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市场调查报告书
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半导体计量和检测设备市场预测至2032年：按设备类型、技术、应用、最终用户和地区分類的全球分析

Semiconductor Metrology and Inspection Equipment Market Forecasts to 2032 - Global Analysis By Equipment Type (Lithography Metrology, Wafer Inspection, Thin Film Metrology, and Other Equipment Types), Technology, Application, End User and By Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 200+ Pages | 商品交期: 2-3个工作天内

价格

根据 Stratistics MRC 的数据，全球半导体计量和测试设备市场预计到 2025 年将达到 97.7 亿美元，到 2032 年将达到 177.6 亿美元，预测期内复合年增长率为 8.9%。

半导体计量和检测设备由精密仪器组成，旨在评估和监控半导体晶圆和装置在製造过程中的特性。这些仪器有助于识别缺陷、尺寸偏差和不规则性，从而确保精度、品质和一致性。透过实现极小尺度的精确测量和分析，它们在製程控制、最大限度提高生产产量比率以及遵守严格的行业标准方面发挥关键作用，从而促进生产用于电子应用的可靠、高性能半导体元件。

根据 arXiv 在 2025 年 3 月发布的预测，大型超级电脑将使用约 20 万个 AI 晶片，硬体成本为 70 亿美元，耗电量为 300 兆瓦。

对更高品质和更高产量比率晶片的需求日益增长。

半导体产业对高性能、低缺陷晶片的需求激增。这一趋势主要受人工智慧、5G 和自动驾驶系统等先进应用的普及所推动，这些应用对製造精度要求极高。随着装置尺寸的缩小，误差容许度也随之降低，因此高解析度计量和侦测工具至关重要。製造商正加大对下一代设备的投资，以确保更严格的製程控制和更高的生产产量比率。光学和电子束检测技术的创新使得即时缺陷检测和製程最佳化成为可能。这种对品质保证日益增长的重视预计将显着推动整个价值链的市场成长。

系统复杂度增加和吞吐量瓶颈

随着半导体製程节点推进到5奈米以下，检测和计量系统的复杂度呈指数级增长。这些工具现在必须以极高的精度分析复杂的3D结构和多层封装。然而，检测过程中产生的资料量极为庞大，需要先进的分析技术和高效能运算基础设施。因此，检测速度往往落后于生产速度，造成产能挑战。此外，将这些系统整合到现有工厂工作流程中需要专业知识和大量资金投入。这些营运和技术障碍减缓了系统的普及，并阻碍了市场加速发展。

对先进包装计量技术的需求日益增长

随着晶片组、2.5D/3D积体电路和扇出型晶圆级封装的日益普及，互连、凸点高度和通孔的精确测量变得至关重要。新的计量解决方案正在被设计出来，以奈米级精度来应对这些复杂的架构。设备供应商正与外包半导体组装测试公司（OSAT）和整合装置製造商（IDM）合作，开发专为先进封装生产线量身定制的工具。光学、X射线和混合计量技术的融合，使得全面的跨层检测成为可能。这种不断发展的格局为专业计量供应商创造了巨大的成长机会。

科技快速过时

由于晶片设计、小型化和製造流程的持续技术创新，半导体产业正经历快速发展。随着製程节点缩小和装置架构日益复杂，现有的计量和侦测工具很快就会过时，需要频繁升级或彻底更换。这缩短了产品生命週期，并增加了製造商的研发和资本成本。随着客户对需要高精度和高准确度的先进解决方案的需求不断增长，无法跟上新兴技术步伐的公司将面临失去竞争优势的风险。因此，技术创新的步伐对企业维持技术相关性和盈利构成了持续的挑战。

新冠疫情的影响：

新冠疫情初期扰乱了全球供应链，导致计量和检测设备的交付和安装延误。然而，疫情也凸显了半导体工厂自动化和远端监控的重要性。因此，在疫情恢復期，对人工智慧赋能、云端连线的侦测工具的需求激增。供应商加快了非接触式和预测性维护解决方案的开发，以减少人为干预。此次危机也促使企业策略转向区域化製造和供应链復苏。

