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市场调查报告书
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1836406

复合半导体材料市场预测至2032年：依产品形态、材料类型、加工服务、应用、最终用户和地区的全球分析

Compound Semiconductor Materials Market Forecasts to 2032 - Global Analysis By Product Form, Material Type, Process Service, Application, End User, and By Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 200+ Pages | 商品交期: 2-3个工作天内

价格

根据 Stratistics MRC 的数据，全球化合物半导体材料市场预计在 2025 年达到 381 亿美元，到 2032 年将达到 589 亿美元，预测期内的复合年增长率为 6.4%。

化合物半导体材料包括GaAs、GaN、InP和SiC等材料，用于高频、光电和电力应用。与硅相比，这些材料具有更优异的电子迁移率、热导率和效率。主要应用包括5G通讯、电力电子、LED和射频设备。对速度更快、更节能的电子元件的需求不断增长，材料合成技术的进步，以及通讯和电动汽车行业的扩张，正在推动市场成长。

扩大5G和电动车基础设施

5G 和电动车 (EV) 基础设施的扩张是 GaN、GaAs 和 InP 等化合物半导体材料的主要需求驱动因素，因为它们与硅相比具有更优异的高频工作性能、功率效率和热性能。通讯业者正在升级其网路以支援毫米波、大规模 MIMO 和小型基地台，越来越多地将这些材料指定用于功率放大器和射频前端。此外，电动车和电力电子製造商需要 GaN 和 SiC 元件来製造高效能逆变器、车载充电器和 DC-DC 转换器，以支援其在汽车和工业领域的快速应用。

原料供应有限

镓、锗和铟等关键原料供应有限，限制复合半导体材料市场的成长。密集的开采和精炼、出口限制以及近期的政策措施导致供应紧张，价格上涨，迫使製造商寻求稀缺原材料或重新设计产品以使用替代品。此外，复杂的纯化和晶体生长流程延长了晶圆製造商的前置作业时间和资本密集度，更长的认证週期增加了营运成本需求，而供应商则正在推行供应链多元化策略，从而推高了营运成本。

半导体技术的进步

半导体材料和製程的进步为化合物半导体市场带来了新的机会。改进的外延生长、更高产量比率的MOCVD和MBE技术、SiC晶圆的雷射切片以及先进的晶体拉製技术，正在提高晶圆品质并降低单位成本。此外，异质整合、晶片架构和先进封装的进步，使得射频、光子和功率应用能够实现更小、更高性能的模组，从而提升了复合材料的价值。这些发展正在加速产品商业化，拓宽其在电讯、汽车和资料通讯的应用范围，加速其在电讯、国防、汽车和资料通讯市场的普及。

地缘政治紧张局势

关键矿产和製造设备的出口限制可能会突然限制镓、锗、先进晶圆和专用工具的获取，从而加剧价格波动和采购风险。国家安全主导的在岸生产和补贴计画可能会分割市场，并随着供应商在地理上重新配置其产能而增加製造成本。此外，出口许可证的不可预测性可能会阻碍长期合约的签订，并推迟产能扩张。这种不确定性可能会迫使买家采取保守的资本支出策略，导致买家持有更多库存，并投资于多采购策略，从而推高单位成本。

COVID-19的影响：

新冠疫情导致工厂停工、物流瓶颈和资本计划延期，扰乱了化合物半导体供应链，同时也加速了对连接和远端办公基础设施的需求。早期晶圆和组装能的短缺导致前置作业时间紧张，并引发了库存采购。復苏需要增加资本支出、实施回流倡议以及供应商多元化。这些转变压缩了投资週期，促使企业调整筹资策略，并大幅提升区域产能。

晶圆市场预计将成为预测期内最大的市场

晶圆领域预计将在预测期内占据最大的市场份额，因为晶圆生产构成了化合物半导体装置的基础价值链，并带来材料、外延和基板的收益。电信、电力电子、汽车和LED应用对GaN、GaAs和SiC晶圆的巨大需求，支撑着晶圆厂的运作并推动产能扩张。此外，随着运转率的提高，晶圆製造的规模经济正在降低单位成本，从而鼓励对上游设施的进一步投资。这使得晶圆成为供应商的主要利润来源。

