查看购物车
  • Traditional Chinese
  • English
  • Japanese
封面
市场调查报告书
商品编码
1865443

行动电话半导体市场预测至2032年：按组件、技术节点、製造流程、应用和地区分類的全球分析

Mobile Phone Semiconductor Market Forecasts to 2032 - Global Analysis By Component, Technology Node, Manufacturing Process, Application and By Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 200+ Pages | 商品交期: 2-3个工作天内

价格

根据 Stratistics MRC 的数据，预计到 2025 年，全球行动电话半导体市场规模将达到 418.1 亿美元，到 2032 年将达到 918.6 亿美元，预测期内复合年增长率为 11.9%。

行动电话半导体是智慧型手机运作的关键电子元件，负责管理处理、储存、能源控制和连接。它们由处理器、储存模组、射频晶片和感测器等组件构成，实现通讯、显示和多媒体功能。这些晶片在提升行动电话性能、功能和能源效率方面发挥着至关重要的作用，确保设备流畅且先进地运作。

每辆车的零件需求量增加

随着製造商将5G连接、人工智慧处理和高解析度摄影机等先进功能整合到晶片组中，晶片组的复杂性和整合度持续提升。每一代行动电话都对运算效能、记忆体容量和能源效率提出了更高的要求，从而推动了半导体消费。此外，折迭式和游戏手机的兴起进一步增加了对专用晶片的需求。电子设备的日益复杂性迫使半导体製造商扩大产能。因此，每台手机的组件数量不断增加，仍是推动行动电话半导体市场扩张的主要因素。

国内人力资源短缺

许多国家缺乏足够的半导体製造技术人员和工程师，导致其依赖外国技术。这种人才短缺抑制了创新，并减缓了本地生产的扩张，尤其是在新兴市场。高准入门槛和复杂的培训要求进一步限制了合格人才的供应。因此，企业往往面临高营运成本和生产效率下降的问题。如果不加大对教育和人才培养的投入，这种人才短缺很可能会继续限制该行业的长期成长潜力。

营运数位化和供应链优化

企业正在加速采用人工智慧、物联网和高阶分析技术，以优化生产线并简化物流。这些技术能够实现即时监控、预测性维护和高效库存管理，从而减少停机时间和废弃物。数位双胞胎和智慧製造系统的整合进一步提高了营运的精准度和成本效益。此外，数位化供应链解决方案增强了透明度和韧性，有助于缓解疫情等突发事件的衝击。预计这一数位化趋势将增强半导体产业的竞争力，并带来更高水准的生产力提升。

激烈的市场竞争与价格压力

企业面临着以更低成本实现更高绩效的持续压力，这挤压了利润空间。科技的快速变化进一步加剧了竞争，因为创新成果很快就会过时。新进者，尤其是来自低成本製造地区的企业，加剧了全球企业在定价方面的挑战。这种激烈的竞争环境迫使製造商加强研发投入和效率提升，以维持差异化优势。然而，持续的价格战会削弱盈利，并扼杀市场的长期创新。

新冠疫情的感染疾病：

新冠疫情严重扰乱了全球半导体供应链，导致供不应求和生产延误。封锁措施、物流中断和劳动力短缺导致产量下降，智慧型手机发布也被推迟。儘管初期受到衝击，但随着远端办公和数位化通讯需求的激增，设备销售也随之飙升。此次危机凸显了半导体产业过度依赖特定製造地的脆弱性。疫情后的调整促使半导体产业重新调整策略，更重视在地化数位化。

预计在预测期内，前端部分将占据最大的市场份额。

预计在预测期内，前端製造领域将占据最大的市场份额。这主要归功于其在晶圆加工和晶体管製造中的关键作用。这些製程决定了半导体装置的性能、效率和可扩展性。随着智慧型手机製造商追求更小、更高性能的晶片，对先进前端製造的需求也不断增长。极紫外线（EUV）光刻和先进蚀刻等技术的重要性日益凸显。领先的晶圆代工厂正在扩大其前端製造产能，以满足这些不断变化的需求。

预计在预测期内，穿戴式装置领域将实现最高的复合年增长率。

预计在预测期内，穿戴式装置领域将实现最高成长率，这主要得益于消费者对健身追踪器、智慧型手錶和健康监测设备日益增长的兴趣。这些设备需要高效、紧凑且低功耗的晶片，以提升功能并延长电池续航力。感测器、连接模组和人工智慧驱动的健康分析功能的整合将进一步推动半导体的使用。此外，医疗和生活方式领域的日益普及也推动了市场规模的成长。