预计在预测期内，微影术计量领域将成为最大的细分市场。

由于微影术在确保先进製程节点的图案保真度和套刻精度方面发挥关键作用，预计在预测期内，光刻计量领域将占据最大的市场份额。随着极微影术的普及，精确测量关键尺寸和线边缘粗糙度的需求日益增长。这些工具对于检测可能影响装置性能的图形化缺陷至关重要。解析度、灵敏度和吞吐量的持续提升正在推动其在先进晶圆厂的应用。设备供应商也在整合人工智慧和机器学习技术，以增强缺陷分类和製程控制。

预计在预测期内，OSAT供应商细分市场将以最高的复合年增长率成长。

由于先进封装技术的日益复杂，预计在预测期内，OSAT（外包半导体封装测试）服务商将实现最高成长率。随着晶片製造商越来越依赖OSAT进行2.5D/3D整合和异构封装，对专用计量工具的需求也随之激增。这些服务商正在投资高精度检测系统，以确保互连可靠性和封装完整性。 X射线、声学和混合计量技术的创新应用正被迅速采用，以满足严格的品质标准。向「精简晶圆厂」模式和设计外包的趋势进一步提升了OSAT的战略重要性。这种转变使OSAT成为不断发展的半导体产业的关键驱动力。

比最大的地区

预计亚太地区将在预测期内占据最大的市场份额，这主要得益于中国、台湾、韩国和日本等国家和地区强大的半导体製造生态系统。这些国家和地区拥有众多大型晶圆代工厂和整合装置製造商 (IDM)，它们正积极投资于先进的计量基础设施。政府支持国内晶片生产和研发的倡议进一步推动了该地区的成长。主要设备供应商的存在以及强大的外包半导体组装与测试 (OSAT) 体係也推动了对检测工具的需求。此外，该地区对人工智慧、5G 和汽车电子领域的关注也促使人们对更高品质的晶片提出了更高的要求。

复合年增长率最高的地区：

预计北美地区在预测期内将呈现最高的复合年增长率。美国的《晶片技术创新与应用法案》（CHIPS Act）及其相关资助计画正在推动国内製造业和设备创新。领先企业正在开发下一代计量工具，以支援5奈米以下和3D封装技术。该地区对人工智慧主导的分析、网路安全和自动化技术的重视，正在增强其检测能力。学术界、国家实验室和产业界之间的合作正在培养一个充满活力的创新生态系统。

免费客製化服务

订阅本报告的用户可享有以下免费客製化服务之一：

  • 公司简介
    • 对至多三家其他市场公司进行全面分析
    • 对主要企业进行SWOT分析（最多3家公司）
  • 区域细分
    • 根据客户兴趣对主要国家进行市场估算、预测和复合年增长率分析（註：基于可行性检查）
  • 竞争基准化分析
    • 基于产品系列、地域覆盖和策略联盟对主要企业基准化分析

目录

第一章执行摘要

第二章 前言

  • 概述
  • 相关利益者
  • 调查范围
  • 调查方法
    • 资料探勘
    • 数据分析
    • 数据检验
    • 研究途径
  • 研究资讯来源
    • 初级研究资讯来源
    • 次级研究资讯来源
    • 先决条件

第三章 市场趋势分析

  • 司机
  • 抑制因素
  • 机会
  • 威胁
  • 技术分析
  • 应用分析
  • 终端用户分析
  • 新兴市场
  • 新冠疫情的影响

第四章 波特五力分析

  • 供应商的议价能力
  • 买方的议价能力
  • 替代品的威胁
  • 新进入者的威胁
  • 竞争对手之间的竞争

第五章 全球半导体计量和检测设备市场（按设备类型划分）

  • 微影术计量
    • 迭加测量
    • 关键尺寸 (CD) 计量
    • 口罩检查/测量
  • 晶圆检测
    • 缺陷检测
    • 无图案晶圆侦测
    • 模式检测
  • 薄膜测量
    • 薄膜厚度测量
    • 屈光分析
  • 其他设备类型