设备整合和封装领域预计将在预测期内实现最高的复合年增长率

由于先进的封装技术能够实现更高密度的化合物半导体装置、更佳的温度控管和更短的互连，预计设备整合与封装领域将在预测期内实现最高成长率。为了满足人工智慧、高速资料通讯、覆晶键合、晶圆层次电子构装和基于晶片的架构的需求正在增长。此外，在封装层级整合射频、光子和功率功能可提高系统效能并降低 BOM 成本。这些进步加快了产品上市时间，并证明了对专业组装能力的投资是合理的。

最大份额区域：

在预测期内，亚太地区预计将占据最大的市场份额，这得益于集中製造、强大的供应商生态系统以及庞大的终端市场需求。晶圆厂、外延、基板生产和封装能力由台湾、韩国、日本和中国大陆共同支援。政府激励措施、晶片设备的大量资本投资以及5G和电气化的快速普及将透过缩短上市时间和降低物流成本来加速产品部署。因此，亚太地区将占据市场价值的主导地位。

复合年增长率最高的地区：

在预测期内，亚太地区预计将实现最高的复合年增长率，这得益于积极的产能扩张、有针对性的产业政策以及国内对电讯、汽车和资料通讯应用不断增长的需求。对氮化镓 (GaN)、碳化硅 (SiC) 和先进封装工厂的大规模投资，加上强大的供应商生态系统和熟练的製造群，正在加快产品上市週期并降低单位成本。这些因素正在推动产能的快速扩张，并吸引全球大规模的国内外投资。

免费客製化服务：

此报告的订阅者可以使用以下免费自订选项之一：

  • 公司简介
    • 全面分析其他市场参与者（最多 3 家公司）
    • 主要企业的SWOT分析（最多3家公司）
  • 区域细分
    • 根据客户兴趣对主要国家进行的市场估计、预测和复合年增长率（註：基于可行性检查）
  • 竞争基准化分析
    • 根据产品系列、地理分布和策略联盟对主要企业基准化分析

目录

第一章执行摘要

第二章 前言

  • 概述
  • 相关利益者
  • 调查范围
  • 调查方法
    • 资料探勘
    • 数据分析
    • 数据检验
    • 研究途径
  • 研究材料
    • 主要研究资料
    • 次级研究资讯来源
    • 先决条件

第三章市场走势分析

  • 驱动程式
  • 抑制因素
  • 机会
  • 威胁
  • 应用分析
  • 最终用户分析
  • 新兴市场
  • COVID-19的影响

第四章 波特五力分析

  • 供应商的议价能力
  • 买方的议价能力
  • 替代品的威胁
  • 新进入者的威胁
  • 竞争对手之间的竞争

第五章全球化合物半导体材料市场（依产品类型）

  • 晶圆
  • 外延晶圆（EpiReady）
  • 薄膜/外延层
  • 粉末和前驱

6. 全球化合物半导体材料市场（依材料类型）

  • 氮化镓（GaN）
  • 砷化镓（GaAs）
  • 碳化硅（SiC）
  • 磷化铟（InP）
  • 氮化铟镓
  • 其他材料类型

7. 全球化合物半导体材料市场（依製程服务）

  • 外延服务
  • 基板製造
  • 装置整合与封装

第八章全球化合物半导体材料市场（依应用）

  • 射频和微波元件
  • 电力电子
  • 光电子学
  • 光电和光纤通讯
  • 感测器和成像
  • 光电及特种光电发电
  • 航太和国防
  • 其他应用

9. 全球复合半导体材料市场（依最终用户）

  • 通讯
  • 车
  • 家电
  • 工业和电力系统
  • 医疗保健和医疗设备
  • 其他最终用户

第十章全球化合物半导体材料市场（按地区）

  • 北美洲
    • 美国
    • 加拿大
    • 墨西哥
  • 欧洲
    • 德国
    • 英国
    • 义大利
    • 法国
    • 西班牙
    • 其他欧洲国家
  • 亚太地区
    • 日本
    • 中国
    • 印度
    • 澳洲
    • 纽西兰
    • 韩国
    • 其他亚太地区
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 其他南美
  • 中东和非洲
    • 沙乌地阿拉伯
    • 阿拉伯聯合大公国
    • 卡达
    • 南非
    • 其他中东和非洲地区

