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市场调查报告书
商品编码
1530860

到 2030 年印刷电路基板(PCB) 市场预测：按产品类型、层压板和材料、製造流程、技术、最终用户和地区进行的全球分析

Printed Circuit Boards Market Forecasts to 2030 - Global Analysis By Product Type, Laminates and Materials, Manufacturing Processes, Technology, End User and By Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 200+ Pages | 商品交期: 2-3个工作天内

价格

根据Stratistics MRC的数据，2024年全球印刷电路基板（PCB）市场规模为924亿美元，预计到2030年将达到1356亿美元，预测期内复合年增长率为6.6%。

印刷电路基板（PCB）是电子设备的基本元件，是非导电基板，其上蚀刻或印刷有导电途径、垫片等。 PCB 是连接和支撑各种电子元件的基础。 PCB 市场涵盖各种应用的基板设计、製造和分销，包括家用电子电器、汽车、通讯和工业领域。

根据IPC（电子工业连接协会）资料，中国仍是最大的PCB生产国，2021年占全球产量的52%。

提高车辆电气化和自动化程度

汽车电气化和自动化趋势是汽车产业PCB需求的主要驱动力。现代汽车需要越来越复杂的电子系统来实现 ADAS（高级驾驶员辅助系统）、资讯娱乐和动力传动系统控制等功能。特别是，电动和自动驾驶汽车严重依赖复杂的 PCB 来管理其复杂的电气和计算系统。这一趋势鼓励汽车製造商在每辆车上使用更多的 PCB，从而刺激市场成长。

原物料价格波动

PCB行业对原材料价格波动非常敏感，尤其是铜，它是PCB製造的关键组成部分。铜等原料价格的波动影响PCB製造商的製造成本和利润率。这种波动可能导致定价不确定性并影响市场成长。製造商可能需要调整其定价策略或寻找替代材料，这可能既困难又耗时，而且市场扩张缓慢。

新技术开发

PCB产业将受惠于5G、物联网(IoT)、人工智慧和先进製造技术等新技术。这些技术正在推动对更复杂、高效能 PCB 的需求。例如，高密度互连（HDI）PCB和柔性PCB的开发在穿戴式装置和小型电子产品中开启了新的应用。此外，3D 列印等 PCB 製造流程的进步为更高效和可客製化的生产提供了机会。

贸易限制

主要经济体（尤其是美国和中国）之间的关税和贸易争端可能会扰乱供应链并增加 PCB 製造商及其客户的成本。这些限制可能会导致采购挑战、价格上涨和市场不确定性。公司可能需要实现供应链多元化或搬迁生产设施，这既昂贵又耗时，并可能影响市场成长和稳定。

COVID-19 的影响：

COVID-19 大流行最初扰乱了 PCB 供应链和製造运营，导致生产延迟和短缺。然而，对支援远端工作和数位服务的电子设备的需求增加部分抵消了这些挑战。这场危机加速了数位转型趋势，为PCB市场创造了长期成长机会，特别是在医疗保健和通讯等领域。

刚性 PCB 领域预计将在预测期内成为最大的领域

刚性 PCB 预计将主导市场，因为它们广泛应用于家用电子电器、汽车和工业应用等各个行业。与柔性 PCB 相比，具有卓越的耐用性、可靠性和温度控管。刚性 PCB 对于高性能电子设备至关重要，它允许将复杂的电路安装在紧凑的空间中。其在大规模生产中的多功能性和成本效益带来了很大的市场占有率，是许多应用的首选。

汽车业预计在预测期内复合年增长率最高

在汽车领域，由于车辆电气化和自动化程度不断提高，对 PCB 的需求预计将快速成长。现代车辆整合了众多电子系统，用于实现资讯娱乐、ADAS 和动力传动系统控制等功能，所有这些都需要复杂的 PCB。向电动和自动驾驶汽车的转变进一步加速了这一趋势，因为这些车辆严重依赖复杂的电子系统。汽车电子产品整合度的不断提高正在推动对 PCB 的巨大需求，从而带动该领域的成长。

占比最大的地区：

预计亚太地区在预测期内将占据最大的市场占有率。亚太地区在 PCB 市场的主导地位归因于中国、台湾、日本和韩国等国家主要电子製造地的存在。该地区拥有强大的供应链、熟练的劳动力和先进的製造能力。此外，该地区消费电子、汽车和通讯行业高度集中，推动了 PCB 需求。政府支持电子製造的措施进一步促进了该地区的市场吸引力。