6. 全球半导体计量和检测设备市场（按技术划分）

  • 光学测量
  • 红外线和热成像
  • 电子束测量
  • X射线测量
  • 扫描探测器测量

第七章 全球半导体计量和检测设备市场（按应用领域划分）

  • 半导体前端製造
  • 后端半导体封装
  • 研发和製程开发
  • 品质保证和可靠性测试
  • 其他用途

第八章 全球半导体计量和检测设备市场（按最终用户划分）

  • 整合装置製造商（IDM）
  • 晶圆代工厂
  • 外包半导体组装和测试 (OSAT) 服务商
  • 研究所
  • 其他最终用户

9. 全球半导体计量和检测设备市场（按地区划分）

  • 北美洲
    • 美国
    • 加拿大
    • 墨西哥
  • 欧洲
    • 德国
    • 英国
    • 义大利
    • 法国
    • 西班牙
    • 其他欧洲
  • 亚太地区
    • 日本
    • 中国
    • 印度
    • 澳洲
    • 纽西兰
    • 韩国
    • 亚太其他地区
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 其他南美洲
  • 中东和非洲
    • 沙乌地阿拉伯
    • 阿拉伯聯合大公国
    • 卡达
    • 南非
    • 其他中东和非洲地区

第十章：重大进展

  • 协议、伙伴关係、合作和合资企业
  • 收购与併购
  • 新产品上市
  • 业务拓展
  • 其他关键策略

第十一章 企业概况

  • KLA Corporation
  • Toray Engineering Co., Ltd.
  • Hitachi High-Tech Corporation
  • JEOL Ltd.
  • Applied Materials Inc.
  • Lasertec Corporation
  • Onto Innovation Inc.
  • SCREEN Holdings Co., Ltd.
  • ASML Holding NV
  • Advantest Corporation
  • Tokyo Electron Limited
  • Nikon Corporation
  • Nova Ltd.
  • Carl Zeiss SMT GmbH
  • Camtek Ltd.
Product Code: SMRC31761

According to Stratistics MRC, the Global Semiconductor Metrology and Inspection Equipment Market is accounted for $9.77 billion in 2025 and is expected to reach $17.76 billion by 2032 growing at a CAGR of 8.9% during the forecast period. Semiconductor Metrology and Inspection Equipment comprises advanced instruments designed to assess and monitor the characteristics of semiconductor wafers and devices during manufacturing. These tools help identify defects, dimensional variations, and irregularities, ensuring accuracy, quality, and consistency. By enabling precise measurement and analysis at extremely small scales, they play a vital role in process control, maximizing production yield, and adhering to rigorous industry standards, thereby facilitating the creation of reliable and high-performance semiconductor components for electronic applications.

According to arXiv in March 2025, the leading supercomputer used approximately 200,000 AI chips cost USD 7 billion in hardware, and draw 300 MW of power.

Market Dynamics:

Driver:

Rising demand for higher chip quality and yield

The semiconductor industry is witnessing a surge in demand for chips with superior performance and minimal defects. This trend is driven by the proliferation of advanced applications such as AI, 5G, and autonomous systems, which require extremely precise fabrication. As device geometries shrink, the margin for error narrows, making high-resolution metrology and inspection tools indispensable. Manufacturers are increasingly investing in next-generation equipment to ensure tighter process control and higher production yields. Innovations in optical and e-beam inspection technologies are enabling real-time defect detection and process optimization. This heightened focus on quality assurance is expected to significantly propel market growth across the value chain.

Restraint:

Increasing system complexity and throughput bottlenecks

As semiconductor nodes advance below 5nm, the complexity of inspection and metrology systems has grown exponentially. These tools must now analyze intricate 3D structures and multilayered packaging with extreme precision. However, the volume of data generated during inspection is massive, requiring sophisticated analytics and high-performance computing infrastructure. This creates throughput challenges, as inspection speed often lags behind production rates. Additionally, integrating these systems into existing fab workflows demands specialized expertise and significant capital investment. These operational and technical hurdles are slowing down widespread adoption, acting as a brake on market acceleration.