第十一章 重大进展

  • 协议、伙伴关係、合作和合资企业
  • 收购与合併
  • 新产品发布
  • 业务扩展
  • 其他关键策略

第十二章 公司概况

  • Wolfspeed, Inc.
  • Qorvo, Inc.
  • Skyworks Solutions, Inc.
  • Infineon Technologies AG
  • STMicroelectronics NV
  • Nichia Corporation
  • Samsung Electronics Co., Ltd.
  • ams OSRAM AG
  • GaN Systems Inc.
  • IQE plc
  • Sumitomo Electric Industries, Ltd.
  • MACOM Technology Solutions Holdings, Inc.
  • II-VI Incorporated
  • AIXTRON SE
  • Veeco Instruments Inc.
  • Applied Materials, Inc.
  • Entegris, Inc.
  • ON Semiconductor Corporation
  • Mitsubishi Electric Corporation
Product Code: SMRC31530

According to Stratistics MRC, the Global Compound Semiconductor Materials Market is accounted for $38.1 billion in 2025 and is expected to reach $58.9 billion by 2032 growing at a CAGR of 6.4% during the forecast period. Compound semiconductor materials involve materials such as GaAs, GaN, InP, and SiC, used for high-frequency, optoelectronic, and power applications. These materials offer superior electron mobility, thermal conductivity, and efficiency compared to silicon. Key applications include 5G communications, power electronics, LEDs, and RF devices. Rising demand for faster, energy-efficient electronic components, advancements in material synthesis and expansion of telecommunications and electric vehicle sectors are driving market growth.

Market Dynamics:

Driver:

Expansion of 5G and EV Infrastructure

Expansion of 5G and electric vehicle (EV) infrastructure is a major demand driver for compound semiconductor materials such as GaN, GaAs and InP because they deliver higher-frequency operation, greater power efficiency, and superior thermal performance compared with silicon. Telecom operators upgrading networks for mmWave, massive MIMO and small cells increasingly specify these materials for power amplifiers and RF front-ends. Additionally, EV and power electronics manufacturers require GaN and SiC components for efficient inverters, onboard chargers and DC-DC converters, supporting rapid adoption across automotive and industrial segments.

Restraint:

Limited Raw Material Availability

Limited availability of critical raw materials such as gallium, germanium and indium is constraining growth of the compound semiconductor materials market. Concentrated mining and refining, export controls and recent policy moves have tightened supplies and elevated prices, forcing manufacturers to secure scarce feedstock or redesign products to use alternatives. Moreover, complex purification and crystal-growth processes raise lead times and capital intensity for wafer producers, and longer qualification cycles increase working capital needs while suppliers pursue supply-chain diversification strategies, raising operating costs.

Opportunity:

Advancements in Semiconductor Technology

Advancements in semiconductor materials and processing are opening new opportunities across the compound semiconductor market. Improved epitaxial growth, higher-yield MOCVD and MBE techniques, laser-slicing for SiC wafers, and refined crystal-pulling raise wafer quality and lower unit costs. Moreover, progress in heterogeneous integration, chiplet architectures and advanced packaging increases the value of compound materials by enabling smaller, higher-performance modules for RF, photonic and power applications. These developments accelerate product commercialization, broaden application scope in telecom, automotive and datacom, and accelerate adoption in telecom, defense, automotive, and datacom markets.

Threat:

Geopolitical Tensions

Export controls on critical minerals or fabrication equipment can abruptly limit access to gallium, germanium, advanced wafers and specialized tools, increasing price volatility and procurement risk. National security-driven onshoring and subsidy programs may fragment markets and raise manufacturing costs as suppliers reconfigure capacity geographically. Moreover, export licensing unpredictability can deter long-term contracts and slow capacity expansion. This uncertainty forces conservatism in capital expenditure pushes buyers to hold larger inventories, compelling investment in multi-source strategies that raise unit costs.

Covid-19 Impact:

The COVID-19 pandemic disrupted compound semiconductor supply chains through plant shutdowns, logistics bottlenecks, and delayed capital projects while simultaneously accelerating demand for connectivity and remote-work infrastructure. Early shortages of wafers and assembly capacity strained lead times and prompted inventory hoarding. Recovery involved increased CAPEX, reshoring initiatives and supplier diversification to bolster resilience. These shifts shortened some timelines for investment and encouraged firms to redesign sourcing strategies and expand regional capacity, significantly.

