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市场调查报告书
商品编码
1744546
2032 年 DRAM 市场预测:按类型、技术、应用和地区进行的全球分析DRAM Market Forecasts to 2032 - Global Analysis By Type (Double Data Rate SDRAM, 3D DRAM, Graphics DDR and Other Types), Technology, Application and By Geography |
根据 Stratistics MRC 的数据,预计 2025 年全球 DRAM 市场规模将达到 1,285.7 亿美元,到 2032 年将达到 2,335.2 亿美元,预测期内的复合年增长率为 8.9%。
电脑、伺服器和行动装置中常见的挥发性记忆体称为动态随机存取记忆体 (DRAM),用于临时储存处理器完成任务所需的资料。与必须频繁刷新才能保留资料的静态随机存取记忆体 (SRAM) 不同,DRAM 中的每一位资料都存储在积体电路内不同的电容器中。由于 DRAM 需要刷新,因此其速度比其他类型的记忆体慢,但其高密度和相对较低的每位元成本使其成为提供大量工作记忆体的理想选择。 DRAM 也会影响程式载入、多工处理和资料处理的速度,使其成为整体系统效能的关键因素。
根据半导体产业协会(SIA)预测,2024年全球半导体市场销售额将创下历史新高,达6,276亿美元,较2023年成长19.1%。其中,作为记忆体子集的DRAM产品销售额将成长82.6%,成为2024年产品类型中增幅最大的产品。
消费性电子产品和智慧型手机的兴起
DRAM 市场深受智慧型手机快速普及的影响,尤其是在新兴市场。 5G 连接、AI 应用和高解析度相机等高级功能在智慧型手机中日益普及,所有这些都需要更快、更大的记忆体容量。此外,DRAM 也用于平板电脑、智慧型手錶、智慧电视和 AR/VR 设备等消费性电子产品,以实现高效的多任务处理和更快的效能。随着OEM追求功能更强大、效能更强劲的设备,DRAM 的单位需求持续成长。
资金投入高、技术复杂
生产 DRAM 需要巨额资本投入,包括晶圆厂、无尘室以及先进的微影术和蚀刻设备。随着 DRAM 节点的缩小(1z、1a、1b 等),企业必须维持研发支出才能维持竞争力。包括三星、SK 海力士和美光在内的少数竞争对手能够承担保持领先地位所需的数十亿美元的投资。高门槛制约了创新和市场多元化。此外,随着 DRAM 节点的缩小,成本效益变得更加复杂,技术复杂性、产量比率问题和漏电问题日益突出。
人工智慧和边缘运算应用的成长
随着人工智慧在医疗、金融和智慧製造等各行各业的日益融合,对快速、低延迟记忆体进行即时资料处理的需求也日益增长。 DRAM 对于人工智慧演算法的高效运作至关重要,尤其是在自然语言处理、影像识别和深度学习等任务中。对于即时分析,在靠近资料来源执行运算的边缘设备(例如自动驾驶汽车、工业机器人和监视录影机)将依赖高性能 DRAM。此外,边缘人工智慧的发展将推动对小型化、节能型 DRAM(例如 LPDDR5 和 HBM(高频宽记忆体))的长期需求。
市场饱和,价格竞争加剧
三星电子、SK海力士和美光科技三家公司占据了全球DRAM产量的90%以上,引领市场。这种寡占导致了激烈的价格竞争,尤其是在供应过剩的情况下。为了保住市场占有率,製造商频繁降价,从而降低了行业利润率。此外,智慧型手机和个人电脑等成熟消费市场的DRAM需求成长已经放缓,导致市场饱和。这些因素使得新参与企业难以获得发展动力,而现有企业也难以维持收益成长。
新冠疫情对 DRAM 市场产生了多重影响。由于供应链中断和工厂停工,半导体产业在 2020 年初首次经历了生产放缓和不确定性。然而,随着远距办公、线上学习和数位娱乐的普及,对笔记型电脑、伺服器和云端基础设施的需求也随之增长,导致 DRAM 使用量激增。汽车和工业领域需求的下降被资料中心和消费性电子产品製造商为满足日益增长的需求而增加的订单所抵消。总体而言,儘管物流挑战和零件短缺在短期内造成了限制,但疫情加速了数位转型,提升了 DRAM 市场的长期成长前景。
预计双倍资料速率 SDRAM(DDR SDRAM)部分在预测期内将占据最大份额。
DDR SDRAM 是伺服器、行动电话、笔记型电脑和个人电脑等各种应用中最常见的 DRAM 类型。由于其高速资料传输能力和价格实惠,预计双倍资料速率 SDRAM (DDR SDRAM) 细分市场将在预测期内占据最大的市场占有率。随着 DDR4 和 DDR5 等后续产品在频宽、能源效率和容量方面不断提升,该细分市场将推动云端运算、人工智慧和游戏等数据密集型业务的发展。由于 DDR5 在消费和商用电子设备中的广泛应用,它在产量和收益方面均占据全球 DRAM 市场的主导地位。
预计 DDR5 部分在预测期内将实现最高的复合年增长率。
预计 DDR5 细分市场将在预测期内实现最高成长率。作为最新一代 DDR 技术,DDR5 在频宽、能源效率和资料传输速度方面较 DDR3 和 DDR4 均有显着提升。 DDR5 支援更高的容量和更佳的效能,使其成为高效能运算、资料中心、游戏和人工智慧等高要求应用的理想选择。此外,由于 DDR5 在消费性电子产品、商用伺服器和下一代运算平台中的应用日益广泛,其市场正在迅速扩张,使其成为 DRAM 类型成长最快、最受欢迎的类型。
预计亚太地区将在预测期内占据最大市场占有率,这主要得益于中国大陆、台湾和韩国等地区拥有重要的半导体製造中心。该地区拥有三星、SK海力士和美光等顶级DRAM製造商的大型製造设施,为产能和技术创新提供了支援。此外,亚太地区消费性电子、汽车和资料中心等终端应用领域的强劲需求也支撑着市场扩张。凭藉完善的供应链基础设施、利于业务发展的政府法规以及对尖端记忆体技术的持续投入,亚太地区在全球DRAM市场占据主导地位。
在预测期内,北美预计将见证最高的复合年增长率,因为该地区专注于采用和开发最尖端科技。大型科技公司、资料中心和人工智慧研究中心的存在,导致对高效能 DRAM 解决方案的需求旺盛。该地区 DRAM 市场的快速扩张还可以归因于对先进运算系统、云端基础设施和 5G 部署的投资不断增加。此外,由于持续的技术创新以及通讯、医疗保健和汽车等行业需求的不断增长,北美已成为 DRAM 市场强劲扩张的关键地区。
