Covered:

  • General-Purpose ICs
  • Application-Specific Integrated Circuits (ASICs)
  • Field-Programmable Gate Arrays (FPGAs)
  • System-on-Chip (SoC)
  • Application-Specific Standard Products (ASSPs)
  • Custom ICs

Technologies Covered:

  • Complementary Metal-Oxide-Semiconductor (CMOS)
  • Bipolar Complementary Metal-Oxide-Semiconductor (BiCMOS)
  • Bipolar
  • Gallium Arsenide (GaAs)
  • Silicon-Germanium (SiGe)
  • Other Technologies

End Users Covered:

  • Consumer Electronics
  • Automotive
  • IT & Telecommunications
  • Manufacturing & Automation
  • Healthcare
  • Aerospace & Defense
  • Other End Users

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2022, 2023, 2024, 2026, and 2030
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Product Analysis
  • 3.7 Technology Analysis
  • 3.8 End User Analysis
  • 3.9 Emerging Markets
  • 3.10 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global Integrated Circuits (ICs) Market, By Product Type

  • 5.1 Introduction
  • 5.2 Digital ICs
    • 5.2.1 Microprocessors
    • 5.2.2 Microcontrollers
    • 5.2.3 Digital Signal Processors (DSPs)
    • 5.2.4 Logic ICs
  • 5.3 Analog ICs
    • 5.3.1 Linear ICs
    • 5.3.2 Power Management ICs
  • 5.4 Memory ICs
    • 5.4.1 DRAM
    • 5.4.2 SRAM
    • 5.4.3 Flash Memory
    • 5.4.4 ROM
  • 5.5 Mixed-Signal ICs
  • 5.6 Other ICs

6 Global Integrated Circuits (ICs) Market, By Packaging Type

  • 6.1 Introduction
  • 6.2 Surface-Mount Devices (SMD)
    • 6.2.1 Quad Flat Packages (QFP)
    • 6.2.2 Ball Grid Array (BGA)
    • 6.2.3 Chip-Scale Package (CSP)
    • 6.2.4 Chip-on-Board (COB)
    • 6.2.5 Other SMD Packages
  • 6.3 Through-Hole Devices
    • 6.3.1 Dual In-line Packages (DIP)
    • 6.3.2 Pin Grid Array (PGA)
    • 6.3.3 Other Through-Hole Device Packages
  • 6.4 Integrated Circuit Modules
    • 6.4.1 System-in-Package (SiP)
    • 6.4.2 Multi-Chip Modules (MCM)
    • 6.4.3 2.5D & 3D IC Packaging
  • 6.5 Advanced Packaging
    • 6.5.1 Fan-out Package on Laminate (FOPL)
    • 6.5.2 Integrated Fan-Out (IFO)
    • 6.5.3 Chip-on-Wafer (CoW)
    • 6.5.4 Other Advanced Packaging

7 Global Integrated Circuits (ICs) Market, By Design Approach

  • 7.1 Introduction
  • 7.2 General-Purpose ICs
  • 7.3 Application-Specific Integrated Circuits (ASICs)
  • 7.4 Field-Programmable Gate Arrays (FPGAs)
  • 7.5 System-on-Chip (SoC)
  • 7.6 Application-Specific Standard Products (ASSPs)
  • 7.7 Custom ICs

8 Global Integrated Circuits (ICs) Market, By Technology

  • 8.1 Introduction
  • 8.2 Complementary Metal-Oxide-Semiconductor (CMOS)
  • 8.3 Bipolar Complementary Metal-Oxide-Semiconductor (BiCMOS)
  • 8.4 Bipolar
  • 8.5 Gallium Arsenide (GaAs)
  • 8.6 Silicon-Germanium (SiGe)
  • 8.7 Other Technologies

9 Global Integrated Circuits (ICs) Market, By End User

  • 9.1 Introduction
  • 9.2 Consumer Electronics
  • 9.3 Automotive
  • 9.4 IT & Telecommunications
  • 9.5 Manufacturing & Automation
  • 9.6 Healthcare
  • 9.7 Aerospace & Defense
  • 9.8 Other End Users

10 Global Integrated Circuits (ICs) Market, By Geography

  • 10.1 Introduction
  • 10.2 North America
    • 10.2.1 US
    • 10.2.2 Canada
    • 10.2.3 Mexico
  • 10.3 Europe
    • 10.3.1 Germany
    • 10.3.2 UK
    • 10.3.3 Italy
    • 10.3.4 France
    • 10.3.5 Spain
    • 10.3.6 Rest of Europe
  • 10.4 Asia Pacific
    • 10.4.1 Japan
    • 10.4.2 China
    • 10.4.3 India
    • 10.4.4 Australia
    • 10.4.5 New Zealand
    • 10.4.6 South Korea
    • 10.4.7 Rest of Asia Pacific
  • 10.5 South America
    • 10.5.1 Argentina
    • 10.5.2 Brazil
    • 10.5.3 Chile
    • 10.5.4 Rest of South America
  • 10.6 Middle East & Africa
    • 10.6.1 Saudi Arabia
    • 10.6.2 UAE
    • 10.6.3 Qatar
    • 10.6.4 South Africa
    • 10.6.5 Rest of Middle East & Africa