The wafers segment is expected to be the largest during the forecast period

The wafers segment is expected to account for the largest market share during the forecast period because wafer production forms the foundational value chain for compound semiconductor devices, capturing material, epitaxy and substrate revenues. High-volume demand for GaN, GaAs and SiC wafers from telecom, power electronics, automotive and LED applications sustains wafer fabs and drives capacity expansion. Moreover, economies of scale in wafer manufacturing reduce per-unit costs as utilization rises, encouraging further investment in upstream capacity. This makes wafers the primary profit pool for suppliers.

The device integration & packaging segment is expected to have the highest CAGR during the forecast period

Over the forecast period, the device integration & packaging segment is predicted to witness the highest growth rate as advanced packaging technologies unlock higher density, improved thermal management and shorter interconnects for compound semiconductor devices. Demand for 2.5D/3D stacking, flip-chip bonding, wafer-level packaging and chiplet-based architectures is rising to meet AI, high-speed datacom, mmWave and power-conversion requirements. Additionally, package-level co-integration of RF, photonic and power functions enhances system performance and reduces BOM cost. These advances shorten time-to-market and justify investment in specialized assembly capacity.

Region with largest share:

During the forecast period, the Asia Pacific region is expected to hold the largest market share driven by concentrated manufacturing, strong supplier ecosystems, and heavy end-market demand. Taiwan, South Korea, Japan and China together support wafer fabs, epitaxy, substrate production and packaging capacity, while regional OEMs and telecom operators create substantial local consumption. Government incentives, large-scale capital spending on chip equipment and rapid adoption of 5G and electrification reduce time to commercialization and lower logistics costs, accelerating product roll-out. Consequently, Asia Pacific will dominate market value.

Region with highest CAGR:

Over the forecast period, the Asia Pacific region is anticipated to exhibit the highest CAGR because of aggressive capacity expansion, targeted industrial policies, and rising domestic demand for telecom, automotive and datacom applications. Major investments in GaN, SiC and advanced packaging fabs, coupled with robust supplier ecosystems and skilled manufacturing clusters, are accelerating commercialization cycles and lowering unit costs. These factors drive rapid capacity additions and attract large-scale domestic and foreign investment globally.

Key players in the market

Some of the key players in Compound Semiconductor Materials Market include Wolfspeed, Inc., Qorvo, Inc., Skyworks Solutions, Inc., Infineon Technologies AG, STMicroelectronics N.V., Nichia Corporation, Samsung Electronics Co., Ltd., ams OSRAM AG, GaN Systems Inc., IQE plc, Sumitomo Electric Industries, Ltd., MACOM Technology Solutions Holdings, Inc., II-VI Incorporated, AIXTRON SE, Veeco Instruments Inc., Applied Materials, Inc., Entegris, Inc., ON Semiconductor Corporation, and Mitsubishi Electric Corporation.

Key Developments:

In July 2025, Infineon Technologies AG is advancing on scalable 300mm GaN power wafer manufacturing expected to deliver samples in late 2025, strengthening its leadership in power systems based on silicon, SiC, and GaN compound semiconductors.

In March 2023, Wolfspeed, Inc. the global leader in Silicon Carbide technology, and North Carolina Agricultural and Technical State University, America's leading historically Black college or university, today announced their intent to apply for CHIPS and Science Act funding to build a new research and development facility on the North Carolina A&T campus. The R&D facility will be focused on Silicon Carbide to support the next generation of advanced compound semiconductors. Wolfspeed and A&T intend to submit the project for federal investment as part of the CHIPS and Science Act when the Notice of Funding Opportunity for R&D facilities is released this fall.