复合年增长率最高的地区：

预计亚太地区在预测期内将出现良好的成长。亚太地区PCB市场的快速成长得益于多种因素。该地区对 5G、物联网和人工智慧等新兴技术的投资不断增加，这推动了对先进 PCB 的需求。印度、东南亚等国家家电、汽车产品国内市场不断拓展，创造了新的商机。此外，全球电子製造业向亚洲的转移以及政府对电子产业的支持政策正在加速该地区的市场成长。

免费客製化服务：

订阅此报告的客户可以存取以下免费自订选项之一：

  • 公司简介
    • 其他市场参与者的综合分析（最多 3 家公司）
    • 主要企业SWOT分析（最多3家企业）
  • 区域分割
    • 根据客户兴趣对主要国家的市场估计、预测和复合年增长率（註：基于可行性检查）
  • 竞争基准化分析
    • 根据产品系列、地理分布和策略联盟对主要企业基准化分析

目录

第一章执行摘要

第二章 前言

  • 概述
  • 相关利益者
  • 调查范围
  • 调查方法
    • 资料探勘
    • 资料分析
    • 资料检验
    • 研究途径
  • 研究资讯来源
    • 主要研究资讯来源
    • 二次研究资讯来源
    • 先决条件

第三章市场趋势分析

  • 促进因素
  • 抑制因素
  • 机会
  • 威胁
  • 产品分析
  • 技术分析
  • 最终用户分析
  • 新兴市场
  • COVID-19 的影响

第4章波特五力分析

  • 供应商的议价能力
  • 买方议价能力
  • 替代品的威胁
  • 新进入者的威胁
  • 竞争公司之间的敌对关係

第五章全球印刷基板（PCB）市场：依产品类型

  • 刚性PCB
    • 一边
    • 双方
    • 多层
  • 柔性线路板
  • 软硬复合板
  • 高密度互连 (HDI) PCB
  • 其他产品类型
    • 金属芯PCB
    • 铝基板

第六章全球印刷基板(PCB) 市场：依层压板和材料分类

  • 层压型
    • 刚性层压板
    • FR-4标准
    • FR-4高Tg
    • FR-4 无卤
    • 其他硬质层压板
    • 柔性层压板
      • 聚酰亚胺 (PI)
      • 聚四氟乙烯
      • 其他柔性层压板
    • 纸基层压板
    • 复合材料层压板
  • 基材
    • 铜箔
    • 介电材料
    • 黏合层

第七章全球印刷基板（PCB）市场：依製造流程分类

  • 製造过程
    • 内层生产
    • 层压
    • 穿孔
    • 金属化
    • 图案电镀
    • 蚀刻
    • 应用阻焊层
    • 零件的放置与焊接
    • 期末考和检查
  • 组装过程
    • 准备组件
    • 元件放置
    • 涂布焊膏
    • 回流焊接
    • 波峰焊
    • 打扫
    • 检查和测试

第八章全球印刷基板(PCB) 市场：依技术分类

  • 表面黏着技术
  • 3D列印PCB技术
  • 通孔技术
  • 微波和射频技术
  • 嵌入式组件技术
  • 柔性和软硬复合技术
  • 高密度互连（HDI）技术
  • 光化学加工技术
  • 雷射直接成像 (LDI)
  • 其他技术

第九章全球印刷基板(PCB) 市场：依最终用户分类

  • 家电
  • 车
  • 通讯
  • 医疗设备
  • 航太和国防
  • 工业电子
  • 其他最终用户

第十章全球印刷基板（PCB）市场：按地区

  • 北美洲
    • 美国
    • 加拿大
    • 墨西哥
  • 欧洲
    • 德国
    • 英国
    • 义大利
    • 法国
    • 西班牙
    • 其他欧洲国家
  • 亚太地区
    • 日本
    • 中国
    • 印度
    • 澳洲
    • 纽西兰
    • 韩国
    • 其他亚太地区
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 南美洲其他地区
  • 中东/非洲
    • 沙乌地阿拉伯
    • 阿拉伯聯合大公国
    • 卡达
    • 南非
    • 其他中东和非洲