11 Key Developments

  • 11.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 11.2 Acquisitions & Mergers
  • 11.3 New Product Launch
  • 11.4 Expansions
  • 11.5 Other Key Strategies

12 Company Profiling

  • 12.1 AMD
  • 12.2 Analog Devices
  • 12.3 Broadcom Inc.
  • 12.4 Infineon Technologies AG
  • 12.5 Intel Corporation
  • 12.6 Marvell Technology, Inc.
  • 12.7 MediaTek Inc.
  • 12.8 Micron Technology, Inc.
  • 12.9 Nvidia Corporation
  • 12.10 NXP Semiconductors N.V.
  • 12.11 ON Semiconductor Corporation
  • 12.12 Qualcomm Technologies, Inc.
  • 12.13 Renesas Electronics Corporation
  • 12.14 Samsung Electronics
  • 12.15 SK Hynix
  • 12.16 STMicroelectronics N.V.
  • 12.17 Taiwan Semiconductor Manufacturing Company (TSMC)
  • 12.18 Texas Instruments

List of Tables

  • Table 1 Global Integrated Circuits (ICs) Market Outlook, By Region (2022-2030) ($MN)
  • Table 2 Global Integrated Circuits (ICs) Market Outlook, By Product Type (2022-2030) ($MN)
  • Table 3 Global Integrated Circuits (ICs) Market Outlook, By Digital ICs (2022-2030) ($MN)
  • Table 4 Global Integrated Circuits (ICs) Market Outlook, By Microprocessors (2022-2030) ($MN)
  • Table 5 Global Integrated Circuits (ICs) Market Outlook, By Microcontrollers (2022-2030) ($MN)
  • Table 6 Global Integrated Circuits (ICs) Market Outlook, By Digital Signal Processors (DSPs) (2022-2030) ($MN)
  • Table 7 Global Integrated Circuits (ICs) Market Outlook, By Logic ICs (2022-2030) ($MN)
  • Table 8 Global Integrated Circuits (ICs) Market Outlook, By Analog ICs (2022-2030) ($MN)
  • Table 9 Global Integrated Circuits (ICs) Market Outlook, By Linear ICs (2022-2030) ($MN)
  • Table 10 Global Integrated Circuits (ICs) Market Outlook, By Power Management ICs (2022-2030) ($MN)
  • Table 11 Global Integrated Circuits (ICs) Market Outlook, By Memory ICs (2022-2030) ($MN)
  • Table 12 Global Integrated Circuits (ICs) Market Outlook, By DRAM (2022-2030) ($MN)
  • Table 13 Global Integrated Circuits (ICs) Market Outlook, By SRAM (2022-2030) ($MN)
  • Table 14 Global Integrated Circuits (ICs) Market Outlook, By Flash Memory (2022-2030) ($MN)
  • Table 15 Global Integrated Circuits (ICs) Market Outlook, By ROM (2022-2030) ($MN)
  • Table 16 Global Integrated Circuits (ICs) Market Outlook, By Mixed-Signal ICs (2022-2030) ($MN)
  • Table 17 Global Integrated Circuits (ICs) Market Outlook, By Other ICs (2022-2030) ($MN)
  • Table 18 Global Integrated Circuits (ICs) Market Outlook, By Packaging Type (2022-2030) ($MN)
  • Table 19 Global Integrated Circuits (ICs) Market Outlook, By Surface-Mount Devices (SMD) (2022-2030) ($MN)
  • Table 20 Global Integrated Circuits (ICs) Market Outlook, By Quad Flat Packages (QFP) (2022-2030) ($MN)
  • Table 21 Global Integrated Circuits (ICs) Market Outlook, By Ball Grid Array (BGA) (2022-2030) ($MN)
  • Table 22 Global Integrated Circuits (ICs) Market Outlook, By Chip-Scale Package (CSP) (2022-2030) ($MN)
  • Table 23 Global Integrated Circuits (ICs) Market Outlook, By Chip-on-Board (COB) (2022-2030) ($MN)
  • Table 24 Global Integrated Circuits (ICs) Market Outlook, By Other SMD Packages (2022-2030) ($MN)
  • Table 25 Global Integrated Circuits (ICs) Market Outlook, By Through-Hole Devices (2022-2030) ($MN)
  • Table 26 Global Integrated Circuits (ICs) Market Outlook, By Dual In-line Packages (DIP) (2022-2030) ($MN)
  • Table 27 Global Integrated Circuits (ICs) Market Outlook, By Pin Grid Array (PGA) (2022-2030) ($MN)