Opportunity:

Growing need for advanced packaging metrology

As chiplets, 2.5D/3D ICs, and fan-out wafer-level packaging gain traction, precise measurement of interconnects, bump heights, and TSVs becomes critical. Emerging metrology solutions are being designed to handle these complex architectures with nanometer-level accuracy. Equipment vendors are collaborating with OSATs and IDMs to develop tools tailored for advanced packaging lines. The convergence of optical, X-ray, and hybrid metrology techniques is enabling comprehensive inspection across layers. This evolving landscape presents a significant growth opportunity for specialized metrology providers.

Threat:

Rapid technological obsolescence

The semiconductor industry evolves swiftly, driven by continuous innovations in chip design, miniaturization, and manufacturing processes. As nodes shrink and device architectures become more complex, existing metrology and inspection tools can quickly become outdated, requiring frequent upgrades or complete replacements. This shortens product life cycles and increases R&D and capital costs for manufacturers. Companies that fail to keep pace with emerging technologies risk losing competitiveness, as customers demand advanced solutions for precision and accuracy. Consequently, the pace of innovation poses a persistent challenge to maintaining technological relevance and profitability.

Covid-19 Impact:

The COVID-19 pandemic initially disrupted global supply chains, delaying the delivery and installation of metrology and inspection equipment. However, it also underscored the importance of automation and remote monitoring in semiconductor fabs. As a result, demand for AI-enabled, cloud-connected inspection tools surged during the recovery phase. Vendors accelerated the development of contactless and predictive maintenance solutions to reduce human intervention. The crisis also prompted strategic shifts toward regional manufacturing and supply chain resilience.

The lithography metrology segment is expected to be the largest during the forecast period

The lithography metrology segment is expected to account for the largest market share during the forecast period, due to its critical role in ensuring pattern fidelity and overlay accuracy at advanced nodes. As EUV lithography becomes mainstream, the need for precise measurement of critical dimensions and line-edge roughness intensifies. These tools are essential for detecting patterning defects that could compromise device performance. Continuous improvements in resolution, sensitivity, and throughput are driving adoption across leading-edge fabs. Equipment providers are also integrating AI and machine learning to enhance defect classification and process control.

The OSAT providers segment is expected to have the highest CAGR during the forecast period

Over the forecast period, the OSAT providers segment is predicted to witness the highest growth rate, driven by the rising complexity of advanced packaging. As chipmakers increasingly rely on OSATs for 2.5D/3D integration and heterogeneous assembly, demand for specialized metrology tools is surging. These providers are investing in high-precision inspection systems to ensure interconnect reliability and package integrity. Innovations in X-ray, acoustic, and hybrid metrology are being rapidly adopted to meet stringent quality standards. The growing trend of fab-lite models and design outsourcing further amplifies OSATs' strategic importance. This shift positions them as key growth drivers in the evolving semiconductor landscape.

Region with largest share:

During the forecast period, the Asia Pacific region is expected to hold the largest market share, fueled by robust semiconductor manufacturing ecosystems in countries like China, Taiwan, South Korea, and Japan. These nations are home to major foundries and IDMs that are aggressively investing in advanced metrology infrastructure. Government initiatives supporting domestic chip production and R&D are further accelerating regional growth. The presence of leading equipment vendors and a strong OSAT base enhances the demand for inspection tools. Additionally, the region's focus on AI, 5G, and automotive electronics is driving the need for higher chip quality.

Region with highest CAGR:

Over the forecast period, the North America region is anticipated to exhibit the highest CAGR, driven by strong investments in semiconductor R&D and fab expansion. The U.S. CHIPS Act and related funding initiatives are catalyzing domestic manufacturing and equipment innovation. Leading players are developing next-gen metrology tools to support sub-5nm and 3D packaging technologies. The region's emphasis on AI-driven analytics, cybersecurity, and automation is enhancing inspection capabilities. Collaborations between academia, national labs, and industry are fostering a vibrant innovation ecosystem.