占比最大的地区：

由于中国、韩国、台湾和日本等国家和地区拥有众多大型晶片製造商和智慧型手机组装，预计亚太地区在预测期内将保持最大的市场份额。该地区受益于稳健的供应链、政府激励措施和成本效益高的生产能力。智慧型手机的快速普及和5G网路的扩展将进一步推动对半导体的需求。此外，大型晶圆代工厂的存在也为大规模生产和创新提供了支持。

年复合成长率最高的地区：

预计在预测期内，北美将实现最高的复合年增长率，这主要得益于先进的研发投资、强大的晶片设计生态系统以及5G和人工智慧设备的日益普及。美国领先的科技公司正在加速处理器和通讯晶片的创新研发。政府支持半导体自给自足和国内製造的措施进一步提升了成长前景。此外，该地区对供应链韧性和先进製造技术的重视也推动了其扩张。

免费客製化服务：

购买此报告的客户可以选择以下免费自订选项之一：

  • 公司概况
    • 对其他市场参与者（最多 3 家公司）进行全面分析
    • 主要企业SWOT分析（最多3家公司）
  • 区域细分
    • 根据客户要求，对主要国家的市场规模和复合年增长率进行估算和预测（註：可行性需确认）。
  • 竞争基准化分析
    • 根据主要参与者的产品系列、地理覆盖范围和策略联盟基准化分析

目录

第一章执行摘要

第二章 前言

  • 概述
  • 相关利益者
  • 调查范围
  • 调查方法
    • 资料探勘
    • 数据分析
    • 数据检验
    • 研究途径
  • 研究材料
    • 原始研究资料
    • 次级研究资讯来源
    • 先决条件

第三章 市场趋势分析

  • 司机
  • 抑制因素
  • 机会
  • 威胁
  • 技术分析
  • 应用分析
  • 新兴市场
  • 新冠疫情的影响

第四章 波特五力分析

  • 供应商的议价能力
  • 买方的议价能力
  • 替代品的威胁
  • 新进入者的威胁
  • 竞争对手之间的竞争

第五章 全球行动电话半导体市场（依组件划分）

  • 处理器和SoC
  • 基频和射频晶片
  • 连线IC
    • Wi-Fi
    • Bluetooth
  • 记忆体和储存
    • DRAM
    • NAND
    • 电子MMC
  • 电源管理积体电路
  • 类比IC
  • 显示驱动积体电路
  • 音讯积体电路
  • 感应器

第六章 全球行动电话半导体市场（依技术节点划分）

  • 尖端（10奈米或更小，包括5奈米、3奈米）
  • 成熟（16-65 奈米）
  • 传统製程（90 奈米及以上）

第七章 全球行动电话半导体市场（依製造流程划分）

  • 前端（晶圆製造）
  • 后端（组装和测试）
  • 封装（覆晶、晶圆级、扇出型）

第八章 全球行动电话半导体市场（依应用领域划分）

  • 智慧型手机
  • 功能手机
  • 穿戴式装置
  • 其他应用

9. 全球行动电话半导体市场（按地区划分）

  • 北美洲
    • 美国
    • 加拿大
    • 墨西哥
  • 欧洲
    • 德国
    • 英国
    • 义大利
    • 法国
    • 西班牙
    • 其他欧洲
  • 亚太地区
    • 日本
    • 中国
    • 印度
    • 澳洲
    • 纽西兰
    • 韩国
    • 亚太其他地区
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 其他南美洲国家
  • 中东和非洲
    • 沙乌地阿拉伯
    • 阿拉伯聯合大公国
    • 卡达
    • 南非
    • 其他中东和非洲地区

第十章：重大进展

  • 协议、伙伴关係、合作和合资企业
  • 收购与併购
  • 新产品上市
  • 业务拓展
  • 其他关键策略

第十一章 企业概况

  • Qualcomm
  • Arm Holdings
  • MediaTek
  • Infineon Technologies
  • Samsung Electronics
  • Texas Instruments
  • Apple Inc.
  • NXP Semiconductors
  • Broadcom Inc.
  • STMicroelectronics
  • Intel Corporation
  • Micron Technology
  • NVIDIA Corporation
  • SK Hynix
  • Taiwan Semiconductor Manufacturing Company（TSMC）
Product Code: SMRC32061

According to Stratistics MRC, the Global Mobile Phone Semiconductor Market is accounted for $41.81 billion in 2025 and is expected to reach $91.86 billion by 2032 growing at a CAGR of 11.9% during the forecast period. Mobile phone semiconductors are vital electronic elements that power smartphones by managing processing, memory, energy control, and connectivity. They consist of components like processors, memory modules, RF chips, and sensors that enable communication, display, and multimedia features. These chips are fundamental in improving the performance, functionality, and energy efficiency of mobile phones, ensuring smooth and advanced device operation.