第十一章 主要进展

  • 合约、伙伴关係、协作和合资企业
  • 收购和合併
  • 新产品发布
  • 业务拓展
  • 其他关键策略

第十二章 公司概况

  • TTM Technologies Inc.
  • AT&S
  • Unimicron Technology Corporation
  • Zhen Ding Tech
  • Compeq Manufacturing Co., Ltd.
  • Tripod Technology Corporation
  • Sanmina Corporation
  • Jabil Inc.
  • Wurth Elektronik Group
  • Becker & Muller Schaltungsdruck GmbH
  • RayMing Technology Co.Ltd
  • Plexus Corporation
  • Benchmark Electronics
  • Lenthor Engineering
  • Samsung Electro-Mechanics
  • Daeduck Electronics Co. Ltd.
  • Nan Ya PCB Corporation
  • Ibiden Co., Ltd.
Product Code: SMRC26972

According to Stratistics MRC, the Global Printed Circuit Boards (PCBs) Market is accounted for $92.4 billion in 2024 and is expected to reach $135.6 billion by 2030, growing at a CAGR of 6.6% during the forecast period. Printed Circuit Boards (PCBs) are fundamental components in electronic devices, consisting of a non-conductive substrate with conductive pathways, pads, and other features etched or printed onto it. They serve as the foundation for connecting and supporting various electronic components. The PCB market encompasses the design, manufacturing, and distribution of these boards for diverse applications, including consumer electronics, automotive, telecommunications, and industrial sectors.

According to data from the IPC (Association Connecting Electronics Industries), China remained the largest PCB producer, accounting for 52% of global production in 2021.

Market Dynamics:

Driver:

Increasing electrification and automation of vehicles

The growing trend of vehicle electrification and automation is driving significant demand for PCBs in the automotive industry. Modern vehicles require increasingly complex electronic systems for functions like advanced driver assistance systems (ADAS), infotainment, and powertrain control. Electric and autonomous vehicles, in particular, rely heavily on sophisticated PCBs to manage their intricate electrical and computational systems. This trend is pushing automakers to incorporate more PCBs per vehicle, thereby fueling market growth.

Restraint:

Fluctuating raw material prices

The PCB industry is sensitive to fluctuations in raw material prices, particularly copper, which is a key component in PCB manufacturing. Volatile prices of copper and other materials can impact production costs and profit margins for PCB manufacturers. This instability can lead to pricing uncertainties, potentially affecting market growth. Manufacturers may need to adjust their pricing strategies or seek alternative materials, which can be challenging and time-consuming, potentially slowing down market expansion.

Opportunity:

Development of new technologies

The PCB industry is poised to benefit from emerging technologies such as 5G, Internet of Things (IoT), artificial intelligence, and advanced manufacturing techniques. These technologies are driving demand for more sophisticated and high-performance PCBs. For instance, the developments of high-density interconnect (HDI) PCBs and flexible PCBs opens up new applications in wearable devices and compact electronics. Additionally, advancements in PCB manufacturing processes, such as 3D printing, offer opportunities for more efficient and customizable production.

Threat:

Trade restrictions

Tariffs and trade disputes between major economies, particularly the US and China, can disrupt supply chains and increase costs for PCB manufacturers and their customers. These restrictions can lead to sourcing challenges, price increases, and market uncertainties. Companies may need to diversify their supply chains or relocate production facilities, which can be costly, and time-consuming, potentially impacting market growth and stability.

Covid-19 Impact:

The COVID-19 pandemic initially disrupted PCB supply chains and manufacturing operations, causing production delays and shortages. However, increased demand for electronics supporting remote work and digital services partially offset these challenges. The crisis accelerated digital transformation trends, creating long-term growth opportunities for the PCB market, particularly in sectors like healthcare and telecommunications.

The rigid PCBs segment is expected to be the largest during the forecast period

Rigid PCBs are expected to dominate the market due to their widespread use across various industries, including consumer electronics, automotive, and industrial applications. They offer superior durability, reliability, and thermal management compared to flexible PCBs. Rigid PCBs are essential in high-performance electronic devices and can accommodate complex circuitry in a compact space. Their versatility and cost-effectiveness for mass production contribute to their large market share, making them the preferred choice for many applications.

The automotive segment is expected to have the highest CAGR during the forecast period

The automotive sector is expected to register rapid growth in PCB demand due to increasing vehicle electrification and automation. Modern vehicles incorporate numerous electronic systems for functions like infotainment, ADAS, and powertrain control, all requiring sophisticated PCBs. The shift towards electric and autonomous vehicles is further accelerating this trend, as these vehicles rely heavily on complex electronic systems. This growing integration of electronics in automobiles is driving significant demand for PCBs, resulting in segment growth.