  • Table 28 Global Integrated Circuits (ICs) Market Outlook, By Other Through-Hole Device Packages (2022-2030) ($MN)
  • Table 29 Global Integrated Circuits (ICs) Market Outlook, By Integrated Circuit Modules (2022-2030) ($MN)
  • Table 30 Global Integrated Circuits (ICs) Market Outlook, By System-in-Package (SiP) (2022-2030) ($MN)
  • Table 31 Global Integrated Circuits (ICs) Market Outlook, By Multi-Chip Modules (MCM) (2022-2030) ($MN)
  • Table 32 Global Integrated Circuits (ICs) Market Outlook, By 2.5D & 3D IC Packaging (2022-2030) ($MN)
  • Table 33 Global Integrated Circuits (ICs) Market Outlook, By Advanced Packaging (2022-2030) ($MN)
  • Table 34 Global Integrated Circuits (ICs) Market Outlook, By Fan-out Package on Laminate (FOPL) (2022-2030) ($MN)
  • Table 35 Global Integrated Circuits (ICs) Market Outlook, By Integrated Fan-Out (IFO) (2022-2030) ($MN)
  • Table 36 Global Integrated Circuits (ICs) Market Outlook, By Chip-on-Wafer (CoW) (2022-2030) ($MN)
  • Table 37 Global Integrated Circuits (ICs) Market Outlook, By Other Advanced Packaging (2022-2030) ($MN)
  • Table 38 Global Integrated Circuits (ICs) Market Outlook, By Design Approach (2022-2030) ($MN)
  • Table 39 Global Integrated Circuits (ICs) Market Outlook, By General-Purpose ICs (2022-2030) ($MN)
  • Table 40 Global Integrated Circuits (ICs) Market Outlook, By Application-Specific Integrated Circuits (ASICs) (2022-2030) ($MN)
  • Table 41 Global Integrated Circuits (ICs) Market Outlook, By Field-Programmable Gate Arrays (FPGAs) (2022-2030) ($MN)
  • Table 42 Global Integrated Circuits (ICs) Market Outlook, By System-on-Chip (SoC) (2022-2030) ($MN)
  • Table 43 Global Integrated Circuits (ICs) Market Outlook, By Application-Specific Standard Products (ASSPs) (2022-2030) ($MN)
  • Table 44 Global Integrated Circuits (ICs) Market Outlook, By Custom ICs (2022-2030) ($MN)
  • Table 45 Global Integrated Circuits (ICs) Market Outlook, By Technology (2022-2030) ($MN)
  • Table 46 Global Integrated Circuits (ICs) Market Outlook, By Complementary Metal-Oxide-Semiconductor (CMOS) (2022-2030) ($MN)
  • Table 47 Global Integrated Circuits (ICs) Market Outlook, By Bipolar Complementary Metal-Oxide-Semiconductor (BiCMOS) (2022-2030) ($MN)
  • Table 48 Global Integrated Circuits (ICs) Market Outlook, By Bipolar (2022-2030) ($MN)
  • Table 49 Global Integrated Circuits (ICs) Market Outlook, By Gallium Arsenide (GaAs) (2022-2030) ($MN)
  • Table 50 Global Integrated Circuits (ICs) Market Outlook, By Silicon-Germanium (SiGe) (2022-2030) ($MN)
  • Table 51 Global Integrated Circuits (ICs) Market Outlook, By Other Technologies (2022-2030) ($MN)
  • Table 52 Global Integrated Circuits (ICs) Market Outlook, By End User (2022-2030) ($MN)
  • Table 53 Global Integrated Circuits (ICs) Market Outlook, By Consumer Electronics (2022-2030) ($MN)
  • Table 54 Global Integrated Circuits (ICs) Market Outlook, By Automotive (2022-2030) ($MN)
  • Table 55 Global Integrated Circuits (ICs) Market Outlook, By IT & Telecommunications (2022-2030) ($MN)
  • Table 56 Global Integrated Circuits (ICs) Market Outlook, By Manufacturing & Automation (2022-2030) ($MN)
  • Table 57 Global Integrated Circuits (ICs) Market Outlook, By Healthcare (2022-2030) ($MN)
  • Table 58 Global Integrated Circuits (ICs) Market Outlook, By Aerospace & Defense (2022-2030) ($MN)
  • Table 59 Global Integrated Circuits (ICs) Market Outlook, By Other End Users (2022-2030) ($MN)

Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.