市场调查报告书
商品编码
1625313
2030 年多媒体 IC 市场预测:按类型、通路类型、应用和地区分類的全球分析Multimedia ICs Market Forecasts to 2030 - Global Analysis By Type (Multimedia Misc and Video ICs), Channel Type (1-16 Channel, 16-32 Channel, 32-64 Channel and Above 64 Channel), Application and by Geography |
根据Stratistics MRC预测,2024年全球多媒体IC市场规模将达417.2亿美元,预计2030年将达到882.5亿美元,预测期内复合年增长率为13.3%。
多媒体 IC 是专门用于处理和管理音讯、视讯和影像讯号等多媒体资料的半导体元件。编码、解码、压缩和讯号处理只是这些积体电路 (IC) 组合在一起为各种设备提供流畅的多媒体性能的部分功能。多媒体 IC 有助于高画质视讯播放、提高音讯品质和有效的电源管理。
根据美国国际贸易委员会(USITC)统计,截至2021年,全球约有8,000个实体资料中心,显着推动了对用于资料处理和储存的多媒体IC的需求。
家电需求扩大
智慧型手机、平板电脑、智慧型电视、笔记型电脑、游戏机和穿戴式科技的普及极大地推动了对多媒体 IC 的需求。处理高解析度音讯、视讯和影像内容的现代设备依赖这些集成电路。全球每年售出超过 12 亿部智慧型手机,多媒体 IC 透过提供先进的相机功能、引人入胜的游戏和流畅的串流媒体来改善用户体验至关重要。此外,由于 4K 和 8K 电视以及超薄笔记型电脑的使用增加,对能够管理大量多媒体资料的有效多媒体 IC 的需求也在增加。
设计和製造成本高
多媒体积体电路是利用先进的半导体製造技术、复杂的设计程序以及庞大的研发成本开发的。 7nm和5nm节点等创新技术的设计、测试和製造成本都非常高。此外,将人工智慧功能、音讯管理和视讯处理等多种功能整合到单一晶片中也会增加开发成本。这些高昂的成本是新兴企业和小型企业进入的主要障碍,抑制了竞争和创新。
AR/VR 和游戏应用程式的成长
随着扩增实境(AR)、虚拟实境(VR)和游戏应用的快速发展,多媒体IC有很多机会。 AR/VR 设备需要 IC 能够提供即时视讯处理、3D 渲染和音讯同步,同时保持低延迟和高功效。同样,游戏产业对具有强大多媒体积体电路的装置(例如游戏机、个人电脑和手持装置)的需求也在激增。此外,多媒体IC在实现下一代身临其境型体验方面具有巨大潜力,特别是在教育、医疗保健和娱乐等领域。
市场竞争加剧
多媒体IC市场的竞争异常激烈,既有许多老牌竞争对手,也有新进业者不断进入该市场。行业领导者高通、博通、联发科、英特尔和德克萨斯凭藉其尖端产品控制着大部分市场,使得小型企业和新兴企业难以扩大市场占有率。此外,科技的快速发展迫使企业不断创新以保持竞争力,从而增加了研发(R&D)成本。竞争对手公司之间争夺市场占有率的价格竞争进一步降低了利润率,尤其是在消费者对价格敏感的行业。
由于供应链中断、工厂关闭以及中国、台湾和韩国等主要半导体中心的製造能力下降,COVID-19 大流行对多媒体积体电路市场造成了严重破坏。由于全球晶片短缺,集成电路製造商被迫提高产量,而笔记型电脑、智慧型手机以及用于远端工作和教育的游戏机等消费性电子产品的需求不断增长,加剧了这种短缺。此外,疫情也减缓了汽车和产业部门的发展,最初推迟了产品发布,但加速了数位化和串流媒体服务,推动了对智慧电视、AR/VR设备和视讯会议系统等多媒体IC的需求增加。
视讯IC领域预计在预测期内规模最大
预计多媒体积体电路市场将由视讯IC领域主导。此类别包括专门用于管理视讯处理功能(例如解码、编码、缩放和压缩)的积体电路。许多应用都依赖视讯积体电路 (IC),包括消费性电子产品(智慧型手机、智慧电视、游戏机)、车载资讯娱乐系统、安全监控和串流服务。此外,对 4K/8K 视讯内容、高清显示器和视讯会议技术不断增长的需求也大大增加了对先进视讯积体电路 (IC) 的需求。
预计超过 64 个通路细分市场在预测期内复合年增长率最高
在多媒体IC市场中,64通道及以上细分市场预计将以最高的复合年增长率成长。此细分市场专注于高通道数商务用(IC)。由于对高清多媒体内容的需求不断增长以及扩增实境(AR)和虚拟实境(VR)等身临其境型技术的出现,该市场正在不断扩大。此外,消费性电子和汽车对先进音响系统的需求,例如多区域音讯应用和环绕音响系统,也推动了市场的爆炸性成长。
亚太地区拥有重要的半导体製造商和消费性电子产品的强劲需求,占据了多媒体积体电路市场的最大份额。中国、韩国、日本和台湾等国家拥有强大的电子工业和先进的半导体製造能力,是重要的多媒体积体电路生产中心。由于该地区智慧型手机、智慧型电视、游戏机和汽车资讯娱乐系统的快速普及,多媒体 IC 的需求量很大。此外,亚太市场的成长也得益于该地区对5G基础设施、人工智慧和物联网技术投资的增加。
多媒体 IC 市场预计将以北美地区最高的复合年增长率成长。这一增长是由于越来越多地使用尖端多媒体技术(例如 5G 连接、人工智慧影像处理以及高清音讯和视讯系统)推动的。该地区智慧家电、无人驾驶汽车以及AR和VR等身临其境型娱乐技术的快速发展也推动了对多媒体IC的需求。此外,半导体行业主要参与者的存在以及消费者对下一代多媒体设备的高支出也推动了北美市场的快速扩张。
According to Stratistics MRC, the Global Multimedia ICs Market is accounted for $41.72 billion in 2024 and is expected to reach $88.25 billion by 2030 growing at a CAGR of 13.3% during the forecast period. Multimedia Integrated Circuits (ICs) are specialized semiconductor components designed to process and manage multimedia data, including audio, video, and image signals. Encoding, decoding, compression, and signal processing are just a few of the functions that these integrated circuits (ICs) combine to provide smooth multimedia performance across a range of devices. Multimedia integrated circuits (ICs) facilitate high-resolution video playback, improved audio quality, and effective power management.