Product Forms Covered:

  • Wafers
  • Epitaxial wafers (epi-ready)
  • Thin films / epilayers
  • Powders & precursors

Material Types Covered:

  • Gallium Nitride (GaN)
  • Gallium Arsenide (GaAs)
  • Silicon Carbide (SiC)
  • Indium Phosphide (InP)
  • Indium Gallium Nitride
  • Other Material types

Process Services Covered:

  • Epitaxy Services
  • Substrate Manufacturing
  • Device Integration & Packaging

Applications Covered:

  • RF & Microwave Components
  • Power Electronics
  • Optoelectronics
  • Photonics & Optical Communications
  • Sensors & Imaging
  • Photovoltaics & Specialty Solar
  • Aerospace & Defense
  • Other Applications

End Users Covered:

  • Telecommunications
  • Automotive
  • Consumer Electronics
  • Industrial & Power Systems
  • Healthcare & Medical Devices
  • Other End Users

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2024, 2025, 2026, 2028, and 2032
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Application Analysis
  • 3.7 End User Analysis
  • 3.8 Emerging Markets
  • 3.9 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global Compound Semiconductor Materials Market, By Product Form

  • 5.1 Introduction
  • 5.2 Wafers
  • 5.3 Epitaxial wafers (epi-ready)
  • 5.4 Thin films / epilayers
  • 5.5 Powders & precursors

6 Global Compound Semiconductor Materials Market, By Material Type

  • 6.1 Introduction
  • 6.2 Gallium Nitride (GaN)
  • 6.3 Gallium Arsenide (GaAs)
  • 6.4 Silicon Carbide (SiC)
  • 6.5 Indium Phosphide (InP)
  • 6.6 Indium Gallium Nitride
  • 6.7 Other Material types

7 Global Compound Semiconductor Materials Market, By Process Service

  • 7.1 Introduction
  • 7.2 Epitaxy Services
  • 7.3 Substrate Manufacturing
  • 7.4 Device Integration & Packaging

8 Global Compound Semiconductor Materials Market, By Application

  • 8.1 Introduction
  • 8.2 RF & Microwave Components
  • 8.3 Power Electronics
  • 8.4 Optoelectronics
  • 8.5 Photonics & Optical Communications
  • 8.6 Sensors & Imaging
  • 8.7 Photovoltaics & Specialty Solar
  • 8.8 Aerospace & Defense
  • 8.9 Other Applications

9 Global Compound Semiconductor Materials Market, By End User

  • 9.1 Introduction
  • 9.2 Telecommunications
  • 9.3 Automotive
  • 9.4 Consumer Electronics
  • 9.5 Industrial & Power Systems
  • 9.6 Healthcare & Medical Devices
  • 9.7 Other End Users

10 Global Compound Semiconductor Materials Market, By Geography

  • 10.1 Introduction
  • 10.2 North America
    • 10.2.1 US
    • 10.2.2 Canada
    • 10.2.3 Mexico
  • 10.3 Europe
    • 10.3.1 Germany
    • 10.3.2 UK
    • 10.3.3 Italy
    • 10.3.4 France
    • 10.3.5 Spain
    • 10.3.6 Rest of Europe
  • 10.4 Asia Pacific
    • 10.4.1 Japan
    • 10.4.2 China
    • 10.4.3 India
    • 10.4.4 Australia
    • 10.4.5 New Zealand
    • 10.4.6 South Korea
    • 10.4.7 Rest of Asia Pacific
  • 10.5 South America
    • 10.5.1 Argentina
    • 10.5.2 Brazil
    • 10.5.3 Chile
    • 10.5.4 Rest of South America
  • 10.6 Middle East & Africa
    • 10.6.1 Saudi Arabia
    • 10.6.2 UAE
    • 10.6.3 Qatar
    • 10.6.4 South Africa
    • 10.6.5 Rest of Middle East & Africa

11 Key Developments

  • 11.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 11.2 Acquisitions & Mergers
  • 11.3 New Product Launch
  • 11.4 Expansions
  • 11.5 Other Key Strategies

12 Company Profiling

  • 12.1 Wolfspeed, Inc.
  • 12.2 Qorvo, Inc.
  • 12.3 Skyworks Solutions, Inc.
  • 12.4 Infineon Technologies AG
  • 12.5 STMicroelectronics N.V.
  • 12.6 Nichia Corporation
  • 12.7 Samsung Electronics Co., Ltd.
  • 12.8 ams OSRAM AG
  • 12.9 GaN Systems Inc.
  • 12.10 IQE plc
  • 12.11 Sumitomo Electric Industries, Ltd.
  • 12.12 MACOM Technology Solutions Holdings, Inc.
  • 12.13 II-VI Incorporated
  • 12.14 AIXTRON SE
  • 12.15 Veeco Instruments Inc.
  • 12.16 Applied Materials, Inc.
  • 12.17 Entegris, Inc.
  • 12.18 ON Semiconductor Corporation
  • 12.19 Mitsubishi Electric Corporation