According to Stratistics MRC, the Global DRAM Market is accounted for $128.57 billion in 2025 and is expected to reach $233.52 billion by 2032 growing at a CAGR of 8.9% during the forecast period. A common form of volatile memory found in computers, servers, and mobile devices is called dynamic random access memory (DRAM), which is used to temporarily store data that the processor needs to complete tasks. Each bit of data is stored in a different capacitor inside an integrated circuit in DRAM, as opposed to static RAM (SRAM), which needs to be updated frequently to preserve the data. DRAM is slower than some other memory types due to its refresh requirement, but it is perfect for providing large amounts of working memory because of its high density and comparatively low cost per bit. Moreover, DRAM has an impact on how quickly programs load, multitask, and process data, making it a critical component of overall system performance.
According to the Semiconductor Industry Association (SIA), the global semiconductor market experienced its highest-ever sales year in 2024, reaching $627.6 billion, a 19.1% increase from 2023. Notably, DRAM products, a subset of memory, recorded an 82.6% sales increase, marking the largest percentage growth of any product category in 2024.
Spread of consumer electronics and smart phones
The DRAM market is still being significantly influenced by the quick spread of smart phones throughout the world, especially in developing nations. Advanced features like 5G connectivity, AI-powered apps, and high-definition cameras are becoming more and more common on smart phones; these features all require faster and larger memory. Furthermore, DRAM is used in consumer electronics like tablets, smart watches, smart TVs, and AR/VR gadgets to enable effective multitasking and faster performance. The demand for DRAM per unit keeps increasing as OEMs strive for devices with more features and power.
High capital expenditure and technological complexity
Massive capital expenditures are needed for fabs, cleanrooms, and highly sophisticated lithography and etching machinery in order to manufacture DRAM. As DRAM nodes (such as 1z, 1a, and 1b) get smaller, businesses must also keep up their R&D expenditures to stay competitive. Few competitors, including Samsung, SK Hynix, and Micron, can afford the multibillion-dollar expenditures required to maintain their lead. Innovation and market diversity are constrained by this high entry barrier. Additionally, cost-effectiveness is further complicated by the increased technical complexity, yield problems, and power leakage that come with scaling DRAM to smaller nodes.
Growth of AI and applications for edge computing
The need for high-speed, low-latency memory to process data in real-time is growing as AI becomes more and more integrated into a variety of industries, including healthcare, finance, and smart manufacturing. DRAM is essential for the efficient operation of AI algorithms, particularly for tasks like natural language processing, image recognition, and deep learning. For real-time analytics, edge devices-such as autonomous cars, industrial robots, and surveillance cameras-that carry out calculations closer to the data source depend on high-performance DRAM. Furthermore, long-term demand for DRAM in small, energy-efficient formats like LPDDR5 and HBM (High Bandwidth Memory) is brought on by the development of AI-on-the-edge.