Region with largest share:

This Asia Pacific region is estimated to command the largest market share over the prediction period. Asia Pacific's dominance in the PCB market is driven by the presence of major electronics manufacturing hubs in countries like China, Taiwan, Japan, and South Korea. The region boasts a robust supply chain, a skilled workforce, and advanced manufacturing capabilities. Additionally, the high concentration of consumer electronics, automotive, and telecommunications industries in this region fuels the demand for PCBs. Government initiatives supporting electronics manufacturing further contribute to the region's market leadership.

Region with highest CAGR:

This Asia Pacific region is anticipated to witness lucrative growth during the forecast period. Asia Pacific's rapid growth in the PCB market is attributed to several factors. The region is experiencing increasing investments in emerging technologies like 5G, IoT, and AI, which drive demand for advanced PCBs. Growing domestic markets for consumer electronics and automotive products in countries like India and Southeast Asian nations are creating new opportunities. Additionally, the shift of global electronics manufacturing towards Asia and supportive government policies for the electronics industry are accelerating market growth in this region.

Key players in the market

Some of the key players in Printed Circuit Boards (PCBs) market include TTM Technologies Inc., AT&S, Unimicron Technology Corporation, Zhen Ding Tech, Compeq Manufacturing Co., Ltd., Tripod Technology Corporation, Sanmina Corporation, Jabil Inc., Wurth Elektronik Group, Becker & Muller Schaltungsdruck GmbH, RayMing Technology Co., Ltd., Plexus Corporation, Benchmark Electronics, Lenthor Engineering, Samsung Electro-Mechanics, Daeduck Electronics Co. Ltd., Nan Ya PCB Corporation, and Ibiden Co., Ltd.

Key Developments:

In May 2023, TTM Technologies, Inc., a leading global manufacturer of technology solutions including mission systems, radio frequency ("RF") components and RF microwave/microelectronic assemblies and printed circuit boards ("PCB"s) has announced the launch of its 5mm x 3.2mm X-Band 8-12 GHz 3dB hybrid coupler and 20dB directional coupler. These state-of-the-art components are designed to meet the demanding requirements of broadband use in medium power X-Band (8-12GHz) commercial-off-the-shelf (COTS) military and aerospace (Mil-Aero) applications.

In January 2024, AT&S opens its first plant in Malaysia. The Austrian company's new plant in Kulim will produce IC substrates for the next generation of microchips for high-performance computing, data centres and AI applications from manufacturers such as AMD.

In June 2023, HDI PCB maker Compeq Manufacturing is scheduled to kick off production at its new plant in Thailand in the second half of 2024, according to the Taiwan-based company.

Product Types Covered:

  • Rigid PCBs
  • Flexible PCBs
  • Rigid-Flex PCBs
  • High Density Interconnect (HDI) PCBs
  • Other Product Types

Laminates and Materials Covered:

  • Laminate Types
  • Base Materials

Manufacturing Processes Covered:

  • Fabrication Process
  • Assembly Process

Technologies Covered:

  • Surface Mount Technology
  • 3D Printed PCB Technology
  • Through-Hole Technology
  • Microwave and RF Technology
  • Embedded Component Technology
  • Flexible and rigid-flex technology
  • High-Density Interconnect (HDI) Technology
  • Photochemical Machining Technology
  • Laser Direct Imaging (LDI)
  • Other Technologies

End Users Covered:

  • Consumer Electronics
  • Automotive
  • Telecommunications
  • Medical Devices
  • Aerospace and Defense
  • Industrial Electronics
  • Other End Users

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2022, 2023, 2024, 2026, and 2030
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Product Analysis
  • 3.7 Technology Analysis
  • 3.8 End User Analysis
  • 3.9 Emerging Markets
  • 3.10 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global Printed Circuit Boards (PCBs) Market, By Product Type

  • 5.1 Introduction
  • 5.2 Rigid PCBs
    • 5.2.1 Single-sided
    • 5.2.2 Double-sided
    • 5.2.3 Multi-layer
  • 5.3 Flexible PCBs
  • 5.4 Rigid-Flex PCBs
  • 5.5 High Density Interconnect (HDI) PCBs
  • 5.6 Other Product Types
    • 5.6.1 Metal Core PCBs
    • 5.6.2 Aluminum PCBs