List of Tables

  • Table 1 Global Compound Semiconductor Materials Market Outlook, By Region (2024-2032) ($MN)
  • Table 2 Global Compound Semiconductor Materials Market Outlook, By Product Form (2024-2032) ($MN)
  • Table 3 Global Compound Semiconductor Materials Market Outlook, By Wafers (2024-2032) ($MN)
  • Table 4 Global Compound Semiconductor Materials Market Outlook, By Epitaxial wafers (epi-ready) (2024-2032) ($MN)
  • Table 5 Global Compound Semiconductor Materials Market Outlook, By Thin films / epilayers (2024-2032) ($MN)
  • Table 6 Global Compound Semiconductor Materials Market Outlook, By Powders & precursors (2024-2032) ($MN)
  • Table 7 Global Compound Semiconductor Materials Market Outlook, By Material Type (2024-2032) ($MN)
  • Table 8 Global Compound Semiconductor Materials Market Outlook, By Gallium Nitride (GaN) (2024-2032) ($MN)
  • Table 9 Global Compound Semiconductor Materials Market Outlook, By Gallium Arsenide (GaAs) (2024-2032) ($MN)
  • Table 10 Global Compound Semiconductor Materials Market Outlook, By Silicon Carbide (SiC) (2024-2032) ($MN)
  • Table 11 Global Compound Semiconductor Materials Market Outlook, By Indium Phosphide (InP) (2024-2032) ($MN)
  • Table 12 Global Compound Semiconductor Materials Market Outlook, By Indium Gallium Nitride (2024-2032) ($MN)
  • Table 13 Global Compound Semiconductor Materials Market Outlook, By Other Material types (2024-2032) ($MN)
  • Table 14 Global Compound Semiconductor Materials Market Outlook, By Process Service (2024-2032) ($MN)
  • Table 15 Global Compound Semiconductor Materials Market Outlook, By Epitaxy Services (2024-2032) ($MN)
  • Table 16 Global Compound Semiconductor Materials Market Outlook, By Substrate Manufacturing (2024-2032) ($MN)
  • Table 17 Global Compound Semiconductor Materials Market Outlook, By Device Integration & Packaging (2024-2032) ($MN)
  • Table 18 Global Compound Semiconductor Materials Market Outlook, By Application (2024-2032) ($MN)
  • Table 19 Global Compound Semiconductor Materials Market Outlook, By RF & Microwave Components (2024-2032) ($MN)
  • Table 20 Global Compound Semiconductor Materials Market Outlook, By Power Electronics (2024-2032) ($MN)
  • Table 21 Global Compound Semiconductor Materials Market Outlook, By Optoelectronics (2024-2032) ($MN)
  • Table 22 Global Compound Semiconductor Materials Market Outlook, By Photonics & Optical Communications (2024-2032) ($MN)
  • Table 23 Global Compound Semiconductor Materials Market Outlook, By Sensors & Imaging (2024-2032) ($MN)
  • Table 24 Global Compound Semiconductor Materials Market Outlook, By Photovoltaics & Specialty Solar (2024-2032) ($MN)
  • Table 25 Global Compound Semiconductor Materials Market Outlook, By Aerospace & Defense (2024-2032) ($MN)
  • Table 26 Global Compound Semiconductor Materials Market Outlook, By Other Applications (2024-2032) ($MN)
  • Table 27 Global Compound Semiconductor Materials Market Outlook, By End User (2024-2032) ($MN)
  • Table 28 Global Compound Semiconductor Materials Market Outlook, By Telecommunications (2024-2032) ($MN)
  • Table 29 Global Compound Semiconductor Materials Market Outlook, By Automotive (2024-2032) ($MN)
  • Table 30 Global Compound Semiconductor Materials Market Outlook, By Consumer Electronics (2024-2032) ($MN)
  • Table 31 Global Compound Semiconductor Materials Market Outlook, By Industrial & Power Systems (2024-2032) ($MN)
  • Table 32 Global Compound Semiconductor Materials Market Outlook, By Healthcare & Medical Devices (2024-2032) ($MN)
  • Table 33 Global Compound Semiconductor Materials Market Outlook, By Other End Users (2024-2032) ($MN)

Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.