Key players in the market

Some of the key players in Semiconductor Metrology and Inspection Equipment Market include KLA Corporation, Toray Engineering Co., Ltd., Hitachi High-Tech Corporation, JEOL Ltd., Applied Materials Inc., Lasertec Corporation, Onto Innovation Inc., SCREEN Holdings Co., Ltd., ASML Holding N.V., Advantest Corporation, Tokyo Electron Limited, Nikon Corporation, Nova Ltd., Carl Zeiss SMT GmbH, and Camtek Ltd.

Key Developments:

In August 2025, Hitachi Energy has completed the acquisition of the remaining stake in eks Energy, a technology and market leader in power electronics and control solutions to deliver a scalable, flexible, and complete approach for energy storage customers. Hitachi Energy acquired a majority stake in eks Energy.

In April 2025, Major League Pickleball (MLP) and Japanese materials manufacturer Toray Industries, Inc. announced an agreement naming Toray a platinum partner with Kitchen branding at the professional, coed, team pickleball league's events. This partnership makes Toray the first-ever Asia-based partner of MLP, expanding the league's brand reach internationally as pickleball continues its unmatched domestic growth.

Equipment Types Covered:

  • Lithography Metrology
  • Wafer Inspection
  • Thin Film Metrology
  • Other Equipment Types

Technologies Covered:

  • Optical Metrology
  • Infrared and Thermal Imaging
  • Electron Beam Metrology
  • X-ray Metrology
  • Scanning Probe Metrology

Applications Covered:

  • Front-End Semiconductor Manufacturing
  • Back-End Semiconductor Packaging
  • R&D and Process Development
  • Quality Assurance and Reliability Testing
  • Other Applications

End Users Covered:

  • Integrated Device Manufacturers (IDMs)
  • Foundries
  • Outsourced Semiconductor Assembly and Test (OSAT) Providers
  • Research Institutions
  • Other End Users

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2024, 2025, 2026, 2028, and 2032
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Technology Analysis
  • 3.7 Application Analysis
  • 3.8 End User Analysis
  • 3.9 Emerging Markets
  • 3.10 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global Semiconductor Metrology and Inspection Equipment Market, By Equipment Type

  • 5.1 Introduction
  • 5.2 Lithography Metrology
    • 5.2.1 Overlay Metrology
    • 5.2.2 Critical Dimension (CD) Metrology
    • 5.2.3 Mask Inspection/Metrology
  • 5.3 Wafer Inspection
    • 5.3.1 Defect Inspection
    • 5.3.2 Unpatterned Wafer Inspection
    • 5.3.3 Patterned Inspection
  • 5.4 Thin Film Metrology
    • 5.4.1 Film Thickness Measurement
    • 5.4.2 Refractive Index Profiling
  • 5.5 Other Equipment Types

6 Global Semiconductor Metrology and Inspection Equipment Market, By Technology

  • 6.1 Introduction
  • 6.2 Optical Metrology
  • 6.3 Infrared and Thermal Imaging
  • 6.4 Electron Beam Metrology
  • 6.5 X-ray Metrology
  • 6.6 Scanning Probe Metrology

7 Global Semiconductor Metrology and Inspection Equipment Market, By Application

  • 7.1 Introduction
  • 7.2 Front-End Semiconductor Manufacturing
  • 7.3 Back-End Semiconductor Packaging
  • 7.4 R&D and Process Development
  • 7.5 Quality Assurance and Reliability Testing
  • 7.6 Other Applications

8 Global Semiconductor Metrology and Inspection Equipment Market, By End User

  • 8.1 Introduction
  • 8.2 Integrated Device Manufacturers (IDMs)
  • 8.3 Foundries
  • 8.4 Outsourced Semiconductor Assembly and Test (OSAT) Providers
  • 8.5 Research Institutions
  • 8.6 Other End Users