Increasing market saturation and price competition
Samsung Electronics, SK Hynix, and Micron Technology are the three main companies that control more than 90% of the global DRAM production, making them the market leaders. Price competition is fierce under this oligopolistic structure, particularly when there is an excess of supply. In an effort to maintain market share, manufacturers frequently lower their prices, which causes industry profit margins to decline. Moreover, DRAM demand growth has slowed in mature consumer markets like smart phones and PCs, which has led to market saturation. These factors make it challenging for both new competitors to acquire traction and for established firms to sustain revenue growth.
The COVID-19 pandemic affected the DRAM market in a variety of ways. The semiconductor industry first experienced production slowdowns and uncertainty in early 2020 as a result of supply chain disruptions and factory shutdowns. But as the popularity of remote work, online learning, and digital entertainment grew, so did the need for laptops, servers, and cloud infrastructure, which led to a sharp increase in DRAM usage. The decrease in demand from the automotive and industrial sectors was counterbalanced by data centers and consumer electronics manufacturers increasing orders to meet increased usage. Overall, the pandemic accelerated digital transformation, bolstering long-term growth prospects for the DRAM market, despite short-term constraints caused by logistical difficulties and component shortages.
The double data rate SDRAM (DDR SDRAM) segment is expected to be the largest during the forecast period
The double data rate SDRAM (DDR SDRAM) segment is expected to account for the largest market share during the forecast period because of its high-speed data transfer capabilities and affordability, DDR SDRAM is the most popular type of DRAM in a range of applications, including servers, cell phones, laptops, and personal computers. Data-intensive operations in cloud computing, artificial intelligence, and gaming are supported by this segment's continued improvements in bandwidth, power efficiency, and capacity with subsequent generations like DDR4 and DDR5. It dominates the global DRAM market in terms of both volume and revenue due to its extensive use in consumer and business electronics.
The DDR5 segment is expected to have the highest CAGR during the forecast period
Over the forecast period, the DDR5 segment is predicted to witness the highest growth rate. DDR5, the most recent generation of DDR technology, offers notable enhancements over DDR3 and DDR4 in terms of bandwidth, power efficiency, and data transfer speeds. It is perfect for demanding applications like high-performance computing, data centers, gaming, and artificial intelligence because it supports larger capacities and improved performance. Additionally, DDR5's market is expanding quickly due to its increasing use in consumer electronics, business servers, and next-generation computing platforms, making it the fastest-growing and most desirable DRAM type.
During the forecast period, the Asia Pacific region is expected to hold the largest market share, mainly due to the existence of significant centers for semiconductor manufacturing in nations like China, Taiwan, and South Korea. This area is home to sizable manufacturing facilities for top DRAM manufacturers like Samsung, SK Hynix, and Micron, which support both production capacity and innovation. Furthermore, supporting market expansion is the robust demand from end-use sectors such as consumer electronics, automotive, and data centers throughout Asia-Pacific. Asia-Pacific dominates the global DRAM market owing to its established supply chain infrastructure, pro-business government regulations, and ongoing investments in cutting-edge memory technologies.
Over the forecast period, the North America region is anticipated to exhibit the highest CAGR because it places a lot of emphasis on the adoption and development of cutting-edge technologies. High-performance DRAM solutions are in high demand due to the presence of major tech giants, data centers, and AI research centers. The rapid expansion of the DRAM market in this region is also attributed to rising investments in advanced computing systems, cloud infrastructure, and 5G deployment. Moreover, North America is positioned as a key region experiencing robust DRAM market expansion due to ongoing innovation and rising demand from industries like telecommunications, healthcare, and automotive.
Key players in the market
Some of the key players in DRAM Market include Samsung Electronics Co., Ltd., Kingston Technology Company, Inc., ADATA Technology Co., Ltd., SK Hynix Inc., Integrated Silicon Solution Inc. (ISSI), Micron Technology Inc., Winbond Electronics Corporation, Jeju Semiconductors Inc, Etron Technology, Inc., Nanya Technology Corporation, LAPIS Technology Inc, Powerchip Semiconductor Manufacturing Corporation, ATP Electronics, Inc., Transcend Information Inc. and CXMT (ChangXin Memory Technologies).
In May 2025, Samsung Electronics announced that it has signed an agreement to acquire all shares of FlaktGroup, a leading global HVAC solutions provider, for €1.5 billion from European investment firm Triton. With the global applied HVAC market experiencing rapid growth, the acquisition reinforces Samsung's commitment to expanding and strengthening its HVAC business.
In March 2025, Micron Technology, Inc. entered into a new revolving credit agreement with HSBC Bank USA, replacing its existing $2.5 billion facility with a $3.5 billion revolving credit facility. This strategic financial move, which includes provisions for potential expansion and improved terms, is aimed at supporting the company's general corporate purposes and enhancing its financial flexibility.
In February 2025, DRAM chipmaker Nanya Technology Corp plans to develop new high-bandwidth memory (HBM) chips tailor-made for edge artificial intelligence (AI) devices such as PCs, mobile phones and robots in an effort to differentiate itself from its rivals.