HBM的全球市场(2026年):HBM3e的价格降低

分析师摘要

三星已完成 NVIDIA HBM3e 认证并开始小批量出货。供应商竞争日趋激烈，HBM4 升级预计将推高成本和溢价。

主要亮点

• 三星已完成与重要客户的 HBM3e 认证并开始小批量出货。
• 为满足包装和系统要求，进行了製程调整和重新取样。
• 由于供应商寻求填满产能，HBM3e 正面临激烈的价格和市占率竞争。
• HBM4 技术升级预计将推高製造成本并带来溢价压力。
• 供应商数量和认证时间将决定未来的供应和价格动态。

本报告探讨并分析了全球 HBM 市场，并提供了截至 2026 年的市场预测。

目录

第一章：引言

第二章：HBM3e 12hi 将在 2026 年继续占市场主导地位，三星进入 NVIDIA 供应链的进程迟早会生效

第三章：HBM3e 细分市场的市场占有率和价格竞争将加剧，HBM4 将成为下一个战场

• HBM 产品平均售价不一

第四章：HBM3e 生产对 DDR5/LPDDR5(X) 产品供应的挤出效应可能更明显

Analyst summary:

Samsung completed NVIDIA certification for HBM3e and began limited shipments; HBM3e will be the near term mainstream. Supplier competition is intensifying while HBM4 upgrades are expected to raise costs and premiums; certification timing will shape prices.

Key Highlights:

• Samsung completed HBM3e certification with a major customer and started limited shipments.
• Process adjustments and re-sampling were made to meet packaging and system requirements.
• HBM3e faces intense price and share competition as suppliers seek to fill capacity.
• HBM4 technology upgrades are expected to raise manufacturing costs and create premium pressure.
• Supplier count and certification timing will determine future supply and pricing dynamics.

Table of Contents

1. Introduction

2. HBM3e 12hi Remains as Market Mainstream for Demand in 2026; Samsung's Penetration of NVIDIA's Supply Chain Proves to be Better Late than Never

3. Trend Is Set for Intensifying Competition for Market Share and Price War in HBM3e Segment; HBM4 Will Be the Next Battleground

• Blended ASP of HBM Products

4. Crowding-Out Effect of HBM3e Production on the Supply of DDR5 and LPDDR5(X) Products Could Become More Pronounced