9 Global Semiconductor Metrology and Inspection Equipment Market, By Geography

  • 9.1 Introduction
  • 9.2 North America
    • 9.2.1 US
    • 9.2.2 Canada
    • 9.2.3 Mexico
  • 9.3 Europe
    • 9.3.1 Germany
    • 9.3.2 UK
    • 9.3.3 Italy
    • 9.3.4 France
    • 9.3.5 Spain
    • 9.3.6 Rest of Europe
  • 9.4 Asia Pacific
    • 9.4.1 Japan
    • 9.4.2 China
    • 9.4.3 India
    • 9.4.4 Australia
    • 9.4.5 New Zealand
    • 9.4.6 South Korea
    • 9.4.7 Rest of Asia Pacific
  • 9.5 South America
    • 9.5.1 Argentina
    • 9.5.2 Brazil
    • 9.5.3 Chile
    • 9.5.4 Rest of South America
  • 9.6 Middle East & Africa
    • 9.6.1 Saudi Arabia
    • 9.6.2 UAE
    • 9.6.3 Qatar
    • 9.6.4 South Africa
    • 9.6.5 Rest of Middle East & Africa

10 Key Developments

  • 10.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 10.2 Acquisitions & Mergers
  • 10.3 New Product Launch
  • 10.4 Expansions
  • 10.5 Other Key Strategies

11 Company Profiling

  • 11.1 KLA Corporation
  • 11.2 Toray Engineering Co., Ltd.
  • 11.3 Hitachi High-Tech Corporation
  • 11.4 JEOL Ltd.
  • 11.5 Applied Materials Inc.
  • 11.6 Lasertec Corporation
  • 11.7 Onto Innovation Inc.
  • 11.8 SCREEN Holdings Co., Ltd.
  • 11.9 ASML Holding N.V.
  • 11.10 Advantest Corporation
  • 11.11 Tokyo Electron Limited
  • 11.12 Nikon Corporation
  • 11.13 Nova Ltd.
  • 11.14 Carl Zeiss SMT GmbH
  • 11.15 Camtek Ltd.

List of Tables

  • Table 1 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Region (2024-2032) ($MN)
  • Table 2 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Equipment Type (2024-2032) ($MN)
  • Table 3 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Lithography Metrology (2024-2032) ($MN)
  • Table 4 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Overlay Metrology (2024-2032) ($MN)
  • Table 5 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Critical Dimension (CD) Metrology (2024-2032) ($MN)
  • Table 6 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Mask Inspection/Metrology (2024-2032) ($MN)
  • Table 7 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Wafer Inspection (2024-2032) ($MN)
  • Table 8 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Defect Inspection (2024-2032) ($MN)
  • Table 9 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Unpatterned Wafer Inspection (2024-2032) ($MN)
  • Table 10 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Patterned Inspection (2024-2032) ($MN)
  • Table 11 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Thin Film Metrology (2024-2032) ($MN)
  • Table 12 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Film Thickness Measurement (2024-2032) ($MN)
  • Table 13 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Refractive Index Profiling (2024-2032) ($MN)
  • Table 14 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Other Equipment Types (2024-2032) ($MN)
  • Table 15 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Technology (2024-2032) ($MN)
  • Table 16 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Optical Metrology (2024-2032) ($MN)
  • Table 17 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Infrared and Thermal Imaging (2024-2032) ($MN)
  • Table 18 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Electron Beam Metrology (2024-2032) ($MN)
  • Table 19 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By X-ray Metrology (2024-2032) ($MN)
  • Table 20 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Scanning Probe Metrology (2024-2032) ($MN)
  • Table 21 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Application (2024-2032) ($MN)
  • Table 22 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Front-End Semiconductor Manufacturing (2024-2032) ($MN)
  • Table 23 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Back-End Semiconductor Packaging (2024-2032) ($MN)
  • Table 24 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By R&D and Process Development (2024-2032) ($MN)
  • Table 25 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Quality Assurance and Reliability Testing (2024-2032) ($MN)
  • Table 26 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Other Applications (2024-2032) ($MN)
  • Table 27 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By End User (2024-2032) ($MN)
  • Table 28 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Integrated Device Manufacturers (IDMs) (2024-2032) ($MN)
  • Table 29 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Foundries (2024-2032) ($MN)
  • Table 30 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Outsourced Semiconductor Assembly and Test (OSAT) Providers (2024-2032) ($MN)
  • Table 31 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Research Institutions (2024-2032) ($MN)
  • Table 32 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Other End Users (2024-2032) ($MN)

Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.