According to the United States International Trade Commission (USITC), the world had approximately 8,000 physical data centers as of 2021, which significantly drives the demand for multimedia ICs used in data processing and storage.
Growing consumer electronics demand
Multimedia IC demand has been greatly boosted by the growing use of smartphones, tablets, smart TVs, laptops, gaming consoles, and wearable technology. Modern devices that process high-definition audio, video, and image content depend on these integrated circuits. With over 1.2 billion smartphones sold worldwide each year, multimedia integrated circuits (ICs) are essential for enhancing user experience through the provision of sophisticated camera features, engaging gaming, and smooth streaming. Additionally, the demand for effective multimedia ICs that can manage massive volumes of multimedia data is also being fueled by the increasing use of 4K and 8K TVs as well as ultra-thin laptops.
High costs of design and production
Multimedia integrated circuits are developed using sophisticated semiconductor fabrication techniques, intricate design procedures, and substantial R&D expenditures. Innovative technologies such as 7nm and 5nm nodes come with extraordinarily high design, testing, and manufacturing costs. Furthermore, the cost of development goes up when several features, like AI capabilities, audio management, and video processing, are combined into a single chip. These exorbitant expenses present a significant obstacle to entry for startups or smaller businesses, stifling competition and innovation.
Growth of AR/VR and gaming applications
Multimedia ICs have lots of opportunities due to the quick development of augmented reality (AR), virtual reality (VR), and gaming applications. ICs that can provide real-time video processing, 3D rendering, and audio synchronization while preserving low latency and high power efficiency are necessary for AR/VR devices. Similar to this, the gaming industry is seeing a sharp increase in demand for gadgets with potent multimedia integrated circuits, such as gaming consoles, PCs, and handhelds. Moreover, multimedia ICs have a lot of potential to power next-generation immersive experiences, especially in sectors like education, healthcare, and entertainment.
Intensive competition in the market
Due to the large number of well-established competitors and the ongoing influx of new ones, the market for multimedia integrated circuits is extremely competitive. With their cutting-edge products, industry leaders Qualcomm, Broadcom, MediaTek, Intel, and Texas Instruments control a large portion of the market, making it difficult for smaller or more recent firms to increase their market share. Furthermore, because of the speed at which technology is developing, businesses must constantly innovate in order to remain competitive, which drives up research and development (R&D) expenses. Price wars between rivals for market share further reduce profit margins, particularly in areas where consumers are price sensitive.