6 Global Printed Circuit Boards (PCBs) Market, By Laminates and Materials

  • 6.1 Introduction
  • 6.2 Laminate Types
    • 6.2.1 Rigid Laminates
    • 6.2.1 FR-4 Standard
    • 6.2.2 FR-4 High Tg
    • 6.2.3 FR-4 Halogen-Free
    • 6.2.4 Other Rigid Laminates
    • 6.2.2 Flexible Laminates
      • 6.2.2.1 Polyimide (PI)
      • 6.2.2.2 Teflon
      • 6.2.2.3 Other Flexible Laminates
    • 6.2.3 Paper-Based Laminates
    • 6.2.4 Composite Laminates
  • 6.3 Base Materials
    • 6.3.1 Copper Foil
    • 6.3.2 Dielectric Materials
    • 6.3.3 Adhesive Layers

7 Global Printed Circuit Boards (PCBs) Market, By Manufacturing Processes

  • 7.1 Introduction
  • 7.2 Fabrication Process
    • 7.2.1 Inner Layer Production
    • 7.2.2 Lamination
    • 7.2.3 Drilling
    • 7.2.4 Metallization
    • 7.2.5 Pattern Plating
    • 7.2.6 Etching
    • 7.2.7 Solder Mask Application
    • 7.2.8 Component Placement and Soldering
    • 7.2.9 Final Testing and Inspection
  • 7.3 Assembly Process
    • 7.3.1 Component Preparation
    • 7.3.2 Component Placement
    • 7.3.3 Solder Paste Application
    • 7.3.4 Reflow Soldering
    • 7.3.5 Wave Soldering
    • 7.3.6 Cleaning
    • 7.3.7 Inspection and Testing

8 Global Printed Circuit Boards (PCBs) Market, By Technology

  • 8.1 Introduction
  • 8.2 Surface Mount Technology
  • 8.3 3D Printed PCB Technology
  • 8.4 Through-Hole Technology
  • 8.5 Microwave and RF Technology
  • 8.6 Embedded Component Technology
  • 8.7 Flexible and rigid-flex technology
  • 8.8 High-Density Interconnect (HDI) Technology
  • 8.9 Photochemical Machining Technology
  • 8.10 Laser Direct Imaging (LDI)
  • 8.11 Other Technologies

9 Global Printed Circuit Boards (PCBs) Market, By End User

  • 9.1 Introduction
  • 9.2 Consumer Electronics
  • 9.3 Automotive
  • 9.4 Telecommunications
  • 9.5 Medical Devices
  • 9.6 Aerospace and Defense
  • 9.7 Industrial Electronics
  • 9.8 Other End Users

10 Global Printed Circuit Boards (PCBs) Market, By Geography

  • 10.1 Introduction
  • 10.2 North America
    • 10.2.1 US
    • 10.2.2 Canada
    • 10.2.3 Mexico
  • 10.3 Europe
    • 10.3.1 Germany
    • 10.3.2 UK
    • 10.3.3 Italy
    • 10.3.4 France
    • 10.3.5 Spain
    • 10.3.6 Rest of Europe
  • 10.4 Asia Pacific
    • 10.4.1 Japan
    • 10.4.2 China
    • 10.4.3 India
    • 10.4.4 Australia
    • 10.4.5 New Zealand
    • 10.4.6 South Korea
    • 10.4.7 Rest of Asia Pacific
  • 10.5 South America
    • 10.5.1 Argentina
    • 10.5.2 Brazil
    • 10.5.3 Chile
    • 10.5.4 Rest of South America
  • 10.6 Middle East & Africa
    • 10.6.1 Saudi Arabia
    • 10.6.2 UAE
    • 10.6.3 Qatar
    • 10.6.4 South Africa
    • 10.6.5 Rest of Middle East & Africa

11 Key Developments

  • 11.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 11.2 Acquisitions & Mergers
  • 11.3 New Product Launch
  • 11.4 Expansions
  • 11.5 Other Key Strategies

12 Company Profiling

  • 12.1 TTM Technologies Inc.
  • 12.2 AT&S
  • 12.3 Unimicron Technology Corporation
  • 12.4 Zhen Ding Tech
  • 12.5 Compeq Manufacturing Co., Ltd.
  • 12.6 Tripod Technology Corporation
  • 12.7 Sanmina Corporation
  • 12.8 Jabil Inc.
  • 12.9 Wurth Elektronik Group
  • 12.10 Becker & Muller Schaltungsdruck GmbH
  • 12.11 RayMing Technology Co.Ltd
  • 12.12 Plexus Corporation
  • 12.13 Benchmark Electronics
  • 12.14 Lenthor Engineering
  • 12.15 Samsung Electro-Mechanics
  • 12.16 Daeduck Electronics Co. Ltd.
  • 12.17 Nan Ya PCB Corporation
  • 12.18 Ibiden Co., Ltd.