Market Dynamics:

Driver:

Increased component demand per phone

As manufacturers integrate advanced features such as 5G connectivity, AI processing, and high-resolution cameras, the complexity and density of chipsets continue to grow. Each generation of mobile phones demands higher computational performance, memory capacity, and power efficiency, driving semiconductor consumption. Additionally, the rise of foldable and gaming smartphones further boosts demand for specialized chips. This expansion in electronic sophistication is compelling semiconductor firms to enhance production capabilities. Consequently, the growing component count per phone remains a primary force fueling the mobile phone semiconductor market's expansion.

Restraint:

Shortage of domestic talent

Many countries lack sufficient engineers and technicians proficient in semiconductor manufacturing, leading to dependence on foreign expertise. This talent gap hampers innovation and delays local production expansion, especially in emerging markets. High barriers to entry and complex training requirements further limit the availability of qualified professionals. As a result, firms often face higher operational costs and production inefficiencies. Without substantial investment in education and workforce development, this shortage could continue to constrain the industry's long-term growth potential.

Opportunity:

Digitalization of operations and supply chain optimization

Companies are increasingly adopting AI, IoT, and advanced analytics to optimize production lines and streamline logistics. These technologies enable real-time monitoring, predictive maintenance, and efficient inventory management, reducing downtime and waste. The integration of digital twins and smart manufacturing systems further enhances operational precision and cost efficiency. Additionally, digital supply chain solutions improve transparency and resilience, mitigating disruptions like those experienced during the pandemic. This digital shift is expected to strengthen competitiveness and unlock new levels of productivity in the semiconductor sector.

Threat:

Intense hyper-competition and price pressure

Companies are under constant pressure to deliver higher performance at lower costs, which compresses profit margins. Rapid technological changes further intensify rivalry, as innovations quickly become obsolete. New entrants, particularly from low-cost manufacturing regions, heighten the pricing challenge for global firms. This competitive intensity forces manufacturers to invest heavily in R&D and efficiency improvements to maintain differentiation. However, sustained price wars could undermine profitability and discourage long-term innovation in the market.

Covid-19 Impact:

The COVID-19 pandemic significantly disrupted the global semiconductor supply chain, causing shortages and production delays. Lockdowns, logistics interruptions, and labor constraints led to reduced output and delayed smartphone launches. Despite initial setbacks, demand surged as remote work and digital communication needs accelerated device sales. The crisis highlighted vulnerabilities in the industry's overreliance on specific manufacturing hubs. These post-pandemic adjustments have reshaped strategies, emphasizing localization and digitalization in semiconductor operations.

The front-end segment is expected to be the largest during the forecast period

The front-end segment is expected to account for the largest market share during the forecast period, due to its vital role in wafer processing and transistor formation. These processes determine the performance, efficiency, and miniaturization capabilities of semiconductor devices. As smartphone manufacturers push for smaller, more powerful chips, demand for advanced front-end manufacturing rises. Technologies such as extreme ultraviolet (EUV) lithography and advanced etching are becoming increasingly critical. Major foundries are expanding their front-end capacities to meet these evolving needs.

The wearable devices segment is expected to have the highest CAGR during the forecast period

Over the forecast period, the wearable devices segment is predicted to witness the highest growth rate, due to rising consumer interest in fitness trackers, smartwatches, and health-monitoring gadgets. These devices require highly efficient, compact, and low-power chips to enhance functionality and battery life. The integration of sensors, connectivity modules, and AI-driven health analytics further fuels semiconductor usage. Additionally, growing adoption in healthcare and lifestyle applications expands the market's reach.

Region with largest share:

During the forecast period, the Asia Pacific region is expected to hold the largest market share, due to the strong presence of leading chip manufacturers and smartphone assemblers in countries such as China, South Korea, Taiwan, and Japan. The region benefits from robust supply chains, government incentives, and cost-effective production capabilities. Rapid smartphone penetration and the expansion of 5G networks further drive semiconductor demand. Additionally, the presence of major foundries supports large-scale manufacturing and innovation.

Region with highest CAGR:

Over the forecast period, the North America region is anticipated to exhibit the highest CAGR, owing to The region's growth is driven by advanced R&D investments, a strong ecosystem of chip designers, and increasing adoption of 5G and AI-powered devices. Major tech companies in the U.S. are accelerating innovation in processor and communication chip development. Government initiatives supporting semiconductor self-reliance and domestic fabrication are further enhancing growth prospects. Additionally, the region's emphasis on supply chain resilience and advanced manufacturing technologies is propelling expansion.