Due to supply chain disruptions, factory closures, and decreased manufacturing capacity in major semiconductor hubs like China, Taiwan, and South Korea, the COVID-19 pandemic severely disrupted the multimedia integrated circuits market. IC manufacturers were under tremendous pressure to increase production due to the global chip shortage, which was made worse by the growing demand for consumer electronics like laptops, smartphones, and gaming consoles for remote work and education. Moreover, the pandemic slowed down the automotive and industrial sectors and delayed product launches at first, but it also sped up digitization and streaming services, which increased demand for multimedia integrated circuits (ICs) in smart TVs, AR/VR devices, and video conferencing systems.
The Video ICs segment is expected to be the largest during the forecast period
The market for multimedia integrated circuits is expected to be dominated by the video ICs segment. Integrated circuits made especially for managing video processing functions like decoding, encoding, scaling, and compression are included in this category. Numerous applications, such as consumer electronics (smartphones, smart TVs, and game consoles), automotive infotainment systems, security surveillance, and streaming services, depend on video integrated circuits (ICs). Additionally, the demand for advanced video integrated circuits (ICs) has increased dramatically due to the growing demand for 4K/8K video content, high-definition displays, and video conferencing technologies.
The Above 64 Channel segment is expected to have the highest CAGR during the forecast period
In the market for multimedia ICs, the above 64-channel segment is anticipated to grow at the highest CAGR. For cutting-edge applications like 4K/8K video streaming, high-performance audio systems, and multichannel audio-video processing for sectors like broadcasting, home entertainment, and professional audio-video equipment, this segment comprises integrated circuits (ICs) with high channel counts. This market is expanding due to the growing need for high-definition multimedia content and the emergence of immersive technologies like augmented reality (AR) and virtual reality (VR). Furthermore, the demand for sophisticated sound systems in consumer electronics and automobiles, such as multi-zone audio applications and surround sound systems is also fueling the market's explosive growth.
Due to the presence of important semiconductor manufacturers and the strong demand for consumer electronics, the Asia-Pacific region has the largest share of the multimedia integrated circuits market. Because of their strong electronics industries and sophisticated semiconductor manufacturing capabilities, nations like China, South Korea, Japan, and Taiwan are important centers for the production of multimedia integrated circuits. Multimedia ICs are in high demand due to the region's quick adoption of smartphones, smart TVs, gaming consoles, and car infotainment systems. Moreover, the market's growth in APAC is also aided by the region's increasing investments in 5G infrastructure, AI, and IoT technologies.
The multimedia ICs market is anticipated to grow at the highest CAGR in the North American region. The growing use of cutting-edge multimedia technologies like 5G connectivity, AI-driven video processing, and high-definition audio-video systems is what is causing this growth. Multimedia IC demand is also being driven by the region's fast development of smart home appliances, driverless cars, and immersive entertainment technologies like AR and VR. Additionally, the market's rapid expansion in North America is also being aided by the presence of significant players in the semiconductor sector and high consumer spending on next-generation multimedia devices.
Key players in the market
Some of the key players in Multimedia ICs market include FTDI Company, Analog Devices Inc, Infineon, STMicroelectronics, Fairchild Semiconductor, Texas Instruments, ROHM Semiconductor, Maxim Integrated Inc, Pericom, NXP Semiconductors, Cypress Semiconductor, Semtech, Microchip Technology Incorporated, ON Semiconductor and MACOM.
In November 2024, Infineon Technologies AG and multinational electric vehicle (EV) automaker Stellantis N.V. announced that they signed an agreement to work together on the power architecture for Stellantis' EVs. Stellantis and Infineon, the number one automotive microcontroller supplier in the world, have already been collaborating since 2022, with Infineon providing silicon carbide (SiC) semiconductors to the EV manufacturer.
In November 2024, STMicroelectronics announced a 21-year Power Purchase Agreement (PPA) with BKH Solar Sdn Bhd, an entity jointly established by ENGIE Renewable SEA Pte Ltd (ENGIE), a renowned global leader in low-carbon energy and services, and Conextone Energy Sdn Bhd, a rapidly emerging solar energy developer in Malaysia.
In September 2024, Analog Devices, Inc. and Tata Group announced a strategic alliance to explore potential cooperative manufacturing opportunities. Tata Electronics, Tata Motors, and Tejas Networks signed a Memorandum of Understanding (MoU) with ADI to enhance strategic and business cooperation, explore opportunities for semiconductor manufacturing in India, and use ADI's products in Tata applications like electric vehicles and network infrastructure.