List of Tables

  • Table 1 Global Printed Circuit Boards (PCBs) Market Outlook, By Region (2022-2030) ($MN)
  • Table 2 Global Printed Circuit Boards (PCBs) Market Outlook, By Product Type (2022-2030) ($MN)
  • Table 3 Global Printed Circuit Boards (PCBs) Market Outlook, By Rigid PCBs (2022-2030) ($MN)
  • Table 4 Global Printed Circuit Boards (PCBs) Market Outlook, By Single-sided (2022-2030) ($MN)
  • Table 5 Global Printed Circuit Boards (PCBs) Market Outlook, By Double-sided (2022-2030) ($MN)
  • Table 6 Global Printed Circuit Boards (PCBs) Market Outlook, By Multi-layer (2022-2030) ($MN)
  • Table 7 Global Printed Circuit Boards (PCBs) Market Outlook, By Flexible PCBs (2022-2030) ($MN)
  • Table 8 Global Printed Circuit Boards (PCBs) Market Outlook, By Rigid-Flex PCBs (2022-2030) ($MN)
  • Table 9 Global Printed Circuit Boards (PCBs) Market Outlook, By High Density Interconnect (HDI) PCBs (2022-2030) ($MN)
  • Table 10 Global Printed Circuit Boards (PCBs) Market Outlook, By Other Product Types (2022-2030) ($MN)
  • Table 11 Global Printed Circuit Boards (PCBs) Market Outlook, By Metal Core PCBs (2022-2030) ($MN)
  • Table 12 Global Printed Circuit Boards (PCBs) Market Outlook, By Aluminum PCBs (2022-2030) ($MN)
  • Table 13 Global Printed Circuit Boards (PCBs) Market Outlook, By Laminates and Materials (2022-2030) ($MN)
  • Table 14 Global Printed Circuit Boards (PCBs) Market Outlook, By Laminate Types (2022-2030) ($MN)
  • Table 15 Global Printed Circuit Boards (PCBs) Market Outlook, By Rigid Laminates (2022-2030) ($MN)
  • Table 16 Global Printed Circuit Boards (PCBs) Market Outlook, By Flexible Laminates (2022-2030) ($MN)
  • Table 17 Global Printed Circuit Boards (PCBs) Market Outlook, By Paper-Based Laminates (2022-2030) ($MN)
  • Table 18 Global Printed Circuit Boards (PCBs) Market Outlook, By Composite Laminates (2022-2030) ($MN)
  • Table 19 Global Printed Circuit Boards (PCBs) Market Outlook, By Base Materials (2022-2030) ($MN)
  • Table 20 Global Printed Circuit Boards (PCBs) Market Outlook, By Copper Foil (2022-2030) ($MN)
  • Table 21 Global Printed Circuit Boards (PCBs) Market Outlook, By Dielectric Materials (2022-2030) ($MN)
  • Table 22 Global Printed Circuit Boards (PCBs) Market Outlook, By Adhesive Layers (2022-2030) ($MN)
  • Table 23 Global Printed Circuit Boards (PCBs) Market Outlook, By Manufacturing Processes (2022-2030) ($MN)
  • Table 24 Global Printed Circuit Boards (PCBs) Market Outlook, By Fabrication Process (2022-2030) ($MN)
  • Table 25 Global Printed Circuit Boards (PCBs) Market Outlook, By Inner Layer Production (2022-2030) ($MN)
  • Table 26 Global Printed Circuit Boards (PCBs) Market Outlook, By Lamination (2022-2030) ($MN)
  • Table 27 Global Printed Circuit Boards (PCBs) Market Outlook, By Drilling (2022-2030) ($MN)
  • Table 28 Global Printed Circuit Boards (PCBs) Market Outlook, By Metallization (2022-2030) ($MN)
  • Table 29 Global Printed Circuit Boards (PCBs) Market Outlook, By Pattern Plating (2022-2030) ($MN)
  • Table 30 Global Printed Circuit Boards (PCBs) Market Outlook, By Etching (2022-2030) ($MN)
  • Table 31 Global Printed Circuit Boards (PCBs) Market Outlook, By Solder Mask Application (2022-2030) ($MN)