Key players in the market

Some of the key players in Mobile Phone Semiconductor Market include Qualcomm, Arm Holdings, MediaTek, Infineon Technologies, Samsung Electronics, Texas Instruments, Apple Inc., NXP Semiconductors, Broadcom Inc., STMicroelectronics, Intel Corporation, Micron Technology, NVIDIA Corporation, SK Hynix, and Taiwan Semiconductor Manufacturing Company (TSMC).

Key Developments:

In October 2025, Qualcomm Technologies, Inc. announced its agreement to acquire Arduino, a premier open-source hardware and software company. The transaction accelerates Qualcomm Technologies' strategy to empower developers by facilitating access to its unmatched portfolio of edge technologies and products. This acquisition builds on the Company's recent integrations of Edge Impulse and Foundries.io, reinforcing its commitment to delivering a full-stack edge platform that spans hardware, software, and cloud services.

In October 2025, MediaTek has teamed with NVIDIA on the design of the GB10 Grace Blackwell Superchip in NVIDIA DGX Spark, a personal AI supercomputer that allows developers to prototype, fine-tune, and inference large AI models on the desktop. Announced earlier this year, DGX Spark will be available to the public starting October 15 to drive the next wave of AI development across industries.

Components Covered:

  • Processors & SoCs
  • Baseband & RF Chips
  • Connectivity Ics
  • Memory & Storage
  • Power Management ICs
  • Analog ICs
  • Display Driver ICs
  • Audio ICs
  • Sensors

Technology Nodes Covered:

  • Advanced (<=10 nm including 5 nm, 3 nm)
  • Mature (16-65 nm)
  • Legacy (>=90 nm)

Manufacturing Processes Covered:

  • Front-End (Wafer Fabrication)
  • Back-End (Assembly & Testing)
  • Packaging (Flip-Chip, Wafer-Level, Fan-Out)

Applications Covered:

  • Smartphones
  • Feature Phones
  • Wearable Devices
  • Other Applications

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2024, 2025, 2026, 2028, and 2032
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Technology Analysis
  • 3.7 Application Analysis
  • 3.8 Emerging Markets
  • 3.9 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global Mobile Phone Semiconductor Market, By Component

  • 5.1 Introduction
  • 5.2 Processors & SoCs
  • 5.3 Baseband & RF Chips
  • 5.4 Connectivity Ics
    • 5.4.1 Wi-Fi
    • 5.4.2 Bluetooth
  • 5.5 Memory & Storage
    • 5.5.1 DRAM
    • 5.5.2 NAND
    • 5.5.3 eMMC
  • 5.6 Power Management ICs
  • 5.7 Analog ICs
  • 5.8 Display Driver ICs
  • 5.9 Audio ICs
  • 5.10 Sensors

6 Global Mobile Phone Semiconductor Market, By Technology Node

  • 6.1 Introduction
  • 6.2 Advanced (<=10 nm including 5 nm, 3 nm)
  • 6.3 Mature (16-65 nm)
  • 6.4 Legacy (>=90 nm)

7 Global Mobile Phone Semiconductor Market, By Manufacturing Process

  • 7.1 Introduction
  • 7.2 Front-End (Wafer Fabrication)
  • 7.3 Back-End (Assembly & Testing)
  • 7.4 Packaging (Flip-Chip, Wafer-Level, Fan-Out)

8 Global Mobile Phone Semiconductor Market, By Application

  • 8.1 Introduction
  • 8.2 Smartphones
  • 8.3 Feature Phones
  • 8.4 Wearable Devices
  • 8.5 Other Applications

9 Global Mobile Phone Semiconductor Market, By Geography

  • 9.1 Introduction
  • 9.2 North America
    • 9.2.1 US
    • 9.2.2 Canada
    • 9.2.3 Mexico
  • 9.3 Europe
    • 9.3.1 Germany
    • 9.3.2 UK
    • 9.3.3 Italy
    • 9.3.4 France
    • 9.3.5 Spain
    • 9.3.6 Rest of Europe
  • 9.4 Asia Pacific
    • 9.4.1 Japan
    • 9.4.2 China
    • 9.4.3 India
    • 9.4.4 Australia
    • 9.4.5 New Zealand
    • 9.4.6 South Korea
    • 9.4.7 Rest of Asia Pacific
  • 9.5 South America
    • 9.5.1 Argentina
    • 9.5.2 Brazil
    • 9.5.3 Chile
    • 9.5.4 Rest of South America
  • 9.6 Middle East & Africa
    • 9.6.1 Saudi Arabia
    • 9.6.2 UAE
    • 9.6.3 Qatar
    • 9.6.4 South Africa
    • 9.6.5 Rest of Middle East & Africa

10 Key Developments

  • 10.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 10.2 Acquisitions & Mergers
  • 10.3 New Product Launch
  • 10.4 Expansions
  • 10.5 Other Key Strategies

11 Company Profiling

  • 11.1 Qualcomm
  • 11.2 Arm Holdings
  • 11.3 MediaTek
  • 11.4 Infineon Technologies
  • 11.5 Samsung Electronics
  • 11.6 Texas Instruments
  • 11.7 Apple Inc.
  • 11.8 NXP Semiconductors
  • 11.9 Broadcom Inc.
  • 11.10 STMicroelectronics
  • 11.11 Intel Corporation
  • 11.12 Micron Technology
  • 11.13 NVIDIA Corporation
  • 11.14 SK Hynix
  • 11.15 Taiwan Semiconductor Manufacturing Company (TSMC)

List of Tables

  • Table 1 Global Mobile Phone Semiconductor Market Outlook, By Region (2024-2032) ($MN)
  • Table 2 Global Mobile Phone Semiconductor Market Outlook, By Component (2024-2032) ($MN)
  • Table 3 Global Mobile Phone Semiconductor Market Outlook, By Processors & SoCs (2024-2032) ($MN)
  • Table 4 Global Mobile Phone Semiconductor Market Outlook, By Baseband & RF Chips (2024-2032) ($MN)
  • Table 5 Global Mobile Phone Semiconductor Market Outlook, By Connectivity Ics (2024-2032) ($MN)
  • Table 6 Global Mobile Phone Semiconductor Market Outlook, By Wi-Fi (2024-2032) ($MN)
  • Table 7 Global Mobile Phone Semiconductor Market Outlook, By Bluetooth (2024-2032) ($MN)
  • Table 8 Global Mobile Phone Semiconductor Market Outlook, By Memory & Storage (2024-2032) ($MN)
  • Table 9 Global Mobile Phone Semiconductor Market Outlook, By DRAM (2024-2032) ($MN)
  • Table 10 Global Mobile Phone Semiconductor Market Outlook, By NAND (2024-2032) ($MN)
  • Table 11 Global Mobile Phone Semiconductor Market Outlook, By eMMC (2024-2032) ($MN)
  • Table 12 Global Mobile Phone Semiconductor Market Outlook, By Power Management ICs (2024-2032) ($MN)
  • Table 13 Global Mobile Phone Semiconductor Market Outlook, By Analog ICs (2024-2032) ($MN)
  • Table 14 Global Mobile Phone Semiconductor Market Outlook, By Display Driver ICs (2024-2032) ($MN)
  • Table 15 Global Mobile Phone Semiconductor Market Outlook, By Audio ICs (2024-2032) ($MN)
  • Table 16 Global Mobile Phone Semiconductor Market Outlook, By Sensors (2024-2032) ($MN)
  • Table 17 Global Mobile Phone Semiconductor Market Outlook, By Technology Node (2024-2032) ($MN)
  • Table 18 Global Mobile Phone Semiconductor Market Outlook, By Advanced (<=10 nm including 5 nm, 3 nm) (2024-2032) ($MN)
  • Table 19 Global Mobile Phone Semiconductor Market Outlook, By Mature (16-65 nm) (2024-2032) ($MN)
  • Table 20 Global Mobile Phone Semiconductor Market Outlook, By Legacy (>=90 nm) (2024-2032) ($MN)
  • Table 21 Global Mobile Phone Semiconductor Market Outlook, By Manufacturing Process (2024-2032) ($MN)
  • Table 22 Global Mobile Phone Semiconductor Market Outlook, By Front-End (Wafer Fabrication) (2024-2032) ($MN)
  • Table 23 Global Mobile Phone Semiconductor Market Outlook, By Back-End (Assembly & Testing) (2024-2032) ($MN)
  • Table 24 Global Mobile Phone Semiconductor Market Outlook, By Packaging (Flip-Chip, Wafer-Level, Fan-Out) (2024-2032) ($MN)
  • Table 25 Global Mobile Phone Semiconductor Market Outlook, By Application (2024-2032) ($MN)
  • Table 26 Global Mobile Phone Semiconductor Market Outlook, By Smartphones (2024-2032) ($MN)
  • Table 27 Global Mobile Phone Semiconductor Market Outlook, By Feature Phones (2024-2032) ($MN)
  • Table 28 Global Mobile Phone Semiconductor Market Outlook, By Wearable Devices (2024-2032) ($MN)
  • Table 29 Global Mobile Phone Semiconductor Market Outlook, By Other Applications (2024-2032) ($MN)

Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.