  • Table 32 Global Printed Circuit Boards (PCBs) Market Outlook, By Component Placement and Soldering (2022-2030) ($MN)
  • Table 33 Global Printed Circuit Boards (PCBs) Market Outlook, By Final Testing and Inspection (2022-2030) ($MN)
  • Table 34 Global Printed Circuit Boards (PCBs) Market Outlook, By Assembly Process (2022-2030) ($MN)
  • Table 35 Global Printed Circuit Boards (PCBs) Market Outlook, By Component Preparation (2022-2030) ($MN)
  • Table 36 Global Printed Circuit Boards (PCBs) Market Outlook, By Component Placement (2022-2030) ($MN)
  • Table 37 Global Printed Circuit Boards (PCBs) Market Outlook, By Solder Paste Application (2022-2030) ($MN)
  • Table 38 Global Printed Circuit Boards (PCBs) Market Outlook, By Reflow Soldering (2022-2030) ($MN)
  • Table 39 Global Printed Circuit Boards (PCBs) Market Outlook, By Wave Soldering (2022-2030) ($MN)
  • Table 40 Global Printed Circuit Boards (PCBs) Market Outlook, By Cleaning (2022-2030) ($MN)
  • Table 41 Global Printed Circuit Boards (PCBs) Market Outlook, By Inspection and Testing (2022-2030) ($MN)
  • Table 42 Global Printed Circuit Boards (PCBs) Market Outlook, By Technology (2022-2030) ($MN)
  • Table 43 Global Printed Circuit Boards (PCBs) Market Outlook, By Surface Mount Technology (2022-2030) ($MN)
  • Table 44 Global Printed Circuit Boards (PCBs) Market Outlook, By 3D Printed PCB Technology (2022-2030) ($MN)
  • Table 45 Global Printed Circuit Boards (PCBs) Market Outlook, By Through-Hole Technology (2022-2030) ($MN)
  • Table 46 Global Printed Circuit Boards (PCBs) Market Outlook, By Microwave and RF Technology (2022-2030) ($MN)
  • Table 47 Global Printed Circuit Boards (PCBs) Market Outlook, By Embedded Component Technology (2022-2030) ($MN)
  • Table 48 Global Printed Circuit Boards (PCBs) Market Outlook, By Flexible and rigid-flex technology (2022-2030) ($MN)
  • Table 49 Global Printed Circuit Boards (PCBs) Market Outlook, By High-Density Interconnect (HDI) Technology (2022-2030) ($MN)
  • Table 50 Global Printed Circuit Boards (PCBs) Market Outlook, By Photochemical Machining Technology (2022-2030) ($MN)
  • Table 51 Global Printed Circuit Boards (PCBs) Market Outlook, By Laser Direct Imaging (LDI) (2022-2030) ($MN)
  • Table 52 Global Printed Circuit Boards (PCBs) Market Outlook, By Other Technologies (2022-2030) ($MN)
  • Table 53 Global Printed Circuit Boards (PCBs) Market Outlook, By End User (2022-2030) ($MN)
  • Table 54 Global Printed Circuit Boards (PCBs) Market Outlook, By Consumer Electronics (2022-2030) ($MN)
  • Table 55 Global Printed Circuit Boards (PCBs) Market Outlook, By Automotive (2022-2030) ($MN)
  • Table 56 Global Printed Circuit Boards (PCBs) Market Outlook, By Telecommunications (2022-2030) ($MN)
  • Table 57 Global Printed Circuit Boards (PCBs) Market Outlook, By Medical Devices (2022-2030) ($MN)
  • Table 58 Global Printed Circuit Boards (PCBs) Market Outlook, By Aerospace and Defense (2022-2030) ($MN)
  • Table 59 Global Printed Circuit Boards (PCBs) Market Outlook, By Industrial Electronics (2022-2030) ($MN)
  • Table 60 Global Printed Circuit Boards (PCBs) Market Outlook, By Other End Users (2022-2030) ($MN)

Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.